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S9S08QD4J2MSCR S9S08QD4J2MSCR NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08QD4J1MSCR S9S08QD4J1MSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.74 EUR
10+5.27 EUR
100+4.32 EUR
500+4.23 EUR
1000+3.56 EUR
Mindestbestellmenge: 3
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KMA221J KMA221J NXP USA Inc. KMA221.pdf Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Cut Tape (CT)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Part Status: Obsolete
Produkt ist nicht verfügbar
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S9S08QD4J1CSCR S9S08QD4J1CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.68 EUR
10+3.51 EUR
25+3.22 EUR
100+2.89 EUR
250+2.74 EUR
500+2.65 EUR
1000+2.57 EUR
Mindestbestellmenge: 4
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MC9S08QD2MSCR MC9S08QD2MSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2300 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.77 EUR
10+3.57 EUR
25+3.27 EUR
100+2.93 EUR
250+2.78 EUR
500+2.68 EUR
1000+2.6 EUR
Mindestbestellmenge: 4
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TJA1145T,118 TJA1145T,118 NXP USA Inc. TJA1145.pdf Description: IC TRANSCEIVER FULL 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Full
Part Status: Obsolete
auf Bestellung 1526 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.59 EUR
10+3.44 EUR
25+3.15 EUR
100+2.83 EUR
250+2.68 EUR
500+2.59 EUR
1000+2.51 EUR
Mindestbestellmenge: 4
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MC9S08PA32AVLCR MC9S08PA32AVLCR NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 7576 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.35 EUR
10+3.25 EUR
25+2.97 EUR
100+2.67 EUR
250+2.52 EUR
500+2.44 EUR
1000+2.37 EUR
Mindestbestellmenge: 5
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TDA8034HN/C1,118 TDA8034HN/C1,118 NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 3800 Stücke:
Lieferzeit 10-14 Tag (e)
18+1 EUR
20+0.88 EUR
25+0.87 EUR
100+0.85 EUR
Mindestbestellmenge: 18
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MC9S08PA4AVTGR MC9S08PA4AVTGR NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 2344 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.94 EUR
13+1.4 EUR
25+1.27 EUR
100+1.12 EUR
250+1.05 EUR
500+1.01 EUR
1000+0.97 EUR
Mindestbestellmenge: 10
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TJA1055T/3/CM,118 TJA1055T/3/CM,118 NXP USA Inc. TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Active
auf Bestellung 7123 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.82 EUR
10+2.84 EUR
25+2.6 EUR
100+2.33 EUR
250+2.2 EUR
500+2.12 EUR
1000+2.06 EUR
Mindestbestellmenge: 5
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TJA1049T/3J TJA1049T/3J NXP USA Inc. TJA1049.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
auf Bestellung 956 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.82 EUR
10+2.08 EUR
25+1.89 EUR
100+1.68 EUR
250+1.58 EUR
500+1.53 EUR
Mindestbestellmenge: 7
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MC9S08PA4MTGR MC9S08PA4MTGR NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 1899 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.18 EUR
12+1.59 EUR
25+1.44 EUR
100+1.27 EUR
250+1.19 EUR
500+1.15 EUR
1000+1.11 EUR
Mindestbestellmenge: 9
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TJA1028T/3V3/20/1J TJA1028T/3V3/20/1J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 4910 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.73 EUR
10+1.83 EUR
25+1.74 EUR
100+1.62 EUR
250+1.53 EUR
500+1.47 EUR
1000+1.42 EUR
Mindestbestellmenge: 7
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MC33662BSEFR2 MC33662BSEFR2 NXP USA Inc. MC33662.pdf Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
auf Bestellung 4747 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.82 EUR
10+2.06 EUR
25+1.88 EUR
100+1.67 EUR
250+1.57 EUR
500+1.51 EUR
1000+1.46 EUR
Mindestbestellmenge: 7
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TJA1044T/1Z TJA1044T/1Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 931 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.78 EUR
14+1.28 EUR
25+1.15 EUR
100+1.02 EUR
250+0.96 EUR
500+0.92 EUR
Mindestbestellmenge: 10
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BGS8M2X BGS8M2X NXP USA Inc. BGS8M2.pdf Description: IC RF AMP 1.8GHZ-2.2GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.4dB
Current - Supply: 5.8mA
Noise Figure: 0.85dB
Test Frequency: 2.2GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3696 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.81 EUR
26+0.7 EUR
27+0.66 EUR
100+0.6 EUR
250+0.57 EUR
500+0.55 EUR
1000+0.52 EUR
Mindestbestellmenge: 22
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LTE3401LX LTE3401LX NXP USA Inc. LTE3401L.pdf Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401HX LTE3401HX NXP USA Inc. LTE3401H.pdf Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1027T/20/1J TJA1027T/20/1J NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4635 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.64 EUR
15+1.18 EUR
25+1.06 EUR
100+0.94 EUR
250+0.88 EUR
500+0.85 EUR
1000+0.78 EUR
Mindestbestellmenge: 11
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MPXV2202DPT1 MPXV2202DPT1 NXP USA Inc. MPX2202.pdf Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.48 EUR
5+21.36 EUR
10+20.57 EUR
25+19.63 EUR
50+18.98 EUR
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MC33660BEFR2 MC33660BEFR2 NXP USA Inc. MC33660.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 21868 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.19 EUR
10+2.35 EUR
25+2.14 EUR
100+1.92 EUR
250+1.81 EUR
500+1.74 EUR
1000+1.69 EUR
Mindestbestellmenge: 6
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TJA1081BTS,118 TJA1081BTS,118 NXP USA Inc. TJA1081B.pdf Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 3653 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.2 EUR
10+6.27 EUR
25+5.79 EUR
100+5.26 EUR
250+5 EUR
500+4.85 EUR
1000+4.72 EUR
Mindestbestellmenge: 3
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MFRC52202HN1,115 MFRC52202HN1,115 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1769 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.02 EUR
10+10.43 EUR
25+9.87 EUR
100+9.11 EUR
250+8.65 EUR
500+8.33 EUR
Mindestbestellmenge: 2
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SL2S5002FTB,115 SL2S5002FTB,115 NXP USA Inc. SL2S5002_SL2S5102.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 1385 Stücke:
Lieferzeit 10-14 Tag (e)
29+0.62 EUR
34+0.53 EUR
36+0.5 EUR
100+0.46 EUR
250+0.43 EUR
500+0.41 EUR
1000+0.4 EUR
Mindestbestellmenge: 29
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TJA1051TK/3/1J TJA1051TK/3/1J NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 10257 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.85 EUR
14+1.35 EUR
25+1.22 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
1000+0.94 EUR
2500+0.9 EUR
Mindestbestellmenge: 10
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MCZ33810EKR2 MCZ33810EKR2 NXP USA Inc. MC33810.pdf Description: IC DVR 8-CH ENGINE CTRL 32-SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.75 EUR
10+12.3 EUR
25+11.44 EUR
100+10.49 EUR
250+10.04 EUR
500+9.77 EUR
Mindestbestellmenge: 2
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MK22FN512CAP12R MK22FN512CAP12R NXP USA Inc. K22P80M120SF7.pdf Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)
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25+15.56 EUR
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1000+13.11 EUR
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A2G35S200-01SR3 A2G35S200-01SR3 NXP USA Inc. A2G35S200-01S.pdf Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
auf Bestellung 77 Stücke:
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MF3MOD2101DA8/05,1 MF3MOD2101DA8/05,1 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 29536 Stücke:
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A2G35S160-01SR3 A2G35S160-01SR3 NXP USA Inc. A2G35S160-01S.pdf Description: RF MOSFET GAN 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
auf Bestellung 172 Stücke:
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MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 725 Stücke:
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MF3MOD8101DA4/05,1 MF3MOD8101DA4/05,1 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 13468 Stücke:
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MF3MODH4101DA4/05, NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 16317 Stücke:
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4+5.83 EUR
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NCF29A1MHN/0500IJ NCF29A1MHN/0500IJ NXP USA Inc. NCF29A1MHN_Web.pdf Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 6027 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.8 EUR
10+10.74 EUR
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100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.45 EUR
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SCIMX6X3EVK10ABR SCIMX6X3EVK10ABR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
HT1MOA4S30/E/3J HT1MOA4S30/E/3J NXP USA Inc. HT1X_SDS.pdf Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 16414 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.63 EUR
10+4.87 EUR
25+4.61 EUR
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250+4.02 EUR
500+3.86 EUR
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A2T26H300-24SR6 A2T26H300-24SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ NCF29A4XHN/0500VJ NXP USA Inc. Description: IC 32HVQFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6X2EVN10ABR MCIMX6X2EVN10ABR NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+52.13 EUR
10+42.32 EUR
25+39.87 EUR
100+37.17 EUR
250+35.89 EUR
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MCIMX31LCVMN4DR2 MCIMX31LCVMN4DR2 NXP USA Inc. MCIMX31_5.pdf Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 748 Stücke:
Lieferzeit 10-14 Tag (e)
1+78.57 EUR
10+64.57 EUR
25+61.07 EUR
100+57.23 EUR
250+55.4 EUR
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MRFE6VP5600HR6 MRFE6VP5600HR6 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 114 Stücke:
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1+1254.72 EUR
10+1106.78 EUR
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PN5180A0HN/C2Y PN5180A0HN/C2Y NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 9708 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.67 EUR
10+13 EUR
25+12.08 EUR
100+11.07 EUR
250+10.59 EUR
500+10.31 EUR
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MF1S7030XDA4/V1J MF1S7030XDA4/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 14535 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.61 EUR
10+2.67 EUR
25+2.44 EUR
100+2.18 EUR
250+2.06 EUR
500+1.98 EUR
1000+1.92 EUR
2500+1.86 EUR
5000+1.82 EUR
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MCIMX357CJQ5CR2 MCIMX357CJQ5CR2 NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
1+52.8 EUR
10+42.88 EUR
25+40.4 EUR
100+37.68 EUR
250+36.38 EUR
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A2I25D025GNR1 A2I25D025GNR1 NXP USA Inc. A2I25D025N.pdf Description: IC TRANS RF LDMOS
auf Bestellung 773 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.75 EUR
10+55.1 EUR
25+52.63 EUR
100+47.05 EUR
250+44.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MMPF0100F9ANESR2 MMPF0100F9ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 11272 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.36 EUR
10+11.18 EUR
25+10.39 EUR
100+9.52 EUR
250+9.1 EUR
500+8.85 EUR
1000+8.65 EUR
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NCK2983AHN/T2CY NCK2983AHN/T2CY NXP USA Inc. Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Memory Size: 32kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.1V ~ 5.5V
Current - Receiving: 17mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: ASK, FSK
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S5030XDA8/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 27018 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.01 EUR
13+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.1 EUR
500+1.06 EUR
1000+1.02 EUR
2500+0.98 EUR
5000+0.96 EUR
Mindestbestellmenge: 9
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MMPF0100F0AEPR2 MMPF0100F0AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 6220 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
Mindestbestellmenge: 2
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MMPF0100F1AEPR2 MMPF0100F1AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
Mindestbestellmenge: 2
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MMPF0100NPAEPR2 MMPF0100NPAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 3920 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
Mindestbestellmenge: 2
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MKM14Z128CHH5R MKM14Z128CHH5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR S9S08EL16F1VTJR NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.63 EUR
Mindestbestellmenge: 2
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SPC5606BK0MLL6R SPC5606BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R SPC5605BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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1+34.71 EUR
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25+26.1 EUR
100+24.2 EUR
250+23.3 EUR
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PN5120A0ET/C2J PN5120A0ET/C2J NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3060 Stücke:
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX257CJM4AR2 MCIMX257CJM4AR2 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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S9S08QD4J2MSCR
S9S08QD4J2MSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08QD4J1MSCR MC9S08QD4.pdf
S9S08QD4J1MSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
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Anzahl Preis
3+6.74 EUR
10+5.27 EUR
100+4.32 EUR
500+4.23 EUR
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KMA221J KMA221.pdf
KMA221J
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Cut Tape (CT)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Part Status: Obsolete
Produkt ist nicht verfügbar
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S9S08QD4J1CSCR MC9S08QD4.pdf
S9S08QD4J1CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
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4+4.68 EUR
10+3.51 EUR
25+3.22 EUR
100+2.89 EUR
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MC9S08QD2MSCR MC9S08QD4.pdf
MC9S08QD2MSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2300 Stücke:
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4+4.77 EUR
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TJA1145T,118 TJA1145.pdf
TJA1145T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Full
Part Status: Obsolete
auf Bestellung 1526 Stücke:
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4+4.59 EUR
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MC9S08PA32AVLCR MC9S08PA4.pdf
MC9S08PA32AVLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 7576 Stücke:
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5+4.35 EUR
10+3.25 EUR
25+2.97 EUR
100+2.67 EUR
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TDA8034HN/C1,118 TDA8034HN.pdf
TDA8034HN/C1,118
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 3800 Stücke:
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18+1 EUR
20+0.88 EUR
25+0.87 EUR
100+0.85 EUR
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MC9S08PA4AVTGR MC9S08PA60_Rev1.pdf
MC9S08PA4AVTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 2344 Stücke:
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10+1.94 EUR
13+1.4 EUR
25+1.27 EUR
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TJA1055T/3/CM,118 TJA1055.pdf
TJA1055T/3/CM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Active
auf Bestellung 7123 Stücke:
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5+3.82 EUR
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TJA1049T/3J TJA1049.pdf
TJA1049T/3J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
auf Bestellung 956 Stücke:
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7+2.82 EUR
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MC9S08PA4MTGR MC9S08PA4.pdf
MC9S08PA4MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 1899 Stücke:
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9+2.18 EUR
12+1.59 EUR
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TJA1028T/3V3/20/1J TJA1028.pdf
TJA1028T/3V3/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 4910 Stücke:
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7+2.73 EUR
10+1.83 EUR
25+1.74 EUR
100+1.62 EUR
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MC33662BSEFR2 MC33662.pdf
MC33662BSEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
auf Bestellung 4747 Stücke:
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Anzahl Preis
7+2.82 EUR
10+2.06 EUR
25+1.88 EUR
100+1.67 EUR
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TJA1044T/1Z TJA1044.pdf
TJA1044T/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 931 Stücke:
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10+1.78 EUR
14+1.28 EUR
25+1.15 EUR
100+1.02 EUR
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BGS8M2X BGS8M2.pdf
BGS8M2X
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8GHZ-2.2GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.4dB
Current - Supply: 5.8mA
Noise Figure: 0.85dB
Test Frequency: 2.2GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3696 Stücke:
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Anzahl Preis
22+0.81 EUR
26+0.7 EUR
27+0.66 EUR
100+0.6 EUR
250+0.57 EUR
500+0.55 EUR
1000+0.52 EUR
Mindestbestellmenge: 22
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LTE3401LX LTE3401L.pdf
LTE3401LX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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LTE3401HX LTE3401H.pdf
LTE3401HX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
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TJA1027T/20/1J TJA1027.pdf
TJA1027T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.64 EUR
15+1.18 EUR
25+1.06 EUR
100+0.94 EUR
250+0.88 EUR
500+0.85 EUR
1000+0.78 EUR
Mindestbestellmenge: 11
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MPXV2202DPT1 MPX2202.pdf
MPXV2202DPT1
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
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1+23.48 EUR
5+21.36 EUR
10+20.57 EUR
25+19.63 EUR
50+18.98 EUR
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MC33660BEFR2 MC33660.pdf
MC33660BEFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 21868 Stücke:
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Anzahl Preis
6+3.19 EUR
10+2.35 EUR
25+2.14 EUR
100+1.92 EUR
250+1.81 EUR
500+1.74 EUR
1000+1.69 EUR
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TJA1081BTS,118 TJA1081B.pdf
TJA1081BTS,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 3653 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.2 EUR
10+6.27 EUR
25+5.79 EUR
100+5.26 EUR
250+5 EUR
500+4.85 EUR
1000+4.72 EUR
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MFRC52202HN1,115 MFRC522.pdf
MFRC52202HN1,115
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1769 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.02 EUR
10+10.43 EUR
25+9.87 EUR
100+9.11 EUR
250+8.65 EUR
500+8.33 EUR
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SL2S5002FTB,115 SL2S5002_SL2S5102.pdf
SL2S5002FTB,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 1385 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
29+0.62 EUR
34+0.53 EUR
36+0.5 EUR
100+0.46 EUR
250+0.43 EUR
500+0.41 EUR
1000+0.4 EUR
Mindestbestellmenge: 29
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TJA1051TK/3/1J TJA1051.pdf
TJA1051TK/3/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 10257 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.85 EUR
14+1.35 EUR
25+1.22 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
1000+0.94 EUR
2500+0.9 EUR
Mindestbestellmenge: 10
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MCZ33810EKR2 MC33810.pdf
MCZ33810EKR2
Hersteller: NXP USA Inc.
Description: IC DVR 8-CH ENGINE CTRL 32-SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.75 EUR
10+12.3 EUR
25+11.44 EUR
100+10.49 EUR
250+10.04 EUR
500+9.77 EUR
Mindestbestellmenge: 2
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MK22FN512CAP12R K22P80M120SF7.pdf
MK22FN512CAP12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 3856 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.14 EUR
10+16.68 EUR
25+15.56 EUR
100+14.33 EUR
250+13.75 EUR
500+13.4 EUR
1000+13.11 EUR
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A2G35S200-01SR3 A2G35S200-01S.pdf
A2G35S200-01SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+252.1 EUR
10+214 EUR
25+204.49 EUR
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MF3MOD2101DA8/05,1 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
MF3MOD2101DA8/05,1
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 29536 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.29 EUR
10+2.44 EUR
25+2.22 EUR
100+1.98 EUR
250+1.87 EUR
500+1.8 EUR
1000+1.75 EUR
2500+1.71 EUR
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A2G35S160-01SR3 A2G35S160-01S.pdf
A2G35S160-01SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
auf Bestellung 172 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+264.42 EUR
10+224.14 EUR
25+214.08 EUR
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MCIMX6D6AVT10ADR IMX6DQAEC.pdf
MCIMX6D6AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+137.68 EUR
10+115 EUR
25+109.34 EUR
100+103.12 EUR
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MF3MOD8101DA4/05,1 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
MF3MOD8101DA4/05,1
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 13468 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.91 EUR
10+4.46 EUR
25+4.1 EUR
100+3.7 EUR
250+3.59 EUR
Mindestbestellmenge: 3
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MF3MODH4101DA4/05, MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 16317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.83 EUR
10+4.39 EUR
25+4.03 EUR
100+3.63 EUR
250+3.44 EUR
500+3.33 EUR
1000+3.24 EUR
2500+3.14 EUR
5000+3.08 EUR
Mindestbestellmenge: 4
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NCF29A1MHN/0500IJ NCF29A1MHN_Web.pdf
NCF29A1MHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 6027 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.8 EUR
10+10.74 EUR
25+9.97 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.45 EUR
Mindestbestellmenge: 2
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SCIMX6X3EVK10ABR
SCIMX6X3EVK10ABR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HT1MOA4S30/E/3J HT1X_SDS.pdf
HT1MOA4S30/E/3J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 16414 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.63 EUR
10+4.87 EUR
25+4.61 EUR
100+4.24 EUR
250+4.02 EUR
500+3.86 EUR
1000+3.72 EUR
Mindestbestellmenge: 4
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A2T26H300-24SR6
A2T26H300-24SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ
NCF29A4XHN/0500VJ
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Produkt ist nicht verfügbar
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MCIMX6X2EVN10ABR IMX6SXIEC.pdf
MCIMX6X2EVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+52.13 EUR
10+42.32 EUR
25+39.87 EUR
100+37.17 EUR
250+35.89 EUR
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MCIMX31LCVMN4DR2 MCIMX31_5.pdf
MCIMX31LCVMN4DR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 748 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+78.57 EUR
10+64.57 EUR
25+61.07 EUR
100+57.23 EUR
250+55.4 EUR
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MRFE6VP5600HR6 MRFE6VP5600H.pdf
MRFE6VP5600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1254.72 EUR
10+1106.78 EUR
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PN5180A0HN/C2Y PN5180A0XX-C1-C2.pdf
PN5180A0HN/C2Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 9708 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.67 EUR
10+13 EUR
25+12.08 EUR
100+11.07 EUR
250+10.59 EUR
500+10.31 EUR
1000+10.07 EUR
Mindestbestellmenge: 2
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MF1S7030XDA4/V1J MF1S50yyX_V1.pdf
MF1S7030XDA4/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 14535 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.61 EUR
10+2.67 EUR
25+2.44 EUR
100+2.18 EUR
250+2.06 EUR
500+1.98 EUR
1000+1.92 EUR
2500+1.86 EUR
5000+1.82 EUR
Mindestbestellmenge: 5
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MCIMX357CJQ5CR2 MCIMX35SR2CEC.pdf
MCIMX357CJQ5CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+52.8 EUR
10+42.88 EUR
25+40.4 EUR
100+37.68 EUR
250+36.38 EUR
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A2I25D025GNR1 A2I25D025N.pdf
A2I25D025GNR1
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
auf Bestellung 773 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.75 EUR
10+55.1 EUR
25+52.63 EUR
100+47.05 EUR
250+44.89 EUR
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MMPF0100F9ANESR2 MMPF0100.pdf
MMPF0100F9ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 11272 Stücke:
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Anzahl Preis
2+14.36 EUR
10+11.18 EUR
25+10.39 EUR
100+9.52 EUR
250+9.1 EUR
500+8.85 EUR
1000+8.65 EUR
Mindestbestellmenge: 2
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NCK2983AHN/T2CY
NCK2983AHN/T2CY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Memory Size: 32kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.1V ~ 5.5V
Current - Receiving: 17mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: ASK, FSK
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S50yyX_V1.pdf
MF1S5030XDA8/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 27018 Stücke:
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Anzahl Preis
9+2.01 EUR
13+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.1 EUR
500+1.06 EUR
1000+1.02 EUR
2500+0.98 EUR
5000+0.96 EUR
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MMPF0100F0AEPR2 MMPF0100.pdf
MMPF0100F0AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 6220 Stücke:
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Anzahl Preis
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
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MMPF0100F1AEPR2 MMPF0100.pdf
MMPF0100F1AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
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MMPF0100NPAEPR2 MMPF0100.pdf
MMPF0100NPAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 3920 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.82 EUR
10+10.74 EUR
25+9.98 EUR
100+9.13 EUR
250+8.73 EUR
500+8.49 EUR
1000+8.29 EUR
Mindestbestellmenge: 2
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MKM14Z128CHH5R MKMxxZxxCxx5.pdf
MKM14Z128CHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR MC9S08EL32.pdf
S9S08EL16F1VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.63 EUR
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SPC5606BK0MLL6R MPC5606B.pdf
SPC5606BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R MPC5606B.pdf
SPC5605BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.71 EUR
10+27.82 EUR
25+26.1 EUR
100+24.2 EUR
250+23.3 EUR
500+22.76 EUR
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PN5120A0ET/C2J PN512.pdf
PN5120A0ET/C2J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3060 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.64 EUR
10+11.83 EUR
25+11.21 EUR
100+10.35 EUR
250+9.83 EUR
500+9.47 EUR
1000+9.12 EUR
Mindestbestellmenge: 2
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MCIMX6S5EVM10ACR IMX6SDLAEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+63.01 EUR
10+51.45 EUR
25+48.56 EUR
100+45.39 EUR
250+43.88 EUR
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MCIMX257CJM4AR2 IMX25CEC.pdf
MCIMX257CJM4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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