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CLRC66302HN,118 CLRC66302HN,118 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 15399 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.3 EUR
10+15.03 EUR
25+14.24 EUR
100+13.16 EUR
250+12.51 EUR
500+12.05 EUR
1000+11.96 EUR
Mindestbestellmenge: 2
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MFRC63002HN,118 MFRC63002HN,118 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 7510 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.82 EUR
10+8.51 EUR
25+8.05 EUR
100+7.42 EUR
250+7.05 EUR
500+6.78 EUR
1000+6.53 EUR
Mindestbestellmenge: 2
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SLRC61002HN,118 SLRC61002HN,118 NXP USA Inc. SLRC610.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 19908 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.54 EUR
10+8.27 EUR
25+7.82 EUR
100+7.21 EUR
250+6.85 EUR
500+6.59 EUR
1000+6.34 EUR
Mindestbestellmenge: 2
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FS32K144HAT0MMHT FS32K144HAT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF300A-40MHZ MRF300A-40MHZ NXP USA Inc. MRF300AN.pdf Description: MRF300A REF BOARD 40.68MHZ 330W
Packaging: Bulk
For Use With/Related Products: MRF300A
Frequency: 40.68MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: MRF300A
Produkt ist nicht verfügbar
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MRF300A-27MHZ MRF300A-27MHZ NXP USA Inc. MRF300AN.pdf Description: MRF300AN REF BRD 27MHZ 330W
Packaging: Bulk
For Use With/Related Products: MRF300A
Frequency: 27MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: MRF300A
Produkt ist nicht verfügbar
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S9S12VRP64F0MLF S9S12VRP64F0MLF NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1046TKZ TJA1046TKZ NXP USA Inc. TJA1046.pdf Description: IC TRANSCEIVER 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Part Status: Active
auf Bestellung 5014 Stücke:
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5+3.75 EUR
10+2.79 EUR
25+2.55 EUR
100+2.29 EUR
250+2.16 EUR
500+2.09 EUR
1000+2.02 EUR
2500+1.96 EUR
Mindestbestellmenge: 5
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MC34988CHFKR2 MC34988CHFKR2 NXP USA Inc. MC34988CHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm
Voltage - Load: 27V (Max)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 30A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34988CHFK MC34988CHFK NXP USA Inc. MC34988CHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Packaging: Tray
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm
Voltage - Load: 27V (Max)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 30A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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FRDM-KW36 FRDM-KW36 NXP USA Inc. MKW36A512.pdf Description: FREEDOM BOARD KINETIS KW35/36
Packaging: Bulk
For Use With/Related Products: KW35, KW36
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: KW35, KW36
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 10 Stücke:
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1+140.57 EUR
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FS32R274KSK2MMM FS32R274KSK2MMM NXP USA Inc. PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 742 Stücke:
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1+65.81 EUR
10+54.42 EUR
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MHT1006NT1 MHT1006NT1 NXP USA Inc. Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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BGA7130,118 BGA7130,118 NXP USA Inc. BGA7130.pdf Description: IC AMP GPS 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 12dB
Current - Supply: 450mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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PTN36043BXY PTN36043BXY NXP USA Inc. PTN36043.pdf Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LPC845M301JHI33Y LPC845M301JHI33Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
auf Bestellung 8929 Stücke:
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5+3.8 EUR
10+2.52 EUR
25+2.45 EUR
100+2.39 EUR
250+2.26 EUR
500+2.18 EUR
1000+2.11 EUR
2500+2.05 EUR
Mindestbestellmenge: 5
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AFT18S230SR5 AFT18S230SR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
auf Bestellung 10 Stücke:
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1+260.46 EUR
10+220.72 EUR
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CBTL08GP053EVY CBTL08GP053EVY NXP USA Inc. CBTL08GP053.pdf Description: IC MUX CROSSBAR SW USB VFBGA40
Packaging: Cut Tape (CT)
Package / Case: 40-VFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: USB
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 8.5GHz
Supplier Device Package: 40-VFBGA (4.75x3.25)
Voltage - Supply, Single (V+): 1.8V
auf Bestellung 13 Stücke:
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4+4.7 EUR
10+4.22 EUR
Mindestbestellmenge: 4
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TJA1043TK/1Y TJA1043TK/1Y NXP USA Inc. TJA1043.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 9670 Stücke:
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7+2.85 EUR
10+2.09 EUR
25+1.9 EUR
100+1.7 EUR
250+1.6 EUR
500+1.54 EUR
1000+1.49 EUR
2500+1.44 EUR
Mindestbestellmenge: 7
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BGA7027,135 BGA7027,135 NXP USA Inc. BGA7027.pdf Description: IC AMP GPS 400MHZ-2.7GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 11dB
Current - Supply: 165mA
Noise Figure: 3.9dB
P1dB: 26dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
auf Bestellung 330 Stücke:
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4+5.16 EUR
10+3.92 EUR
25+3.54 EUR
100+3.08 EUR
250+2.83 EUR
Mindestbestellmenge: 4
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MMA20312BVT1 MMA20312BVT1 NXP USA Inc. Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
auf Bestellung 842 Stücke:
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2+11.21 EUR
10+10.27 EUR
25+9.34 EUR
100+8.4 EUR
250+7.7 EUR
500+7 EUR
Mindestbestellmenge: 2
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UJA1163TK,118 UJA1163TK,118 NXP USA Inc. UJA1163.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
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MC9S08PA8AVTGR MC9S08PA8AVTGR NXP USA Inc. MC9S08PA60_Rev1.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3755 Stücke:
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7+2.83 EUR
10+2.09 EUR
25+1.9 EUR
100+1.69 EUR
250+1.59 EUR
500+1.54 EUR
1000+1.49 EUR
2500+1.44 EUR
Mindestbestellmenge: 7
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TDF8530TH/N2,118 TDF8530TH/N2,118 NXP USA Inc. 75017410.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Active
auf Bestellung 500 Stücke:
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1+64.7 EUR
10+52.75 EUR
25+49.77 EUR
100+46.49 EUR
250+44.93 EUR
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TJA1024HGZ TJA1024HGZ NXP USA Inc. TJA1024.pdf Description: IC TRANSCEIVER 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Protocol: LINbus
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2852 Stücke:
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4+5.3 EUR
10+4.76 EUR
25+4.5 EUR
100+3.9 EUR
250+3.7 EUR
500+3.32 EUR
1000+2.8 EUR
Mindestbestellmenge: 4
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PCA9745BTWJ PCA9745BTWJ NXP USA Inc. PCA9745B.pdf Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Grade: Automotive
auf Bestellung 7471 Stücke:
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4+4.72 EUR
10+3.54 EUR
25+3.25 EUR
100+2.92 EUR
250+2.77 EUR
500+2.67 EUR
1000+2.6 EUR
Mindestbestellmenge: 4
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TJA1044GTKZ TJA1044GTKZ NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 2202 Stücke:
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11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
Mindestbestellmenge: 11
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MCZ33903C5EKR2 MCZ33903C5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MCZ33903C3EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC33975ATEKR2 MC33975ATEKR2 NXP USA Inc. MC33975.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 1000 Stücke:
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2+11.6 EUR
Mindestbestellmenge: 2
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S9S12XS128J1CALR S9S12XS128J1CALR NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
auf Bestellung 420 Stücke:
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TJA1029TK/20/1J TJA1029TK/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 8681 Stücke:
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TJA1029TK,118 TJA1029TK,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4880 Stücke:
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TEA19161T/2Y TEA19161T/2Y NXP USA Inc. TEA19161T.pdf Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
auf Bestellung 8826 Stücke:
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MC33689DPEWR2 MC33689DPEWR2 NXP USA Inc. MC33797.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 377 Stücke:
Lieferzeit 10-14 Tag (e)
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TDF8590TH/N1TJ TDF8590TH/N1TJ NXP USA Inc. TDF8590TH_2.pdf Description: IC AMP D MONO/STEREO 160W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34674CEPR2 MC34674CEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, PCF7941ATSM2AB120, NXP USA Inc. UM10473.pdf Description: IC REMOTE KEYLESS ENTRY 20SSOP
Packaging: Cut Tape (CT)
Part Status: Active
Features: PLL Frequency Synthesizer and PA
Modulation or Protocol: ASK, FSK, UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: General Purpose
Data Rate (Max): 4.8kbps
DigiKey Programmable: Not Verified
Frequency: 315MHz, 434MHz, 868MHz
Data Interface: RS232
Power - Output: 9.8dBm
Antenna Connector: Not Included
auf Bestellung 8938 Stücke:
Lieferzeit 10-14 Tag (e)
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TDF8546TH/N2,118 TDF8546TH/N2,118 NXP USA Inc. TDF8546.pdf Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022T,118 NXP USA Inc. TJA1022.pdf Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 6709 Stücke:
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TJA1028TK/5V0/20:1 TJA1028TK/5V0/20:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1370 Stücke:
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8+2.46 EUR
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AFM906NT1 AFM906NT1 NXP USA Inc. AFM906N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 901 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.17 EUR
10+3.11 EUR
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TDA1566TH/N2S,118 TDA1566TH/N2S,118 NXP USA Inc. TDA1566.pdf Description: IC AMP AB MONO/STER 150W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 75W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGS8H2X BGS8H2X NXP USA Inc. BGS8H2.pdf Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 4354 Stücke:
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17+1.07 EUR
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1000+0.46 EUR
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TEA1713T/N2,518 TEA1713T/N2,518 NXP USA Inc. TEA1713T.pdf Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 16 Stücke:
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4+5.44 EUR
10+4.1 EUR
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BGU8M1X BGU8M1X NXP USA Inc. BGU8M1.pdf Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
Lieferzeit 10-14 Tag (e)
20+0.92 EUR
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TJA1029T/20/1J TJA1029T/20/1J NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1029T,118 TJA1029T,118 NXP USA Inc. TJA1029.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
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Mindestbestellmenge: 9
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TEA19162T/2J TEA19162T/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
auf Bestellung 4845 Stücke:
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11+1.71 EUR
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BF513,215 BF513,215 NXP USA Inc. BF510_511_512_513_CNV.pdf Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS8001FTB/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4907 Stücke:
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24+0.76 EUR
28+0.64 EUR
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Mindestbestellmenge: 24
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TEA1738T/N1,118 TEA1738T/N1,118 NXP USA Inc. TEA1738T_TEA1738LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 2371 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.39 EUR
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SL2S1512FTBX SL2S1512FTBX NXP USA Inc. SL2S1412_SL2S1512_SL2S1612.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9695 Stücke:
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Mindestbestellmenge: 28
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BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156,115 NXP USA Inc. BB156.pdf Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS/1,115 NXP USA Inc. TEA1731LTS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7720 Stücke:
Lieferzeit 10-14 Tag (e)
84+0.21 EUR
124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4CTG NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)
11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
Mindestbestellmenge: 11
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CLRC66302HN,118 CLRC663.pdf
CLRC66302HN,118
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 15399 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.3 EUR
10+15.03 EUR
25+14.24 EUR
100+13.16 EUR
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500+12.05 EUR
1000+11.96 EUR
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MFRC63002HN,118 MFRC630.pdf
MFRC63002HN,118
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 7510 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.82 EUR
10+8.51 EUR
25+8.05 EUR
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1000+6.53 EUR
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SLRC61002HN,118 SLRC610.pdf
SLRC61002HN,118
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 19908 Stücke:
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Anzahl Preis
2+9.54 EUR
10+8.27 EUR
25+7.82 EUR
100+7.21 EUR
250+6.85 EUR
500+6.59 EUR
1000+6.34 EUR
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FS32K144HAT0MMHT S32K1xx.pdf
FS32K144HAT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF300A-40MHZ MRF300AN.pdf
MRF300A-40MHZ
Hersteller: NXP USA Inc.
Description: MRF300A REF BOARD 40.68MHZ 330W
Packaging: Bulk
For Use With/Related Products: MRF300A
Frequency: 40.68MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: MRF300A
Produkt ist nicht verfügbar
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MRF300A-27MHZ MRF300AN.pdf
MRF300A-27MHZ
Hersteller: NXP USA Inc.
Description: MRF300AN REF BRD 27MHZ 330W
Packaging: Bulk
For Use With/Related Products: MRF300A
Frequency: 27MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Utilized IC / Part: MRF300A
Produkt ist nicht verfügbar
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S9S12VRP64F0MLF 15944_MC9S12VRRMV3.pdf
S9S12VRP64F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1046TKZ TJA1046.pdf
TJA1046TKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Part Status: Active
auf Bestellung 5014 Stücke:
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Anzahl Preis
5+3.75 EUR
10+2.79 EUR
25+2.55 EUR
100+2.29 EUR
250+2.16 EUR
500+2.09 EUR
1000+2.02 EUR
2500+1.96 EUR
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MC34988CHFKR2 MC34988CHFK.pdf
MC34988CHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm
Voltage - Load: 27V (Max)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 30A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34988CHFK MC34988CHFK.pdf
MC34988CHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Packaging: Tray
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm
Voltage - Load: 27V (Max)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 30A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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FRDM-KW36 MKW36A512.pdf
FRDM-KW36
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KINETIS KW35/36
Packaging: Bulk
For Use With/Related Products: KW35, KW36
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: KW35, KW36
Supplied Contents: Board(s)
Part Status: Active
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FS32R274KSK2MMM PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw
FS32R274KSK2MMM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
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1+65.81 EUR
10+54.42 EUR
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MHT1006NT1
MHT1006NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
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BGA7130,118 BGA7130.pdf
BGA7130,118
Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 12dB
Current - Supply: 450mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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PTN36043BXY PTN36043.pdf
PTN36043BXY
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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LPC845M301JHI33Y LPC84x.pdf
LPC845M301JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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5+3.8 EUR
10+2.52 EUR
25+2.45 EUR
100+2.39 EUR
250+2.26 EUR
500+2.18 EUR
1000+2.11 EUR
2500+2.05 EUR
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AFT18S230SR5
AFT18S230SR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Cut Tape (CT)
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
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1+260.46 EUR
10+220.72 EUR
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CBTL08GP053EVY CBTL08GP053.pdf
CBTL08GP053EVY
Hersteller: NXP USA Inc.
Description: IC MUX CROSSBAR SW USB VFBGA40
Packaging: Cut Tape (CT)
Package / Case: 40-VFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Applications: USB
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 8.5GHz
Supplier Device Package: 40-VFBGA (4.75x3.25)
Voltage - Supply, Single (V+): 1.8V
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4+4.7 EUR
10+4.22 EUR
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TJA1043TK/1Y TJA1043.pdf
TJA1043TK/1Y
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 9670 Stücke:
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7+2.85 EUR
10+2.09 EUR
25+1.9 EUR
100+1.7 EUR
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500+1.54 EUR
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2500+1.44 EUR
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BGA7027,135 BGA7027.pdf
BGA7027,135
Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.7GHZ SOT89-3
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 11dB
Current - Supply: 165mA
Noise Figure: 3.9dB
P1dB: 26dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89-3
Part Status: Active
auf Bestellung 330 Stücke:
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4+5.16 EUR
10+3.92 EUR
25+3.54 EUR
100+3.08 EUR
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MMA20312BVT1
MMA20312BVT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
auf Bestellung 842 Stücke:
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2+11.21 EUR
10+10.27 EUR
25+9.34 EUR
100+8.4 EUR
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500+7 EUR
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UJA1163TK,118 UJA1163.pdf
UJA1163TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Produkt ist nicht verfügbar
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MC9S08PA8AVTGR MC9S08PA60_Rev1.pdf
MC9S08PA8AVTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3755 Stücke:
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Anzahl Preis
7+2.83 EUR
10+2.09 EUR
25+1.9 EUR
100+1.69 EUR
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500+1.54 EUR
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TDF8530TH/N2,118 75017410.pdf
TDF8530TH/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Active
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1+64.7 EUR
10+52.75 EUR
25+49.77 EUR
100+46.49 EUR
250+44.93 EUR
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TJA1024HGZ TJA1024.pdf
TJA1024HGZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Protocol: LINbus
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2852 Stücke:
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4+5.3 EUR
10+4.76 EUR
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100+3.9 EUR
250+3.7 EUR
500+3.32 EUR
1000+2.8 EUR
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PCA9745BTWJ PCA9745B.pdf
PCA9745BTWJ
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN SPI 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 20V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 8MHz
Type: Linear
Operating Temperature: -40°C ~ 105°C
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): No
Topology: Shift Register
Supplier Device Package: 28-HTSSOP
Dimming: SPI
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Grade: Automotive
auf Bestellung 7471 Stücke:
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4+4.72 EUR
10+3.54 EUR
25+3.25 EUR
100+2.92 EUR
250+2.77 EUR
500+2.67 EUR
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TJA1044GTKZ TJA1044.pdf
TJA1044GTKZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 2202 Stücke:
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Anzahl Preis
11+1.71 EUR
15+1.23 EUR
25+1.11 EUR
100+0.98 EUR
250+0.92 EUR
500+0.88 EUR
1000+0.85 EUR
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MCZ33903C5EKR2 MC33903%2C4%2C5.pdf
MCZ33903C5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MCZ33903C3EKR2 MC33903%2C4%2C5.pdf
MCZ33903C3EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC33975ATEKR2 MC33975.pdf
MC33975ATEKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 1000 Stücke:
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Anzahl Preis
2+11.6 EUR
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S9S12XS128J1CALR S12XSFS.pdf
S9S12XS128J1CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
auf Bestellung 420 Stücke:
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TJA1029TK/20/1J TJA1029.pdf
TJA1029TK/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 8681 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.37 EUR
19+0.96 EUR
25+0.92 EUR
100+0.88 EUR
250+0.84 EUR
500+0.81 EUR
1000+0.76 EUR
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TJA1029TK,118 TJA1029.pdf
TJA1029TK,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 4880 Stücke:
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9+2.02 EUR
10+1.81 EUR
25+1.72 EUR
100+1.41 EUR
250+1.32 EUR
500+1.17 EUR
1000+0.92 EUR
2500+0.86 EUR
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TEA19161T/2Y TEA19161T.pdf
TEA19161T/2Y
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
auf Bestellung 8826 Stücke:
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6+3.43 EUR
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25+2.32 EUR
100+2.08 EUR
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500+1.89 EUR
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MC33689DPEWR2 MC33797.pdf
MC33689DPEWR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 377 Stücke:
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2+10.23 EUR
10+9.18 EUR
25+8.68 EUR
100+7.52 EUR
250+7.14 EUR
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TDF8590TH/N1TJ TDF8590TH_2.pdf
TDF8590TH/N1TJ
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 160W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34674CEPR2 MC34674.pdf
MC34674CEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF7941ATSM2AB120, UM10473.pdf
PCF7941ATSM2AB120,
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20SSOP
Packaging: Cut Tape (CT)
Part Status: Active
Features: PLL Frequency Synthesizer and PA
Modulation or Protocol: ASK, FSK, UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: General Purpose
Data Rate (Max): 4.8kbps
DigiKey Programmable: Not Verified
Frequency: 315MHz, 434MHz, 868MHz
Data Interface: RS232
Power - Output: 9.8dBm
Antenna Connector: Not Included
auf Bestellung 8938 Stücke:
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3+8.69 EUR
10+6.66 EUR
25+6.15 EUR
100+5.59 EUR
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TDF8546TH/N2,118 TDF8546.pdf
TDF8546TH/N2,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1022T,118 TJA1022.pdf
TJA1022T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 6709 Stücke:
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10+1.76 EUR
25+1.73 EUR
100+1.69 EUR
250+1.58 EUR
500+1.52 EUR
1000+1.46 EUR
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TJA1028TK/5V0/20:1 TJA1028.pdf
TJA1028TK/5V0/20:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1370 Stücke:
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8+2.46 EUR
11+1.67 EUR
25+1.58 EUR
100+1.48 EUR
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500+1.33 EUR
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AFM906NT1 AFM906N.pdf
AFM906NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 901 Stücke:
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5+4.17 EUR
10+3.11 EUR
25+2.84 EUR
100+2.55 EUR
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500+2.32 EUR
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TDA1566TH/N2S,118 TDA1566.pdf
TDA1566TH/N2S,118
Hersteller: NXP USA Inc.
Description: IC AMP AB MONO/STER 150W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6.5V ~ 18V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 75W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGS8H2X BGS8H2.pdf
BGS8H2X
Hersteller: NXP USA Inc.
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
auf Bestellung 4354 Stücke:
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17+1.07 EUR
19+0.95 EUR
25+0.86 EUR
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250+0.66 EUR
500+0.58 EUR
1000+0.46 EUR
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TEA1713T/N2,518 TEA1713T.pdf
TEA1713T/N2,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 16 Stücke:
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4+5.44 EUR
10+4.1 EUR
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BGU8M1X BGU8M1.pdf
BGU8M1X
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 1370 Stücke:
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20+0.92 EUR
22+0.82 EUR
25+0.74 EUR
100+0.65 EUR
250+0.57 EUR
500+0.5 EUR
1000+0.4 EUR
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TJA1029T/20/1J TJA1029.pdf
TJA1029T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Produkt ist nicht verfügbar
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TJA1029T,118 TJA1029.pdf
TJA1029T,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.11 EUR
10+1.89 EUR
25+1.79 EUR
100+1.47 EUR
250+1.37 EUR
500+1.21 EUR
1000+0.96 EUR
Mindestbestellmenge: 9
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TEA19162T/2J TEA19162T.pdf
TEA19162T/2J
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
auf Bestellung 4845 Stücke:
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Anzahl Preis
11+1.71 EUR
15+1.24 EUR
25+1.12 EUR
100+0.99 EUR
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BF513,215 BF510_511_512_513_CNV.pdf
BF513,215
Hersteller: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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HTMS8001FTB/AF,115 HTMS1X01_8X01.pdf
HTMS8001FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
auf Bestellung 4907 Stücke:
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24+0.76 EUR
28+0.64 EUR
30+0.61 EUR
100+0.55 EUR
250+0.52 EUR
500+0.5 EUR
1000+0.48 EUR
Mindestbestellmenge: 24
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TEA1738T/N1,118 TEA1738T_TEA1738LT.pdf
TEA1738T/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
auf Bestellung 2371 Stücke:
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13+1.39 EUR
18+1 EUR
25+0.9 EUR
100+0.79 EUR
250+0.74 EUR
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1000+0.68 EUR
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SL2S1512FTBX SL2S1412_SL2S1512_SL2S1612.pdf
SL2S1512FTBX
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 9695 Stücke:
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28+0.63 EUR
33+0.55 EUR
34+0.52 EUR
100+0.47 EUR
250+0.45 EUR
500+0.43 EUR
1000+0.41 EUR
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BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
auf Bestellung 588 Stücke:
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BB156,115 BB156.pdf
BB156,115
Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
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TEA1731LTS/1,115 TEA1731LTS.pdf
TEA1731LTS/1,115
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
auf Bestellung 7720 Stücke:
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Anzahl Preis
84+0.21 EUR
124+0.14 EUR
141+0.13 EUR
167+0.11 EUR
250+0.097 EUR
500+0.091 EUR
1000+0.087 EUR
2500+0.082 EUR
5000+0.079 EUR
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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MC9S08PL4CTG MC9S08PL4.pdf
MC9S08PL4CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.67 EUR
15+1.21 EUR
96+0.97 EUR
192+0.92 EUR
288+0.9 EUR
576+0.86 EUR
1056+0.84 EUR
2592+0.8 EUR
Mindestbestellmenge: 11
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