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BGS8M2X BGS8M2X NXP USA Inc. BGS8M2.pdf Description: IC RF AMP 1.8GHZ-2.2GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.4dB
Current - Supply: 5.8mA
Noise Figure: 0.85dB
Test Frequency: 2.2GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3750 Stücke:
Lieferzeit 10-14 Tag (e)
15+1.18 EUR
20+0.89 EUR
25+0.79 EUR
100+0.68 EUR
250+0.62 EUR
500+0.58 EUR
1000+0.54 EUR
Mindestbestellmenge: 15
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LTE3401LX LTE3401LX NXP USA Inc. LTE3401L.pdf Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 452 Stücke:
Lieferzeit 10-14 Tag (e)
20+0.88 EUR
29+0.61 EUR
33+0.54 EUR
100+0.47 EUR
250+0.44 EUR
Mindestbestellmenge: 20
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LTE3401HX LTE3401HX NXP USA Inc. LTE3401H.pdf Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 2764 Stücke:
Lieferzeit 10-14 Tag (e)
23+0.79 EUR
33+0.55 EUR
37+0.49 EUR
100+0.42 EUR
250+0.39 EUR
500+0.37 EUR
1000+0.36 EUR
2500+0.34 EUR
Mindestbestellmenge: 23
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TJA1027T/20/1J TJA1027T/20/1J NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2239 Stücke:
Lieferzeit 10-14 Tag (e)
12+1.50 EUR
18+1.02 EUR
25+0.95 EUR
100+0.87 EUR
250+0.86 EUR
500+0.84 EUR
1000+0.79 EUR
Mindestbestellmenge: 12
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MPXV2202DPT1 MPXV2202DPT1 NXP USA Inc. MPX2202.pdf Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 677 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.88 EUR
5+21.74 EUR
10+20.94 EUR
25+19.98 EUR
50+19.32 EUR
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BAP50-03,135 BAP50-03,135 NXP USA Inc. BAP50-03.pdf Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC33660BEFR2 MC33660BEFR2 NXP USA Inc. MC33660.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 26449 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.27 EUR
10+2.41 EUR
25+2.20 EUR
100+1.96 EUR
250+1.85 EUR
500+1.78 EUR
1000+1.73 EUR
Mindestbestellmenge: 6
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TJA1081BTS,118 TJA1081BTS,118 NXP USA Inc. TJA1081B.pdf Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 4014 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.76 EUR
10+6.70 EUR
25+6.18 EUR
100+5.61 EUR
250+5.34 EUR
500+5.18 EUR
1000+5.04 EUR
Mindestbestellmenge: 3
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MFRC52202HN1,115 MFRC52202HN1,115 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1946 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.23 EUR
10+10.61 EUR
25+10.05 EUR
100+9.27 EUR
250+8.81 EUR
500+8.48 EUR
Mindestbestellmenge: 2
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SL2S5002FTB,115 SL2S5002FTB,115 NXP USA Inc. SL2S5002_SL2S5102.pdf Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 2210 Stücke:
Lieferzeit 10-14 Tag (e)
28+0.63 EUR
33+0.54 EUR
35+0.51 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
1000+0.40 EUR
Mindestbestellmenge: 28
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TJA1051TK/3/1J TJA1051TK/3/1J NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 16984 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.88 EUR
13+1.37 EUR
25+1.24 EUR
100+1.10 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.96 EUR
2500+0.92 EUR
Mindestbestellmenge: 10
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MCZ33810EKR2 MCZ33810EKR2 NXP USA Inc. MC33810.pdf Description: IC DVR 8-CH ENGINE CTRL 32-SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
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MK22FN512CAP12R MK22FN512CAP12R NXP USA Inc. K22P80M120SF7.pdf Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 5649 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.52 EUR
10+16.98 EUR
25+15.84 EUR
100+14.59 EUR
250+13.99 EUR
500+13.64 EUR
1000+13.34 EUR
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A2G35S200-01SR3 A2G35S200-01SR3 NXP USA Inc. A2G35S200-01S.pdf Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
1+227.69 EUR
10+216.92 EUR
25+212.30 EUR
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MF3MOD2101DA8/05,1 MF3MOD2101DA8/05,1 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 29623 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.45 EUR
10+3.31 EUR
25+3.03 EUR
100+2.72 EUR
250+2.57 EUR
500+2.48 EUR
1000+2.41 EUR
2500+2.33 EUR
5000+2.29 EUR
Mindestbestellmenge: 4
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A2G35S160-01SR3 A2G35S160-01SR3 NXP USA Inc. A2G35S160-01S.pdf Description: RF MOSFET GAN 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
auf Bestellung 172 Stücke:
Lieferzeit 10-14 Tag (e)
1+264.42 EUR
10+224.14 EUR
25+214.08 EUR
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MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 764 Stücke:
Lieferzeit 10-14 Tag (e)
1+148.14 EUR
10+123.73 EUR
25+117.64 EUR
100+110.95 EUR
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MF3MOD8101DA4/05,1 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 13468 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.20 EUR
10+4.68 EUR
25+4.30 EUR
100+3.88 EUR
250+3.68 EUR
500+3.56 EUR
1000+3.46 EUR
2500+3.36 EUR
Mindestbestellmenge: 3
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MF3MODH4101DA4/05, NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 16317 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.83 EUR
10+4.39 EUR
25+4.03 EUR
100+3.63 EUR
250+3.44 EUR
500+3.33 EUR
1000+3.24 EUR
2500+3.14 EUR
5000+3.08 EUR
Mindestbestellmenge: 4
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NCF29A1MHN/0500IJ NCF29A1MHN/0500IJ NXP USA Inc. NCF29A1MHN_Web.pdf Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 6029 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.54 EUR
10+12.09 EUR
25+11.23 EUR
100+10.28 EUR
250+9.83 EUR
500+9.55 EUR
1000+9.33 EUR
Mindestbestellmenge: 2
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SCIMX6X3EVK10ABR SCIMX6X3EVK10ABR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HT1MOA4S30/E/3J HT1MOA4S30/E/3J NXP USA Inc. HT1X_SDS.pdf Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 16437 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.11 EUR
10+5.27 EUR
25+4.99 EUR
100+4.59 EUR
250+4.35 EUR
500+4.18 EUR
1000+4.02 EUR
Mindestbestellmenge: 3
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A2T26H300-24SR6 A2T26H300-24SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ NCF29A4XHN/0500VJ NXP USA Inc. Description: IC 32HVQFN
Produkt ist nicht verfügbar
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MCIMX6X2EVN10ABR MCIMX6X2EVN10ABR NXP USA Inc. IMX6SXCEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+55.69 EUR
10+45.20 EUR
25+42.58 EUR
100+39.70 EUR
250+38.33 EUR
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MCIMX31LCVMN4DR2 MCIMX31LCVMN4DR2 NXP USA Inc. MCIMX31C.pdf Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 748 Stücke:
Lieferzeit 10-14 Tag (e)
1+83.92 EUR
10+68.96 EUR
25+65.23 EUR
100+61.12 EUR
250+59.16 EUR
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MRFE6VP5600HR6 MRFE6VP5600HR6 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
1+335.79 EUR
10+291.80 EUR
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PN5180A0HN/C2Y PN5180A0HN/C2Y NXP USA Inc. PN5180A0XX-C1-C2.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 9708 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.67 EUR
10+13.00 EUR
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100+11.07 EUR
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500+10.31 EUR
1000+10.07 EUR
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MF1S7030XDA4/V1J MF1S7030XDA4/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
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5+3.61 EUR
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100+2.18 EUR
250+2.06 EUR
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1000+1.92 EUR
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MCIMX357CJQ5CR2 MCIMX357CJQ5CR2 NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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A2I25D025GNR1 A2I25D025GNR1 NXP USA Inc. A2I25D025N.pdf Description: IC TRANS RF LDMOS
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MMPF0100F9ANESR2 MMPF0100F9ANESR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 11297 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.98 EUR
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NCK2983AHN/T2CY NCK2983AHN/T2CY NXP USA Inc. Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Memory Size: 32kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.1V ~ 5.5V
Current - Receiving: 17mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: ASK, FSK
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S5030XDA8/V1J NXP USA Inc. MF1S50yyX_V1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 27018 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.01 EUR
13+1.46 EUR
25+1.32 EUR
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250+1.10 EUR
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1000+1.02 EUR
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5000+0.96 EUR
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MMPF0100F0AEPR2 MMPF0100F0AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 6490 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.75 EUR
10+11.48 EUR
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100+9.75 EUR
250+9.32 EUR
500+9.07 EUR
1000+8.85 EUR
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MMPF0100F1AEPR2 MMPF0100F1AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
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MMPF0100NPAEPR2 MMPF0100NPAEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 3950 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.26 EUR
10+11.86 EUR
25+11.01 EUR
100+10.08 EUR
250+9.64 EUR
500+9.37 EUR
1000+9.15 EUR
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MKM14Z128CHH5R MKM14Z128CHH5R NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 MCIMX233DJM4CR2 NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR S9S08EL16F1VTJR NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.63 EUR
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SPC5606BK0MLL6R SPC5606BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R SPC5605BK0MLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.32 EUR
10+28.31 EUR
25+26.56 EUR
100+24.64 EUR
250+23.72 EUR
500+23.17 EUR
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PN5120A0ET/C2J PN5120A0ET/C2J NXP USA Inc. PN512.pdf Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3135 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.36 EUR
10+14.27 EUR
25+13.03 EUR
100+11.52 EUR
250+10.71 EUR
500+10.19 EUR
1000+9.73 EUR
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
1+67.76 EUR
10+55.33 EUR
25+52.22 EUR
100+48.81 EUR
250+47.18 EUR
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MCIMX257CJM4AR2 MCIMX257CJM4AR2 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z TFA9891UK/N1/S1Z NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC845-BRK LPC845-BRK NXP USA Inc. LPC84x.pdf Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.88 EUR
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LPC54S016JET100E LPC54S016JET100E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.24 EUR
10+10.24 EUR
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100+8.67 EUR
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LPC54S018-EVK LPC54S018-EVK NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: LPCXPRESSO LPC54S018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54S018
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080SIP-DK QN9080SIP-DK NXP USA Inc. QN9080-001-M17.pdf Description: QN9080SIP DEV KIT + DONGLE
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: QN908x
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Lieferzeit 10-14 Tag (e)
1+216.18 EUR
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QN9080-001-M17AZ QN9080-001-M17AZ NXP USA Inc. QN9080-001-M17.pdf Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Cut Tape (CT)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
1+33.33 EUR
10+29.06 EUR
25+27.57 EUR
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MIMX8MM4DVTLZAA MIMX8MM4DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.29 EUR
10+48.20 EUR
25+45.43 EUR
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MIMX8MM3DVTLZAA MIMX8MM3DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
1+45.28 EUR
10+36.76 EUR
25+35.08 EUR
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MIMX8MM1DVTLZAA MIMX8MM1DVTLZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 152 Stücke:
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MIMX8MM1CVTKZAA MIMX8MM1CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 159 Stücke:
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8MMINILPD4-EVK 8MMINILPD4-EVK NXP USA Inc. IMX8MMINIFS.pdf Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA MIMX8MM6DVTLZAA NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 634 Stücke:
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MIMX8MM6CVTKZAA MIMX8MM6CVTKZAA NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 248 Stücke:
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BGS8M2X BGS8M2.pdf
BGS8M2X
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.8GHZ-2.2GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 14.4dB
Current - Supply: 5.8mA
Noise Figure: 0.85dB
Test Frequency: 2.2GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3750 Stücke:
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Anzahl Preis
15+1.18 EUR
20+0.89 EUR
25+0.79 EUR
100+0.68 EUR
250+0.62 EUR
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1000+0.54 EUR
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LTE3401LX LTE3401L.pdf
LTE3401LX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 617MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 617MHz ~ 960MHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.2dB
Current - Supply: 10.3mA
Noise Figure: 0.66dB
P1dB: -7.4dBm
Test Frequency: 943MHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 452 Stücke:
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Anzahl Preis
20+0.88 EUR
29+0.61 EUR
33+0.54 EUR
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250+0.44 EUR
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LTE3401HX LTE3401H.pdf
LTE3401HX
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.452-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.452GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.5dB
Current - Supply: 13.4mA
Noise Figure: 0.75dB
P1dB: -7.5dBm
Test Frequency: 2.69GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 2764 Stücke:
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23+0.79 EUR
33+0.55 EUR
37+0.49 EUR
100+0.42 EUR
250+0.39 EUR
500+0.37 EUR
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2500+0.34 EUR
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TJA1027T/20/1J TJA1027.pdf
TJA1027T/20/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
auf Bestellung 2239 Stücke:
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12+1.50 EUR
18+1.02 EUR
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100+0.87 EUR
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MPXV2202DPT1 MPX2202.pdf
MPXV2202DPT1
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 677 Stücke:
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1+23.88 EUR
5+21.74 EUR
10+20.94 EUR
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BAP50-03,135 BAP50-03.pdf
BAP50-03,135
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC33660BEFR2 MC33660.pdf
MC33660BEFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
auf Bestellung 26449 Stücke:
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6+3.27 EUR
10+2.41 EUR
25+2.20 EUR
100+1.96 EUR
250+1.85 EUR
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1000+1.73 EUR
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TJA1081BTS,118 TJA1081B.pdf
TJA1081BTS,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SSOP
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 16-SSOP
Part Status: Active
Grade: Automotive
auf Bestellung 4014 Stücke:
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3+8.76 EUR
10+6.70 EUR
25+6.18 EUR
100+5.61 EUR
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MFRC52202HN1,115 MFRC522.pdf
MFRC52202HN1,115
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1946 Stücke:
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Anzahl Preis
2+12.23 EUR
10+10.61 EUR
25+10.05 EUR
100+9.27 EUR
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SL2S5002FTB,115 SL2S5002_SL2S5102.pdf
SL2S5002FTB,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
auf Bestellung 2210 Stücke:
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Anzahl Preis
28+0.63 EUR
33+0.54 EUR
35+0.51 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
1000+0.40 EUR
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TJA1051TK/3/1J TJA1051.pdf
TJA1051TK/3/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 16984 Stücke:
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Anzahl Preis
10+1.88 EUR
13+1.37 EUR
25+1.24 EUR
100+1.10 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.96 EUR
2500+0.92 EUR
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MCZ33810EKR2 MC33810.pdf
MCZ33810EKR2
Hersteller: NXP USA Inc.
Description: IC DVR 8-CH ENGINE CTRL 32-SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Current - Supply: 10mA
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
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MK22FN512CAP12R K22P80M120SF7.pdf
MK22FN512CAP12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (4.13x3.56)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 5649 Stücke:
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1+21.52 EUR
10+16.98 EUR
25+15.84 EUR
100+14.59 EUR
250+13.99 EUR
500+13.64 EUR
1000+13.34 EUR
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A2G35S200-01SR3 A2G35S200-01S.pdf
A2G35S200-01SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
auf Bestellung 77 Stücke:
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1+227.69 EUR
10+216.92 EUR
25+212.30 EUR
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MF3MOD2101DA8/05,1 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
MF3MOD2101DA8/05,1
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 29623 Stücke:
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4+4.45 EUR
10+3.31 EUR
25+3.03 EUR
100+2.72 EUR
250+2.57 EUR
500+2.48 EUR
1000+2.41 EUR
2500+2.33 EUR
5000+2.29 EUR
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A2G35S160-01SR3 A2G35S160-01S.pdf
A2G35S160-01SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI400
Packaging: Cut Tape (CT)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
auf Bestellung 172 Stücke:
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Anzahl Preis
1+264.42 EUR
10+224.14 EUR
25+214.08 EUR
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MCIMX6D6AVT10ADR IMX6DQIEC.pdf
MCIMX6D6AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 764 Stücke:
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Anzahl Preis
1+148.14 EUR
10+123.73 EUR
25+117.64 EUR
100+110.95 EUR
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MF3MOD8101DA4/05,1 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 13468 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.20 EUR
10+4.68 EUR
25+4.30 EUR
100+3.88 EUR
250+3.68 EUR
500+3.56 EUR
1000+3.46 EUR
2500+3.36 EUR
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MF3MODH4101DA4/05, MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Part Status: Active
auf Bestellung 16317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.83 EUR
10+4.39 EUR
25+4.03 EUR
100+3.63 EUR
250+3.44 EUR
500+3.33 EUR
1000+3.24 EUR
2500+3.14 EUR
5000+3.08 EUR
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NCF29A1MHN/0500IJ NCF29A1MHN_Web.pdf
NCF29A1MHN/0500IJ
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 6029 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.54 EUR
10+12.09 EUR
25+11.23 EUR
100+10.28 EUR
250+9.83 EUR
500+9.55 EUR
1000+9.33 EUR
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SCIMX6X3EVK10ABR
SCIMX6X3EVK10ABR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HT1MOA4S30/E/3J HT1X_SDS.pdf
HT1MOA4S30/E/3J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6.5V
Supplier Device Package: PLLMC
Part Status: Active
auf Bestellung 16437 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.11 EUR
10+5.27 EUR
25+4.99 EUR
100+4.59 EUR
250+4.35 EUR
500+4.18 EUR
1000+4.02 EUR
Mindestbestellmenge: 3
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A2T26H300-24SR6
A2T26H300-24SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Configuration: Dual
Power - Output: 60W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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NCF29A4XHN/0500VJ
NCF29A4XHN/0500VJ
Hersteller: NXP USA Inc.
Description: IC 32HVQFN
Produkt ist nicht verfügbar
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MCIMX6X2EVN10ABR IMX6SXCEC.pdf
MCIMX6X2EVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.69 EUR
10+45.20 EUR
25+42.58 EUR
100+39.70 EUR
250+38.33 EUR
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MCIMX31LCVMN4DR2 MCIMX31C.pdf
MCIMX31LCVMN4DR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Cut Tape (CT)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Part Status: Active
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
auf Bestellung 748 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+83.92 EUR
10+68.96 EUR
25+65.23 EUR
100+61.12 EUR
250+59.16 EUR
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MRFE6VP5600HR6 MRFE6VP5600H.pdf
MRFE6VP5600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+335.79 EUR
10+291.80 EUR
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PN5180A0HN/C2Y PN5180A0XX-C1-C2.pdf
PN5180A0HN/C2Y
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 9708 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.67 EUR
10+13.00 EUR
25+12.08 EUR
100+11.07 EUR
250+10.59 EUR
500+10.31 EUR
1000+10.07 EUR
Mindestbestellmenge: 2
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MF1S7030XDA4/V1J MF1S50yyX_V1.pdf
MF1S7030XDA4/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 14535 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.61 EUR
10+2.67 EUR
25+2.44 EUR
100+2.18 EUR
250+2.06 EUR
500+1.98 EUR
1000+1.92 EUR
2500+1.86 EUR
5000+1.82 EUR
Mindestbestellmenge: 5
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MCIMX357CJQ5CR2 MCIMX35SR2CEC.pdf
MCIMX357CJQ5CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Part Status: Active
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+54.12 EUR
10+43.95 EUR
25+41.41 EUR
100+38.62 EUR
250+37.29 EUR
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A2I25D025GNR1 A2I25D025N.pdf
A2I25D025GNR1
Hersteller: NXP USA Inc.
Description: IC TRANS RF LDMOS
auf Bestellung 773 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.75 EUR
10+55.10 EUR
25+52.63 EUR
100+47.05 EUR
250+44.89 EUR
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MMPF0100F9ANESR2 MMPF0100.pdf
MMPF0100F9ANESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 11297 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.98 EUR
10+12.44 EUR
25+11.56 EUR
100+10.59 EUR
250+10.12 EUR
500+9.84 EUR
1000+9.62 EUR
Mindestbestellmenge: 2
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NCK2983AHN/T2CY
NCK2983AHN/T2CY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Memory Size: 32kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.1V ~ 5.5V
Current - Receiving: 17mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: ASK, FSK
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF1S5030XDA8/V1J MF1S50yyX_V1.pdf
MF1S5030XDA8/V1J
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Cut Tape (CT)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Not For New Designs
auf Bestellung 27018 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.01 EUR
13+1.46 EUR
25+1.32 EUR
100+1.17 EUR
250+1.10 EUR
500+1.06 EUR
1000+1.02 EUR
2500+0.98 EUR
5000+0.96 EUR
Mindestbestellmenge: 9
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MMPF0100F0AEPR2 MMPF0100.pdf
MMPF0100F0AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 6490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.75 EUR
10+11.48 EUR
25+10.66 EUR
100+9.75 EUR
250+9.32 EUR
500+9.07 EUR
1000+8.85 EUR
Mindestbestellmenge: 2
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MMPF0100F1AEPR2 MMPF0100.pdf
MMPF0100F1AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
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MMPF0100NPAEPR2 MMPF0100.pdf
MMPF0100NPAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 3950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.26 EUR
10+11.86 EUR
25+11.01 EUR
100+10.08 EUR
250+9.64 EUR
500+9.37 EUR
1000+9.15 EUR
Mindestbestellmenge: 2
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MKM14Z128CHH5R MKMxxZxxCxx5.pdf
MKM14Z128CHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX233DJM4CR2 IMX233FS.pdf
MCIMX233DJM4CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Produkt ist nicht verfügbar
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S9S08EL16F1VTJR MC9S08EL32.pdf
S9S08EL16F1VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.63 EUR
Mindestbestellmenge: 2
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SPC5606BK0MLL6R MPC5606B.pdf
SPC5606BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLL6R MPC5606B.pdf
SPC5605BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.32 EUR
10+28.31 EUR
25+26.56 EUR
100+24.64 EUR
250+23.72 EUR
500+23.17 EUR
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PN5120A0ET/C2J PN512.pdf
PN5120A0ET/C2J
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64TFBGA
Packaging: Cut Tape (CT)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 64-TFBGA (5.5x5.5)
Part Status: Active
auf Bestellung 3135 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.36 EUR
10+14.27 EUR
25+13.03 EUR
100+11.52 EUR
250+10.71 EUR
500+10.19 EUR
1000+9.73 EUR
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MCIMX6S5EVM10ACR IMX6SDLCEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 502 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+67.76 EUR
10+55.33 EUR
25+52.22 EUR
100+48.81 EUR
250+47.18 EUR
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MCIMX257CJM4AR2 IMX25CEC.pdf
MCIMX257CJM4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Cut Tape (CT)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TFA9891UK/N1/S1Z
TFA9891UK/N1/S1Z
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Packaging: Cut Tape (CT)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 49-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Supplier Device Package: 49-WLCSP (3.43x2.98)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC845-BRK LPC84x.pdf
LPC845-BRK
Hersteller: NXP USA Inc.
Description: MCUXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Part Status: Active
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Anzahl Preis
2+10.88 EUR
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LPC54S016JET100E LPC540XXMCUFAMFS.pdf
LPC54S016JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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2+13.24 EUR
10+10.24 EUR
25+9.50 EUR
100+8.67 EUR
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LPC54S018-EVK LPC540XXMCUFAMFS.pdf
LPC54S018-EVK
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54S018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54S018
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Tape & Reel (TR)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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QN9080SIP-DK QN9080-001-M17.pdf
QN9080SIP-DK
Hersteller: NXP USA Inc.
Description: QN9080SIP DEV KIT + DONGLE
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Utilized IC / Part: QN908x
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1+216.18 EUR
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QN9080-001-M17AZ QN9080-001-M17.pdf
QN9080-001-M17AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 54LFLGA
Packaging: Cut Tape (CT)
Package / Case: 54-LFLGA
Sensitivity: -92.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.67V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 54-LFLGA (9.7x6)
GPIO: 32
Modulation: FSK
RF Family/Standard: Bluetooth
Serial Interfaces: ADC, GPIO, I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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1+33.33 EUR
10+29.06 EUR
25+27.57 EUR
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MIMX8MM4DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM4DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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1+59.29 EUR
10+48.20 EUR
25+45.43 EUR
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MIMX8MM3DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM3DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 94 Stücke:
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1+45.28 EUR
10+36.76 EUR
25+35.08 EUR
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MIMX8MM1DVTLZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
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1+44.63 EUR
10+36.22 EUR
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MIMX8MM1CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM1CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 159 Stücke:
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1+51.57 EUR
10+41.98 EUR
25+39.58 EUR
152+37.86 EUR
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8MMINILPD4-EVK IMX8MMINIFS.pdf
8MMINILPD4-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M MINI EVAL BRD
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAA IMX8MMCEC.pdf
MIMX8MM6DVTLZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 634 Stücke:
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Anzahl Preis
1+60.33 EUR
10+49.08 EUR
25+46.28 EUR
152+42.47 EUR
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MIMX8MM6CVTKZAA i.MX8M_Mini_Appl_Processor.pdf
MIMX8MM6CVTKZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Part Status: Active
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 248 Stücke:
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1+65.67 EUR
10+53.57 EUR
25+50.55 EUR
152+46.46 EUR
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