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ASL5015FHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Grade: Automotive
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0MLFT FS32K142HAT0MLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
auf Bestellung 1003 Stücke:
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2+13.96 EUR
10+10.87 EUR
25+10.1 EUR
100+9.25 EUR
250+8.82 EUR
500+8.58 EUR
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S9S12G48AVLFR S9S12G48AVLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
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MF2DL1001DUF/02Z NXP USA Inc. MF2DLHX0.pdf Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
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SPC5675KFK0MMM2 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
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ASL5108FHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRVR CTRLR PWM 36HVQFN
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Applications: Automotive
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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SLN-ALEXA-IOT SLN-ALEXA-IOT NXP USA Inc. IMXRT1060CEC_SUPPLEMENT.pdf Description: EVAL BOARD FOR MIMXRT106ADVL6A
Packaging: Bulk
Function: Audio Processing
Type: Audio
Contents: Board(s)
Utilized IC / Part: MIMXRT106ADVL6A
Supplied Contents: Board(s)
Primary Attributes: Audio Front End
Embedded: No
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PCA9491AUKZ NXP USA Inc. Description: 6A DIRECT CHARGER
Part Status: Active
Packaging: Tape & Reel (TR)
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LPC845M301JHI48Y LPC845M301JHI48Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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FS32K116LIT0VFMR FS32K116LIT0VFMR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS2088ARDB-KIT NXP USA Inc. Description: LS2088ARDB-KIT ADVANCED ACCESSOR
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: LS2088A
Produkt ist nicht verfügbar
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FS32K118LFT0MLFR FS32K118LFT0MLFR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144HAT0MLFT FS32K144HAT0MLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 1829 Stücke:
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10+10.28 EUR
25+10.09 EUR
100+9.8 EUR
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FS32K142HRT0MLHT FS32K142HRT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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100+23.93 EUR
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NCF295AVHN4/0300ZY NXP USA Inc. Description: ACTIC-SRX
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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A3G20S250-01SR3 NXP USA Inc. A3G20S250-01S.pdf Description: AIRFAST RF POWER GAN TRANSISTOR
Produkt ist nicht verfügbar
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MKW35A512VFT4 MKW35A512VFT4 NXP USA Inc. MKW36A512.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LS1028AXN7NQA LS1028AXN7NQA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
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SAF775DHV/N208Q/FY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LS2048ASE711B NXP USA Inc. Description: LS2048A ST WE 2100 R1.1
Produkt ist nicht verfügbar
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TEA19162T/3J TEA19162T/3J NXP USA Inc. TEA19162T.pdf Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
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A2G22S190-01SR3 NXP USA Inc. A2G22S190-01S.pdf Description: RF MOSFET
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC40XS6500CEKR2 NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH 12V PENTA 40MOH
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MC33FS8410G6ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8410
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K116LFT0VLFR FS32K116LFT0VLFR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A3I35D025WGNR1 A3I35D025WGNR1 NXP USA Inc. A3I35D025WN.pdf Description: IC AMP GPS 3.2GHZ-4GHZ TO270WBG
Supplier Device Package: TO-270WBG-17
Test Frequency: 3.8GHz ~ 4GHz
P1dB: 42.6dBm
Gain: 30.5dB
Voltage - Supply: 28V
RF Type: General Purpose
Frequency: 3.2GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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LS1018ASE7HNA LS1018ASE7HNA NXP USA Inc. Download?colCode=LS1027A&amp;location=null Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 1 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ASL5015SHV/0Y ASL5015SHV/0Y NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 48-HLQFP (7x7)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF2DL1001DUD/02Z NXP USA Inc. MF2DLHX0.pdf Description: MIFARE DESFIRE LIGHT CONTACTLESS
Supplier Device Package: Wafer
Standards: Mifare, ISO 14443, ISO 7816-4
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
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FS32K142UAT0VLFT FS32K142UAT0VLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
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10+7.62 EUR
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MC9S08PL16SCTG MC9S08PL16SCTG NXP USA Inc. MC9S08PL16S.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
Core Size: 8-Bit
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9+2.04 EUR
12+1.49 EUR
96+1.2 EUR
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MC9S08PL8SCTG MC9S08PL8SCTG NXP USA Inc. MC9S08PL16S.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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10+2.06 EUR
96+1.6 EUR
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MC9S08PL16SCTJ MC9S08PL16SCTJ NXP USA Inc. MC9S08PL16S.pdf Description: IC MCU S08PLS 8-BIT TSSOP20
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FS32K148HAT0MLLT FS32K148HAT0MLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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1+34.94 EUR
10+27.96 EUR
25+23.89 EUR
80+23.5 EUR
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OM5569/NT322E NXP USA Inc. Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: NT3H1101
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08PB16MTG MC9S08PB16MTG NXP USA Inc. MC9S08PB16.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC9S08PB8VTG MC9S08PB8VTG NXP USA Inc. MC9S08PB16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PB16VTJ MC9S08PB16VTJ NXP USA Inc. MC9S08PB16.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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74LV27D,112 74LV27D,112 NXP USA Inc. 74LV27.pdf Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
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PEMI2QFN/WT,115 PEMI2QFN/WT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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TEA1611T/N2,518 TEA1611T/N2,518 NXP USA Inc. TEA1611T.pdf Description: IC CTLR RESONANT CONVERT 20-SOIC
Current - Supply: 2.4 mA
Part Status: Obsolete
Applications: Resonant Converter Controller
Voltage - Supply: 11V ~ 13V
Operating Temperature: -25°C ~ 70°C
Packaging: Bulk
DigiKey Programmable: Not Verified
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LD6836CX4/28H,315 LD6836CX4/28H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.8V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6836CX4/14P,315 LD6836CX4/14P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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N74F02D,602 N74F02D,602 NXP USA Inc. DS_568_74F02.pdf Description: IC GATE NOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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HEF4543BP,652 HEF4543BP,652 NXP USA Inc. HEF4543B.pdf Description: IC DRVR 7 SEGMENT 16DIP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 16-DIP
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment
Interface: BCD
Mounting Type: Through Hole
Display Type: LED, LCD
Package / Case: 16-DIP (0.300", 7.62mm)
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ADC1415S105HN/C1,5 ADC1415S105HN/C1,5 NXP USA Inc. ADC1415S_Series.pdf Description: IC ADC 14BIT PIPELINED 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V, 5V
Voltage - Supply, Digital: 2.85V ~ 3.4V, 5V
Sampling Rate (Per Second): 105M
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 40-HVQFN (6x6)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
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74HC670D,652 74HC670D,652 NXP USA Inc. 74HC(T)670.pdf Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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BFG10W/X,115 BFG10W/X,115 NXP USA Inc. BFG10W_X_Rev_Oct2010.pdf Description: RF TRANS NPN 10V 1.9GHZ 4SO
Supplier Device Package: 4-SO
Frequency - Transition: 1.9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 50mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 250mA
Power - Max: 400mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343 Reverse Pinning
Packaging: Bulk
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LD6836CX4/33H,315 LD6836CX4/33H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6836CX4/12P,315 LD6836CX4/12P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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BGA2716,115 BGA2716,115 NXP USA Inc. BGA2716_Rev3.pdf Description: IC AMP ISM 50MHZ-3.6GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 50MHz ~ 3.6GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 22.9dB
Current - Supply: 15.9mA
Noise Figure: 5.3dB
P1dB: 8.9dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BAP63-05W,115 BAP63-05W,115 NXP USA Inc. BAP63-05W_Rev_Oct2010.pdf Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
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74HCT40105N,112 74HCT40105N,112 NXP USA Inc. 74HC%28T%2940105_Rev3.pdf Description: IC FIFO ASYNC 16X4 40NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Function: Asynchronous
Memory Size: 64 (16 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 28MHz
Access Time: 40ns
Supplier Device Package: 16-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 5.5 V
DigiKey Programmable: Not Verified
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PDTA123EE,115 PDTA123EE,115 NXP USA Inc. PDTA123E_SERIES.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
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BLF888,112 BLF888,112 NXP USA Inc. Description: TRANSISTOR RF PWR LDMOS SOT979A
Packaging: Tube
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual, Common Source
Power - Output: 250W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: CDFM2
Voltage - Rated: 104 V
Voltage - Test: 50 V
Current - Test: 1.3 A
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LD6836CX4/36P,315 LD6836CX4/36P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.6V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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CBT3251DS,118 CBT3251DS,118 NXP USA Inc. PHGLS29765-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX 1 X 8:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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NTS0101GM,115 NTS0101GM,115 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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74ABT08N,112 74ABT08N,112 NXP USA Inc. 74ABT08_DS_Rev2.pdf Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
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74CBTLV3861DK,118 74CBTLV3861DK,118 NXP USA Inc. 74CBTLV3861.pdf Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
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ASL5015FHNZ PB_ASL5xxxyHz.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Grade: Automotive
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0MLFT S32K1xx.pdf
FS32K142HAT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
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S9S12G48AVLFR
S9S12G48AVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Produkt ist nicht verfügbar
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MF2DL1001DUF/02Z MF2DLHX0.pdf
Hersteller: NXP USA Inc.
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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SPC5675KFK0MMM2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ASL5108FHNZ PB_ASL5xxxyHz.pdf
Hersteller: NXP USA Inc.
Description: IC LED DRVR CTRLR PWM 36HVQFN
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 36-HVQFN (6x6)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 800mA
Applications: Automotive
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SLN-ALEXA-IOT IMXRT1060CEC_SUPPLEMENT.pdf
SLN-ALEXA-IOT
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MIMXRT106ADVL6A
Packaging: Bulk
Function: Audio Processing
Type: Audio
Contents: Board(s)
Utilized IC / Part: MIMXRT106ADVL6A
Supplied Contents: Board(s)
Primary Attributes: Audio Front End
Embedded: No
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PCA9491AUKZ
Hersteller: NXP USA Inc.
Description: 6A DIRECT CHARGER
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC84x.pdf
LPC845M301JHI48Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K116LIT0VFMR S32K-DS.pdf
FS32K116LIT0VFMR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS2088ARDB-KIT
Hersteller: NXP USA Inc.
Description: LS2088ARDB-KIT ADVANCED ACCESSOR
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: LS2088A
Produkt ist nicht verfügbar
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FS32K118LFT0MLFR S32K1xx.pdf
FS32K118LFT0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144HAT0MLFT S32K1xx.pdf
FS32K144HAT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
auf Bestellung 1829 Stücke:
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AnzahlPreis
2+16.58 EUR
10+10.28 EUR
25+10.09 EUR
100+9.8 EUR
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FS32K142HRT0MLHT S32K1xx.pdf
FS32K142HRT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 794 Stücke:
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1+34.39 EUR
10+27.53 EUR
25+25.82 EUR
100+23.93 EUR
250+23.04 EUR
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NCF295AVHN4/0300ZY
Hersteller: NXP USA Inc.
Description: ACTIC-SRX
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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A3G20S250-01SR3 A3G20S250-01S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Produkt ist nicht verfügbar
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MKW35A512VFT4 MKW36A512.pdf
MKW35A512VFT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LS1028AXN7NQA Download?colCode=LS1027A&amp;location=null
LS1028AXN7NQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.3GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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SAF775DHV/N208Q/FY
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LS2048ASE711B
Hersteller: NXP USA Inc.
Description: LS2048A ST WE 2100 R1.1
Produkt ist nicht verfügbar
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TEA19162T/3J TEA19162T.pdf
TEA19162T/3J
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
Produkt ist nicht verfügbar
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A2G22S190-01SR3 A2G22S190-01S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC40XS6500CEKR2 MC12XS6D3.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 12V PENTA 40MOH
Produkt ist nicht verfügbar
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MC33FS8410G6ESR2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8410
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K116LFT0VLFR S32K-DS.pdf
FS32K116LFT0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A3I35D025WGNR1 A3I35D025WN.pdf
A3I35D025WGNR1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WBG
Supplier Device Package: TO-270WBG-17
Test Frequency: 3.8GHz ~ 4GHz
P1dB: 42.6dBm
Gain: 30.5dB
Voltage - Supply: 28V
RF Type: General Purpose
Frequency: 3.2GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LS1018ASE7HNA Download?colCode=LS1027A&amp;location=null
LS1018ASE7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 1 Core, 64-Bit
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ASL5015SHV/0Y PB_ASL5xxxyHz.pdf
ASL5015SHV/0Y
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 48HLQFP
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 4.5V
Dimming: PWM
Supplier Device Package: 48-HLQFP (7x7)
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Current - Output / Channel: 1.5A
Operating Temperature: -40°C ~ 125°C (TA)
Type: DC DC Controller
Frequency: 200MHz
Number of Outputs: 12
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF2DL1001DUD/02Z MF2DLHX0.pdf
Hersteller: NXP USA Inc.
Description: MIFARE DESFIRE LIGHT CONTACTLESS
Supplier Device Package: Wafer
Standards: Mifare, ISO 14443, ISO 7816-4
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UAT0VLFT S32K1xx.pdf
FS32K142UAT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
auf Bestellung 1157 Stücke:
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2+13.13 EUR
10+7.62 EUR
25+7.58 EUR
100+7.55 EUR
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MC9S08PL16SCTG MC9S08PL16S.pdf
MC9S08PL16SCTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
Core Size: 8-Bit
auf Bestellung 220 Stücke:
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AnzahlPreis
9+2.04 EUR
12+1.49 EUR
96+1.2 EUR
192+1.14 EUR
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MC9S08PL8SCTG MC9S08PL16S.pdf
MC9S08PL8SCTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 288 Stücke:
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AnzahlPreis
7+2.64 EUR
10+2.06 EUR
96+1.6 EUR
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MC9S08PL16SCTJ MC9S08PL16S.pdf
MC9S08PL16SCTJ
Hersteller: NXP USA Inc.
Description: IC MCU S08PLS 8-BIT TSSOP20
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FS32K148HAT0MLLT S32K1xx.pdf
FS32K148HAT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+34.94 EUR
10+27.96 EUR
25+23.89 EUR
80+23.5 EUR
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OM5569/NT322E
Hersteller: NXP USA Inc.
Description: NTAG 12C PLUS EXPLORER KIT
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: NT3H1101
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08PB16MTG MC9S08PB16.pdf
MC9S08PB16MTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PB8VTG MC9S08PB16.pdf
MC9S08PB8VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08PB16VTJ MC9S08PB16.pdf
MC9S08PB16VTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LV27D,112 74LV27.pdf
74LV27D,112
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 10ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
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PEMI2QFN/WT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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TEA1611T/N2,518 TEA1611T.pdf
TEA1611T/N2,518
Hersteller: NXP USA Inc.
Description: IC CTLR RESONANT CONVERT 20-SOIC
Current - Supply: 2.4 mA
Part Status: Obsolete
Applications: Resonant Converter Controller
Voltage - Supply: 11V ~ 13V
Operating Temperature: -25°C ~ 70°C
Packaging: Bulk
DigiKey Programmable: Not Verified
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LD6836CX4/28H,315 LD6836.pdf
LD6836CX4/28H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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LD6836CX4/14P,315 LD6836.pdf
LD6836CX4/14P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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N74F02D,602 DS_568_74F02.pdf
N74F02D,602
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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HEF4543BP,652 HEF4543B.pdf
HEF4543BP,652
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 16DIP
Packaging: Tube
Part Status: Obsolete
Supplier Device Package: 16-DIP
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment
Interface: BCD
Mounting Type: Through Hole
Display Type: LED, LCD
Package / Case: 16-DIP (0.300", 7.62mm)
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ADC1415S105HN/C1,5 ADC1415S_Series.pdf
ADC1415S105HN/C1,5
Hersteller: NXP USA Inc.
Description: IC ADC 14BIT PIPELINED 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: LVDS - Parallel, Parallel
Reference Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.85V ~ 3.4V, 5V
Voltage - Supply, Digital: 2.85V ~ 3.4V, 5V
Sampling Rate (Per Second): 105M
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 40-HVQFN (6x6)
Architecture: Pipelined
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
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74HC670D,652 74HC(T)670.pdf
74HC670D,652
Hersteller: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Independent Circuits: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Register File
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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BFG10W/X,115 BFG10W_X_Rev_Oct2010.pdf
BFG10W/X,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 1.9GHZ 4SO
Supplier Device Package: 4-SO
Frequency - Transition: 1.9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 50mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 250mA
Power - Max: 400mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343 Reverse Pinning
Packaging: Bulk
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LD6836CX4/33H,315 LD6836.pdf
LD6836CX4/33H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6836CX4/12P,315 LD6836.pdf
LD6836CX4/12P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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BGA2716,115 BGA2716_Rev3.pdf
BGA2716,115
Hersteller: NXP USA Inc.
Description: IC AMP ISM 50MHZ-3.6GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 50MHz ~ 3.6GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 22.9dB
Current - Supply: 15.9mA
Noise Figure: 5.3dB
P1dB: 8.9dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
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BAP63-05W,115 BAP63-05W_Rev_Oct2010.pdf
BAP63-05W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 100 mA
Power Dissipation (Max): 240 mW
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74HCT40105N,112 74HC%28T%2940105_Rev3.pdf
74HCT40105N,112
Hersteller: NXP USA Inc.
Description: IC FIFO ASYNC 16X4 40NS 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Function: Asynchronous
Memory Size: 64 (16 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 28MHz
Access Time: 40ns
Supplier Device Package: 16-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 4.5 V ~ 5.5 V
DigiKey Programmable: Not Verified
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PDTA123EE,115 PDTA123E_SERIES.pdf
PDTA123EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
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BLF888,112
BLF888,112
Hersteller: NXP USA Inc.
Description: TRANSISTOR RF PWR LDMOS SOT979A
Packaging: Tube
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual, Common Source
Power - Output: 250W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: CDFM2
Voltage - Rated: 104 V
Voltage - Test: 50 V
Current - Test: 1.3 A
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LD6836CX4/36P,315 LD6836.pdf
LD6836CX4/36P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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CBT3251DS,118 PHGLS29765-1.pdf?t.download=true&u=5oefqw
CBT3251DS,118
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 1 X 8:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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NTS0101GM,115 NTS0101.pdf
NTS0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
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74ABT08N,112 74ABT08_DS_Rev2.pdf
74ABT08N,112
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
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74CBTLV3861DK,118 74CBTLV3861.pdf
74CBTLV3861DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
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987+0.49 EUR
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