FRDMGD3100HBIEVM NXP USA Inc.
Hersteller: NXP USA Inc.
Description: EVAL BD FOR KL1X KL2X MC33GD3100
Supplied Contents: Board(s)
Utilized IC / Part: KL1x, KL2x, MC33GD3100
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
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Technische Details FRDMGD3100HBIEVM NXP USA Inc.
Description: EVAL BD FOR KL1X KL2X MC33GD3100, Supplied Contents: Board(s), Utilized IC / Part: KL1x, KL2x, MC33GD3100, Type: Power Management, Function: Gate Driver, Packaging: Bulk, Secondary Attributes: SPI Interface(s), Contents: Board(s), Part Status: Active, Embedded: Yes, MCU, 32-Bit, Primary Attributes: 1-Channel (Single).
Weitere Produktangebote FRDMGD3100HBIEVM nach Preis ab 435.35 EUR bis 435.35 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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|---|---|---|---|---|---|---|---|
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FRDMGD3100HBIEVM | NXP Semiconductors |
Power Management IC Development Tools Half-Bridge evaluation board for HybridPACK Drive IGBT/SiC module featuring GD3100 |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
|
| FRDMGD3100HBIEVM |
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Hersteller: NXP Semiconductors
Power Management IC Development Tools Half-Bridge evaluation board for HybridPACK Drive IGBT/SiC module featuring GD3100
Power Management IC Development Tools Half-Bridge evaluation board for HybridPACK Drive IGBT/SiC module featuring GD3100
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 435.35 EUR |


