LPC55S66JBD100K NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
| Anzahl | Preis |
|---|---|
| 3+ | 6.41 EUR |
| 10+ | 6.38 EUR |
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Technische Details LPC55S66JBD100K NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP, Number of I/O: 64, Part Status: Active, Supplier Device Package: 100-HLQFP (14x14), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 10x16b, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 144K x 8, Program Memory Size: 256KB (256K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 100-LQFP Exposed Pad, Packaging: Tray, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC55S66JBD100K nach Preis ab 6.34 EUR bis 6.44 EUR
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LPC55S66JBD100K | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S66JBD100 |
auf Bestellung 487 Stücke: Lieferzeit 10-14 Tag (e) |
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