MC34PF1550A1EPR2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 85+ | 5.88 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details MC34PF1550A1EPR2 NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 105°C, Voltage - Supply: 3.8V ~ 7V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5).
Weitere Produktangebote MC34PF1550A1EPR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
|
|
MC34PF1550A1EPR2 | Hersteller : NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
|
|
|
MC34PF1550A1EPR2 | Hersteller : NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
|
 |
MC34PF1550A1EPR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC 3 LDO Regs 40 QFN |
Produkt ist nicht verfügbar |