Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 307 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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| SAF3555HV/N151,518 | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED HD RAD |
Produkt ist nicht verfügbar |
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| SAF5000EL/V100/S2Y | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED MULTI |
Produkt ist nicht verfügbar |
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| TDA18256HN/C1Y | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TEF5000EL/V1/S20Y | NXP USA Inc. | Description: WISPA-ITS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TEF5100EL/V1/S20Y | NXP USA Inc. | Description: WISPA-ITS |
Produkt ist nicht verfügbar |
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| OM13220/ASC3012UL | NXP USA Inc. | Description: DEMO BOARD OM13220/ASC3012 |
Produkt ist nicht verfügbar |
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| OM13221/ASC3112UL | NXP USA Inc. |
Description: DEMO BOARD OM13221/ASC3112 Part Status: Obsolete Supplied Contents: Board(s) Packaging: Box |
Produkt ist nicht verfügbar |
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| SL2ICS5311EW/V7,00 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ WAFERPart Status: Obsolete Supplier Device Package: Wafer Standards: EPC, ISO 15693 Type: RFID Transponder Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MC33MR2001TVK | NXP USA Inc. |
Description: IC TX 77GHZ RADAR AUTO 89VFBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PC33MR2001RVK | NXP USA Inc. | Description: IC RX 77GHZ RADAR AUTO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PC33MR2001VVK | NXP USA Inc. | Description: IC VCO 77GHZ RADAR AUTO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF5000EL/V100/S2K | NXP USA Inc. | Description: MULTI APPLICATION RADIO SYSTEM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18204HN/C1,557 | NXP USA Inc. |
Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18256HN/C1E | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18256HN/C1K | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18264HB/C1,557 | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18267HB/C1,557 | NXP USA Inc. | Description: IC TELECOM INTERFACE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDA18280HN/C1K | NXP USA Inc. |
Description: IC TELECOM INTERFACE Part Status: Obsolete Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TEF5000EL/V1/S20K | NXP USA Inc. | Description: WISPA-ITS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TEF5100EL/V1/S20K | NXP USA Inc. | Description: WISPA-ITS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA1210KEG | NXP USA Inc. |
Description: IC ACCEL Z- AXIS 100GPackaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA1220KEG | NXP USA Inc. |
Description: IC ACCEL LOW G Z-AXISPart Status: Obsolete Packaging: Tube |
Produkt ist nicht verfügbar |
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| PMMA1251KEG | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA1252KEG | NXP USA Inc. |
Description: IC ACCEL 5G Z-AXIS Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA2204KEG | NXP USA Inc. |
Description: IC ACCEL X-AXIS 100G ROHS Part Status: Obsolete Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA2244KEG | NXP USA Inc. |
Description: IC ACCEL 20G X-AXIS Part Status: Obsolete Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA3201KEG | NXP USA Inc. | Description: IC ACCEL XY AXIS 40G ROHS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA3202KEG | NXP USA Inc. |
Description: IC ACCEL SMT LN XY SOIC-20 Part Status: Obsolete Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMMA3204KEG | NXP USA Inc. |
Description: IC ACCEL XY 100 / 30G SOIC-20 Part Status: Obsolete Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPXM2102AT1 | NXP USA Inc. |
Description: SENSOR 14.5PSIA .04V 5MPAKPackaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 5-SMD Module Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 14.5PSI (100kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
auf Bestellung 1006 Stücke: Lieferzeit 10-14 Tag (e) |
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MC13892DJVLR2 | NXP USA Inc. |
Description: IC PWR MGMT I.MX35/51 186BGAPackaging: Cut Tape (CT) Package / Case: 186-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 186-PBGA (12x12) Part Status: Active |
auf Bestellung 2043 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9510AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C HOTSWAP 1CH 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 6mA Data Rate (Max): 400kHz Supplier Device Package: 8-SO Part Status: Active Capacitance - Input: 1.9 pF |
auf Bestellung 642 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU6101,147 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSONPackaging: Cut Tape (CT) Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 40MHz ~ 4GHz RF Type: General Purpose Voltage - Supply: 1.5V ~ 5V Gain: 19.5dB Current - Supply: 10mA Noise Figure: 2.4dB P1dB: 3.5dBm Test Frequency: 3.5GHz Supplier Device Package: 6-HXSON (1.3x2) Part Status: Active |
auf Bestellung 3581 Stücke: Lieferzeit 10-14 Tag (e) |
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KMI15/1/V3PX | NXP USA Inc. |
Description: MAGNETIC SWITCH SPEC PURP 2SIPFeatures: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: SOT-453B Output Type: Current Source Mounting Type: Through Hole Function: Special Purpose Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 12V Technology: Magnetoresistive Current - Output (Max): 14mA (Typ) Supplier Device Package: 2-SIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SL3S1202FTB1,115 | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ 3XSON |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCAL6416AEX1Z | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24X2QFNPackaging: Cut Tape (CT) Features: POR Package / Case: 24-XFLGA Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-X2QFN (2x2) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 5765 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS600IPW/S8HP | NXP USA Inc. |
Description: IC I2C CONTROLLER SPI 16TSSOPDigiKey Programmable: Not Verified Part Status: Last Time Buy Protocol: I2C Current - Supply: 11mA Voltage - Supply: 2.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C Interface: SPI Function: Controller Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SC18IS602BIPW/S8HP | NXP USA Inc. |
Description: IC BRIDGE SPI/I2C 16TSSOPDigiKey Programmable: Not Verified Part Status: Last Time Buy Supplier Device Package: 16-TSSOP Protocol: I2C Current - Supply: 11mA Voltage - Supply: 2.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C Interface: SPI Function: Controller Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF13750HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Voltage - Test: 50 V Voltage - Rated: 105 V Part Status: Active Supplier Device Package: NI-1230-4H Technology: LDMOS Gain: 20.6dB Power - Output: 650W Configuration: Dual Frequency: 700MHz ~ 1.3GHz Mounting Type: Chassis Mount Current Rating (Amps): 10µA Package / Case: SOT-979A Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SJA1105ELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGAPart Status: Active Supplier Device Package: 159-LFBGA (12x12) Standards: IEEE 802.3 Protocol: Ethernet Current - Supply: 3.5mA Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TJ) Interface: SPI Function: Switch Package / Case: 159-LFBGA Packaging: Cut Tape (CT) Qualification: AEC-Q100 Grade: Automotive DigiKey Programmable: Not Verified |
auf Bestellung 2910 Stücke: Lieferzeit 10-14 Tag (e) |
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SJA1105TELY | NXP USA Inc. |
Description: IC ETHERNET SWITCH SPI 159LFBGAProtocol: Ethernet Current - Supply: 3.5mA Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TJ) Interface: SPI Function: Switch Package / Case: 159-LFBGA Packaging: Cut Tape (CT) Qualification: AEC-Q100 DigiKey Programmable: Not Verified Grade: Automotive Supplier Device Package: 159-LFBGA (12x12) Standards: IEEE 802.3 |
auf Bestellung 2283 Stücke: Lieferzeit 10-14 Tag (e) |
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TFA9892AUK/N1BZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 6.6W 49WLCSP Part Status: Active Supplier Device Package: 49-WLCSP (3.63x3.13) Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 49-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TFA9896UK/N1Z | NXP USA Inc. |
Description: IC AMP CLASS D MONO 2.1W 30WLCSP Part Status: Active Supplier Device Package: 30-WLCSP (2.72x2.06) Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm Voltage - Supply: 2.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 30-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TFA9891UK/N1AZ | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.6W 49WLCSP Part Status: Active Supplier Device Package: 49-WLCSP (3.43x2.98) Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 49-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Cut Tape (CT) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NX30P6093UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSPPart Status: Obsolete Fault Protection: Over Temperature, Over Voltage Supplier Device Package: 20-WLCSP (2.16x1.7) Ratio - Input:Output: 1:1 Current - Output (Max): 8A Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Voltage - Load: 2.8V ~ 20V Rds On (Typ): 8.95mOhm Operating Temperature: -40°C ~ 85°C (TA) Switch Type: USB Switch Interface: I²C Number of Outputs: 1 Mounting Type: Surface Mount Output Type: P-Channel Package / Case: 20-UFBGA, WLCSP Features: Slew Rate Controlled Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
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TEA1999TK/1J | NXP USA Inc. |
Description: FLYBACK SRMounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Current - Supply: 250 µA Supplier Device Package: 8-HVSON (3x3) Applications: Active/Synchronous Rectification Controller Voltage - Supply: 0V ~ 21V Operating Temperature: -40°C ~ 150°C (TJ) |
Produkt ist nicht verfügbar |
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MCIMX8M-EVK | NXP USA Inc. |
Description: I.MX 8M EVAL BRDPart Status: Active Utilized IC / Part: i.MX 8M Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A53, Cortex®-M4 Contents: Board(s), Cable(s), Power Supply Type: MPU Mounting Type: Fixed Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC8N04FHI24E | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFNPackaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Connectivity: I2C, SPI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-HVQFN (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC8N04FHI24Z | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFNDigiKey Programmable: Not Verified Number of I/O: 12 Part Status: Active Supplier Device Package: 24-HVQFN (4x4) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Core Size: 32-Bit Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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OM40002UL | NXP USA Inc. |
Description: LPC8N04 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC8N04 Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC8N04FHI24Z | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 24HVQFNPart Status: Active Supplier Device Package: 24-HVQFN (4x4) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V Core Size: 32-Bit Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Number of I/O: 12 |
auf Bestellung 925 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33972ATEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SSOP-EP Part Status: Active |
auf Bestellung 2659 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8AMTGR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOPNumber of I/O: 14 Part Status: Active Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit DigiKey Programmable: Not Verified Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 3752 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXM2053GST1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAKPackaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 5-SMD Module, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: -0.6% ~ 0.4% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.12" (2.97mm) Tube Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: Barbless Maximum Pressure: 29.01PSI (200kPa) Part Status: Active |
auf Bestellung 2005 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16C752BIB48,128 | NXP USA Inc. |
Description: IC DUAL UART 64BYTE 48LQFPPackaging: Cut Tape (CT) Package / Case: 48-LQFP Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 64 Byte Data Rate (Max): 5Mbps Supplier Device Package: 48-LQFP (7x7) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Active |
auf Bestellung 3410 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF8551BTT/AJ | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 48TSSOPPackaging: Cut Tape (CT) Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Current - Supply: 1.2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1027TK/20,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8HVSONPart Status: Active Receiver Hysteresis: 175 mV Supplier Device Package: 8-HVSON (3x3) Protocol: LINbus Number of Drivers/Receivers: 1/1 Voltage - Supply: 5V ~ 18V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 2832 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP142LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 50V 130MW SOD2Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOD2 Current - Max: 100 mA Power Dissipation (Max): 130 mW |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC11A04UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSPPackaging: Cut Tape (CT) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 20-WLCSP (2.55x2.55) Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9KEAZN64AMLHR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 2196 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF3555HV/N151,518 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED HD RAD
Description: IC INTERFACE SPECIALIZED HD RAD
Produkt ist nicht verfügbar
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| SAF5000EL/V100/S2Y |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED MULTI
Description: IC INTERFACE SPECIALIZED MULTI
Produkt ist nicht verfügbar
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| TDA18256HN/C1Y |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TEF5000EL/V1/S20Y |
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Description: WISPA-ITS
Produkt ist nicht verfügbar
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| TEF5100EL/V1/S20Y |
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Description: WISPA-ITS
Produkt ist nicht verfügbar
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| OM13220/ASC3012UL |
Hersteller: NXP USA Inc.
Description: DEMO BOARD OM13220/ASC3012
Description: DEMO BOARD OM13220/ASC3012
Produkt ist nicht verfügbar
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| OM13221/ASC3112UL |
Hersteller: NXP USA Inc.
Description: DEMO BOARD OM13221/ASC3112
Part Status: Obsolete
Supplied Contents: Board(s)
Packaging: Box
Description: DEMO BOARD OM13221/ASC3112
Part Status: Obsolete
Supplied Contents: Board(s)
Packaging: Box
Produkt ist nicht verfügbar
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| SL2ICS5311EW/V7,00 |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Part Status: Obsolete
Supplier Device Package: Wafer
Standards: EPC, ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: IC RFID TRANSP 13.56MHZ WAFER
Part Status: Obsolete
Supplier Device Package: Wafer
Standards: EPC, ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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| MC33MR2001TVK |
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Hersteller: NXP USA Inc.
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Description: IC TX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
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| PC33MR2001RVK |
Hersteller: NXP USA Inc.
Description: IC RX 77GHZ RADAR AUTO
Description: IC RX 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
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| PC33MR2001VVK |
Hersteller: NXP USA Inc.
Description: IC VCO 77GHZ RADAR AUTO
Description: IC VCO 77GHZ RADAR AUTO
Produkt ist nicht verfügbar
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| SAF5000EL/V100/S2K |
Hersteller: NXP USA Inc.
Description: MULTI APPLICATION RADIO SYSTEM
Description: MULTI APPLICATION RADIO SYSTEM
Produkt ist nicht verfügbar
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| TDA18204HN/C1,557 |
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Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
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| TDA18256HN/C1E |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA18256HN/C1K |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TDA18264HB/C1,557 |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA18267HB/C1,557 |
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE
Description: IC TELECOM INTERFACE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TEF5000EL/V1/S20K |
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Description: WISPA-ITS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEF5100EL/V1/S20K |
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Description: WISPA-ITS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMMA1251KEG |
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS
Description: IC ACCEL Z-AXIS
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PMMA3201KEG |
Hersteller: NXP USA Inc.
Description: IC ACCEL XY AXIS 40G ROHS
Description: IC ACCEL XY AXIS 40G ROHS
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PMMA3204KEG |
Hersteller: NXP USA Inc.
Description: IC ACCEL XY 100 / 30G SOIC-20
Part Status: Obsolete
Packaging: Tube
Description: IC ACCEL XY 100 / 30G SOIC-20
Part Status: Obsolete
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPXM2102AT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 14.5PSIA .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
auf Bestellung 1006 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.93 EUR |
| 5+ | 14.41 EUR |
| 10+ | 13.85 EUR |
| 25+ | 13.19 EUR |
| 50+ | 12.73 EUR |
| 100+ | 12.31 EUR |
| 500+ | 11.65 EUR |
| MC13892DJVLR2 |
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Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active
auf Bestellung 2043 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.64 EUR |
| 10+ | 15.45 EUR |
| 25+ | 14.4 EUR |
| 100+ | 13.25 EUR |
| 250+ | 13.19 EUR |
| PCA9510AD,118 |
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Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 1.9 pF
auf Bestellung 642 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.15 EUR |
| 10+ | 3.1 EUR |
| 25+ | 2.84 EUR |
| 100+ | 2.55 EUR |
| 250+ | 2.41 EUR |
| 500+ | 2.36 EUR |
| BGU6101,147 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
Description: IC RF AMP GPS 40MHZ-4GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 1.5V ~ 5V
Gain: 19.5dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 3.5dBm
Test Frequency: 3.5GHz
Supplier Device Package: 6-HXSON (1.3x2)
Part Status: Active
auf Bestellung 3581 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.74 EUR |
| 12+ | 1.5 EUR |
| 25+ | 1.41 EUR |
| 100+ | 1.3 EUR |
| 250+ | 1.22 EUR |
| 500+ | 1.17 EUR |
| 1000+ | 1.13 EUR |
| KMI15/1/V3PX |
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Hersteller: NXP USA Inc.
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Description: MAGNETIC SWITCH SPEC PURP 2SIP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: SOT-453B
Output Type: Current Source
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 12V
Technology: Magnetoresistive
Current - Output (Max): 14mA (Typ)
Supplier Device Package: 2-SIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SL3S1202FTB1,115 |
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Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ 3XSON
Description: IC RFID TRANSP 840-960MHZ 3XSON
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCAL6416AEX1Z |
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Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24X2QFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-XFLGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-X2QFN (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5765 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.2 EUR |
| 12+ | 1.6 EUR |
| 25+ | 1.45 EUR |
| 100+ | 1.29 EUR |
| 250+ | 1.21 EUR |
| 500+ | 1.16 EUR |
| 1000+ | 1.13 EUR |
| SC18IS600IPW/S8HP |
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Hersteller: NXP USA Inc.
Description: IC I2C CONTROLLER SPI 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Protocol: I2C
Current - Supply: 11mA
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Supplier Device Package: 16-TSSOP
Description: IC I2C CONTROLLER SPI 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Protocol: I2C
Current - Supply: 11mA
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SC18IS602BIPW/S8HP |
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Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 16-TSSOP
Protocol: I2C
Current - Supply: 11mA
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC BRIDGE SPI/I2C 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 16-TSSOP
Protocol: I2C
Current - Supply: 11mA
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF13750HR5 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 105 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 105 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 20.6dB
Power - Output: 650W
Configuration: Dual
Frequency: 700MHz ~ 1.3GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SJA1105ELY |
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Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
auf Bestellung 2910 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.8 EUR |
| 10+ | 10.71 EUR |
| 25+ | 9.94 EUR |
| 100+ | 9.08 EUR |
| 250+ | 8.68 EUR |
| 500+ | 8.43 EUR |
| SJA1105TELY |
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Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Description: IC ETHERNET SWITCH SPI 159LFBGA
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
auf Bestellung 2283 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 17.51 EUR |
| 10+ | 13.69 EUR |
| 25+ | 12.74 EUR |
| 100+ | 11.69 EUR |
| 250+ | 11.19 EUR |
| 500+ | 10.89 EUR |
| TFA9892AUK/N1BZ |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.63x3.13)
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.63x3.13)
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9896UK/N1Z |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Part Status: Active
Supplier Device Package: 30-WLCSP (2.72x2.06)
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 30-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Description: IC AMP CLASS D MONO 2.1W 30WLCSP
Part Status: Active
Supplier Device Package: 30-WLCSP (2.72x2.06)
Max Output Power x Channels @ Load: 2.1W x 1 @ 8Ohm
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 30-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9891UK/N1AZ |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| NX30P6093UKZ |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Part Status: Obsolete
Fault Protection: Over Temperature, Over Voltage
Supplier Device Package: 20-WLCSP (2.16x1.7)
Ratio - Input:Output: 1:1
Current - Output (Max): 8A
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Voltage - Load: 2.8V ~ 20V
Rds On (Typ): 8.95mOhm
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: I²C
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 20-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Part Status: Obsolete
Fault Protection: Over Temperature, Over Voltage
Supplier Device Package: 20-WLCSP (2.16x1.7)
Ratio - Input:Output: 1:1
Current - Output (Max): 8A
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Voltage - Load: 2.8V ~ 20V
Rds On (Typ): 8.95mOhm
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: I²C
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 20-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1999TK/1J |
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Hersteller: NXP USA Inc.
Description: FLYBACK SR
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Description: FLYBACK SR
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX8M-EVK |
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Hersteller: NXP USA Inc.
Description: I.MX 8M EVAL BRD
Part Status: Active
Utilized IC / Part: i.MX 8M
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: I.MX 8M EVAL BRD
Part Status: Active
Utilized IC / Part: i.MX 8M
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC8N04FHI24E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.33 EUR |
| 10+ | 3.22 EUR |
| 25+ | 2.95 EUR |
| LPC8N04FHI24Z |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
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| OM40002UL |
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Hersteller: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 40.83 EUR |
| LPC8N04FHI24Z |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 12
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 12
auf Bestellung 925 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.41 EUR |
| 10+ | 2.02 EUR |
| 25+ | 2 EUR |
| 100+ | 1.99 EUR |
| 250+ | 1.98 EUR |
| MC33972ATEKR2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
auf Bestellung 2659 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.17 EUR |
| 10+ | 7.01 EUR |
| 25+ | 6.47 EUR |
| 100+ | 5.87 EUR |
| 250+ | 5.59 EUR |
| 500+ | 5.42 EUR |
| S9KEAZN8AMTGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 3752 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.1 EUR |
| 10+ | 1.79 EUR |
| 25+ | 1.76 EUR |
| 100+ | 1.73 EUR |
| 250+ | 1.72 EUR |
| 1000+ | 1.66 EUR |
| MPXM2053GST1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
Description: SENSOR 7.25PSIG 0.12" .04V 5MPAK
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Part Status: Active
auf Bestellung 2005 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 16.26 EUR |
| 5+ | 14.73 EUR |
| 10+ | 14.17 EUR |
| 25+ | 13.49 EUR |
| 50+ | 13.02 EUR |
| 100+ | 12.6 EUR |
| SC16C752BIB48,128 |
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Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 3410 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12 EUR |
| 10+ | 9.29 EUR |
| 25+ | 8.61 EUR |
| 100+ | 7.86 EUR |
| 250+ | 7.66 EUR |
| PCF8551BTT/AJ |
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Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1027TK/20,118 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2832 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 11+ | 1.65 EUR |
| 17+ | 1.08 EUR |
| 25+ | 0.98 EUR |
| 100+ | 0.89 EUR |
| 250+ | 0.87 EUR |
| 500+ | 0.85 EUR |
| 1000+ | 0.77 EUR |
| BAP142LX,315 |
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Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11A04UK,118 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9KEAZN64AMLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 2196 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.58 EUR |
| 10+ | 4.97 EUR |
| 25+ | 4.57 EUR |
| 100+ | 4.14 EUR |
| 250+ | 3.93 EUR |
| 500+ | 3.84 EUR |

























