Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34235) > Seite 307 nach 571
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| SW32R37-SMCL421P | NXP USA Inc. |
Description: AUTOSAR SOFTWARE S32R37 SAFETY M Packaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered Part Status: Active |
Produkt ist nicht verfügbar |
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| SW32R37-SMCL421V | NXP USA Inc. |
Description: AUTOSAR SOFTWARE S32R37 SAFETY M Packaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered Part Status: Active |
Produkt ist nicht verfügbar |
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| SW32V23-A53SCSTF | NXP USA Inc. | Description: AUTO SOFTWARE S32V23 A53 STRUCTU |
Produkt ist nicht verfügbar |
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| SW32V23-A53SCSTL | NXP USA Inc. |
Description: AUTO SOFTWARE S32V23 A53 STRUCTU Packaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered Part Status: Active |
Produkt ist nicht verfügbar |
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| SW32V23-M4SCSTF | NXP USA Inc. | Description: AUTO SOFTWARE S32V23 M4 STRUCTUR |
Produkt ist nicht verfügbar |
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| SW32V23-M4SCSTL | NXP USA Inc. | Description: AUTO SOFTWARE S32V23 M4 STRUCTUR |
Produkt ist nicht verfügbar |
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| SW32V23-OS421L | NXP USA Inc. | Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2 |
Produkt ist nicht verfügbar |
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| SW32V23-OS421P | NXP USA Inc. | Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2 |
Produkt ist nicht verfügbar |
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| SW32V23-OS421V | NXP USA Inc. | Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2 |
Produkt ist nicht verfügbar |
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| SW32V23-SMCL421P | NXP USA Inc. | Description: AUTOSAR SOFTWARE S32V23 SAFETY M |
Produkt ist nicht verfügbar |
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| SW32V23-SMCL421V | NXP USA Inc. | Description: AUTOSAR SOFTWARE S32V23 SAFETY M |
Produkt ist nicht verfügbar |
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| SW574XC-SCST001F | NXP USA Inc. | Description: AUTO SOFTWARE 5746C Z4 STRUCTURA |
Produkt ist nicht verfügbar |
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| SW5777C-SMCL401P | NXP USA Inc. | Description: AUTOSAR SOFTWARE 5777C COBRA55 S |
Produkt ist nicht verfügbar |
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| SW5777C-SMCL401V | NXP USA Inc. | Description: AUTOSAR SOFTWARE 5777C COBRA55 S |
Produkt ist nicht verfügbar |
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| SW577XC-MMCL1B | NXP USA Inc. | Description: 577XC MMCLIB BIN |
Produkt ist nicht verfügbar |
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| SW577XK-SCST001F | NXP USA Inc. | Description: AUTO SOFTWARE 5777K Z7 STRUCTURA |
Produkt ist nicht verfügbar |
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| SWKEA-MMCL1B | NXP USA Inc. | Description: KEA MMCLIB BIN |
Produkt ist nicht verfügbar |
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| SWKEA-MMCL1C | NXP USA Inc. | Description: KEA MMCLIB SRC |
Produkt ist nicht verfügbar |
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| SWS12Z-FCST001F | NXP USA Inc. | Description: AUTO SOFTWARE S12Z CORE SELF TES |
Produkt ist nicht verfügbar |
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| SWS12Z-SCST001F | NXP USA Inc. | Description: S12Z SCST90 FAM |
Produkt ist nicht verfügbar |
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| SWS12Z-SCST001S | NXP USA Inc. |
Description: S12Z SCST90 DISM Packaging: Bulk Type: License |
Produkt ist nicht verfügbar |
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| SW32K14-MMCL1B | NXP USA Inc. | Description: S32K14 MMCLIB BIN |
Produkt ist nicht verfügbar |
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| SW32K14-MMCL1C | NXP USA Inc. | Description: S32K14 MMCLIB SRC |
Produkt ist nicht verfügbar |
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| SW32K14-SMCL401P | NXP USA Inc. | Description: S32K14 SMCAL4.0 PROJ |
Produkt ist nicht verfügbar |
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| SW32K14-SMCL401S | NXP USA Inc. | Description: S32K14 SMCAL4.0 DISM |
Produkt ist nicht verfügbar |
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| SW32K14-SMCL401V | NXP USA Inc. | Description: S32K14 SMCAL4.0 VOL |
Produkt ist nicht verfügbar |
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MCIMX6U6AVM10AD | NXP USA Inc. |
 Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA |
Produkt ist nicht verfügbar |
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AFT31150NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 2.7GHz ~ 3.1GHz Power - Output: 150W Gain: 17.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Active Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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AFV10700H-1090 | NXP USA Inc. |
Description: AFV10700H REF BOARD 1090MHZ 700W |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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| CBTV24DD12AETY | NXP USA Inc. |
Description: IC SWITCH SPDT X 12 9OHM 48TFBGA Packaging: Tape & Reel (TR) Package / Case: 48-TFBGA Mounting Type: Surface Mount Operating Temperature: -10°C ~ 85°C (TA) On-State Resistance (Max): 9Ohm -3db Bandwidth: 7.4GHz Supplier Device Package: 48-TFBGA (3x8) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 400mOhm (Typ) Part Status: Last Time Buy Number of Circuits: 12 |
Produkt ist nicht verfügbar |
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DEVKIT-S12VRP | NXP USA Inc. |
Description: S12VRP EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12 Board Type: Evaluation Platform Utilized IC / Part: S12VRP Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 21-28 Tag (e) |
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FS32K144MAT0CMHR | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 100MAPBGA Packaging: Tape & Reel (TR) Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active Number of I/O: 89 |
Produkt ist nicht verfügbar |
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FS32K144MFT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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FS32K144MFT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1114FHN33/303Y | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC11E37FBD48/501Y | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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LPC1768FET100Z | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Obsolete Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC4337JET256Y | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC844M201JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC845M301JHI33E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC35FS4502CAE | NXP USA Inc. |
Description: FS4500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
Produkt ist nicht verfügbar |
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MC35FS4502CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4502NAE | NXP USA Inc. |
Description: FS4500 |
Produkt ist nicht verfügbar |
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MC35FS4502NAER2 | NXP USA Inc. |
Description: FS4500 |
Produkt ist nicht verfügbar |
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MC35FS4503NAER2 | NXP USA Inc. |
Description: FS4500 |
Produkt ist nicht verfügbar |
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MC35FS6500NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
auf Bestellung 220 Stücke: Lieferzeit 21-28 Tag (e) |
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MC35FS6510CAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6510CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MCIMX6X1AVO08ACR | NXP USA Inc. |
Description: I.MX6SX AUTO ROM P ENHAN |
Produkt ist nicht verfügbar |
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MMRF5017HSR5 | NXP USA Inc. |
Description: RF MOSFET HEMT 50V NI400 Packaging: Tray Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 30MHz ~ 2.2GHz Power - Output: 125W Gain: 18.4dB Technology: HEMT Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 150 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF13750H-915MHZ | NXP USA Inc. |
Description: MRF13750H REF BRD 915MHZ 750W Packaging: Bulk For Use With/Related Products: MRF13750H Frequency: 902MHz ~ 928MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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MRF13750HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS DL 50V NI-1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 700MHz ~ 1.3GHz Configuration: Dual Power - Output: 650W Gain: 20.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V |
Produkt ist nicht verfügbar |
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MRF13750HSR5 | NXP USA Inc. |
Description: RF POWER LDMOS TRANSISTOR 750 W Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 700MHz ~ 1.3GHz Power - Output: 750W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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| NX30P6093UKZ | NXP USA Inc. |
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP Packaging: Tape & Reel (TR) Features: Slew Rate Controlled Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I²C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 8.95mOhm Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| OM11056UL | NXP USA Inc. |
Description: PCA8885 AND PCF8885 EVALUATION B Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 3.3V or 5V Sensor Type: Touch, Capacitive Utilized IC / Part: PCx8885 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| OM11057AUL | NXP USA Inc. |
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN Packaging: Bulk Sensor Type: Touch, Capacitive Utilized IC / Part: PCA8886, PCF8885 Supplied Contents: Board(s) Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| OM11064UL | NXP USA Inc. |
Description: PTN3460 DP-LVDS DEMO BOARD Packaging: Bulk Function: Video Processing Type: Video Utilized IC / Part: PTN3460 Supplied Contents: Board(s) Primary Attributes: DisplayPort to LVDS |
Produkt ist nicht verfügbar |
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| OM13257,598 | NXP USA Inc. |
Description: UNIVERSAL TEMPERATURE SENSOR DAU |
Produkt ist nicht verfügbar |
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| OM13315,598 | NXP USA Inc. |
Description: NVT2001GM/2002DP DEMO BOARD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2001 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| OM13316,598 | NXP USA Inc. |
Description: NVT2003DP/04TL/06PW DEMOBD Packaging: Bulk Function: Logic-Level Translator Type: Interface Utilized IC / Part: NVT2003 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
| SW32R37-SMCL421P |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32R37 SAFETY M
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: AUTOSAR SOFTWARE S32R37 SAFETY M
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
| SW32R37-SMCL421V |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32R37 SAFETY M
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: AUTOSAR SOFTWARE S32R37 SAFETY M
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
| SW32V23-A53SCSTF |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE S32V23 A53 STRUCTU
Description: AUTO SOFTWARE S32V23 A53 STRUCTU
Produkt ist nicht verfügbar
| SW32V23-A53SCSTL |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE S32V23 A53 STRUCTU
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: AUTO SOFTWARE S32V23 A53 STRUCTU
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
| SW32V23-M4SCSTF |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE S32V23 M4 STRUCTUR
Description: AUTO SOFTWARE S32V23 M4 STRUCTUR
Produkt ist nicht verfügbar
| SW32V23-M4SCSTL |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE S32V23 M4 STRUCTUR
Description: AUTO SOFTWARE S32V23 M4 STRUCTUR
Produkt ist nicht verfügbar
| SW32V23-OS421L |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Produkt ist nicht verfügbar
| SW32V23-OS421P |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Produkt ist nicht verfügbar
| SW32V23-OS421V |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Description: AUTOSAR SOFTWARE S32V23 M4 OS4.2
Produkt ist nicht verfügbar
| SW32V23-SMCL421P |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32V23 SAFETY M
Description: AUTOSAR SOFTWARE S32V23 SAFETY M
Produkt ist nicht verfügbar
| SW32V23-SMCL421V |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE S32V23 SAFETY M
Description: AUTOSAR SOFTWARE S32V23 SAFETY M
Produkt ist nicht verfügbar
| SW574XC-SCST001F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE 5746C Z4 STRUCTURA
Description: AUTO SOFTWARE 5746C Z4 STRUCTURA
Produkt ist nicht verfügbar
| SW5777C-SMCL401P |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE 5777C COBRA55 S
Description: AUTOSAR SOFTWARE 5777C COBRA55 S
Produkt ist nicht verfügbar
| SW5777C-SMCL401V |
Hersteller: NXP USA Inc.
Description: AUTOSAR SOFTWARE 5777C COBRA55 S
Description: AUTOSAR SOFTWARE 5777C COBRA55 S
Produkt ist nicht verfügbar
| SW577XK-SCST001F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE 5777K Z7 STRUCTURA
Description: AUTO SOFTWARE 5777K Z7 STRUCTURA
Produkt ist nicht verfügbar
| SWS12Z-FCST001F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE S12Z CORE SELF TES
Description: AUTO SOFTWARE S12Z CORE SELF TES
Produkt ist nicht verfügbar
| SWS12Z-SCST001S |
Produkt ist nicht verfügbar
| SW32K14-SMCL401P |
Hersteller: NXP USA Inc.
Description: S32K14 SMCAL4.0 PROJ
Description: S32K14 SMCAL4.0 PROJ
Produkt ist nicht verfügbar
| SW32K14-SMCL401S |
Hersteller: NXP USA Inc.
Description: S32K14 SMCAL4.0 DISM
Description: S32K14 SMCAL4.0 DISM
Produkt ist nicht verfügbar
| SW32K14-SMCL401V |
Hersteller: NXP USA Inc.
Description: S32K14 SMCAL4.0 VOL
Description: S32K14 SMCAL4.0 VOL
Produkt ist nicht verfügbar
| MCIMX6U6AVM10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Produkt ist nicht verfügbar
| AFT31150NR5 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.1GHz
Power - Output: 150W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.1GHz
Power - Output: 150W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| AFV10700H-1090 |
|
Hersteller: NXP USA Inc.
Description: AFV10700H REF BOARD 1090MHZ 700W
Description: AFV10700H REF BOARD 1090MHZ 700W
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 10120.81 EUR |
| CBTV24DD12AETY |
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 12 9OHM 48TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 85°C (TA)
On-State Resistance (Max): 9Ohm
-3db Bandwidth: 7.4GHz
Supplier Device Package: 48-TFBGA (3x8)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 400mOhm (Typ)
Part Status: Last Time Buy
Number of Circuits: 12
Description: IC SWITCH SPDT X 12 9OHM 48TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 85°C (TA)
On-State Resistance (Max): 9Ohm
-3db Bandwidth: 7.4GHz
Supplier Device Package: 48-TFBGA (3x8)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 400mOhm (Typ)
Part Status: Last Time Buy
Number of Circuits: 12
Produkt ist nicht verfügbar
| DEVKIT-S12VRP |
|
Hersteller: NXP USA Inc.
Description: S12VRP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VRP
Part Status: Active
Description: S12VRP EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: S12VRP
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 318.86 EUR |
| FS32K144MAT0CMHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
Produkt ist nicht verfügbar
| FS32K144MFT0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
| FS32K144MFT0VLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1114FHN33/303Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC11E37FBD48/501Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Produkt ist nicht verfügbar
| LPC1768FET100Z |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Obsolete
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Obsolete
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC4337JET256Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC844M201JHI33E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC845M301JHI33E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC35FS4502CAE |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
| MC35FS4502CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6500NAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 220 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 23.92 EUR |
| 10+ | 21.6 EUR |
| 25+ | 20.59 EUR |
| 80+ | 17.88 EUR |
| MC35FS6510CAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6510CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MCIMX6X1AVO08ACR |
|
Hersteller: NXP USA Inc.
Description: I.MX6SX AUTO ROM P ENHAN
Description: I.MX6SX AUTO ROM P ENHAN
Produkt ist nicht verfügbar
| MMRF5017HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET HEMT 50V NI400
Packaging: Tray
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 526.16 EUR |
| MRF13750H-915MHZ |
|
Hersteller: NXP USA Inc.
Description: MRF13750H REF BRD 915MHZ 750W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 902MHz ~ 928MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Description: MRF13750H REF BRD 915MHZ 750W
Packaging: Bulk
For Use With/Related Products: MRF13750H
Frequency: 902MHz ~ 928MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| MRF13750HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS DL 50V NI-1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Description: RF MOSFET LDMOS DL 50V NI-1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Produkt ist nicht verfügbar
| MRF13750HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF POWER LDMOS TRANSISTOR 750 W
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 750W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF POWER LDMOS TRANSISTOR 750 W
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 750W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
| NX30P6093UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I²C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM11056UL |
|
Hersteller: NXP USA Inc.
Description: PCA8885 AND PCF8885 EVALUATION B
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 3.3V or 5V
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCx8885
Supplied Contents: Board(s)
Part Status: Obsolete
Description: PCA8885 AND PCF8885 EVALUATION B
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 3.3V or 5V
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCx8885
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM11057AUL |
|
Hersteller: NXP USA Inc.
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCA8886, PCF8885
Supplied Contents: Board(s)
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete
Description: ADD-ONBOARD 2X8885 DIRECT SENSIN
Packaging: Bulk
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCA8886, PCF8885
Supplied Contents: Board(s)
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM11064UL |
Hersteller: NXP USA Inc.
Description: PTN3460 DP-LVDS DEMO BOARD
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Description: PTN3460 DP-LVDS DEMO BOARD
Packaging: Bulk
Function: Video Processing
Type: Video
Utilized IC / Part: PTN3460
Supplied Contents: Board(s)
Primary Attributes: DisplayPort to LVDS
Produkt ist nicht verfügbar
| OM13257,598 |
|
Hersteller: NXP USA Inc.
Description: UNIVERSAL TEMPERATURE SENSOR DAU
Description: UNIVERSAL TEMPERATURE SENSOR DAU
Produkt ist nicht verfügbar
| OM13315,598 |
|
Hersteller: NXP USA Inc.
Description: NVT2001GM/2002DP DEMO BOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2001
Supplied Contents: Board(s)
Part Status: Active
Description: NVT2001GM/2002DP DEMO BOARD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2001
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| OM13316,598 |
|
Hersteller: NXP USA Inc.
Description: NVT2003DP/04TL/06PW DEMOBD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
Description: NVT2003DP/04TL/06PW DEMOBD
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Utilized IC / Part: NVT2003
Supplied Contents: Board(s)
Produkt ist nicht verfügbar