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SJA1105ELY SJA1105ELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
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SJA1105TELY SJA1105TELY NXP USA Inc. SJA1105.pdf Description: IC ETHERNET SWITCH SPI 159LFBGA
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
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TFA9892AUK/N1BZ TFA9892AUK/N1BZ NXP USA Inc. Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.63x3.13)
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
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TFA9891UK/N1AZ TFA9891UK/N1AZ NXP USA Inc. Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
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NX30P6093UKZ NXP USA Inc. NXP_GreenChip_FS.pdf Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Part Status: Obsolete
Fault Protection: Over Temperature, Over Voltage
Supplier Device Package: 20-WLCSP (2.16x1.7)
Ratio - Input:Output: 1:1
Current - Output (Max): 8A
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Voltage - Load: 2.8V ~ 20V
Rds On (Typ): 8.95mOhm
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: I²C
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 20-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TEA1999TK/1J TEA1999TK/1J NXP USA Inc. TEA1999TK.pdf Description: FLYBACK SR
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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MCIMX8M-EVK MCIMX8M-EVK NXP USA Inc. i.MX8M_Family_FS.pdf Description: I.MX 8M EVAL BRD
Part Status: Active
Utilized IC / Part: i.MX 8M
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC8N04FHI24E LPC8N04FHI24E NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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OM40002UL OM40002UL NXP USA Inc. get-started-with-the-om40002:GS-OM40002 Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
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LPC8N04FHI24Z LPC8N04FHI24Z NXP USA Inc. LPC8N04.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 12
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MC33972ATEKR2 MC33972ATEKR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
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S9KEAZN8AMTGR S9KEAZN8AMTGR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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SC16C752BIB48,128 SC16C752BIB48,128 NXP USA Inc. SC16C752B.pdf Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
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PCF8551BTT/AJ PCF8551BTT/AJ NXP USA Inc. PCF8551.pdf Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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TJA1027TK/20,118 TJA1027TK/20,118 NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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LPC11A04UK,118 LPC11A04UK,118 NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9KEAZN64AMLHR S9KEAZN64AMLHR NXP USA Inc. S9KEA64P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
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LPC812M101JDH16J LPC812M101JDH16J NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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GTL2000DGG,118 GTL2000DGG,118 NXP USA Inc. GTL2000.pdf Description: IC TRANSLATOR BIDIR 48TSSOP
Number of Circuits: 1
Part Status: Obsolete
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 22
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 48-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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LPC824M201JHI33Y LPC824M201JHI33Y NXP USA Inc. LPC82X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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TDA8037TT/C1J TDA8037TT/C1J NXP USA Inc. TDA8037.pdf Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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LPC1111FHN33/102'5 LPC1111FHN33/102'5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
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A2V07H400-04NR3 NXP USA Inc. A2V07H400-04N.pdf Description: RF MOSFET LDMOS 48V OM780G-4
Current - Test: 700 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Part Status: Active
Supplier Device Package: OM-780G-4L
Technology: LDMOS
Gain: 19.9dB
Power - Output: 267W
Configuration: Dual
Frequency: 595MHz ~ 851MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780G-4L
Packaging: Tape & Reel (TR)
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A3T18H455W23SR6 A3T18H455W23SR6 NXP USA Inc. A3T18H455W23S.pdf Description: RF MOSFET LDMOS 30V ACP1230S-4
Current - Test: 600 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Supplier Device Package: ACP-1230S-4L2S
Technology: LDMOS
Gain: 16.7dB
Power - Output: 192W
Configuration: Dual
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: ACP-1230S-4L2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3T21H360W23SR6 NXP USA Inc. A3T21H360W23S.pdf Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
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FS32K142HAT0MLHT FS32K142HAT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
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FS32K142HAT0MLLT FS32K142HAT0MLLT NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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FS32K142MNT0VLLR FS32K142MNT0VLLR NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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FS32K142MNT0VLLT FS32K142MNT0VLLT NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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FS32K142UAT0VLHT FS32K142UAT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UAT0VLLT FS32K142UAT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UFT0VLHT FS32K142UFT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
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FS32K142UFT0VLLT FS32K142UFT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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FS32K144HAT0VLHR FS32K144HAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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FS32K144HRT0MLHT FS32K144HRT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K144HRT0VMHR FS32K144HRT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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FS32K144HRT0VMHT FS32K144HRT0VMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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FS32K144MAT0VLHR FS32K144MAT0VLHR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
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FS32K144MAT0VLHT FS32K144MAT0VLHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
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FS32K144MNT0VLHR FS32K144MNT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
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FS32K144MNT0VLHT FS32K144MNT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
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FS32K148HST0MLQT FS32K148HST0MLQT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 128
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
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FS32K148UJT0VLQT FS32K148UJT0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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FS32K148UJT0VLUT FS32K148UJT0VLUT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 156
DigiKey Programmable: Not Verified
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FS32K148UJT0VMHT FS32K148UJT0VMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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LPC54005JBD100E LPC54005JBD100E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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LPC54005JET100E LPC54005JET100E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
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LPC54016JBD100E LPC54016JBD100E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 100LQFP
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
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LPC54016JBD208E LPC54016JBD208E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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LPC54016JET180E LPC54016JET180E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 145
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
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LPC54018JBD208E LPC54018JBD208E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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LPC54018JET180E LPC54018JET180E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 145
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
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LPC54605J512BD100E LPC54605J512BD100E NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC54605J512ET100E LPC54605J512ET100E NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC54S005JBD100E LPC54S005JBD100E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC54S005JET100E LPC54S005JET100E NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC54S016JBD100E LPC54S016JBD100E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC54S016JBD208E LPC54S016JBD208E NXP USA Inc. LPC540XXMCUFAMFS.pdf Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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SJA1105ELY SJA1105.pdf
SJA1105ELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Part Status: Active
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
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SJA1105TELY SJA1105.pdf
SJA1105TELY
Hersteller: NXP USA Inc.
Description: IC ETHERNET SWITCH SPI 159LFBGA
Protocol: Ethernet
Current - Supply: 3.5mA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Interface: SPI
Function: Switch
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Grade: Automotive
Supplier Device Package: 159-LFBGA (12x12)
Standards: IEEE 802.3
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TFA9892AUK/N1BZ
TFA9892AUK/N1BZ
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 6.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.63x3.13)
Max Output Power x Channels @ Load: 6.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
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TFA9891UK/N1AZ
TFA9891UK/N1AZ
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.6W 49WLCSP
Part Status: Active
Supplier Device Package: 49-WLCSP (3.43x2.98)
Max Output Power x Channels @ Load: 3.6W x 1 @ 8Ohm
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 49-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
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NX30P6093UKZ NXP_GreenChip_FS.pdf
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Part Status: Obsolete
Fault Protection: Over Temperature, Over Voltage
Supplier Device Package: 20-WLCSP (2.16x1.7)
Ratio - Input:Output: 1:1
Current - Output (Max): 8A
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Voltage - Load: 2.8V ~ 20V
Rds On (Typ): 8.95mOhm
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: I²C
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 20-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TEA1999TK/1J TEA1999TK.pdf
TEA1999TK/1J
Hersteller: NXP USA Inc.
Description: FLYBACK SR
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Current - Supply: 250 µA
Supplier Device Package: 8-HVSON (3x3)
Applications: Active/Synchronous Rectification Controller
Voltage - Supply: 0V ~ 21V
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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MCIMX8M-EVK i.MX8M_Family_FS.pdf
MCIMX8M-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8M EVAL BRD
Part Status: Active
Utilized IC / Part: i.MX 8M
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC8N04FHI24E LPC8N04.pdf
LPC8N04FHI24E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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5+5.15 EUR
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LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OM40002UL get-started-with-the-om40002:GS-OM40002
OM40002UL
Hersteller: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC8N04
Part Status: Active
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LPC8N04FHI24Z LPC8N04.pdf
LPC8N04FHI24Z
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Part Status: Active
Supplier Device Package: 24-HVQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 12
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MC33972ATEKR2
MC33972ATEKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
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S9KEAZN8AMTGR S9KEA8P44M48SF0.pdf
S9KEAZN8AMTGR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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SC16C752BIB48,128 SC16C752B.pdf
SC16C752BIB48,128
Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
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PCF8551BTT/AJ PCF8551.pdf
PCF8551BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Produkt ist nicht verfügbar
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TJA1027TK/20,118 TJA1027.pdf
TJA1027TK/20,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Part Status: Active
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-HVSON (3x3)
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Cut Tape (CT)
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9+2.39 EUR
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BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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LPC11A04UK,118 LPC11AXX.pdf
LPC11A04UK,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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S9KEAZN64AMLHR S9KEA64P64M20SF0.pdf
S9KEAZN64AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
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3+7.83 EUR
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LPC812M101JDH16J LPC81XM.pdf
LPC812M101JDH16J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Verified
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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7+3.2 EUR
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GTL2000DGG,118 GTL2000.pdf
GTL2000DGG,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 48TSSOP
Number of Circuits: 1
Part Status: Obsolete
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 22
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 48-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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LPC824M201JHI33Y LPC82X.pdf
LPC824M201JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
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10+3.72 EUR
25+3.4 EUR
100+3.06 EUR
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500+2.8 EUR
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TDA8037TT/C1J TDA8037.pdf
TDA8037TT/C1J
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: Smart Card
Supplier Device Package: 16-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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LPC1111FHN33/102'5 LPC111X.pdf
LPC1111FHN33/102'5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
auf Bestellung 12192 Stücke:
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5+4.69 EUR
10+3.18 EUR
25+2.77 EUR
100+2.38 EUR
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A2V07H400-04NR3 A2V07H400-04N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Current - Test: 700 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Part Status: Active
Supplier Device Package: OM-780G-4L
Technology: LDMOS
Gain: 19.9dB
Power - Output: 267W
Configuration: Dual
Frequency: 595MHz ~ 851MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780G-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3T18H455W23SR6 A3T18H455W23S.pdf
A3T18H455W23SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Current - Test: 600 mA
Voltage - Test: 30 V
Voltage - Rated: 65 V
Supplier Device Package: ACP-1230S-4L2S
Technology: LDMOS
Gain: 16.7dB
Power - Output: 192W
Configuration: Dual
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: ACP-1230S-4L2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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A3T21H360W23SR6 A3T21H360W23S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
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FS32K142HAT0MLHT S32K1xx.pdf
FS32K142HAT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
auf Bestellung 55 Stücke:
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2+15.79 EUR
10+12.94 EUR
25+12.46 EUR
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FS32K142HAT0MLLT
FS32K142HAT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 66 Stücke:
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2+16.23 EUR
10+9.45 EUR
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FS32K142MNT0VLLR
FS32K142MNT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142MNT0VLLT
FS32K142MNT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UAT0VLHT S32K1xx.pdf
FS32K142UAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UAT0VLLT S32K1xx.pdf
FS32K142UAT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K142UFT0VLHT S32K1xx.pdf
FS32K142UFT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K142UFT0VLLT S32K1xx.pdf
FS32K142UFT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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FS32K144HAT0VLHR S32K1xx.pdf
FS32K144HAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K144HRT0MLHT S32K1xx.pdf
FS32K144HRT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144HRT0VMHR S32K1xx.pdf
FS32K144HRT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K144HRT0VMHT S32K1xx.pdf
FS32K144HRT0VMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FS32K144MAT0VLHR S32K-DS.pdf
FS32K144MAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K144MAT0VLHT S32K-DS.pdf
FS32K144MAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
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FS32K144MNT0VLHR S32K1xx.pdf
FS32K144MNT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Produkt ist nicht verfügbar
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FS32K144MNT0VLHT S32K1xx.pdf
FS32K144MNT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HST0MLQT S32K-DS.pdf
FS32K148HST0MLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 128
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Produkt ist nicht verfügbar
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FS32K148UJT0VLQT S32K1xx.pdf
FS32K148UJT0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
auf Bestellung 271 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+34.53 EUR
10+28.96 EUR
25+28.2 EUR
100+25.74 EUR
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FS32K148UJT0VLUT S32K1xx.pdf
FS32K148UJT0VLUT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 156
DigiKey Programmable: Not Verified
auf Bestellung 170 Stücke:
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AnzahlPrivatkunde
1+29.76 EUR
10+23.56 EUR
25+22.02 EUR
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FS32K148UJT0VMHT S32K1xx.pdf
FS32K148UJT0VMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 892 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+38.45 EUR
10+30.74 EUR
25+28.81 EUR
100+26.69 EUR
250+26.43 EUR
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LPC54005JBD100E LPC540xx.pdf
LPC54005JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 90 Stücke:
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10+11 EUR
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90+10.73 EUR
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LPC54005JET100E LPC540xx.pdf
LPC54005JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
auf Bestellung 260 Stücke:
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LPC54016JBD100E LPC540xx.pdf
LPC54016JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
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LPC54016JBD208E LPC540xx.pdf
LPC54016JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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LPC54016JET180E LPC540xx.pdf
LPC54016JET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 145
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC54018JBD208E LPC540xx.pdf
LPC54018JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
auf Bestellung 72 Stücke:
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LPC54018JET180E LPC540xx.pdf
LPC54018JET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 145
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC54605J512BD100E LPC546XX.pdf
LPC54605J512BD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 200K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC54605J512ET100E LPC546XX.pdf
LPC54605J512ET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 219 Stücke:
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LPC54S005JBD100E LPC540XXMCUFAMFS.pdf
LPC54S005JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 58 Stücke:
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LPC54S005JET100E LPC540xx.pdf
LPC54S005JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 280 Stücke:
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LPC54S016JBD100E LPC540XXMCUFAMFS.pdf
LPC54S016JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
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LPC54S016JBD208E LPC540XXMCUFAMFS.pdf
LPC54S016JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 171
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 360K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
auf Bestellung 43 Stücke:
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2+17.55 EUR
10+13.73 EUR
36+12.46 EUR
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