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A3I25X050GNR1 NXP USA Inc. A3I25X050N.pdf Description: RF MOSFET LDMOS 28V OM400G-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Technology: LDMOS (Dual)
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
Gain: 28.8dB
Produkt ist nicht verfügbar
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A3I25X050NR1 NXP USA Inc. A3I25X050N.pdf Description: RF MOSFET LDMOS 28V OM400-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Technology: LDMOS (Dual)
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
Gain: 28.8dB
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/DZ TJA1028T/5V0/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/DZ TJA1028T/5V0/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 684 Stücke:
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8+2.43 EUR
12+1.5 EUR
25+1.42 EUR
100+1.34 EUR
250+1.32 EUR
500+1.31 EUR
Mindestbestellmenge: 8
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TJA1028TK/3V3/20/J TJA1028TK/3V3/20/J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/3V3/20/J TJA1028TK/3V3/20/J NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 4987 Stücke:
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7+2.85 EUR
10+2.18 EUR
25+2.04 EUR
100+1.72 EUR
250+1.52 EUR
500+1.45 EUR
1000+1.22 EUR
2500+1.18 EUR
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TJA1028T/3V3/20/DZ TJA1028T/3V3/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028T/3V3/20/DZ TJA1028T/3V3/20/DZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1348 Stücke:
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9+2.02 EUR
15+1.21 EUR
25+1.14 EUR
100+1.08 EUR
250+1.07 EUR
500+1.06 EUR
1000+0.92 EUR
Mindestbestellmenge: 9
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TJA1028T/3V3/20/1U TJA1028T/3V3/20/1U NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/1U TJA1028T/5V0/20/1U NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MWCT1123FVLL MWCT1123FVLL NXP USA Inc. MWCT1123FVLL.pdf Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1023IFVLL MWCT1023IFVLL NXP USA Inc. MWCT1123FVLL.pdf Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08D-Q100118 74AHC08D-Q100118 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: IC GATE AND
Packaging: Bulk
Part Status: Active
auf Bestellung 46687 Stücke:
Lieferzeit 10-14 Tag (e)
2470+0.2 EUR
Mindestbestellmenge: 2470
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74AHC08BQ-Q100115 74AHC08BQ-Q100115 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2520 Stücke:
Lieferzeit 10-14 Tag (e)
2520+0.23 EUR
Mindestbestellmenge: 2520
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74AHC08BQ115 74AHC08BQ115 NXP USA Inc. 74AHC_AHCT08.pdf Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74AHC08PW-Q100118 74AHC08PW-Q100118 NXP USA Inc. 74AHC_AHCT08_Q100.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08BQ/C4115 74AHC08BQ/C4115 NXP USA Inc. 74AHC_AHCT08.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW/S400118 74AHC08PW/S400118 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW653 74AHC08PW653 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KITPF5200FRDMEVM KITPF5200FRDMEVM NXP USA Inc. getting-started-with-the-kitpf5200frdmevm-evaluation-board:GS-KITPF5200FRDMEVM Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s), Accessories
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+440 EUR
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MPC561MZP56 MPC561MZP56 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CGTK2/T0B040X A7101CGTK2/T0B040X NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CGTK2/T0B0405 A7101CGTK2/T0B0405 NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CGT1/T0B0408, A7101CGT1/T0B0408, NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CGHN1/T0B0406 A7101CGHN1/T0B0406 NXP USA Inc. Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CLTK2/T0BC2WJ A7101CLTK2/T0BC2WJ NXP USA Inc. PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SmartCard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF1510A2EPR2 MC34PF1510A2EPR2 NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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SC16C654BIA529 NXP USA Inc. PIRSS01198-1.pdf?t.download=true&u=5oefqw Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX79-B24133 BZX79-B24133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX27LVOP4A MCIMX27LVOP4A NXP USA Inc. MCIMX27EC.pdf Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TWR-SB0800-36EVB NXP USA Inc. Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61002PYC115 PHPT61002PYC115 NXP USA Inc. PHPT61002PYC.pdf Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61006NY115 PHPT61006NY115 NXP USA Inc. PHPT61006NY.pdf Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9450AAHNY PCA9450AAHNY NXP USA Inc. PCA9450.pdf Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 1898 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.64 EUR
10+6.61 EUR
25+6.1 EUR
100+5.55 EUR
250+5.28 EUR
500+5.12 EUR
1000+4.99 EUR
Mindestbestellmenge: 3
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SPC5747CK1MMJ6R SPC5747CK1MMJ6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8887-A2-CBKE/AZ NXP USA Inc. Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/BZ NXP USA Inc. Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
Produkt ist nicht verfügbar
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PESD5V0U1BL/315 NXP USA Inc. Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6L7DVN10AB MCIMX6L7DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EP MC34PF1510A4EP NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKW21Z512VHT4 MKW21Z512VHT4 NXP USA Inc. KNTSKW41Z31Z21ZFS.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
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3+6.86 EUR
10+6.74 EUR
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MC9RS08KA4CPJ MC9RS08KA4CPJ NXP USA Inc. MC9RS08KA%284%2C8%29.pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC54102J256BD64QL LPC54102J256BD64QL NXP USA Inc. LPC5410X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.46 EUR
10+10.47 EUR
25+9.72 EUR
160+8.68 EUR
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S9S12G64BMLC S9S12G64BMLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12GN48BCLC S9S12GN48BCLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3356R1BSMP PTN3356R1BSMP NXP USA Inc. PTN3356R1.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 47655 Stücke:
Lieferzeit 10-14 Tag (e)
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S9S08DZ32F2CLFR S9S08DZ32F2CLFR NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMBA6F0VLF S912ZVMBA6F0VLF NXP USA Inc. S12ZVMBFS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RD33775ACNTEVB NXP USA Inc. Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
UJA1076ATW/5V0/WDJ UJA1076ATW/5V0/WDJ NXP USA Inc. UJA1076A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+3.68 EUR
Mindestbestellmenge: 2000
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MMA5148KWR2528 MMA5148KWR2528 NXP USA Inc. FSCLS07279-1.pdf?t.download=true&u=5oefqw Description: PSI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
48+10.21 EUR
Mindestbestellmenge: 48
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FXLS90322AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Produkt ist nicht verfügbar
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FXLS90322AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
auf Bestellung 1958 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.56 EUR
10+9.38 EUR
25+8.94 EUR
50+8.63 EUR
100+8.32 EUR
250+7.94 EUR
500+7.65 EUR
1000+7.38 EUR
Mindestbestellmenge: 2
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SAF7751HN/N207ZMP NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HN/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N205/S3K NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N207ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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A3I25X050GNR1 A3I25X050N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM400G-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400G-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Technology: LDMOS (Dual)
Supplier Device Package: OM-400G-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
Gain: 28.8dB
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A3I25X050NR1 A3I25X050N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM400-8
Packaging: Tape & Reel (TR)
Package / Case: OM-400-8
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
Configuration: 2 N-Channel
Power - Output: 5.6W
Technology: LDMOS (Dual)
Supplier Device Package: OM-400-8
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 130 mA
Gain: 28.8dB
Produkt ist nicht verfügbar
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TJA1028T/5V0/20/DZ TJA1028.pdf
TJA1028T/5V0/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1028T/5V0/20/DZ TJA1028.pdf
TJA1028T/5V0/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.43 EUR
12+1.5 EUR
25+1.42 EUR
100+1.34 EUR
250+1.32 EUR
500+1.31 EUR
Mindestbestellmenge: 8
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TJA1028TK/3V3/20/J TJA1028.pdf
TJA1028TK/3V3/20/J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/3V3/20/J TJA1028.pdf
TJA1028TK/3V3/20/J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 4987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.85 EUR
10+2.18 EUR
25+2.04 EUR
100+1.72 EUR
250+1.52 EUR
500+1.45 EUR
1000+1.22 EUR
2500+1.18 EUR
Mindestbestellmenge: 7
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TJA1028T/3V3/20/DZ TJA1028.pdf
TJA1028T/3V3/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1028T/3V3/20/DZ TJA1028.pdf
TJA1028T/3V3/20/DZ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
auf Bestellung 1348 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.02 EUR
15+1.21 EUR
25+1.14 EUR
100+1.08 EUR
250+1.07 EUR
500+1.06 EUR
1000+0.92 EUR
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TJA1028T/3V3/20/1U TJA1028.pdf
TJA1028T/3V3/20/1U
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1028T/5V0/20/1U TJA1028.pdf
TJA1028T/5V0/20/1U
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LIN
Supplier Device Package: 8-SO
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MWCT1123FVLL MWCT1123FVLL.pdf
MWCT1123FVLL
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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MWCT1023IFVLL MWCT1123FVLL.pdf
MWCT1023IFVLL
Hersteller: NXP USA Inc.
Description: KV4X WCT 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Applications: Microcontroller, MCU
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08D-Q100118 74AHC_AHCT08_Q100.pdf
74AHC08D-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Part Status: Active
auf Bestellung 46687 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2470+0.2 EUR
Mindestbestellmenge: 2470
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74AHC08BQ-Q100115 74AHC_AHCT08_Q100.pdf
74AHC08BQ-Q100115
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2520+0.23 EUR
Mindestbestellmenge: 2520
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74AHC08BQ115 74AHC_AHCT08.pdf
74AHC08BQ115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC08BQ - AND GAT
Packaging: Bulk
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74AHC08PW-Q100118 74AHC_AHCT08_Q100.pdf
74AHC08PW-Q100118
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08BQ/C4115 74AHC_AHCT08.pdf
74AHC08BQ/C4115
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC08PW/S400118 PHGLS15178-1.pdf?t.download=true&u=5oefqw
74AHC08PW/S400118
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AHC08PW653 PHGLS15178-1.pdf?t.download=true&u=5oefqw
74AHC08PW653
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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KITPF5200FRDMEVM getting-started-with-the-kitpf5200frdmevm-evaluation-board:GS-KITPF5200FRDMEVM
KITPF5200FRDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: On-Board LEDs, Test Points
Contents: Board(s), Cable(s), Accessories
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+440 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MPC561MZP56 MPC561RM.pdf
MPC561MZP56
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A7101CGTK2/T0B040X
A7101CGTK2/T0B040X
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A7101CGTK2/T0B0405
A7101CGTK2/T0B0405
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A7101CGT1/T0B0408,
A7101CGT1/T0B0408,
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A7101CGHN1/T0B0406
A7101CGHN1/T0B0406
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A7101CLTK2/T0BC2WJ PHGL-S-A0006349687-1.pdf?t.download=true&amp;u=5oefqw
A7101CLTK2/T0BC2WJ
Hersteller: NXP USA Inc.
Description: PLUG TRUST SECURE ELEMENT
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SmartCard
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 3.6V
Controller Series: A71CL
Applications: Authentication
Core Processor: i.MX6UL
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34PF1510A2EPR2 PF1510.pdf
MC34PF1510A2EPR2
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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SC16C654BIA529 PIRSS01198-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QUAD UART WITH 64-BYTE FIFOS AND
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BZX79-B24133 BZX79.pdf
BZX79-B24133
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-B24 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX27LVOP4A MCIMX27EC.pdf
MCIMX27LVOP4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TWR-SB0800-36EVB
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD - SB0800 SOLEN
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC34SB0800
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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PHPT61002PYC115 PHPT61002PYC.pdf
PHPT61002PYC115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PHPT61006NY115 PHPT61006NY.pdf
PHPT61006NY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9450AAHNY PCA9450.pdf
PCA9450AAHNY
Hersteller: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 1898 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.64 EUR
10+6.61 EUR
25+6.1 EUR
100+5.55 EUR
250+5.28 EUR
500+5.12 EUR
1000+4.99 EUR
Mindestbestellmenge: 3
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SPC5747CK1MMJ6R MPC5748G.pdf
SPC5747CK1MMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8887-A2-CBKE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 124WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 124-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v4.2 Dual Mode
Data Rate (Max): 433Mbps
Supplier Device Package: 124-WLCSP
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, UART
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
88W8787-A1-BRDA/BZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Package / Case: 120-VFBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Data Rate (Max): 150Mbps
Supplier Device Package: 120-VFBGA (7x7)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Part Status: Active
Protocol: 802.11a/g/b, Bluetooth v2.1 +EDR
Modulation: 4DQPSK, 8DPSK, DSSS, GFSK, OFDM
Produkt ist nicht verfügbar
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PESD5V0U1BL/315
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 2.9pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 5.5V
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6L7DVN10AB IMX6SLCEC.pdf
MCIMX6L7DVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
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MC34PF1510A4EP PF1510.pdf
MC34PF1510A4EP
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKW21Z512VHT4 KNTSKW41Z31Z21ZFS.pdf
MKW21Z512VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Zigbee®
Current - Receiving: 6.2mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.86 EUR
10+6.74 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
MC9RS08KA4CPJ MC9RS08KA%284%2C8%29.pdf
MC9RS08KA4CPJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54102J256BD64QL LPC5410X.pdf
LPC54102J256BD64QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.46 EUR
10+10.47 EUR
25+9.72 EUR
160+8.68 EUR
Mindestbestellmenge: 2
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S9S12G64BMLC S12G%20Family%20Fact%20Sheet.pdf
S9S12G64BMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN48BCLC S12G%20Family%20Fact%20Sheet.pdf
S9S12GN48BCLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3356R1BSMP PTN3356R1.pdf
PTN3356R1BSMP
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 2.8V ~ 3.6V
Applications: DisplayPort
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 47655 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
179+2.81 EUR
Mindestbestellmenge: 179
Im Einkaufswagen  Stück im Wert von  UAH
S9S08DZ32F2CLFR
S9S08DZ32F2CLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMBA6F0VLF S12ZVMBFS.pdf
S912ZVMBA6F0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RD33775ACNTEVB
Hersteller: NXP USA Inc.
Description: RD33775ACNTEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33775A
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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UJA1076ATW/5V0/WDJ UJA1076A.pdf
UJA1076ATW/5V0/WDJ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Part Status: Active
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+3.68 EUR
Mindestbestellmenge: 2000
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MMA5148KWR2528 FSCLS07279-1.pdf?t.download=true&u=5oefqw
MMA5148KWR2528
Hersteller: NXP USA Inc.
Description: PSI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
48+10.21 EUR
Mindestbestellmenge: 48
Im Einkaufswagen  Stück im Wert von  UAH
FXLS90322AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
Produkt ist nicht verfügbar
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FXLS90322AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Cut Tape (CT)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Part Status: Active
Mounting Type: Surface Mount, Wettable Flank
auf Bestellung 1958 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.56 EUR
10+9.38 EUR
25+8.94 EUR
50+8.63 EUR
100+8.32 EUR
250+7.94 EUR
500+7.65 EUR
1000+7.38 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HN/N207ZMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HN/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N205/S3K
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7755HV/N207ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7753HV/N205ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SAF7751HV/N207ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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