Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36787) > Seite 481 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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| 74AHCT1G04GW-Q100125 | NXP USA Inc. |
 Description: INVERTER, AHCT/VHCT/VT SERIESPart Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74AHCT1G04GM115 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT1G04GM - INVE Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MMW9014KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Function: Transmitter Mounting Type: Surface Mount Package / Case: 182-UFBGA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 182-HUBGA (6.1x6.5) RF Type: General Purpose Frequency: 24.25GHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MMW9012KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Part Status: Active Supplier Device Package: 182-HUBGA (6.1x6.5) RF Type: General Purpose Frequency: 26.5GHz ~ 29.5GHz Function: Transmitter Mounting Type: Surface Mount Package / Case: 182-UFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PCA9634D | NXP USA Inc. |
Description: LED DRIVER 8-SEGMENT Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PCA9634D118 | NXP USA Inc. |
Description: IC LED DRIVER LIN DIM 25MA 20SO Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC9S12DB128MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12DB128CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Obsolete Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 252 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F541D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 946 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMMA2241KEG | NXP USA Inc. |
Description: IC ACCEL X-LATERAL 10G Packaging: Tube Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LM75BDP/DG,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8TSSOP Features: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F83766VLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP DigiKey Programmable: Not Verified Number of I/O: 68 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 48K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPXV2202DP | NXP USA Inc. |
 Description: SENSOR 29.01PSID 0.13" .04V 8SOPFeatures: Temperature Compensated Packaging: Tray Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08GT8AMFCE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 24 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL05Z32VLF4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 41 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 14x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 8505 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222CUKZ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 WLCSP12 Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222CUKZ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 WLCSP12 Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
auf Bestellung 15374 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC32245AEC,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 96LFBGA Part Status: Active Supplier Device Package: 96-LFBGA (13.5x5.5) Current - Output High, Low: 24mA, 24mA Number of Bits per Element: 8 Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 96-LFBGA Packaging: Bulk |
auf Bestellung 80605 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXHZ6116A6U | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.645V 8SSOP Output Type: Analog Voltage Package / Case: 8-SOIC (0.295", 7.50mm Width) Features: Temperature Compensated Packaging: Tube Part Status: Obsolete Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Supplier Device Package: 8-SSOP Applications: Board Mount Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Output: 0.399 V ~ 4.645 V Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPXHZ6116A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.645V 8SSOP Part Status: Active Maximum Pressure: 58.02PSI (400kPa) Port Style: No Port Supplier Device Package: 8-SSOP Applications: Board Mount Voltage - Supply: 4.75V ~ 5.25V Termination Style: Gull Wing Operating Temperature: -40°C ~ 125°C Accuracy: ±1.5% Pressure Type: Absolute Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Output: 0.399 V ~ 4.645 V Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 8-SOIC (0.295", 7.50mm Width) Features: Temperature Compensated Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| STMP3770XXLAEA2N | NXP USA Inc. |
Description: STMP3770 - PMP CONTROLLER Packaging: Bulk Part Status: Obsolete |
auf Bestellung 6836 Stücke: Lieferzeit 10-14 Tag (e) |
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| STMP3770XXBJEA3N | NXP USA Inc. |
Description: STMP3770XXBJEA3N Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| STMP3770XXLAEA3N | NXP USA Inc. |
Description: STMP3770XXLAEA3N Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LX2160XN72232B | NXP USA Inc. |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Speed: 2.2GHz Mounting Type: Surface Mount Package / Case: 1517-BBGA, FCBGA Packaging: Tray Part Status: Active SATA: SATA 3.0 (4) Security Features: Secure Boot, TrustZone® Graphics Acceleration: Yes RAM Controllers: DDR4 Number of Cores/Bus Width: 16 Core, 64-Bit USB: USB 3.0 (2) + PHY (2) Ethernet: 100Gbps (2) Supplier Device Package: 1517-FCPBGA (40x40) Voltage - I/O: 1.2V, 1.8V, 3.3V Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TJ) |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8560VTAQFC | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08GT8ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFP DigiKey Programmable: Not Verified Package / Case: 44-QFP Number of I/O: 36 Part Status: Active Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NCF29A1XHN/0500IJ | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NCF29A1XHN/0500IJ | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
auf Bestellung 5964 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0L5UV/DG125 | NXP USA Inc. |
Description: TVS DIODE 5VWM 12VC SOT666 Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: SOT-666 Unidirectional Channels: 5 Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 12V Power - Peak Pulse: 25W Power Line Protection: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KITPF5200SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR KL25Z, PF5200 Packaging: Box Function: Automotive Type: Power Management Contents: Board(s), Cable(s), Accessories Utilized IC / Part: KL25Z, PF5200 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 2-Channel (Dual) Secondary Attributes: On-Board LEDs, Test Points Embedded: Yes, MCU |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF776DEL/200SK | NXP USA Inc. |
Description: SAF776DEL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KC13237CHT | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NT2H1001G0DUDV | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443 Supplier Device Package: Die |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 112373 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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NCF3340AHN/00330Y | NXP USA Inc. |
Description: AUTOMOTIVE QUALIFIED NFC CONTROL Supplier Device Package: 40-HVQFN (6x6) Standards: FeliCa, ISO 14443, MIFARE, NFC Voltage - Supply: 2.3V ~ 5.5V Type: RFID Reader/Transponder Interface: I²C, SPI Frequency: 24.12MHz Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NCJ3340AHN/00330Y | NXP USA Inc. |
Description: NFC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC56F8013VFAE | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 16KB (8K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1249 Stücke: Lieferzeit 10-14 Tag (e) |
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| LFBGAINTPU3A | NXP USA Inc. |
Description: NXP LEAD FREE 324 PIN 1.0 MM PIT Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPY2A | NXP USA Inc. |
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPT5A | NXP USA Inc. |
Description: NXP LEAD FREE 269 PIN. 0.80 MM P Packaging: Bulk Module/Board Type: Socket Module - BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPS1A | NXP USA Inc. |
Description: 256 PIN 1.0MM BGA TO PGA ADAPTER Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPH1A | NXP USA Inc. |
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPV1A | NXP USA Inc. |
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPS2A | NXP USA Inc. |
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPT3A | NXP USA Inc. |
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPT4A | NXP USA Inc. |
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTPZ3A | NXP USA Inc. |
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER Packaging: Bulk Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFBGAINTJ33QLT | NXP USA Inc. |
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5 Packaging: Bulk For Use With/Related Products: MPC563x Module/Board Type: Socket Adapter Utilized IC / Part: MPC563x |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8270VVUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 450MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XDG128F2MAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA1938T/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 10SO Control Features: EN, Soft Start Voltage - Start Up: 17.5 V Fault Protection: Over Power, Over Temperature, Over Voltage Supplier Device Package: 10-SO Voltage - Supply (Vcc/Vdd): 0V ~ 120V Topology: Flyback Output Isolation: Isolated Internal Switch(s): No Frequency - Switching: 25.5kHz ~ 128kHz Operating Temperature: -25°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 10-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| HT2ICS2002W/V6F/RZ | NXP USA Inc. |
Description: HITAG 2 TRANSPONDER IC Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -55°C ~ 140°C Voltage - Supply: -0.5V ~ 6.5V Standards: ISO 11784, ISO 11785 Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 11091 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MC908QVY4CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908JK8MDWE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC DigiKey Programmable: Not Verified Number of I/O: 15 Supplier Device Package: 20-SOIC Peripherals: LED, LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 13x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
auf Bestellung 4522 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908LK24CFUE | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 64QFP Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I²C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 2688 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908JL16CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28SOIC Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 23 Supplier Device Package: 28-SOIC Peripherals: LED, LVD, POR, PWM Connectivity: I²C, SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: HC08 |
auf Bestellung 1594 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908GT16CFBER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFP DigiKey Programmable: Not Verified Number of I/O: 36 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tape & Reel (TR) |
auf Bestellung 1470 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908GT16CFBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFP DigiKey Programmable: Not Verified Number of I/O: 36 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Bulk |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908AP8CFAE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 48-LQFP (7x7) Peripherals: LED, LVD, POR, PWM Connectivity: I2C, IRSCI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 74AHCT1G04GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Description: INVERTER, AHCT/VHCT/VT SERIES
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT1G04GM115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMW9014KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 24.25GHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMW9012KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Part Status: Active
Supplier Device Package: 182-HUBGA (6.1x6.5)
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 182-UFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA9634D |
|
Hersteller: NXP USA Inc.
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9634D118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12DB128MPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12DB128CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 252 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| N74F541D,623 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 946+ | 0.63 EUR |
| LM75BDP/DG,118 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F83766VLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPXV2202DP |
|
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08GT8AMFCE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 58+ | 9.39 EUR |
| MKL05Z32VLF4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 41
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9KEAZN8AMFKR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5000+ | 2.63 EUR |
| S9KEAZN8AMFKR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 8505 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.74 EUR |
| 10+ | 3.53 EUR |
| 25+ | 3.22 EUR |
| 100+ | 2.89 EUR |
| 250+ | 2.73 EUR |
| 500+ | 2.63 EUR |
| 1000+ | 2.61 EUR |
| PTN3222CUKZ |
|
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8000+ | 2.05 EUR |
| PTN3222CUKZ |
|
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 15374 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.06 EUR |
| 10+ | 3 EUR |
| 25+ | 2.74 EUR |
| 100+ | 2.45 EUR |
| 250+ | 2.31 EUR |
| 500+ | 2.24 EUR |
| 74LVC32245AEC,518 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
auf Bestellung 80605 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 89+ | 7.08 EUR |
| MPXHZ6116A6U |
|
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tube
Part Status: Obsolete
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPXHZ6116A6T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Part Status: Active
Maximum Pressure: 58.02PSI (400kPa)
Port Style: No Port
Supplier Device Package: 8-SSOP
Applications: Board Mount
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Output: 0.399 V ~ 4.645 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| STMP3770XXLAEA2N |
|
auf Bestellung 6836 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 37+ | 15.02 EUR |
| LX2160XN72232B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1227.29 EUR |
| MPC8560VTAQFC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08GT8ACFBE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Package / Case: 44-QFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Package / Case: 44-QFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCF29A1XHN/0500IJ |
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCF29A1XHN/0500IJ |
Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
auf Bestellung 5964 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.49 EUR |
| 10+ | 22.16 EUR |
| 25+ | 21 EUR |
| 100+ | 19.42 EUR |
| 250+ | 18.47 EUR |
| 500+ | 17.79 EUR |
| 1000+ | 17.16 EUR |
| PESD5V0L5UV/DG125 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KITPF5200SKTEVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 697.29 EUR |
| SAF776DEL/200SK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NT2H1001G0DUDV |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
Mindestbestellmenge: 112373 Stücke
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Stück im Wert von UAH
| NCF3340AHN/00330Y |
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.3V ~ 5.5V
Type: RFID Reader/Transponder
Interface: I²C, SPI
Frequency: 24.12MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.3V ~ 5.5V
Type: RFID Reader/Transponder
Interface: I²C, SPI
Frequency: 24.12MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCJ3340AHN/00330Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F8013VFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1249 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.69 EUR |
| 10+ | 18.62 EUR |
| 50+ | 16.59 EUR |
| 100+ | 15.96 EUR |
| 500+ | 14.89 EUR |
| LFBGAINTPY2A |
Hersteller: NXP USA Inc.
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPT5A |
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPH1A |
Hersteller: NXP USA Inc.
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPV1A |
Hersteller: NXP USA Inc.
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPS2A |
Hersteller: NXP USA Inc.
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPT3A |
Hersteller: NXP USA Inc.
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPT4A |
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTPZ3A |
Hersteller: NXP USA Inc.
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFBGAINTJ33QLT |
Hersteller: NXP USA Inc.
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC563x
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC563x
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| MPC8270VVUPEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 340.59 EUR |
| S912XDG128F2MAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| TEA1938T/1J |
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Control Features: EN, Soft Start
Voltage - Start Up: 17.5 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC OFFLINE SWITCH FLYBACK 10SO
Control Features: EN, Soft Start
Voltage - Start Up: 17.5 V
Fault Protection: Over Power, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 25.5kHz ~ 128kHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| HT2ICS2002W/V6F/RZ |
|
Hersteller: NXP USA Inc.
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Mindestbestellmenge: 11091 Stücke
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| MC908QVY4CDWER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 132+ | 7.96 EUR |
| MC908JK8MDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 15
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 4522 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 167+ | 6.28 EUR |
| MC908LK24CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2688 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 79+ | 13.28 EUR |
| MC908JL16CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: HC08
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-SOIC
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: HC08
auf Bestellung 1594 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 69+ | 15.37 EUR |
| MC908GT16CFBER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
auf Bestellung 1470 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 60+ | 17.47 EUR |
| MC908GT16CFBE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Bulk
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 60+ | 17.47 EUR |
| MC908AP8CFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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