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BUK7Y98-80E,115 BUK7Y98-80E,115 NXP USA Inc. BUK7Y98-80E.pdf Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1024IZVHT NXP USA Inc. MWPR1124ZVHT.pdf Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1124ZVHT NXP USA Inc. MWPR1124ZVHT.pdf Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X4AVM08ABR MCIMX6X4AVM08ABR NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HEC4040BT-Q100118 NXP USA Inc. Description: J-K FLIP-FLOP, 2-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C62115 BZX84J-C62115 NXP USA Inc. BZX84J_SER.pdf Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C5V1115 BZX84J-C5V1115 NXP USA Inc. BZX84J_SER.pdf Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT3H2211W0FTTJ NT3H2211W0FTTJ NXP USA Inc. NT3H2111_2211.pdf Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5446 Stücke:
Lieferzeit 10-14 Tag (e)
9+2.09 EUR
10+1.81 EUR
25+1.7 EUR
100+1.56 EUR
250+1.48 EUR
500+1.42 EUR
1000+1.36 EUR
Mindestbestellmenge: 9
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MC33XS2410EL NXP USA Inc. MC33XS2410.pdf Description: HIGH-SIDE SWITCH 60V HTSSOP28
Packaging: Tube
Features: Load Discharge, Slew Rate Controlled
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74AUP2G80GF,115 74AUP2G80GF,115 NXP USA Inc. PHGLS25983-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
1528+0.34 EUR
Mindestbestellmenge: 1528
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NX3L4053HRZ NX3L4053HRZ NXP USA Inc. Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HXQFN (3x3)
Part Status: Active
Produkt ist nicht verfügbar
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74ALVT162240DL,112 74ALVT162240DL,112 NXP USA Inc. 74ALVT162240.pdf Description: IC BUFFER INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08QG8MPBE MC9S08QG8MPBE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ASK-RYLT1046-1K NXP USA Inc. Description: ROYALTY PREPAYMENT 1K UNITS - LS
Packaging: Bulk
For Use With/Related Products: LS1046A
Type: Design Software
Part Status: Active
Produkt ist nicht verfügbar
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74LVCV2G66GTX NXP USA Inc. 74LVCV2G66.pdf Description: IC SWITCH SPST-NOX2 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 210MHz
Supplier Device Package: 8-XSON (1.95x1)
Voltage - Supply, Single (V+): 2.3V ~ 5.5V
Charge Injection: 0.0035pC
Crosstalk: -55dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 5ns, 9ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 10µA
Part Status: Active
Number of Circuits: 2
auf Bestellung 59251 Stücke:
Lieferzeit 10-14 Tag (e)
2016+0.26 EUR
Mindestbestellmenge: 2016
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FRDM-STBA-A8967 FRDM-STBA-A8967 NXP USA Inc. UM11735.pdf Description: DEV BOARD FXLS8967AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8967AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Contents: Board(s), Cable(s)
auf Bestellung 1 Stücke:
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1+148.33 EUR
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MC56F80748MLH MC56F80748MLH NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 796 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.01 EUR
10+10.06 EUR
25+9.32 EUR
160+8.3 EUR
320+8.04 EUR
480+7.91 EUR
Mindestbestellmenge: 2
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MC56F81000-EVK MC56F81000-EVK NXP USA Inc. MC56F81000EVKQSG.pdf Description: MC56F81000 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F81000
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+69.73 EUR
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MC56F80000-EVK MC56F80000-EVK NXP USA Inc. MC56F80000-EVK.pdf Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
Core Processor: 56800EF
auf Bestellung 10 Stücke:
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1+87.17 EUR
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MC56F82348MLH MC56F82348MLH NXP USA Inc. Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
49+10.19 EUR
Mindestbestellmenge: 49
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PMV37EN,215 PMV37EN,215 NXP USA Inc. Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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PMV37EN,215 PMV37EN,215 NXP USA Inc. Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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MCIMX280DVM4B MCIMX280DVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Part Status: Active
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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A2T20H160W04NR3528 NXP USA Inc. PHGL-S-A0002371724-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 3460 Stücke:
Lieferzeit 10-14 Tag (e)
4+144.07 EUR
Mindestbestellmenge: 4
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FXLS8967AFR3 NXP USA Inc. FXLS8967AF.pdf Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Produkt ist nicht verfügbar
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FXLS8967AFR3 NXP USA Inc. FXLS8967AF.pdf Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
3+6 EUR
10+4.5 EUR
25+4 EUR
50+3.8 EUR
100+3.7 EUR
500+3.1 EUR
Mindestbestellmenge: 3
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MCIMX534AVP8C2R2 MCIMX534AVP8C2R2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX534AVP8C2 MCIMX534AVP8C2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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SAF775CHN/N208W/HK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT27PW,118 74HCT27PW,118 NXP USA Inc. PHGL-S-A0001295645-1.pdf?t.download=true&u=5oefqw Description: IC GATE NOR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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TWR-LCD-RGB,598 NXP USA Inc. Description: TOWER SYSTEM, PERIPHERAL MODULE,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BF1202WR,135 BF1202WR,135 NXP USA Inc. BF1202(R,WR)_Rev_Sept2010.pdf Description: MOSFET N-CH DUAL GATE 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30.5dB
Technology: MOSFET
Noise Figure: 0.9dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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BF1202R,215 BF1202R,215 NXP USA Inc. BF1202%28R%2CWR%29_Rev_Sept2010.pdf Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 30mA
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Power - Output: 200mW
Gain: 30.5dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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BF1202R,215 BF1202R,215 NXP USA Inc. BF1202%28R%2CWR%29_Rev_Sept2010.pdf Description: RF MOSFET 5V SOT143R
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 30mA
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Power - Output: 200mW
Gain: 30.5dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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74AUP1G79GS,132 74AUP1G79GS,132 NXP USA Inc. PHGLS24882-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)
3484+0.15 EUR
Mindestbestellmenge: 3484
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BF1204,115 BF1204,115 NXP USA Inc. BF1204_Rev_Sept2010.pdf Description: FET RF 10V 400MHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
auf Bestellung 6939 Stücke:
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995+0.53 EUR
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MMG3012NT1 MMG3012NT1 NXP USA Inc. MMG3012NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 82mA
Noise Figure: 3.8dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3012NT1 MMG3012NT1 NXP USA Inc. MMG3012NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 82mA
Noise Figure: 3.8dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8349ECVVAJDB MPC8349ECVVAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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SPC5602PEF0VLL6R SPC5602PEF0VLL6R NXP USA Inc. MPC5602P.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Produkt ist nicht verfügbar
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MPC9456AC MPC9456AC NXP USA Inc. MPC9456.pdf Description: IC CLK BUFFER 1:10 250MHZ 32TQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
Part Status: Obsolete
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
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SSL5235TE/1518 SSL5235TE/1518 NXP USA Inc. Description: 5 OHM/550 VOLT MAINS DIMMABLE BU
Packaging: Bulk
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
579+0.83 EUR
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SSL5235BTE/1518 NXP USA Inc. Description: 5 OHM/550 V MAINS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SSL5235BTE/1Y NXP USA Inc. Description: IC LED DRIVER
Packaging: Bulk
Part Status: Active
auf Bestellung 7465 Stücke:
Lieferzeit 10-14 Tag (e)
628+0.79 EUR
Mindestbestellmenge: 628
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PCA9633D16,112 PCA9633D16,112 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-SO
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9633D16,118 PCA9633D16,118 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXPQ3115BVST1 FXPQ3115BVST1 NXP USA Inc. FXPQ3115BV.pdf Description: IC PRESSURE SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 7 b
Operating Pressure: 2.9PSI ~ 15.95PSI (20kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.11PSI (±0.75kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Medical Ventilation
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Active
Produkt ist nicht verfügbar
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PCA9531PW118 PCA9531PW118 NXP USA Inc. PCA9531.pdf Description: IC LED DRVR LIN DIM 25MA 16TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TWR-CM3120-EVM NXP USA Inc. KTTWRCM3120UG.pdf Description: TOWER BOARD - CM3120 IO-LINK MA
Packaging: Bulk
Function: IO-Link
Type: Interface
Contents: Board(s)
Utilized IC / Part: CM3120
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AB,557 NXP USA Inc. IMX6DQPIEC.pdf Description: I.MX 6 SERIES 32 BIT MPU, QUAD A
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP5EYM1AA557 NXP USA Inc. IMX6DQPCEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT08AC MCIMX6Q4AVT08AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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BTA330Y-800BT127 BTA330Y-800BT127 NXP USA Inc. PHGL-S-A0001060295-1.pdf?t.download=true&u=5oefqw Description: 3 QUADRANT TRIAC TO 220AB
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S32G-VNP-GLDBOX3 S32G-VNP-GLDBOX3 NXP USA Inc. S32G-VNP-GLDBOX3UG.pdf Description: EVAL BOARD FOR S32G2
Packaging: Box
Function: Networking
Type: Reference Design
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+5271.66 EUR
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MPC8541PXAPF MPC8541PXAPF NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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S9S12GN32F0MLFR S9S12GN32F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF6V3090NR1 MRF6V3090NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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LD6836CX4/25P,315 LD6836CX4/25P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17957 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
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MK10DX64VLK7R MK10DX64VLK7R NXP USA Inc. K10P81M72SF1.pdf Description: IC MCU 32BIT 64KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 56
Produkt ist nicht verfügbar
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MCIMX6D7CZK08AD NXP USA Inc. IMX6DQCPOPEC.pdf Description: I.MX 6 SERIES 32-BIT MPU QUAD A
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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BUK7Y98-80E,115 BUK7Y98-80E.pdf
BUK7Y98-80E,115
Hersteller: NXP USA Inc.
Description: BUK7Y98-80E - N-CHANNEL 80V, 98
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1024IZVHT MWPR1124ZVHT.pdf
Hersteller: NXP USA Inc.
Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MWPR1124ZVHT MWPR1124ZVHT.pdf
Hersteller: NXP USA Inc.
Description: KW40 512 WCT 48LQFN
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6X4AVM08ABR
MCIMX6X4AVM08ABR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 529-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Part Status: Active
Produkt ist nicht verfügbar
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HEC4040BT-Q100118
Hersteller: NXP USA Inc.
Description: J-K FLIP-FLOP, 2-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C62115 BZX84J_SER.pdf
BZX84J-C62115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZX84J-C5V1115 BZX84J_SER.pdf
BZX84J-C5V1115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C5V1 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NT3H2211W0FTTJ NT3H2111_2211.pdf
NT3H2211W0FTTJ
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.3V
Standards: ISO 14443
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 5446 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.09 EUR
10+1.81 EUR
25+1.7 EUR
100+1.56 EUR
250+1.48 EUR
500+1.42 EUR
1000+1.36 EUR
Mindestbestellmenge: 9
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MC33XS2410EL MC33XS2410.pdf
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 60V HTSSOP28
Packaging: Tube
Features: Load Discharge, Slew Rate Controlled
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 100mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.6A
Ratio - Input:Output: 1:4
Supplier Device Package: 28-HTSSOP
Fault Protection: Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74AUP2G80GF,115 PHGLS25983-1.pdf?t.download=true&u=5oefqw
74AUP2G80GF,115
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1528+0.34 EUR
Mindestbestellmenge: 1528
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NX3L4053HRZ
NX3L4053HRZ
Hersteller: NXP USA Inc.
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HXQFN (3x3)
Part Status: Active
Produkt ist nicht verfügbar
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74ALVT162240DL,112 74ALVT162240.pdf
74ALVT162240DL,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08QG8MPBE MC9S08QG8.pdf
MC9S08QG8MPBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ASK-RYLT1046-1K
Hersteller: NXP USA Inc.
Description: ROYALTY PREPAYMENT 1K UNITS - LS
Packaging: Bulk
For Use With/Related Products: LS1046A
Type: Design Software
Part Status: Active
Produkt ist nicht verfügbar
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74LVCV2G66GTX 74LVCV2G66.pdf
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NOX2 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 210MHz
Supplier Device Package: 8-XSON (1.95x1)
Voltage - Supply, Single (V+): 2.3V ~ 5.5V
Charge Injection: 0.0035pC
Crosstalk: -55dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 5ns, 9ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 10µA
Part Status: Active
Number of Circuits: 2
auf Bestellung 59251 Stücke:
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Anzahl Preis
2016+0.26 EUR
Mindestbestellmenge: 2016
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FRDM-STBA-A8967 UM11735.pdf
FRDM-STBA-A8967
Hersteller: NXP USA Inc.
Description: DEV BOARD FXLS8967AF ACCEL
Packaging: Bulk
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8967AF, K22
Supplied Contents: Board(s), Cable(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
Part Status: Active
Contents: Board(s), Cable(s)
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1+148.33 EUR
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MC56F80748MLH MC56F80XXX.pdf
MC56F80748MLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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Anzahl Preis
2+13.01 EUR
10+10.06 EUR
25+9.32 EUR
160+8.3 EUR
320+8.04 EUR
480+7.91 EUR
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MC56F81000-EVK MC56F81000EVKQSG.pdf
MC56F81000-EVK
Hersteller: NXP USA Inc.
Description: MC56F81000 EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F81000
Part Status: Active
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MC56F80000-EVK MC56F80000-EVK.pdf
MC56F80000-EVK
Hersteller: NXP USA Inc.
Description: DIGITAL SIGNAL CTRL EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s)
Board Type: Evaluation Platform
Utilized IC / Part: MC56F80748
Part Status: Active
Core Processor: 56800EF
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1+87.17 EUR
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MC56F82348MLH
MC56F82348MLH
Hersteller: NXP USA Inc.
Description: MC56F82348 - 32-BIT DSC, 56800EX
Packaging: Bulk
Part Status: Active
auf Bestellung 160 Stücke:
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Anzahl Preis
49+10.19 EUR
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PMV37EN,215
PMV37EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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PMV37EN,215
PMV37EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 3.1A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.1A (Ta)
Rds On (Max) @ Id, Vgs: 36mOhm @ 3.1A, 10V
Power Dissipation (Max): 380mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 10 V
Produkt ist nicht verfügbar
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MCIMX280DVM4B IMX28CEC.pdf
MCIMX280DVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Part Status: Active
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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A2T20H160W04NR3528 PHGL-S-A0002371724-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 3460 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+144.07 EUR
Mindestbestellmenge: 4
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FXLS8967AFR3 FXLS8967AF.pdf
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Produkt ist nicht verfügbar
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FXLS8967AFR3 FXLS8967AF.pdf
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6 EUR
10+4.5 EUR
25+4 EUR
50+3.8 EUR
100+3.7 EUR
500+3.1 EUR
Mindestbestellmenge: 3
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MCIMX534AVP8C2R2
MCIMX534AVP8C2R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX534AVP8C2
MCIMX534AVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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SAF775CHN/N208W/HK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74HCT27PW,118 PHGL-S-A0001295645-1.pdf?t.download=true&u=5oefqw
74HCT27PW,118
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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TWR-LCD-RGB,598
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM, PERIPHERAL MODULE,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BF1202WR,135 BF1202(R,WR)_Rev_Sept2010.pdf
BF1202WR,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH DUAL GATE 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30.5dB
Technology: MOSFET
Noise Figure: 0.9dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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BF1202R,215 BF1202%28R%2CWR%29_Rev_Sept2010.pdf
BF1202R,215
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 30mA
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Power - Output: 200mW
Gain: 30.5dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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BF1202R,215 BF1202%28R%2CWR%29_Rev_Sept2010.pdf
BF1202R,215
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 30mA
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Power - Output: 200mW
Gain: 30.5dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
Produkt ist nicht verfügbar
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74AUP1G79GS,132 PHGLS24882-1.pdf?t.download=true&u=5oefqw
74AUP1G79GS,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3484+0.15 EUR
Mindestbestellmenge: 3484
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BF1204,115 BF1204_Rev_Sept2010.pdf
BF1204,115
Hersteller: NXP USA Inc.
Description: FET RF 10V 400MHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 0.9dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
auf Bestellung 6939 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
995+0.53 EUR
Mindestbestellmenge: 995
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MMG3012NT1 MMG3012NT1.pdf
MMG3012NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 82mA
Noise Figure: 3.8dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3012NT1 MMG3012NT1.pdf
MMG3012NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 19dB
Current - Supply: 82mA
Noise Figure: 3.8dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8349ECVVAJDB MPC8349EAEC.pdf
MPC8349ECVVAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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SPC5602PEF0VLL6R MPC5602P.pdf
SPC5602PEF0VLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Produkt ist nicht verfügbar
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MPC9456AC MPC9456.pdf
MPC9456AC
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:10 250MHZ 32TQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
Part Status: Obsolete
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
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SSL5235TE/1518
SSL5235TE/1518
Hersteller: NXP USA Inc.
Description: 5 OHM/550 VOLT MAINS DIMMABLE BU
Packaging: Bulk
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
579+0.83 EUR
Mindestbestellmenge: 579
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SSL5235BTE/1518
Hersteller: NXP USA Inc.
Description: 5 OHM/550 V MAINS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SSL5235BTE/1Y
Hersteller: NXP USA Inc.
Description: IC LED DRIVER
Packaging: Bulk
Part Status: Active
auf Bestellung 7465 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
628+0.79 EUR
Mindestbestellmenge: 628
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PCA9633D16,112 PCA9633.pdf
PCA9633D16,112
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-SO
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9633D16,118 PCA9633.pdf
PCA9633D16,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-SO
Dimming: I²C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXPQ3115BVST1 FXPQ3115BV.pdf
FXPQ3115BVST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 7 b
Operating Pressure: 2.9PSI ~ 15.95PSI (20kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.11PSI (±0.75kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Medical Ventilation
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Active
Produkt ist nicht verfügbar
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PCA9531PW118 PCA9531.pdf
PCA9531PW118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN DIM 25MA 16TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TWR-CM3120-EVM KTTWRCM3120UG.pdf
Hersteller: NXP USA Inc.
Description: TOWER BOARD - CM3120 IO-LINK MA
Packaging: Bulk
Function: IO-Link
Type: Interface
Contents: Board(s)
Utilized IC / Part: CM3120
Platform: Freescale Tower System
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP7CVT8AB,557 IMX6DQPIEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, QUAD A
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6QP5EYM1AA557 IMX6DQPCEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX6Q4AVT08AC IMX6DQAEC.pdf
MCIMX6Q4AVT08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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BTA330Y-800BT127 PHGL-S-A0001060295-1.pdf?t.download=true&u=5oefqw
BTA330Y-800BT127
Hersteller: NXP USA Inc.
Description: 3 QUADRANT TRIAC TO 220AB
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S32G-VNP-GLDBOX3 S32G-VNP-GLDBOX3UG.pdf
S32G-VNP-GLDBOX3
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32G2
Packaging: Box
Function: Networking
Type: Reference Design
Utilized IC / Part: S32G2, SJA1110, TJA1102-TJA1102S, TJA1043, TJA1463VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+5271.66 EUR
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MPC8541PXAPF MPC8541EEC.pdf
MPC8541PXAPF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
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S9S12GN32F0MLFR MC9S12GRMV1.pdf
S9S12GN32F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF6V3090NR1
MRF6V3090NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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LD6836CX4/25P,315 LD6836.pdf
LD6836CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17957 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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MK10DX64VLK7R K10P81M72SF1.pdf
MK10DX64VLK7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 56
Produkt ist nicht verfügbar
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MCIMX6D7CZK08AD IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU QUAD A
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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