Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36601) > Seite 481 nach 611
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MCIMX258CVM4 | NXP USA Inc. |
 Description: IC MPU I.MX25 400MHZ 400LFBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR, DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FS32K118LFT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX6D7CVT08AD | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 624FCBGA Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 105°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
auf Bestellung 579 Stücke: Lieferzeit 10-14 Tag (e) |
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| SC550372MFU42R2 | NXP USA Inc. |
Description: IC Part Status: Obsolete Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| WPR1500-HV | NXP USA Inc. |
Description: EVAL BOARD FOR WPR1516 Packaging: Bulk Function: Receiver Type: Interface Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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WPR1500-LDO | NXP USA Inc. |
Description: EVAL BOARD FOR WPR1516 Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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WPR1500-BUCK | NXP USA Inc. |
Description: EVAL BOARD FOR WPR1516 Packaging: Box Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: WPR1516 Supplied Contents: Board(s) Primary Attributes: Receiver Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX512CJM6C | NXP USA Inc. |
Description: IC MPU I.MX51 600MHZ 529BGA Part Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Display & Interface Controllers: Keypad, LCD Graphics Acceleration: No RAM Controllers: LPDDR, DDR2 Supplier Device Package: 529-BGA (19x19) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Core Processor: ARM® Cortex®-A8 Operating Temperature: -40°C ~ 95°C (TC) Speed: 600MHz Mounting Type: Surface Mount Package / Case: 529-LFBGA Packaging: Tray Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (3), USB 2.0 + PHY (1) Ethernet: 10/100Mbps (1) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVML32F3WKHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 31 Part Status: Active Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| HTMS1001FUG/AM,026 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAP Part Status: Obsolete Writable Memory: 1.76kb (User) Standards: ISO 11784, ISO 11785 Technology: Passive Memory Type: Read/Write Frequency: 100kHz ~ 150kHz Style: Encapsulated Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MKM33Z64CLL5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 68 Part Status: Not For New Designs Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LCD, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x16b, 4x24b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKM35Z512VLL7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 72 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKM35Z256VLL7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 72 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5747CK1CMJ2 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA DigiKey Programmable: Not Verified Number of I/O: 178 Part Status: Active Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 80MHz/120MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5747CK1CMJ2R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA DigiKey Programmable: Not Verified Number of I/O: 178 Part Status: Active Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 80MHz/120MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F82743VFM | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 2400 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMA5212AKWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G SPI 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±120g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4 Grade: Automotive Part Status: Obsolete Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MRF6V2010NBR5 | NXP USA Inc. |
Description: FET RF 110V 220MHZ TO-272-2 Packaging: Cut Tape (CT) Package / Case: TO-272BC Mounting Type: Chassis Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-272-2 Part Status: Obsolete Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 30 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G274ASBK1VUCR | NXP USA Inc. |
Description: S32G274A ARM CORTEX-M7 AND -A53, Part Status: Active Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit USB: USB 2.0 OTG (1) Ethernet: 1/2.5Gbps (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz, 1GHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART RAM Controllers: DDR3L, LPDDR4 Co-Processors/DSP: Multimedia; NEON |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC865M201JBD64/0E | NXP USA Inc. |
Description: IC MCU CORTEX M0+ LQFP64 Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray Part Status: Active |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5120A0HN/C2,551 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG4E2CSC | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256 x 8 Program Memory Size: 4KB (4K x 8) Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tube DigiKey Programmable: Not Verified Speed: 40MHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 98 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF1550A6EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1114FHN33/301:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1114FHN33/301:5 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 4798 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH16541ADGG112 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
auf Bestellung 312 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC5516JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LPC5516JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
auf Bestellung 963 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDF19972AEL/C1E | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDF19972BEL/C1Y | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TDF19972BEL/C1E | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MSC8151SAG1000B | NXP USA Inc. |
Description: IC DSP 1X 1GHZ SC3850 783FCBGA Supplier Device Package: 783-FCPBGA (29x29) Clock Rate: 1GHz Voltage - Core: 1.00V Voltage - I/O: 2.50V On-Chip RAM: 576kB Non-Volatile Memory: ROM (96KB) Operating Temperature: 0°C ~ 105°C (TJ) Type: SC3850 Single Core Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9675PW,118 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 24TSSOP Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9675PW,118 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 24TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1671 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF5018HSR5 | NXP USA Inc. |
Description: RF MOSFET GAN NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2SA Mounting Type: Surface Mount Frequency: 1MHz ~ 2.7GHz Power - Output: 125W Gain: 17.3dB Technology: GaN Supplier Device Package: NI-400S-2SA Part Status: Active Voltage - Rated: 125 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CBTL04GP043EXJ | NXP USA Inc. |
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA Packaging: Tape & Reel (TR) Package / Case: 28-XFBGA Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TA) Supplier Device Package: 28-XFBGA (2x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF1511NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V PLD-1.5 Current - Test: 150 mA Voltage - Test: 7.5 V Voltage - Rated: 40 V Part Status: Obsolete Supplier Device Package: PLD-1.5 Technology: LDMOS Gain: 13dB Power - Output: 8W Frequency: 175MHz Mounting Type: Surface Mount Current Rating (Amps): 4A Package / Case: PLD-1.5 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 74AXP1G86GXH | NXP USA Inc. |
Description: IC GATE XOR 1CH 2-INP 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-X2SON (0.80x0.80) Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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P87C51X2BBD,157 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44LQFP DigiKey Programmable: Not Verified Number of I/O: 32 Part Status: Obsolete Supplier Device Package: 44-LQFP (10x10) Peripherals: POR Connectivity: EBI/EMI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Core Processor: 8051 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 128 x 8 Program Memory Size: 4KB (4K x 8) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| CLRC66303EVJ | NXP USA Inc. |
Description: MULTI-PROTOCOL FRONTEND WITH SMA Packaging: Tape & Reel (TR) Package / Case: 36-VFBGA Mounting Type: Surface Mount Supplier Device Package: 36-VFBGA (3.5x3.5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| HEF4046BT653 | NXP USA Inc. |
Description: NOW NEXPERIA HEF4046BT - PHASE L Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LS1048ASE7PTA | NXP USA Inc. |
Description: LS1048 - QORIQ LAYERSCAPE 1088A Packaging: Bulk Part Status: Active |
auf Bestellung 97 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX79-B68,133 | NXP USA Inc. |
Description: DIODE ZENER 68V 400MW ALF2 Tolerance: ±2% Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 68 V Impedance (Max) (Zzt): 240 Ohms Supplier Device Package: ALF2 Part Status: Active Power - Max: 400 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V |
auf Bestellung 119000 Stücke: Lieferzeit 10-14 Tag (e) |
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MKM35Z512VLQ7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 99 |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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MKM35Z256VLQ7R | NXP USA Inc. |
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 75MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 99 |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9515-100A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V Drain to Source Voltage (Vdss): 100 V Vgs (Max): ±10V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Active Supplier Device Package: TO-220AB Vgs(th) (Max) @ Id: 2V @ 1mA Power Dissipation (Max): 230W (Tc) Rds On (Max) @ Id, Vgs: 14.4mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Packaging: Bulk |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1044ATK/3/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1044AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1044AT/3/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1044ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PMV280ENEA215 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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ON5452,518 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| ON5426/C3,127 | NXP USA Inc. |
Description: ON5426/C3,127 Packaging: Bulk Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| ON5452,518 | NXP USA Inc. |
Description: RF MOSFET 20SOIC Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BC51-10PASX | NXP USA Inc. |
Description: TRANS PNP 45V 1A DFN2020D-3 Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Frequency - Transition: 145MHz Supplier Device Package: DFN2020D-3 Part Status: Active Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 420 mW |
auf Bestellung 84000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC51-10PAS115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC555LFCVR40 | NXP USA Inc. |
Description: IC MCU 32BIT 448KB FLASH 272PBGA Packaging: Tray Package / Case: 272-BBGA Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 448KB (448K x 8) RAM Size: 26K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 272-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 101 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FS32K142HRT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U7CVM08AD | NXP USA Inc. |
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LS1048ASN7Q1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCIMX258CVM4 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K118LFT0MLFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D7CVT08AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 138.62 EUR |
| 10+ | 115.25 EUR |
| 60+ | 105.08 EUR |
| 120+ | 102.32 EUR |
| WPR1500-HV |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| WPR1500-LDO |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| WPR1500-BUCK |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX512CJM6C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 95°C (TC)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Description: IC MPU I.MX51 600MHZ 529BGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 95°C (TC)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML32F3WKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| HTMS1001FUG/AM,026 |
|
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Packaging: Bulk
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MKM33Z64CLL5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Not For New Designs
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LCD, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x16b, 4x24b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Part Status: Not For New Designs
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LCD, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x16b, 4x24b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MKM35Z512VLL7R |
|
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Produkt ist nicht verfügbar
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| MKM35Z256VLL7R |
|
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 72
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SPC5747CK1CMJ2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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| SPC5747CK1CMJ2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Part Status: Active
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MC56F82743VFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.8 EUR |
| 10+ | 10.7 EUR |
| 25+ | 9.92 EUR |
| 100+ | 9.07 EUR |
| 490+ | 8.78 EUR |
| MMA5212AKWR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
Description: ACCELEROMETER 120G SPI 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V2010NBR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Cut Tape (CT)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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| S32G274ASBK1VUCR |
|
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Description: S32G274A ARM CORTEX-M7 AND -A53,
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| LPC865M201JBD64/0E |
|
Hersteller: NXP USA Inc.
Description: IC MCU CORTEX M0+ LQFP64
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Part Status: Active
Description: IC MCU CORTEX M0+ LQFP64
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.69 EUR |
| 10+ | 2.95 EUR |
| 25+ | 2.8 EUR |
| PN5120A0HN/C2,551 |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.96 EUR |
| 10+ | 13.85 EUR |
| 25+ | 13.13 EUR |
| S9S08SG4E2CSC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Speed: 40MHz
Mounting Type: Surface Mount
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Speed: 40MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Mindestbestellmenge: 98 Stücke
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| MC34PF1550A6EP |
|
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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| LPC1114FHN33/301:5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 4.01 EUR |
| LPC1114FHN33/301:5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4798 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.52 EUR |
| 10+ | 5.68 EUR |
| 25+ | 5.21 EUR |
| 100+ | 4.71 EUR |
| 250+ | 4.47 EUR |
| 500+ | 4.37 EUR |
| 74LVCH16541ADGG112 |
|
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 312+ | 1.93 EUR |
| LPC5516JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC5516JBD100Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.83 EUR |
| 10+ | 10.79 EUR |
| 25+ | 10.58 EUR |
| 50+ | 10.51 EUR |
| 100+ | 9.42 EUR |
| 250+ | 9.39 EUR |
| 500+ | 8.81 EUR |
| MSC8151SAG1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 2.50V
On-Chip RAM: 576kB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: 0°C ~ 105°C (TJ)
Type: SC3850 Single Core
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 2.50V
On-Chip RAM: 576kB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: 0°C ~ 105°C (TJ)
Type: SC3850 Single Core
Interface: Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9675PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA9675PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1671 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.24 EUR |
| 10+ | 3.9 EUR |
| 25+ | 3.57 EUR |
| 100+ | 3.2 EUR |
| 250+ | 3.03 EUR |
| 500+ | 2.93 EUR |
| 1000+ | 2.83 EUR |
| MMRF5018HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Description: RF MOSFET GAN NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Technology: GaN
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04GP043EXJ |
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 28-XFBGA
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
Part Status: Obsolete
Description: IC SWITCH DPDT X 2 15OHM 28XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 28-XFBGA
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C (TA)
Supplier Device Package: 28-XFBGA (2x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF1511NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Current - Test: 150 mA
Voltage - Test: 7.5 V
Voltage - Rated: 40 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 13dB
Power - Output: 8W
Frequency: 175MHz
Mounting Type: Surface Mount
Current Rating (Amps): 4A
Package / Case: PLD-1.5
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 7.5V PLD-1.5
Current - Test: 150 mA
Voltage - Test: 7.5 V
Voltage - Rated: 40 V
Part Status: Obsolete
Supplier Device Package: PLD-1.5
Technology: LDMOS
Gain: 13dB
Power - Output: 8W
Frequency: 175MHz
Mounting Type: Surface Mount
Current Rating (Amps): 4A
Package / Case: PLD-1.5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AXP1G86GXH |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 2-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE XOR 1CH 2-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-X2SON (0.80x0.80)
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2845+ | 0.23 EUR |
| P87C51X2BBD,157 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Description: IC MCU 8BIT 4KB OTP 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CLRC66303EVJ |
|
Hersteller: NXP USA Inc.
Description: MULTI-PROTOCOL FRONTEND WITH SMA
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 36-VFBGA (3.5x3.5)
Part Status: Active
Description: MULTI-PROTOCOL FRONTEND WITH SMA
Packaging: Tape & Reel (TR)
Package / Case: 36-VFBGA
Mounting Type: Surface Mount
Supplier Device Package: 36-VFBGA (3.5x3.5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| HEF4046BT653 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA HEF4046BT - PHASE L
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA HEF4046BT - PHASE L
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1048ASE7PTA |
|
Hersteller: NXP USA Inc.
Description: LS1048 - QORIQ LAYERSCAPE 1088A
Packaging: Bulk
Part Status: Active
Description: LS1048 - QORIQ LAYERSCAPE 1088A
Packaging: Bulk
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 308.66 EUR |
| BZX79-B68,133 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 68V 400MW ALF2
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 240 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Description: DIODE ZENER 68V 400MW ALF2
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 240 Ohms
Supplier Device Package: ALF2
Part Status: Active
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
auf Bestellung 119000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.042 EUR |
| MKM35Z512VLQ7R |
|
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 500+ | 15.35 EUR |
| MKM35Z256VLQ7R |
|
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 500+ | 11.73 EUR |
| BUK9515-100A127 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 14.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 8600 pF @ 25 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 14.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 293+ | 2.05 EUR |
| TJA1044ATK/3/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TJA1044AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TJA1044AT/3/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| TJA1044ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| PMV280ENEA215 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| ON5426/C3,127 |
Hersteller: NXP USA Inc.
Description: ON5426/C3,127
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Obsolete
Description: ON5426/C3,127
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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| BC51-10PASX |
|
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Part Status: Active
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
auf Bestellung 84000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3904+ | 0.14 EUR |
| BC51-10PAS115 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| MPC555LFCVR40 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 101
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FS32K142HRT0VLHT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 39.58 EUR |
| 10+ | 31.69 EUR |
| 25+ | 29.71 EUR |
| 100+ | 27.55 EUR |
| 250+ | 26.51 EUR |
| MCIMX6U7CVM08AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| LS1048ASN7Q1A |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.6GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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