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LPC804M101JHI33Y LPC804M101JHI33Y NXP USA Inc. LPC804_DS.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 10453 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.91 EUR
10+3.05 EUR
100+2.45 EUR
500+2.32 EUR
1000+1.92 EUR
2500+1.79 EUR
Mindestbestellmenge: 5
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74HCT4075N,652 74HCT4075N,652 NXP USA Inc. 74HC_HCT4075.pdf Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC13892DJVK MC13892DJVK NXP USA Inc. Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
auf Bestellung 2080 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.42 EUR
10+12.84 EUR
25+11.95 EUR
100+10.97 EUR
250+10.5 EUR
500+10.22 EUR
Mindestbestellmenge: 2
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MC56F8145VFGE MC56F8145VFGE NXP USA Inc. MC56F833xDSAD.pdf Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68SEC000AE20 MC68SEC000AE20 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S12E32CFUE MC9S12E32CFUE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997PA1-NXWI/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997PA1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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MSC8101VT1500F MSC8101VT1500F NXP USA Inc. MSC8101.pdf Description: IC DSP 16BIT 250MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 75°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 300MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC802M001JDH16 NXP USA Inc. Description: IC MCU 32BIT FLASH
Packaging: Tube
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
380+2.32 EUR
Mindestbestellmenge: 380
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LPC860-MAX LPC860-MAX NXP USA Inc. LPCXpresso860-MAXUM.pdf Description: LPCXPRESSO860-MAX EVAL
Packaging: Box
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.27 EUR
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LPC802M001JDH20J LPC802M001JDH20J NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2796 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.24 EUR
15+1.25 EUR
25+1.23 EUR
100+1.2 EUR
1000+1.06 EUR
Mindestbestellmenge: 8
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74HC08PW/C4118 74HC08PW/C4118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08PW/S400118 74HC08PW/S400118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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NX3V1T66GM,132 NX3V1T66GM,132 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 5000 Stücke:
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3328+0.15 EUR
Mindestbestellmenge: 3328
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LD6806CX4/30H,315 LD6806CX4/30H,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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HTSICH5601EW/V7:00 NXP USA Inc. HTSICH56_48_SDS.pdf Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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74HC08D/C4118 74HC08D/C4118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC68020EH33E MC68020EH33E NXP USA Inc. MC68020UM.pdf Description: IC MPU M680X0 33MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HC08D/S200118 74HC08D/S200118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AU118 74HC08D/AU118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AUJ 74HC08D/AUJ NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT685SFFOBR MIMXRT685SFFOBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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RX1214B300YI112 RX1214B300YI112 NXP USA Inc. Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33903CP3EK MCZ33903CP3EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Obsolete
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.16 EUR
10+14.6 EUR
25+13.92 EUR
Mindestbestellmenge: 2
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MPC5200CVR400BR2 MPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
500+81.71 EUR
Mindestbestellmenge: 500
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MPC5200CVR400BR2 MPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Cut Tape (CT)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200CVR400 MPC5200CVR400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
auf Bestellung 539 Stücke:
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MPC5200VR400 MPC5200VR400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
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MPC5200VR400B MPC5200VR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
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MPC5200CVR400B MPC5200CVR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
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SPC5200CVR400557 NXP USA Inc. Description: POWERPC CORE ARCHITECTURE MPU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5200CBV400R2 SPC5200CBV400R2 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5200CVR400R2 SPC5200CVR400R2 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192FCR2 NXP USA Inc. MC13192_Rev3.3.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192FCR2 NXP USA Inc. MC13192_Rev3.3.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6U6AVM10ADR MCIMX6U6AVM10ADR NXP USA Inc. IMX6SDLAEC.pdf Description: I.MX 6 SERIES 32-BIT MPU, DUAL A
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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M68DIP8SOICE NXP USA Inc. Description: ADAPTER 8-PIN DIP - SOIC
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - SOIC
Part Status: Obsolete
Utilized IC / Part: Target Cable
Produkt ist nicht verfügbar
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TEA1753T/N1,518 TEA1753T/N1,518 NXP USA Inc. TEA1753T.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 2500 Stücke:
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2500+1.9 EUR
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TEA1753T/N1,518 TEA1753T/N1,518 NXP USA Inc. TEA1753T.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 4968 Stücke:
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5+3.64 EUR
10+2.72 EUR
25+2.48 EUR
100+2.22 EUR
250+2.1 EUR
500+2.02 EUR
1000+1.96 EUR
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UBA2028T/N1,518 UBA2028T/N1,518 NXP USA Inc. UBA2028.pdf Description: IC CFL/TL DRIVER 100KHZ 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 40.5kHz ~ 100kHz
Type: CFL/TL Driver
Operating Temperature: -25°C ~ 80°C
Voltage - Supply: 9.1V ~ 13V
Supplier Device Package: 20-SO
Dimming: Yes
Current - Output Source/Sink: 280mA
Part Status: Obsolete
Current - Supply: 1.5 mA
Produkt ist nicht verfügbar
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UBA2028T/N1,518 UBA2028T/N1,518 NXP USA Inc. UBA2028.pdf Description: IC CFL/TL DRIVER 100KHZ 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 40.5kHz ~ 100kHz
Type: CFL/TL Driver
Operating Temperature: -25°C ~ 80°C
Voltage - Supply: 9.1V ~ 13V
Supplier Device Package: 20-SO
Dimming: Yes
Current - Output Source/Sink: 280mA
Part Status: Obsolete
Current - Supply: 1.5 mA
auf Bestellung 481725 Stücke:
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208+2.44 EUR
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T1013NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MCF52211CAE66 MCF52211CAE66 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZV90-C7V5115 BZV90-C7V5115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 75V 1.5W 5% UNIDIR
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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MRFE6P9220HR3 NXP USA Inc. MRFE6P9220H.pdf Description: RF MOSFET LDMOS 28V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 47W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
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S9S08DZ128F2MLH S9S08DZ128F2MLH NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.39 EUR
10+12.87 EUR
25+11.99 EUR
80+11.52 EUR
Mindestbestellmenge: 2
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MPXV5004GVP MPXV5004GVP NXP USA Inc. MPXV5004G.pdf Description: SENSOR 0.57PSIG 0.13" 4.9V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXV5004GC7U MPXV5004GC7U NXP USA Inc. MPXV5004G.pdf Description: SENSOR 0.57PSIG 0.13" 4.9V 8DIP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08AC32CFUE MC9S08AC32CFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 394 Stücke:
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10+10.87 EUR
25+10.1 EUR
100+9.24 EUR
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MC9S08AC32MFGE MC9S08AC32MFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LFT0MLHT FS32K118LFT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1237 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.38 EUR
10+12.09 EUR
80+10.01 EUR
Mindestbestellmenge: 2
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MC56F8365VFGE MC56F8365VFGE NXP USA Inc. MC56F8365.pdf Description: IC MCU 16BIT 512KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Last Time Buy
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 1080 Stücke:
Lieferzeit 10-14 Tag (e)
1+93.83 EUR
10+77.35 EUR
25+73.24 EUR
80+69.33 EUR
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BAS21J/ZL NXP USA Inc. BAS21J.pdf Description: BAS21J - SINGLE HIGH-SPEED SWITC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC804M101JHI33Y LPC804_DS.pdf
LPC804M101JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 10453 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.91 EUR
10+3.05 EUR
100+2.45 EUR
500+2.32 EUR
1000+1.92 EUR
2500+1.79 EUR
Mindestbestellmenge: 5
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74HCT4075N,652 74HC_HCT4075.pdf
74HCT4075N,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC13892DJVK
MC13892DJVK
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
auf Bestellung 2080 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.42 EUR
10+12.84 EUR
25+11.95 EUR
100+10.97 EUR
250+10.5 EUR
500+10.22 EUR
Mindestbestellmenge: 2
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MC56F8145VFGE MC56F833xDSAD.pdf
MC56F8145VFGE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68SEC000AE20 MC68SEC000.pdf
MC68SEC000AE20
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S12E32CFUE MC9S12E128V1.pdf
MC9S12E32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997PA1-NXWI/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997PA1-NXWE/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tray
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AZ 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 98-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 98-HVQFN (9x9)
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
Part Status: Active
Produkt ist nicht verfügbar
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MSC8101VT1500F MSC8101.pdf
MSC8101VT1500F
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 75°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 300MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC802M001JDH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT FLASH
Packaging: Tube
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
380+2.32 EUR
Mindestbestellmenge: 380
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LPC860-MAX LPCXpresso860-MAXUM.pdf
LPC860-MAX
Hersteller: NXP USA Inc.
Description: LPCXPRESSO860-MAX EVAL
Packaging: Box
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.27 EUR
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LPC802M001JDH20J LPC802.pdf
LPC802M001JDH20J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
auf Bestellung 2796 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.24 EUR
15+1.25 EUR
25+1.23 EUR
100+1.2 EUR
1000+1.06 EUR
Mindestbestellmenge: 8
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74HC08PW/C4118 74HC_HCT08.pdf
74HC08PW/C4118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08PW/S400118 74HC_HCT08.pdf
74HC08PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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NX3V1T66GM,132 NX3V1T66.pdf
NX3V1T66GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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LD6806CX4/30H,315 LD6806_Series.pdf
LD6806CX4/30H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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HTSICH5601EW/V7:00 HTSICH56_48_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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74HC08D/C4118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/C4118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC68020EH33E MC68020UM.pdf
MC68020EH33E
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HC08D/S200118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/S200118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AU118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/AU118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AUJ 74HC_HCT08.pdf
74HC08D/AUJ
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Hersteller: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Hersteller: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMXRT685SFFOBR RT600.pdf
MIMXRT685SFFOBR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Tape & Reel (TR)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Part Status: Active
Number of I/O: 147
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-665
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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RX1214B300YI112
RX1214B300YI112
Hersteller: NXP USA Inc.
Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33903CP3EK MC33903,4,5.pdf
MCZ33903CP3EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP
Part Status: Obsolete
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.16 EUR
10+14.6 EUR
25+13.92 EUR
Mindestbestellmenge: 2
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MPC5200CVR400BR2 MPC5200BDS.pdf
MPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+81.71 EUR
Mindestbestellmenge: 500
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MPC5200CVR400BR2 MPC5200BDS.pdf
MPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Cut Tape (CT)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
auf Bestellung 632 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+115.58 EUR
10+96.04 EUR
25+91.16 EUR
100+85.8 EUR
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MPC5200CVR400 MPC5200.pdf
MPC5200CVR400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
auf Bestellung 539 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+138.46 EUR
10+115.64 EUR
25+109.95 EUR
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MPC5200VR400 MPC5200.pdf
MPC5200VR400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
auf Bestellung 200 Stücke:
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Anzahl Preis
1+135.61 EUR
10+113.19 EUR
25+107.6 EUR
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MPC5200VR400B MPC5200BDS.pdf
MPC5200VR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+106.96 EUR
10+88.68 EUR
25+84.12 EUR
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MPC5200CVR400B MPC5200BDS.pdf
MPC5200CVR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Not For New Designs
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+115.58 EUR
10+96.04 EUR
25+91.16 EUR
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SPC5200CVR400557
Hersteller: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5200CBV400R2 MPC5200.pdf
SPC5200CBV400R2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5200CVR400R2 MPC5200.pdf
SPC5200CVR400R2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192_Rev3.3.pdf
MC13192FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192_Rev3.3.pdf
MC13192FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6U6AVM10ADR IMX6SDLAEC.pdf
MCIMX6U6AVM10ADR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU, DUAL A
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Produkt ist nicht verfügbar
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M68DIP8SOICE
Hersteller: NXP USA Inc.
Description: ADAPTER 8-PIN DIP - SOIC
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - SOIC
Part Status: Obsolete
Utilized IC / Part: Target Cable
Produkt ist nicht verfügbar
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TEA1753T/N1,518 TEA1753T.pdf
TEA1753T/N1,518
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.9 EUR
Mindestbestellmenge: 2500
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TEA1753T/N1,518 TEA1753T.pdf
TEA1753T/N1,518
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 4968 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.64 EUR
10+2.72 EUR
25+2.48 EUR
100+2.22 EUR
250+2.1 EUR
500+2.02 EUR
1000+1.96 EUR
Mindestbestellmenge: 5
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UBA2028T/N1,518 UBA2028.pdf
UBA2028T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 100KHZ 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 40.5kHz ~ 100kHz
Type: CFL/TL Driver
Operating Temperature: -25°C ~ 80°C
Voltage - Supply: 9.1V ~ 13V
Supplier Device Package: 20-SO
Dimming: Yes
Current - Output Source/Sink: 280mA
Part Status: Obsolete
Current - Supply: 1.5 mA
Produkt ist nicht verfügbar
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UBA2028T/N1,518 UBA2028.pdf
UBA2028T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 100KHZ 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 40.5kHz ~ 100kHz
Type: CFL/TL Driver
Operating Temperature: -25°C ~ 80°C
Voltage - Supply: 9.1V ~ 13V
Supplier Device Package: 20-SO
Dimming: Yes
Current - Output Source/Sink: 280mA
Part Status: Obsolete
Current - Supply: 1.5 mA
auf Bestellung 481725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
208+2.44 EUR
Mindestbestellmenge: 208
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T1013NXN7MQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MCF52211CAE66 MCF52211.pdf
MCF52211CAE66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZV90-C7V5115 BZV90.pdf
BZV90-C7V5115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 75V 1.5W 5% UNIDIR
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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MRFE6P9220HR3 MRFE6P9220H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 47W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
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S9S08DZ128F2MLH MC9S08DZ128.pdf
S9S08DZ128F2MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.39 EUR
10+12.87 EUR
25+11.99 EUR
80+11.52 EUR
Mindestbestellmenge: 2
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MPXV5004GVP MPXV5004G.pdf
MPXV5004GVP
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 4.9V 8SOP
Packaging: Tray
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPXV5004GC7U MPXV5004G.pdf
MPXV5004GC7U
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 4.9V 8DIP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08AC32CFUE MC9S08AC60AD.pdf
MC9S08AC32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 394 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.97 EUR
10+10.87 EUR
25+10.1 EUR
100+9.24 EUR
Mindestbestellmenge: 2
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MC9S08AC32MFGE MC9S08AC60AD.pdf
MC9S08AC32MFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K118LFT0MLHT S32K1xx.pdf
FS32K118LFT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1237 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.38 EUR
10+12.09 EUR
80+10.01 EUR
Mindestbestellmenge: 2
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MC56F8365VFGE MC56F8365.pdf
MC56F8365VFGE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (256K x 16)
RAM Size: 18K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Last Time Buy
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 1080 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+93.83 EUR
10+77.35 EUR
25+73.24 EUR
80+69.33 EUR
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BAS21J/ZL BAS21J.pdf
Hersteller: NXP USA Inc.
Description: BAS21J - SINGLE HIGH-SPEED SWITC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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