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P5040NXN7TMC NXP USA Inc. FSCLS11784-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
auf Bestellung 63 Stücke:
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1+673.75 EUR
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MR-T1ETH8 MR-T1ETH8 NXP USA Inc. Description: EVAL BOARD FOR SE050
Part Status: Active
Embedded: No
Primary Attributes: 40V Operating Voltage
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: SE050, SJA1110, VR5510
Type: Interface
Function: Ethernet
Packaging: Bulk
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s), Accessories
Produkt ist nicht verfügbar
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BAP64LX,315 BAP64LX,315 NXP USA Inc. BAP64LX.pdf Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
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10000+0.15 EUR
20000+0.14 EUR
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BAP64LX,315 BAP64LX,315 NXP USA Inc. BAP64LX.pdf Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
auf Bestellung 26970 Stücke:
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46+0.39 EUR
68+0.26 EUR
76+0.23 EUR
100+0.2 EUR
250+0.18 EUR
500+0.17 EUR
1000+0.16 EUR
5000+0.15 EUR
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P89LPC915FDH,129 P89LPC915FDH,129 NXP USA Inc. P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x8b; D/A 1x8b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
DigiKey Programmable: Verified
Number of I/O: 12
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PCA9505DGGY PCA9505DGGY NXP USA Inc. PCA9505_9506.pdf Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5260 Stücke:
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3+8.34 EUR
10+6.37 EUR
25+5.88 EUR
100+5.34 EUR
250+5.12 EUR
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LS1023ASN7MQB LS1023ASN7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106557 TEF6638HW/V106557 NXP USA Inc. 201605020DN-DN81.pdf Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF6638HW/V105518 NXP USA Inc. 201605020DN-DN81.pdf Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V105557 TEF6638HW/V105557 NXP USA Inc. 201605020DN-DN81.pdf Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106Z/SK NXP USA Inc. Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106/SAK NXP USA Inc. Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106Z/SY NXP USA Inc. Description: TEF6638HW
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106/SBK NXP USA Inc. Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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S912ZVMC12F2WKHR S912ZVMC12F2WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF7S21170HSR3 NXP USA Inc. MRF7S21170H.pdf Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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MML20242HT1 MML20242HT1 NXP USA Inc. MML20242H.pdf Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MCHSC705C8ACFBE MCHSC705C8ACFBE NXP USA Inc. MC68HC705C8.pdf Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMEG045V150EPD146 PMEG045V150EPD146 NXP USA Inc. PMEG045V150EPD.pdf Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 43500 Stücke:
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838+0.63 EUR
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LPC2136FBD64/01151 NXP USA Inc. PHGLS23095-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2136FBD64/01,15 LPC2136FBD64/01,15 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2136FBD64,151 LPC2136FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1024DAG5B MIMXRT1024DAG5B NXP USA Inc. IMXRT1024CEC.pdf Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
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2+16.84 EUR
10+13.18 EUR
60+11.58 EUR
120+11.15 EUR
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S912ZVML12F1VKH S912ZVML12F1VKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1VKHR S912ZVML12F1VKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12P64CLH MC9S12P64CLH NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGA2712,115 BGA2712,115 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA2712,115 BGA2712,115 NXP USA Inc. BGA2712_Rev_Nov2010.pdf Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK51DX256CLK7 NXP USA Inc. FSCLS07731-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
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28+19.22 EUR
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PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCA9509D,118 PCA9509D,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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SPC5607BAVLQ6R SPC5607BAVLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
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S32G398ASCK1VUCR S32G398ASCK1VUCR NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 2.5Gbps (3)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1.3GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32G399ASCK1VUCT NXP USA Inc. S32G2.pdf Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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S32G398ASCK1VUCT S32G398ASCK1VUCT NXP USA Inc. S32G3.pdf Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
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MKL04Z8VLC4R MKL04Z8VLC4R NXP USA Inc. KL04P48M48SF1.pdf Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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MC9S08QD2CSC MC9S08QD2CSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
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2548+2.29 EUR
5096+2.24 EUR
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S912ZVML64F1WKH557 S912ZVML64F1WKH557 NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLH S9S08LG32J0CLH NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.9K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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UBA2024P/N1,112 UBA2024P/N1,112 NXP USA Inc. UBA2024.pdf Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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AFT05MP075N-54M NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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P1016NSE5DFB NXP USA Inc. Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
auf Bestellung 2155 Stücke:
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MC9S08AC96MFUE MC9S08AC96MFUE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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P82B96DPZ P82B96DPZ NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
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100+4.28 EUR
250+4.07 EUR
500+3.93 EUR
1000+3.83 EUR
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PCA9671PW118 PCA9671PW118 NXP USA Inc. PCA9671.pdf Description: IC I/O EXPANDER I2C 16B 24TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9509AGM,125 PCA9509AGM,125 NXP USA Inc. PCA9509A.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCF85053ATK-ARD PCF85053ATK-ARD NXP USA Inc. PCF85053ATK-ARD.pdf Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
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74ABT827D,623 74ABT827D,623 NXP USA Inc. 74ABT827.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT827D,623 74ABT827D,623 NXP USA Inc. 74ABT827.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX258CJM4A557 NXP USA Inc. IMX25CEC.pdf Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX258CVM4 MCIMX258CVM4 NXP USA Inc. IMX25CEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K118LFT0MLFT FS32K118LFT0MLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D7CVT08AD MCIMX6D7CVT08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 800MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
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60+88.3 EUR
120+85.98 EUR
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SC550372MFU42R2 NXP USA Inc. Description: IC
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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WPR1500-HV NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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WPR1500-LDO WPR1500-LDO NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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WPR1500-BUCK WPR1500-BUCK NXP USA Inc. Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX512CJM6C MCIMX512CJM6C NXP USA Inc. IMX51CEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 95°C (TC)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Produkt ist nicht verfügbar
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S912ZVML32F3WKHR S912ZVML32F3WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Produkt ist nicht verfügbar
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P5040NXN7TMC FSCLS11784-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Packaging: Bulk
Part Status: Active
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MR-T1ETH8
MR-T1ETH8
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SE050
Part Status: Active
Embedded: No
Primary Attributes: 40V Operating Voltage
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: SE050, SJA1110, VR5510
Type: Interface
Function: Ethernet
Packaging: Bulk
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s), Accessories
Produkt ist nicht verfügbar
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BAP64LX,315 BAP64LX.pdf
BAP64LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
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10000+0.15 EUR
20000+0.14 EUR
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BAP64LX,315 BAP64LX.pdf
BAP64LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 150 mW
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AnzahlPreis
46+0.39 EUR
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76+0.23 EUR
100+0.2 EUR
250+0.18 EUR
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1000+0.16 EUR
5000+0.15 EUR
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P89LPC915FDH,129 P89LPC915_916_917.pdf
P89LPC915FDH,129
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 4x8b; D/A 1x8b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
DigiKey Programmable: Verified
Number of I/O: 12
Program Memory Size: 2KB (2K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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PCA9505DGGY PCA9505_9506.pdf
PCA9505DGGY
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 56TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 40
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 56-TSSOP
Current - Output Source/Sink: 10mA, 15mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.34 EUR
10+6.37 EUR
25+5.88 EUR
100+5.34 EUR
250+5.12 EUR
Mindestbestellmenge: 3 Stücke
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LS1023ASN7MQB LS1043AFS.pdf
LS1023ASN7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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TEF6638HW/V106557 201605020DN-DN81.pdf
TEF6638HW/V106557
Hersteller: NXP USA Inc.
Description: TEF6638HW - DIGITAL CAR RADIO IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF6638HW/V105518 201605020DN-DN81.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V105557 201605020DN-DN81.pdf
TEF6638HW/V105557
Hersteller: NXP USA Inc.
Description: IC DGTL CHIP AUTO RADIO 100HTQFP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106Z/SK
Hersteller: NXP USA Inc.
Description: TEF6638HW/V106Z/S30/HTQFP100/STA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106/SAK
Hersteller: NXP USA Inc.
Description: TEF6638HW/V106/S31/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF6638HW/V106Z/SY
Hersteller: NXP USA Inc.
Description: TEF6638HW
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TEF6638HW/V106/SBK
Hersteller: NXP USA Inc.
Description: TEF6638HW/V106/S32/HTQFP100/TRAY
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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S912ZVMC12F2WKHR S12ZVMFS.pdf
S912ZVMC12F2WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF7S21170HSR3 MRF7S21170H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 50W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-880S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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MML20242HT1 MML20242H.pdf
MML20242HT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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MML20242HT1 MML20242H.pdf
MML20242HT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.4GHZ-2.8GHZ 12QFN
Part Status: Obsolete
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 1.95GHz
P1dB: 24dBm
Noise Figure: 0.57dB
Current - Supply: 160mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: LTE, TDS-CDMA, W-CDMA
Frequency: 1.4GHz ~ 2.8GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MCHSC705C8ACFBE MC68HC705C8.pdf
MCHSC705C8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMEG045V150EPD146 PMEG045V150EPD.pdf
PMEG045V150EPD146
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 43500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
838+0.63 EUR
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LPC2136FBD64/01151 PHGLS23095-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2136FBD64/01,15 LPC2131_32_34_36_38.pdf
LPC2136FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2136FBD64,151 LPC2131_32_34_36_38.pdf
LPC2136FBD64,151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1024DAG5B IMXRT1024CEC.pdf
MIMXRT1024DAG5B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 90
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+16.84 EUR
10+13.18 EUR
60+11.58 EUR
120+11.15 EUR
Mindestbestellmenge: 2 Stücke
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S912ZVML12F1VKH S12ZVMFS.pdf
S912ZVML12F1VKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1VKHR S12ZVMFS.pdf
S912ZVML12F1VKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12P64CLH MC9S12P128RMV1.pdf
MC9S12P64CLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGA2712,115 BGA2712_Rev_Nov2010.pdf
BGA2712,115
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA2712,115 BGA2712_Rev_Nov2010.pdf
BGA2712,115
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-3.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 1GHz ~ 3.2GHz
RF Type: ISM
Voltage - Supply: 5V ~ 6V
Gain: 21.3dB
Current - Supply: 12.3mA
Noise Figure: 3.9dB
P1dB: 4.8dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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MK51DX256CLK7 FSCLS07731-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
28+19.22 EUR
Mindestbestellmenge: 28 Stücke
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCA9509D,118 PCA9509.pdf
PCA9509D,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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SPC5607BAVLQ6R MPC560XBFAMFS.pdf
SPC5607BAVLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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S32G398ASCK1VUCR S32G2.pdf
S32G398ASCK1VUCR
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 2.5Gbps (3)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1.3GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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S32G399ASCK1VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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S32G398ASCK1VUCT S32G3.pdf
S32G398ASCK1VUCT
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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MKL04Z8VLC4R KL04P48M48SF1.pdf
MKL04Z8VLC4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
126+3.62 EUR
Mindestbestellmenge: 126 Stücke
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MC9S08QD2CSC MC9S08QD4.pdf
MC9S08QD2CSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
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5+4.33 EUR
10+3.24 EUR
98+2.67 EUR
196+2.56 EUR
294+2.5 EUR
588+2.42 EUR
1078+2.36 EUR
2548+2.29 EUR
5096+2.24 EUR
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S912ZVML64F1WKH557 FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
S912ZVML64F1WKH557
Hersteller: NXP USA Inc.
Description: 16-BIT FLASH, CPU12 CPU
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0CLH MC9S08LG32.pdf
S9S08LG32J0CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.9K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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UBA2024P/N1,112 UBA2024.pdf
UBA2024P/N1,112
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Current - Supply: 5 mA
Produkt ist nicht verfügbar
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AFT05MP075N-54M AFT05MP075N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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P1016NSE5DFB
Hersteller: NXP USA Inc.
Description: QORIQ, POWER ARCH 32-BIT SOC, 53
Packaging: Bulk
Part Status: Active
auf Bestellung 2155 Stücke:
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5+127.21 EUR
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MC9S08AC96MFUE MC9S08AC128.pdf
MC9S08AC96MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 6K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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P82B96DPZ P82B96.pdf
P82B96DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 270ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 1.1mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 4537 Stücke:
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3+6.81 EUR
10+5.16 EUR
25+4.74 EUR
100+4.28 EUR
250+4.07 EUR
500+3.93 EUR
1000+3.83 EUR
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PCA9671PW118 PCA9671.pdf
PCA9671PW118
Hersteller: NXP USA Inc.
Description: IC I/O EXPANDER I2C 16B 24TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9509AGM,125 PCA9509A.pdf
PCA9509AGM,125
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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PCF85053ATK-ARD PCF85053ATK-ARD.pdf
PCF85053ATK-ARD
Hersteller: NXP USA Inc.
Description: PCF85053ATK-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85053A
Platform: Arduino
Part Status: Active
auf Bestellung 6 Stücke:
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1+114.4 EUR
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74ABT827D,623 74ABT827.pdf
74ABT827D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT827D,623 74ABT827.pdf
74ABT827D,623
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX258CJM4A557 IMX25CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX25 32-BIT MPU, ARM926EJ-S CO
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX258CVM4 IMX25CEC.pdf
MCIMX258CVM4
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Obsolete
Produkt ist nicht verfügbar
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FS32K118LFT0MLFT S32K1xx.pdf
FS32K118LFT0MLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6D7CVT08AD IMX6DQAEC.pdf
MCIMX6D7CVT08AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 624FCBGA
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
auf Bestellung 579 Stücke:
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1+116.49 EUR
10+96.85 EUR
60+88.3 EUR
120+85.98 EUR
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SC550372MFU42R2
Hersteller: NXP USA Inc.
Description: IC
Part Status: Obsolete
Packaging: Bulk
Produkt ist nicht verfügbar
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WPR1500-HV
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Bulk
Function: Receiver
Type: Interface
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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WPR1500-LDO
WPR1500-LDO
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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WPR1500-BUCK
WPR1500-BUCK
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR WPR1516
Packaging: Box
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: WPR1516
Supplied Contents: Board(s)
Primary Attributes: Receiver
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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MCIMX512CJM6C IMX51CEC.pdf
MCIMX512CJM6C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 95°C (TC)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Produkt ist nicht verfügbar
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S912ZVML32F3WKHR S12ZVMFS.pdf
S912ZVML32F3WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Produkt ist nicht verfügbar
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