LPC5516JBD100Y NXP Semiconductors
auf Bestellung 1000 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 14.61 EUR |
| 10+ | 12.97 EUR |
| 100+ | 11.65 EUR |
| 250+ | 11.6 EUR |
| 500+ | 10.89 EUR |
| 1000+ | 10.01 EUR |
| 2000+ | 9.65 EUR |
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Technische Details LPC5516JBD100Y NXP Semiconductors
Description: IC MCU 32BIT 256KB FLSH 100LQFP, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Part Status: Active, Number of I/O: 64.
Weitere Produktangebote LPC5516JBD100Y nach Preis ab 10.97 EUR bis 14.74 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| LPC5516JBD100Y | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLSH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
auf Bestellung 963 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC5516JBD100Y | Hersteller : NXP Semiconductors |
MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 100-Pin HLQFP EP |
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| LPC5516JBD100Y | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 128kBSRAM,256kBFLASH; HLQFP100 Operating temperature: -40...105°C Case: HLQFP100 Supply voltage: 1.8...3.6V DC Type of integrated circuit: ARM microcontroller Interface: CAN; GPIO; I2C; I2S; SPI; USART; USB Number of inputs/outputs: 64 Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Kind of architecture: Cortex M33 Memory: 128kB SRAM; 256kB FLASH Mounting: SMD Anzahl je Verpackung: 1000 Stücke |
Produkt ist nicht verfügbar |
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| LPC5516JBD100Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 |
Produkt ist nicht verfügbar |
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| LPC5516JBD100Y | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 128kBSRAM,256kBFLASH; HLQFP100 Operating temperature: -40...105°C Case: HLQFP100 Supply voltage: 1.8...3.6V DC Type of integrated circuit: ARM microcontroller Interface: CAN; GPIO; I2C; I2S; SPI; USART; USB Number of inputs/outputs: 64 Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Kind of architecture: Cortex M33 Memory: 128kB SRAM; 256kB FLASH Mounting: SMD |
Produkt ist nicht verfügbar |