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Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF

Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF

Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: STMP3770 - PMP CONTROLLER
Packaging: Bulk
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: STMP3770XXBJEA3N
Packaging: Bulk
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: STMP3770XXLAEA3N
Packaging: Bulk
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)

Hersteller: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)

Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 12VC SOT666
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-666
Unidirectional Channels: 5
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 25W
Power Line Protection: No

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, PF5200
Packaging: Box
Function: Automotive
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, PF5200
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 2-Channel (Dual)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: SAF776DEL
Packaging: Tray

Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die

Hersteller: NXP USA Inc.
Description: AUTOMOTIVE QUALIFIED NFC CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 24.12MHz
Interface: I²C, SPI
Type: RFID Reader/Transponder
Voltage - Supply: 2.3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)

Hersteller: NXP USA Inc.
Description: NFC
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 324 PIN 1.0 MM PIT
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: 473 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 269 PIN. 0.80 MM P
Packaging: Bulk
Module/Board Type: Socket Module - BGA

Hersteller: NXP USA Inc.
Description: 256 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: 100 PIN 1.0MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 356 PIN 0.8 MM BGA TO PGA ADAPTE
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 252 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 257 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 512 PIN 0.8MM BGA TO PGA ADAPTER
Packaging: Bulk
Module/Board Type: Socket Adapter

Hersteller: NXP USA Inc.
Description: 208 PIN 1.0MM PGA TO 144 PIN 0.5
Packaging: Bulk
For Use With/Related Products: MPC563x
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC563x

Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 17.5 V
Control Features: EN, Soft Start

Hersteller: NXP USA Inc.
Description: HITAG 2 TRANSPONDER IC
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: -0.5V ~ 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: Wafer

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I²C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V

Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 7A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 7A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V

Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 600 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 20 A
Current - Reverse Leakage @ Vr: 100 µA @ 1300 V

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33665A
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: TVS DIODE 8VWM 13VC 4WLCSP
Packaging: Bulk
Package / Case: 4-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -35°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 290pF @ 1MHz
Current - Peak Pulse (10/1000µs): 33A (8/20µs)
Voltage - Reverse Standoff (Typ): 8V (Max)
Supplier Device Package: 4-WLCSP (0.76x0.76)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 10V
Voltage - Clamping (Max) @ Ipp: 13V
Power Line Protection: No

Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA

Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 12mA
Supplier Device Package: 20-SSOP

Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk