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TEF6617T/V1518 TEF6617T/V1518 NXP USA Inc. Description: IC CAR RADIO SGL CHIP 32SOIC
Packaging: Bulk
Part Status: Active
auf Bestellung 1000 Stücke:
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55+10.98 EUR
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LPC2136FBD64/01EL LPC2136FBD64/01EL NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
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MRF300ANBN-88MHZ NXP USA Inc. MRF300AN.pdf Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MC56F82313VLC MC56F82313VLC NXP USA Inc. MC56F823XX.pdf Description: IC MCU 32BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
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MC34PF1510A2EP MC34PF1510A2EP NXP USA Inc. PF1510.pdf Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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S32G378AACK1VUCT S32G378AACK1VUCT NXP USA Inc. S32G3.pdf Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
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S32G378AACK1VUCR S32G378AACK1VUCR NXP USA Inc. S32G3.pdf Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASCK1VUCT S32G378ASCK1VUCT NXP USA Inc. S32G3.pdf Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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S32G378ASCK1VUCR S32G378ASCK1VUCR NXP USA Inc. S32G3.pdf Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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OM14500/TJA1101JP OM14500/TJA1101JP NXP USA Inc. TR1329.pdf Description: EVALUATION BOARD
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: TJA1101
Type: Interface
Function: Ethernet
Packaging: Bulk
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BF904,235 BF904,235 NXP USA Inc. BF904%28R%29_Rev6.pdf Description: RF MOSFET 5V SOT143R
Current - Test: 10 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Noise Figure: 1dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 200MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NVT2002TLH NVT2002TLH NXP USA Inc. NVT2001_NVT2002.pdf Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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14+1.52 EUR
20+1.08 EUR
25+0.98 EUR
100+0.86 EUR
250+0.8 EUR
500+0.76 EUR
1000+0.74 EUR
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LPC804M101JHI33Y LPC804M101JHI33Y NXP USA Inc. LPC804_DS.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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LPC804M101JHI33Y LPC804M101JHI33Y NXP USA Inc. LPC804_DS.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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5+4.65 EUR
10+3.63 EUR
100+2.92 EUR
500+2.76 EUR
1000+2.28 EUR
2500+2.13 EUR
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74HCT4075N,652 74HCT4075N,652 NXP USA Inc. 74HC_HCT4075.pdf Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC56F8145VFGE MC56F8145VFGE NXP USA Inc. MC56F833xDSAD.pdf Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68SEC000AE20 MC68SEC000AE20 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64LQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12E32CFUE MC9S12E32CFUE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997PA1-NXWI/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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88W8997PA1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
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88W8997-A1-NXWE/AK NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC8101VT1500F MSC8101VT1500F NXP USA Inc. MSC8101.pdf Description: IC DSP 16BIT 250MHZ 332FCBGA
Part Status: Obsolete
Supplier Device Package: 332-FCBGA (17x17)
Clock Rate: 300MHz
Voltage - Core: 1.60V
Voltage - I/O: 3.30V
On-Chip RAM: 512KB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 75°C (TJ)
Type: SC140 Core
Interface: Communications Processor Module (CPM)
Mounting Type: Surface Mount
Package / Case: 332-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC802M001JDH16 NXP USA Inc. Description: IC MCU 32BIT FLASH
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Packaging: Tube
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LPC860-MAX LPC860-MAX NXP USA Inc. LPCXpresso860-MAXUM.pdf Description: LPCXPRESSO860-MAX EVAL
Part Status: Active
Packaging: Box
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LPC802M001JDH20J LPC802M001JDH20J NXP USA Inc. LPC802.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
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10+2.17 EUR
25+1.96 EUR
100+1.75 EUR
250+1.64 EUR
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74HC08PW/C4118 74HC08PW/C4118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC08PW/S400118 74HC08PW/S400118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3V1T66GM,132 NX3V1T66GM,132 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 25MHz
On-State Resistance (Max): 450mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 70pF
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Charge Injection: 12pC
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3328+0.18 EUR
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LD6806CX4/30H,315 LD6806CX4/30H,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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HTSICH5601EW/V7:00 NXP USA Inc. HTSICH56_48_SDS.pdf Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 24569 Stücke
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74HC08D/C4118 74HC08D/C4118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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MC68020EH33E MC68020EH33E NXP USA Inc. MC68020UM.pdf Description: IC MPU M680X0 33MHZ 132PQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: 68020
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Produkt ist nicht verfügbar
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74HC08D/S200118 74HC08D/S200118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AU118 74HC08D/AU118 NXP USA Inc. PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 4CH 2-INP 14SO
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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74HC08D/AUJ 74HC08D/AUJ NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHNY NXP USA Inc. ASL1500SHN.pdf Description: IC LED DRIVER CTRLR 32HVQFN
Frequency: 120kHz ~ 700kHz
Number of Outputs: 1
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Voltage - Output: 80V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Voltage - Supply (Max): 40V
Voltage - Supply (Min): 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Topology: Boost
Applications: Lighting
Operating Temperature: -40°C ~ 125°C
Type: DC DC Controller
Produkt ist nicht verfügbar
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MIMXRT685SFFOBR MIMXRT685SFFOBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 249FOWLP
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Number of I/O: 147
Part Status: Active
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: External Program Memory
Oscillator Type: Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 4.5M x 8
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Power - Peak Pulse: 6W
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Power Line Protection: No
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA968AVL,115 NXP USA Inc. BZA900AVL_SERIES.pdf Description: TVS DIODE 6.8VWM SOT665
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Part Status: Obsolete
Power Line Protection: No
Power - Peak Pulse: 6W
Produkt ist nicht verfügbar
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RX1214B300YI112 RX1214B300YI112 NXP USA Inc. Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33903CP3EK MCZ33903CP3EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MPC5200CVR400BR2 MPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MPC5200CVR400BR2 MPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Cut Tape (CT)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200CVR400 MPC5200CVR400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200VR400 MPC5200VR400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200VR400B MPC5200VR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200CVR400B MPC5200CVR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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SPC5200CVR400557 NXP USA Inc. Description: POWERPC CORE ARCHITECTURE MPU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5200CBV400R2 SPC5200CBV400R2 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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SPC5200CVR400R2 SPC5200CVR400R2 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192FCR2 NXP USA Inc. MC13192_Rev3.3.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192FCR2 NXP USA Inc. MC13192_Rev3.3.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6U6AVM10ADR MCIMX6U6AVM10ADR NXP USA Inc. IMX6SDLAEC.pdf Description: I.MX 6 SERIES 32-BIT MPU, DUAL A
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M68DIP8SOICE NXP USA Inc. Description: ADAPTER 8-PIN DIP - SOIC
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - SOIC
Utilized IC / Part: Target Cable
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1753T/N1,518 TEA1753T/N1,518 NXP USA Inc. TEA1753T.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
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TEA1753T/N1,518 TEA1753T/N1,518 NXP USA Inc. TEA1753T.pdf Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
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UBA2028T/N1,518 UBA2028T/N1,518 NXP USA Inc. UBA2028.pdf Description: IC CFL/TL DRIVER 100KHZ 20SO
Current - Supply: 1.5 mA
Part Status: Obsolete
Current - Output Source/Sink: 280mA
Dimming: Yes
Supplier Device Package: 20-SO
Voltage - Supply: 9.1V ~ 13V
Operating Temperature: -25°C ~ 80°C
Type: CFL/TL Driver
Frequency: 40.5kHz ~ 100kHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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UBA2028T/N1,518 UBA2028T/N1,518 NXP USA Inc. UBA2028.pdf Description: IC CFL/TL DRIVER 100KHZ 20SO
Current - Supply: 1.5 mA
Part Status: Obsolete
Current - Output Source/Sink: 280mA
Dimming: Yes
Supplier Device Package: 20-SO
Voltage - Supply: 9.1V ~ 13V
Operating Temperature: -25°C ~ 80°C
Type: CFL/TL Driver
Frequency: 40.5kHz ~ 100kHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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TEF6617T/V1518
TEF6617T/V1518
Hersteller: NXP USA Inc.
Description: IC CAR RADIO SGL CHIP 32SOIC
Packaging: Bulk
Part Status: Active
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AnzahlPrivatkunde
55+10.98 EUR
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LPC2136FBD64/01EL LPC2131_32_34_36_38.pdf
LPC2136FBD64/01EL
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
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MRF300ANBN-88MHZ MRF300AN.pdf
Hersteller: NXP USA Inc.
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MC56F82313VLC MC56F823XX.pdf
MC56F82313VLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Produkt ist nicht verfügbar
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MC34PF1510A2EP PF1510.pdf
MC34PF1510A2EP
Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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S32G378AACK1VUCT S32G3.pdf
S32G378AACK1VUCT
Hersteller: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
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25+215.13 EUR
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S32G378AACK1VUCR S32G3.pdf
S32G378AACK1VUCR
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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S32G378ASCK1VUCT S32G3.pdf
S32G378ASCK1VUCT
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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1+180.34 EUR
10+150.75 EUR
25+143.36 EUR
100+135.24 EUR
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S32G378ASCK1VUCR S32G3.pdf
S32G378ASCK1VUCR
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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OM14500/TJA1101JP TR1329.pdf
OM14500/TJA1101JP
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: TJA1101
Type: Interface
Function: Ethernet
Packaging: Bulk
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BF904,235 BF904%28R%29_Rev6.pdf
BF904,235
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Current - Test: 10 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Noise Figure: 1dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 200MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NVT2002TLH NVT2001_NVT2002.pdf
NVT2002TLH
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 11706 Stücke:
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14+1.52 EUR
20+1.08 EUR
25+0.98 EUR
100+0.86 EUR
250+0.8 EUR
500+0.76 EUR
1000+0.74 EUR
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LPC804M101JHI33Y LPC804_DS.pdf
LPC804M101JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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6000+2.05 EUR
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LPC804M101JHI33Y LPC804_DS.pdf
LPC804M101JHI33Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
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5+4.65 EUR
10+3.63 EUR
100+2.92 EUR
500+2.76 EUR
1000+2.28 EUR
2500+2.13 EUR
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74HCT4075N,652 74HC_HCT4075.pdf
74HCT4075N,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC56F8145VFGE MC56F833xDSAD.pdf
MC56F8145VFGE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68SEC000AE20 MC68SEC000.pdf
MC68SEC000AE20
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64LQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12E32CFUE MC9S12E128V1.pdf
MC9S12E32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997PA1-NXWI/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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88W8997PA1-NXWE/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AK 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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88W8997-A1-NXWE/AZ 88W8997-FACT-SHEET.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC8101VT1500F MSC8101.pdf
MSC8101VT1500F
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Part Status: Obsolete
Supplier Device Package: 332-FCBGA (17x17)
Clock Rate: 300MHz
Voltage - Core: 1.60V
Voltage - I/O: 3.30V
On-Chip RAM: 512KB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 75°C (TJ)
Type: SC140 Core
Interface: Communications Processor Module (CPM)
Mounting Type: Surface Mount
Package / Case: 332-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC802M001JDH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT FLASH
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Packaging: Tube
auf Bestellung 380 Stücke:
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380+2.76 EUR
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LPC860-MAX LPCXpresso860-MAXUM.pdf
LPC860-MAX
Hersteller: NXP USA Inc.
Description: LPCXPRESSO860-MAX EVAL
Part Status: Active
Packaging: Box
auf Bestellung 32 Stücke:
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1+30.07 EUR
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LPC802M001JDH20J LPC802.pdf
LPC802M001JDH20J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
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8+2.95 EUR
10+2.17 EUR
25+1.96 EUR
100+1.75 EUR
250+1.64 EUR
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74HC08PW/C4118 74HC_HCT08.pdf
74HC08PW/C4118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74HC08PW/S400118 74HC_HCT08.pdf
74HC08PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14TSSOP
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3V1T66GM,132 NX3V1T66.pdf
NX3V1T66GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 25MHz
On-State Resistance (Max): 450mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 70pF
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Charge Injection: 12pC
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
3328+0.18 EUR
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LD6806CX4/30H,315 LD6806_Series.pdf
LD6806CX4/30H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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HTSICH5601EW/V7:00 HTSICH56_48_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 100-150KHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 100kHz ~ 150kHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3.5V
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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74HC08D/C4118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/C4118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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MC68020EH33E MC68020UM.pdf
MC68020EH33E
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 33MHZ 132PQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: 68020
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Produkt ist nicht verfügbar
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74HC08D/S200118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/S200118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HC08D/AU118 PHGL-S-A0001295587-1.pdf?t.download=true&u=5oefqw
74HC08D/AU118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Part Status: Active
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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74HC08D/AUJ 74HC_HCT08.pdf
74HC08D/AUJ
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Hersteller: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 80V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 120kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C
Applications: Lighting
Topology: Boost
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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ASL1500SHNY ASL1500SHN.pdf
ASL1500SHNY
Hersteller: NXP USA Inc.
Description: IC LED DRIVER CTRLR 32HVQFN
Frequency: 120kHz ~ 700kHz
Number of Outputs: 1
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Voltage - Output: 80V
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Voltage - Supply (Max): 40V
Voltage - Supply (Min): 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Topology: Boost
Applications: Lighting
Operating Temperature: -40°C ~ 125°C
Type: DC DC Controller
Produkt ist nicht verfügbar
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MIMXRT685SFFOBR RT600.pdf
MIMXRT685SFFOBR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Number of I/O: 147
Part Status: Active
Supplier Device Package: 249-FOWLP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: External Program Memory
Oscillator Type: Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 4.5M x 8
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 249-WFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Power - Peak Pulse: 6W
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Power Line Protection: No
Produkt ist nicht verfügbar
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BZA968AVL,115 BZA900AVL_SERIES.pdf
BZA968AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM SOT665
Unidirectional Channels: 4
Supplier Device Package: SOT-665
Voltage - Reverse Standoff (Typ): 6.8V
Capacitance @ Frequency: 16pF @ 1MHz
Applications: General Purpose
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Part Status: Obsolete
Power Line Protection: No
Power - Peak Pulse: 6W
Produkt ist nicht verfügbar
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RX1214B300YI112
RX1214B300YI112
Hersteller: NXP USA Inc.
Description: RF POWER TRANSISTORS
Packaging: Bulk
Package / Case: SOT-439A
Mounting Type: Chassis Mount
Transistor Type: NPN
Gain: 8dB
Power - Max: 570W
Current - Collector (Ic) (Max): 21A
Voltage - Collector Emitter Breakdown (Max): 60V
Supplier Device Package: CDFM2
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33903CP3EK MC33903,4,5.pdf
MCZ33903CP3EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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2+19.23 EUR
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MPC5200CVR400BR2 MPC5200BDS.pdf
MPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MPC5200CVR400BR2 MPC5200BDS.pdf
MPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Cut Tape (CT)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200CVR400 MPC5200.pdf
MPC5200CVR400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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1+199.49 EUR
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MPC5200VR400 MPC5200.pdf
MPC5200VR400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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1+195.36 EUR
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MPC5200VR400B MPC5200BDS.pdf
MPC5200VR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC5200CVR400B MPC5200BDS.pdf
MPC5200CVR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Not For New Designs
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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1+143.88 EUR
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SPC5200CVR400557
Hersteller: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5200CBV400R2 MPC5200.pdf
SPC5200CBV400R2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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SPC5200CVR400R2 MPC5200.pdf
SPC5200CVR400R2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192_Rev3.3.pdf
MC13192FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13192FCR2 MC13192_Rev3.3.pdf
MC13192FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6U6AVM10ADR IMX6SDLAEC.pdf
MCIMX6U6AVM10ADR
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU, DUAL A
Additional Interfaces: Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M68DIP8SOICE
Hersteller: NXP USA Inc.
Description: ADAPTER 8-PIN DIP - SOIC
Packaging: Bulk
For Use With/Related Products: Target Cable
Module/Board Type: Socket Module - SOIC
Utilized IC / Part: Target Cable
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1753T/N1,518 TEA1753T.pdf
TEA1753T/N1,518
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 2500 Stücke:
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2500+3.68 EUR
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TEA1753T/N1,518 TEA1753T.pdf
TEA1753T/N1,518
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 250kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Part Status: Active
Power (Watts): 250 W
auf Bestellung 4957 Stücke:
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4+6.43 EUR
10+4.82 EUR
25+4.43 EUR
100+3.99 EUR
250+3.77 EUR
500+3.65 EUR
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UBA2028T/N1,518 UBA2028.pdf
UBA2028T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 100KHZ 20SO
Current - Supply: 1.5 mA
Part Status: Obsolete
Current - Output Source/Sink: 280mA
Dimming: Yes
Supplier Device Package: 20-SO
Voltage - Supply: 9.1V ~ 13V
Operating Temperature: -25°C ~ 80°C
Type: CFL/TL Driver
Frequency: 40.5kHz ~ 100kHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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UBA2028T/N1,518 UBA2028.pdf
UBA2028T/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 100KHZ 20SO
Current - Supply: 1.5 mA
Part Status: Obsolete
Current - Output Source/Sink: 280mA
Dimming: Yes
Supplier Device Package: 20-SO
Voltage - Supply: 9.1V ~ 13V
Operating Temperature: -25°C ~ 80°C
Type: CFL/TL Driver
Frequency: 40.5kHz ~ 100kHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 481725 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
208+2.9 EUR
Mindestbestellmenge: 208 Stücke
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