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MCF5206EAB40 MCF5206EAB40 NXP USA Inc. MCF5206EFS.pdf Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF24301HR5178 NXP USA Inc. ROCELEC_1.pdf?t.download=true&u=ovmfp3 Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
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mpc8250aczumhbc mpc8250aczumhbc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8250ACVVMHBC MPC8250ACVVMHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132N,112 NXP USA Inc. 74LV132.pdf Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
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74LV367D,112 74LV367D,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
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74LV367N,112 74LV367N,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 SPC5603BF2CLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
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PDTA113ZE,115 PDTA113ZE,115 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
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PDTA113EE,115 PDTA113EE,115 NXP USA Inc. PHGLS19170-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665ATF4AE NXP USA Inc. MC33665A_SDS.pdf Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
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2+17.41 EUR
10+13.59 EUR
25+12.64 EUR
80+11.73 EUR
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A3I20D040WNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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A3I20D040WGNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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AFSC5G23D37T2 NXP USA Inc. AFSC5G23D37.pdf Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 NXP USA Inc. A3I35D012WN.pdf Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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PMGD130UN,115 PMGD130UN,115 NXP USA Inc. PMGD130UN.pdf Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 390mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8255ACVVMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8347ECVRADDB NXP USA Inc. MPC8347EAEC.pdf Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI
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3+179.06 EUR
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LPC4310FBD144,551 LPC4310FBD144,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
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74AUP3G0434GD125 74AUP3G0434GD125 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
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74AUP3G0434DC125 74AUP3G0434DC125 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
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74AUP3G0434GT115 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 8-XSON (1.95x1)
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74AUP3G0434GS115 74AUP3G0434GS115 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
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S9S12ZVL16F0VLC S9S12ZVL16F0VLC NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
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S9S08SG4E2VTGR518 S9S08SG4E2VTGR518 NXP USA Inc. MC9S08SG8.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
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74AXP1T34GS,125 74AXP1T34GS,125 NXP USA Inc. PHGL-S-A0001360287-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
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74AXP1T34GN,125 74AXP1T34GN,125 NXP USA Inc. NEXP-S-A0003105714-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
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74AXP1T34GN125 74AXP1T34GN125 NXP USA Inc. 74AXP1T34.pdf Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
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74AXP1T34GM125 74AXP1T34GM125 NXP USA Inc. 74AXP1T34.pdf Description: 74AXP1T34GM - BUFFER, AXP SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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74AXP1T34GS125 74AXP1T34GS125 NXP USA Inc. 74AXP1T34.pdf Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
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74AXP1T34GW125 74AXP1T34GW125 NXP USA Inc. 74AXP1T34.pdf Description: 74AXP1T34GW - BUFFER, AXP SERIES
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74LV365N,112 74LV365N,112 NXP USA Inc. 74LV365.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
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74LV132DB,118 74LV132DB,118 NXP USA Inc. PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.9V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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1569+0.31 EUR
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74LV132DB,112 74LV132DB,112 NXP USA Inc. PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LV/LV-A/LVX/H SERIES,
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74ALVT162241DL,112 74ALVT162241DL,112 NXP USA Inc. 74ALVT162241.pdf Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Produkt ist nicht verfügbar
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FS32K116LAT0VLFT FS32K116LAT0VLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6X3EVK10AC MCIMX6X3EVK10AC NXP USA Inc. Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
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MCIMX6X3EVK10ACR MCIMX6X3EVK10ACR NXP USA Inc. Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
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MCIMX6S4AVM08ABR MCIMX6S4AVM08ABR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC22XS4200BEK MC22XS4200BEK NXP USA Inc. 22XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
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SL2S5302FTB115 NXP USA Inc. Description: ICODE SLIX-S SMART LABEL IC
Produkt ist nicht verfügbar
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A3V09H521-24SR6 NXP USA Inc. A3V09H521-24S.pdf Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BZT52H-B5V1/DLT115 BZT52H-B5V1/DLT115 NXP USA Inc. BZT52H_SER.pdf Description: NOW NEXPERIA BZT52H-B5V1 - ZENER
Produkt ist nicht verfügbar
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MCIMX6QP5EVT2AA MCIMX6QP5EVT2AA NXP USA Inc. Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6DP5EVT2AA MCIMX6DP5EVT2AA NXP USA Inc. Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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PCA9617ADP-ARD NXP USA Inc. UM11763.pdf Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Packaging: Box
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9617A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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SPX3078D NXP USA Inc. Description: SENSORS UNCOMP
Produkt ist nicht verfügbar
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P2041NSE7PNC NXP USA Inc. FSCL-S-A0000311302-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7 Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MCF54452VP266 MCF54452VP266 NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
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300+41.23 EUR
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LD6816CX4/12H,315 LD6816CX4/12H,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 1.2V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
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3328+0.15 EUR
Mindestbestellmenge: 3328
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MCIMX6X3EVO10AC MCIMX6X3EVO10AC NXP USA Inc. IMX6SXCEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MPC8349VVAGDB MPC8349VVAGDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 400MHZ 672TBGA
Produkt ist nicht verfügbar
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MK22DN512VLH5 MK22DN512VLH5 NXP USA Inc. K22P64M50SF4.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDMGD3160DCMHB FRDMGD3160DCMHB NXP USA Inc. UM11637.pdf Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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FRDMGD3160HB8EVM FRDMGD3160HB8EVM NXP USA Inc. UM11777.pdf Description: HALF-BRIDGE EVAL BOARD GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
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FRDMGD3160HBIEVM NXP USA Inc. Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
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FRDMGD3160XM3EVM FRDMGD3160XM3EVM NXP USA Inc. getting-started-with-the-frdmgd3160xm3evm-evaluation-board:GS-FRDMGD3160XM3EVM Description: EVAL BOARD FOR KL25Z, MC33GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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MGD3160AM315EK NXP USA Inc. PB_GD3160.pdf Description: SNGL CH GATE DRIVER 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 15A
Current - Output High, Low: 15A, 15A
Supplier Device Package: 32-SOIC
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 40V
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10+14.86 EUR
Mindestbestellmenge: 2
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MCF5206EAB40 MCF5206EFS.pdf
MCF5206EAB40
Hersteller: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF24301HR5178 ROCELEC_1.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
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mpc8250aczumhbc MPC8250.pdf
mpc8250aczumhbc
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8250ACVVMHBC MPC8250.pdf
MPC8250ACVVMHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132.pdf
74LV132N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
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74LV367D,112 74LV367.pdf
74LV367D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
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74LV367N,112 74LV367.pdf
74LV367N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 MPC5604BC.pdf
SPC5603BF2CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTA113ZE,115 PDTA113Z_SER.pdf
PDTA113ZE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
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PDTA113EE,115 PHGLS19170-1.pdf?t.download=true&u=5oefqw
PDTA113EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665A_SDS.pdf
MC33665ATF4AE
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.41 EUR
10+13.59 EUR
25+12.64 EUR
80+11.73 EUR
Mindestbestellmenge: 2
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A3I20D040WNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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A3I20D040WGNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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AFSC5G23D37T2 AFSC5G23D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 A3I35D012WN.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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PMGD130UN,115 PMGD130UN.pdf
PMGD130UN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 390mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8260A.pdf
MPC8255ACVVMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8347ECVRADDB MPC8347EAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+179.06 EUR
Mindestbestellmenge: 3
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LPC4310FBD144,551 LPC4350_30_20_10.pdf
LPC4310FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP3G0434GD125 74AUP3G0434.pdf
74AUP3G0434GD125
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
auf Bestellung 92750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1031+0.48 EUR
Mindestbestellmenge: 1031
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74AUP3G0434DC125 74AUP3G0434.pdf
74AUP3G0434DC125
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
764+0.64 EUR
Mindestbestellmenge: 764
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74AUP3G0434GT115 74AUP3G0434.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 8-XSON (1.95x1)
Produkt ist nicht verfügbar
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74AUP3G0434GS115 74AUP3G0434.pdf
74AUP3G0434GS115
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Produkt ist nicht verfügbar
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S9S12ZVL16F0VLC S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL16F0VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR518 MC9S08SG8.pdf
S9S08SG4E2VTGR518
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
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74AXP1T34GS,125 PHGL-S-A0001360287-1.pdf?t.download=true&u=5oefqw
74AXP1T34GS,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
auf Bestellung 4967 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2402+0.21 EUR
Mindestbestellmenge: 2402
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74AXP1T34GN,125 NEXP-S-A0003105714-1.pdf?t.download=true&u=5oefqw
74AXP1T34GN,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1718+0.30 EUR
Mindestbestellmenge: 1718
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74AXP1T34GN125 74AXP1T34.pdf
74AXP1T34GN125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GM125 74AXP1T34.pdf
74AXP1T34GM125
Hersteller: NXP USA Inc.
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AXP1T34GS125 74AXP1T34.pdf
74AXP1T34GS125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GW125 74AXP1T34.pdf
74AXP1T34GW125
Hersteller: NXP USA Inc.
Description: 74AXP1T34GW - BUFFER, AXP SERIES
Produkt ist nicht verfügbar
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74LV365N,112 74LV365.pdf
74LV365N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
auf Bestellung 1768 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
340+1.55 EUR
Mindestbestellmenge: 340
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74LV132DB,118 PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw
74LV132DB,118
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.9V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1569+0.31 EUR
Mindestbestellmenge: 1569
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74LV132DB,112 PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw
74LV132DB,112
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
auf Bestellung 2492 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1443+0.37 EUR
Mindestbestellmenge: 1443
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74ALVT162241DL,112 74ALVT162241.pdf
74ALVT162241DL,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-SSOP
Produkt ist nicht verfügbar
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FS32K116LAT0VLFT S32K1xx.pdf
FS32K116LAT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6X3EVK10AC
MCIMX6X3EVK10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6X3EVK10ACR
MCIMX6X3EVK10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S4AVM08ABR IMX6SDLCEC.pdf
MCIMX6S4AVM08ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC22XS4200BEK 22XS4200.pdf
MC22XS4200BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
Produkt ist nicht verfügbar
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SL2S5302FTB115
Hersteller: NXP USA Inc.
Description: ICODE SLIX-S SMART LABEL IC
Produkt ist nicht verfügbar
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A3V09H521-24SR6 A3V09H521-24S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BZT52H-B5V1/DLT115 BZT52H_SER.pdf
BZT52H-B5V1/DLT115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZT52H-B5V1 - ZENER
Produkt ist nicht verfügbar
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MCIMX6QP5EVT2AA
MCIMX6QP5EVT2AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MCIMX6DP5EVT2AA
MCIMX6DP5EVT2AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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PCA9617ADP-ARD UM11763.pdf
Hersteller: NXP USA Inc.
Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Packaging: Box
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9617A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
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SPX3078D
Hersteller: NXP USA Inc.
Description: SENSORS UNCOMP
Produkt ist nicht verfügbar
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P2041NSE7PNC FSCL-S-A0000311302-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7
Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MCF54452VP266 MCF54455.pdf
MCF54452VP266
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.10 EUR
10+48.86 EUR
25+46.05 EUR
80+43.38 EUR
300+41.23 EUR
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LD6816CX4/12H,315 LD6816.pdf
LD6816CX4/12H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 150MA 4-WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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MCIMX6X3EVO10AC IMX6SXCEC.pdf
MCIMX6X3EVO10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MPC8349VVAGDB MPC8349EAEC.pdf
MPC8349VVAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672TBGA
Produkt ist nicht verfügbar
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MK22DN512VLH5 K22P64M50SF4.pdf
MK22DN512VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDMGD3160DCMHB UM11637.pdf
FRDMGD3160DCMHB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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FRDMGD3160HB8EVM UM11777.pdf
FRDMGD3160HB8EVM
Hersteller: NXP USA Inc.
Description: HALF-BRIDGE EVAL BOARD GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+824.14 EUR
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FRDMGD3160HBIEVM
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+670.35 EUR
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FRDMGD3160XM3EVM getting-started-with-the-frdmgd3160xm3evm-evaluation-board:GS-FRDMGD3160XM3EVM
FRDMGD3160XM3EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+625.38 EUR
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MGD3160AM315EK PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: SNGL CH GATE DRIVER 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 15A
Current - Output High, Low: 15A, 15A
Supplier Device Package: 32-SOIC
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 40V
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.44 EUR
10+14.86 EUR
Mindestbestellmenge: 2
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