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BUK9Y29-40E/CX NXP USA Inc. Description: TRANS N-CH LFPAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1P2201DUD/00Z NXP USA Inc. MF1P(H)x2_SDS.pdf Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 34187 Stücke
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MF1P2231DUD/00Z NXP USA Inc. MF1P(H)x2_SDS.pdf Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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MF1PH2201DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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MF1P2200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MF1PH2200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1P4230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Part Status: Active
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1P2200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV1
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH2231DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MF1PH2200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4201DUD/00Z NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MF1PH2230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH2230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MF1P4200DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08MM128VLH MC9S08MM128VLH NXP USA Inc. MC9S08MM128.pdf Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BF2VLQ4 SPC5603BF2VLQ4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7758HV/N205ZY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA2017AAT/1Y TEA2017AAT/1Y NXP USA Inc. TEA2017AAT_2.pdf Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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TEA2016AAT/1/S30Y TEA2016AAT/1/S30Y NXP USA Inc. TEA2016AAT.pdf Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
Produkt ist nicht verfügbar
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TEA2017ABT/2Y TEA2017ABT/2Y NXP USA Inc. TEA2017ABT_2.pdf Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
Produkt ist nicht verfügbar
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TEA2016AAT/2Y TEA2016AAT/2Y NXP USA Inc. TEA2016AAT_2.pdf Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2500 Stücke
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TEA2095T/1J TEA2095T/1J NXP USA Inc. TEA2095T.pdf Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Current - Supply: 90 µA
Produkt ist nicht verfügbar
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TEA2017ABT/1Y TEA2017ABT/1Y NXP USA Inc. TEA2017AAT_2.pdf Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
Produkt ist nicht verfügbar
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TEA2017AAT/3Y TEA2017AAT/3Y NXP USA Inc. TEA2017AAT_3.pdf Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
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2500+2.96 EUR
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TJA1103EVB TJA1103EVB NXP USA Inc. getting-started-with-the-tja1103evb-evaluation-board:GS-TJA1103EVB Description: EVAL BOARD FOR TJA1103
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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SAF7758HN/N207ZK NXP USA Inc. Description: CAR DISP
Part Status: Obsolete
Supplier Device Package: 176-HLQFP (24x24)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF5213LCVM66 MCF5213LCVM66 NXP USA Inc. MCF5213EC.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1200 Stücke
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MC34704AEP MC34704AEP NXP USA Inc. MC34704.pdf Description: IC POWER MANAGEMENT 56-QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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2+12.36 EUR
10+9.81 EUR
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MIMXRT1172AVM8AR MIMXRT1172AVM8AR NXP USA Inc. IMXRT1170AEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
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74AUP3G34GNX 74AUP3G34GNX NXP USA Inc. 74AUP3G34.pdf Description: IC BUFFER NON-INVERT 3.6V 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
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74AUP1G34GN,132 74AUP1G34GN,132 NXP USA Inc. PHGLS24880-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
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74AUP1G34GX/S500125 74AUP1G34GX/S500125 NXP USA Inc. PHGLS24880-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
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SAF7770EL/202Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z13BY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z13BK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z130K NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z130Y NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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PMEG2015EA115 PMEG2015EA115 NXP USA Inc. PMEG2015EA.pdf Description: DIODE SCHOTTKY 20V 1.5A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F82728VLH MC56F82728VLH NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MKL02Z8VFG4 MKL02Z8VFG4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
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10+4.18 EUR
25+3.62 EUR
80+3.07 EUR
230+2.7 EUR
490+2.49 EUR
980+2.34 EUR
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MKL02Z32VFM4 MKL02Z32VFM4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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5+4.24 EUR
10+3.18 EUR
25+2.92 EUR
100+2.63 EUR
490+2.43 EUR
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MKL02Z16VFM4 MKL02Z16VFM4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Mounting Type: Surface Mount, Wettable Flank
Number of I/O: 28
Part Status: Active
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
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10+2.38 EUR
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LD6805K/13H,115 LD6805K/13H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
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LD6805K/30P,115 LD6805K/30P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 3V 150MA DFN1010C-4
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
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LD6805K/28H,115 LD6805K/28H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.8V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
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LD6805K/13P,115 LD6805K/13P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
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LD6805K/20H,115 LD6805K/20H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2V 150MA DFN1010C-4
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LD6805K/23P,115 LD6805K/23P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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LD6805K/31H,115 LD6805K/31H,115 NXP USA Inc. LD6805.pdf Description: IC REG LINEAR 3.1V 150MA 4UDFN
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-UDFN (1.0x1.0)
Voltage - Output (Min/Fixed): 3.1V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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3206+0.16 EUR
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LD6805K/18P,115 LD6805K/18P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6805K/29H,115 LD6805K/29H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.9V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 50000 Stücke:
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2959+0.16 EUR
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LD6805K/33H,115 LD6805K/33H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 3.3V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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BUK625R0-40C,118-NXP BUK625R0-40C,118-NXP NXP USA Inc. Description: MOSFET N-CH 40V 90A DPAK
Input Capacitance (Ciss) (Max) @ Vds: 5200 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Part Status: Active
Supplier Device Package: DPAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 158W (Ta)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 90A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1051TK/3/2Z TJA1051TK/3/2Z NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 6000 Stücke
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SPC5603BK0MLL6 SPC5603BK0MLL6 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 450 Stücke
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P5021NXE72QC P5021NXE72QC NXP USA Inc. P5021.pdf Description: IC MPU QORIQ P5 2.2GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (10), 10Gbps (2)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.0V, 1.2V
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
auf Bestellung 63 Stücke:
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8+121.3 EUR
Mindestbestellmenge: 8 Stücke
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LPC4323JET100 NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
auf Bestellung 1966 Stücke:
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11+86.2 EUR
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LD6806TD/36H,125 LD6806TD/36H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3.6V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2959+0.16 EUR
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MC705P6ECDWE MC705P6ECDWE NXP USA Inc. MC68HC705P6A.pdf Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Number of I/O: 21
DigiKey Programmable: Not Verified
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BUK9Y29-40E/CX
Hersteller: NXP USA Inc.
Description: TRANS N-CH LFPAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1P2201DUD/00Z MF1P(H)x2_SDS.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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MF1P2231DUD/00Z MF1P(H)x2_SDS.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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MF1PH2201DUD/00Z MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV2
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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MF1P2200DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MF1PH2200DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1P4230DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV2
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Part Status: Active
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1P2200DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH2231DUD/00Z MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MF1PH2200DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4201DUD/00Z MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: Wafer
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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MF1PH2230DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Part Status: Active
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA8, Smart Card Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH2230DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MF1P4200DA8/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08MM128VLH MC9S08MM128.pdf
MC9S08MM128VLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BF2VLQ4 MPC5602D.pdf
SPC5603BF2VLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7758HV/N205ZY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA2017AAT/1Y TEA2017AAT_2.pdf
TEA2017AAT/1Y
Hersteller: NXP USA Inc.
Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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TEA2016AAT/1/S30Y TEA2016AAT.pdf
TEA2016AAT/1/S30Y
Hersteller: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
Produkt ist nicht verfügbar
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TEA2017ABT/2Y TEA2017ABT_2.pdf
TEA2017ABT/2Y
Hersteller: NXP USA Inc.
Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
Produkt ist nicht verfügbar
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TEA2016AAT/2Y TEA2016AAT_2.pdf
TEA2016AAT/2Y
Hersteller: NXP USA Inc.
Description: DCM/QR PFC + RESONANT POWER SUPP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 0.5V ~ 2.65V, 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 4.8 mA
Produkt ist nicht verfügbar
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TEA2095T/1J TEA2095T.pdf
TEA2095T/1J
Hersteller: NXP USA Inc.
Description: DUAL SYNCHRONOUS RECTIFICATION C
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.75V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Current - Supply: 90 µA
Produkt ist nicht verfügbar
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TEA2017ABT/1Y TEA2017AAT_2.pdf
TEA2017ABT/1Y
Hersteller: NXP USA Inc.
Description: PFC + RESONANT POWER SUPPLY CONT
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Current - Supply: 8 mA
Produkt ist nicht verfügbar
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TEA2017AAT/3Y TEA2017AAT_3.pdf
TEA2017AAT/3Y
Hersteller: NXP USA Inc.
Description: DCM/QR/CCM & MULTI MODE PFC + RE
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 36V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+2.96 EUR
Mindestbestellmenge: 2500 Stücke
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TJA1103EVB getting-started-with-the-tja1103evb-evaluation-board:GS-TJA1103EVB
TJA1103EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1103
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Secondary Attributes: On-Board LEDs
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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SAF7758HN/N207ZK
Hersteller: NXP USA Inc.
Description: CAR DISP
Part Status: Obsolete
Supplier Device Package: 176-HLQFP (24x24)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF5213LCVM66 MCF5213EC.pdf
MCF5213LCVM66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1200 Stücke
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MC34704AEP MC34704.pdf
MC34704AEP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 56-QFN
Part Status: Active
Supplier Device Package: 56-QFN-EP (7x7)
Current - Supply: 86mA
Applications: Processor
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -20°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1848 Stücke:
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AnzahlPreis
2+12.36 EUR
10+9.81 EUR
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MIMXRT1172AVM8AR IMXRT1170AEC.pdf
MIMXRT1172AVM8AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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74AUP3G34GNX 74AUP3G34.pdf
74AUP3G34GNX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
Part Status: Active
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AnzahlPreis
1139+0.39 EUR
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74AUP1G34GN,132 PHGLS24880-1.pdf?t.download=true&u=5oefqw
74AUP1G34GN,132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
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AnzahlPreis
2142+0.25 EUR
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74AUP1G34GX/S500125 PHGLS24880-1.pdf?t.download=true&u=5oefqw
74AUP1G34GX/S500125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Part Status: Active
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AnzahlPreis
4594+0.12 EUR
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SAF7770EL/202Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z13BY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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SAF7770EL/202Z13BK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z130K
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z130Y
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
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SAF7770EL/202Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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PMEG2015EA115 PMEG2015EA.pdf
PMEG2015EA115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 20V 1.5A SOD323
Current - Reverse Leakage @ Vr: 50 µA @ 15 V
Voltage - Forward (Vf) (Max) @ If: 660 mV @ 1.5 A
Voltage - DC Reverse (Vr) (Max): 20 V
Part Status: Active
Operating Temperature - Junction: -65°C ~ 125°C
Supplier Device Package: SOD-323
Current - Average Rectified (Io): 1.5A
Capacitance @ Vr, F: 25pF @ 5V, 1MHz
Technology: Schottky
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F82728VLH MC56F827XXDS.pdf
MC56F82728VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL02Z8VFG4 KL0xPB.pdf
MKL02Z8VFG4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
auf Bestellung 2092 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+6.35 EUR
10+4.18 EUR
25+3.62 EUR
80+3.07 EUR
230+2.7 EUR
490+2.49 EUR
980+2.34 EUR
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MKL02Z32VFM4 KL0xPB.pdf
MKL02Z32VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 13477 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.24 EUR
10+3.18 EUR
25+2.92 EUR
100+2.63 EUR
490+2.43 EUR
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MKL02Z16VFM4 KL0xPB.pdf
MKL02Z16VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Connectivity: I2C, SPI, UART/USART
Mounting Type: Surface Mount, Wettable Flank
Number of I/O: 28
Part Status: Active
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+2.46 EUR
10+2.38 EUR
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LD6805K/13H,115 LD6805.pdf
LD6805K/13H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2959+0.16 EUR
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LD6805K/30P,115 LD6805.pdf
LD6805K/30P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 3V 150MA DFN1010C-4
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
auf Bestellung 370394 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2959+0.17 EUR
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LD6805K/28H,115 LD6805.pdf
LD6805K/28H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
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LD6805K/13P,115 LD6805.pdf
LD6805K/13P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.3V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.3V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
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LD6805K/20H,115 LD6805.pdf
LD6805K/20H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2V 150MA DFN1010C-4
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
Produkt ist nicht verfügbar
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LD6805K/23P,115 LD6805.pdf
LD6805K/23P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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LD6805K/31H,115 LD6805.pdf
LD6805K/31H,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.1V 150MA 4UDFN
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-UDFN (1.0x1.0)
Voltage - Output (Min/Fixed): 3.1V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6805K/18P,115 LD6805.pdf
LD6805K/18P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6805K/29H,115 LD6805.pdf
LD6805K/29H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.9V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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AnzahlPreis
2959+0.16 EUR
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LD6805K/33H,115 LD6805.pdf
LD6805K/33H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 3.3V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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BUK625R0-40C,118-NXP
BUK625R0-40C,118-NXP
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 90A DPAK
Input Capacitance (Ciss) (Max) @ Vds: 5200 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±16V
Part Status: Active
Supplier Device Package: DPAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 158W (Ta)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 90A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1051TK/3/2Z TJA1051.pdf
TJA1051TK/3/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5603BK0MLL6
SPC5603BK0MLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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P5021NXE72QC P5021.pdf
P5021NXE72QC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P5 2.2GHZ 1295BGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (10), 10Gbps (2)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.0V, 1.2V
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 2.2GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Bulk
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AnzahlPreis
8+121.3 EUR
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LPC4323JET100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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LD6806TD/36H,125 LD6806_Series.pdf
LD6806TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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AnzahlPreis
2959+0.16 EUR
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MC705P6ECDWE MC68HC705P6A.pdf
MC705P6ECDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Number of I/O: 21
DigiKey Programmable: Not Verified
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AnzahlPreis
182+5.46 EUR
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