Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35475) > Seite 475 nach 592
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NCF2922AHN3/0212CY | NXP USA Inc. |
Description: RECEIVER 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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FRDMPKPT2000EVM | NXP USA Inc. |
Description: FREEDOM BOARD KIT - PT2000 PROG Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: PT2000 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit |
Produkt ist nicht verfügbar |
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S9S12HY64J0CLLR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 80 DigiKey Programmable: Not Verified |
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MC68LK332GCAG16-NXP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PEMI1QFN/RP,315 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-101, SOT-883 Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 23dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Part Status: Obsolete Number of Channels: 1 |
Produkt ist nicht verfügbar |
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74AHCT2G126GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
auf Bestellung 68069 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT2G241DP125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-TSSOP Part Status: Active |
auf Bestellung 3087 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT2G125GD,125-NX | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
Produkt ist nicht verfügbar |
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BUK7Y28-75B,115 | NXP USA Inc. |
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LD6836TD/36H,125 | NXP USA Inc. |
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auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836TD/22H,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.2V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.2V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806CX4/33H,315 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 3.3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
Produkt ist nicht verfügbar |
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74HCT2G08DP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BZX79-C51143 | NXP USA Inc. |
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auf Bestellung 35000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX79-C56133 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BAP51L,315 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: DFN1006-2 Current - Max: 100 mA Power Dissipation (Max): 500 mW |
Produkt ist nicht verfügbar |
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MC35FS6511NAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6511NAE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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RAPIDRF-26E39 | NXP USA Inc. |
![]() Packaging: Bulk Frequency: 2.496GHz ~ 2.69GHz Type: Front End Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC3152FET208,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 192K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, PWM, WDT Supplier Device Package: 208-TFBGA (12x12) Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCAL6408AHK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC9S08AW16MFUE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 163 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV90-C56115 | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 56 V Impedance (Max) (Zzt): 200 Ohms Supplier Device Package: SOT-223 Grade: Automotive Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V Qualification: AEC-Q100 |
auf Bestellung 1990 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT374D118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 8mA, 8mA Trigger Type: Positive Edge Clock Frequency: 130 MHz Input Capacitance: 3 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF Number of Bits per Element: 8 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX537CVP8C2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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HOMEKIT-SDK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XEQ512BVAAR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512BVAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LD6816CX4/33P,315 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 3.3V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
Produkt ist nicht verfügbar |
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PEMI2QFN/LP,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 19dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 2 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2211AT/N1,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 10.7V ~ 13.8V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 900mA Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9502BS,157 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SPI Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: No Supplier Device Package: 24-HVQFN (4x4) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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UJA1169AF-EVB | NXP USA Inc. |
![]() Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: UJA1169A Supplied Contents: Board(s) Primary Attributes: 12V Supply Secondary Attributes: SPI Interface(s) Embedded: Yes, MCU Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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PHPT60603PY115 | NXP USA Inc. |
![]() Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC13202FC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 4dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 32-HVQFN (5x5) GPIO: 7 Modulation: DSSS, O-QPSK RF Family/Standard: 802.15.4, General ISM > 1GHz Serial Interfaces: SPI Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA24S08AD | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
auf Bestellung 4264 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA24S08AD112 | NXP USA Inc. | Description: EEPROM 1MX8 |
Produkt ist nicht verfügbar |
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PCA24S08AD,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 8Kbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: EEPROM Clock Frequency: 400 kHz Memory Format: EEPROM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 1K x 8 DigiKey Programmable: Not Verified |
auf Bestellung 1839 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLS8964AFR3 | NXP USA Inc. |
![]() Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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FXLS8964AFR3 | NXP USA Inc. |
![]() Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 636 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F80746MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: 56800EF Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F80646VLF | NXP USA Inc. |
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MC56F80626VLF | NXP USA Inc. |
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MC56F80736VLF | NXP USA Inc. |
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MC56F80746VLF | NXP USA Inc. |
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MC56F80726VLF | NXP USA Inc. |
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MC56F8027VLHR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (16K x 16) RAM Size: 2K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 2x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
auf Bestellung 2892 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF7G24L-100,112 | NXP USA Inc. |
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auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860ENCVR66D4 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 123 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-WLCSP (1.84x1.87) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Packaging: Cut Tape (CT) Package / Case: 16-UFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-WLCSP (1.84x1.87) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68HC908QY4CDTE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74CBTLVD3245DS,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP Part Status: Obsolete |
auf Bestellung 1482 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS8530A1ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5606BK0VLQ6 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74ALVCH16373DL,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Independent Circuits: 2 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 2.1ns Supplier Device Package: 48-SSOP Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJD203A,127 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A Current - Collector Cutoff (Max): 100µA DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V Supplier Device Package: TO-220AB Current - Collector (Ic) (Max): 4 A Voltage - Collector Emitter Breakdown (Max): 425 V Power - Max: 80 W |
auf Bestellung 1499 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJD103AD,118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC860ENVR50D4 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 2997 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF52212CAE50 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Last Time Buy Number of I/O: 56 DigiKey Programmable: Not Verified |
auf Bestellung 690 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMPKPT2000EVM |
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12HY64J0CLLR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC68LK332GCAG16-NXP |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PEMI1QFN/RP,315 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74AHCT2G126GD,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 68069 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2049+ | 0.24 EUR |
74AHCT2G241DP125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3087 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1567+ | 0.33 EUR |
74AHCT2G125GD,125-NX |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BUK7Y28-75B,115 |
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Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Description: TRANSISTOR >30MHZ
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LD6836TD/36H,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2885+ | 0.17 EUR |
LD6836TD/22H,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2885+ | 0.17 EUR |
LD6806CX4/33H,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3.3V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74HCT2G08DP |
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Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BZX79-C51143 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
15000+ | 0.034 EUR |
BZX79-C56133 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
Description: NOW NEXPERIA BZX79-C56 - ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
BAP51L,315 |
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Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC35FS6511NAER2 |
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Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC35FS6511NAE |
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Hersteller: NXP USA Inc.
Description: FS6500
Description: FS6500
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
RAPIDRF-26E39 |
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Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Active
Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 1158.47 EUR |
LPC3152FET208,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 208-TFBGA (12x12)
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 208-TFBGA (12x12)
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PCAL6408AHK |
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Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC9S08AW16MFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
36+ | 15.08 EUR |
BZV90-C56115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Grade: Automotive
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q100
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Grade: Automotive
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q100
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1990+ | 0.27 EUR |
74AHCT374D118 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1348+ | 0.37 EUR |
MCIMX537CVP8C2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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HOMEKIT-SDK |
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Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
Im Einkaufswagen
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S912XEQ512BVAAR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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S912XEQ512BVAA |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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LD6816CX4/33P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
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PEMI2QFN/LP,115 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3806+ | 0.13 EUR |
UBA2211AT/N1,518 |
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Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
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PCA9502BS,157 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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UJA1169AF-EVB |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 129.99 EUR |
MC13202FC |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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PCA24S08AD |
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Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4264 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
740+ | 0.67 EUR |
PCA24S08AD112 |
Hersteller: NXP USA Inc.
Description: EEPROM 1MX8
Description: EEPROM 1MX8
Produkt ist nicht verfügbar
Im Einkaufswagen
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PCA24S08AD,112 |
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Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1839 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
FXLS8964AFR3 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FXLS8964AFR3 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: ACCELEROMETER 2-16G 10DFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 636 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 3.62 EUR |
10+ | 3.45 EUR |
25+ | 3.26 EUR |
50+ | 3.12 EUR |
100+ | 3 EUR |
500+ | 2.75 EUR |
MC56F80746MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.66 EUR |
10+ | 11.52 EUR |
80+ | 9.54 EUR |
1000+ | 8.32 EUR |
MC56F80646VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80626VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC56F80736VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC56F80746VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Im Einkaufswagen
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MC56F80726VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Im Einkaufswagen
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MC56F8027VLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 2892 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 23.2 EUR |
10+ | 18.3 EUR |
25+ | 17.07 EUR |
100+ | 15.72 EUR |
250+ | 15.08 EUR |
500+ | 14.69 EUR |
BLF7G24L-100,112 |
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Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 96.04 EUR |
MPC860ENCVR66D4 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 320.54 EUR |
NVT4858UKZ |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
NVT4858UKZ |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.75 EUR |
10+ | 2.46 EUR |
25+ | 2.34 EUR |
100+ | 1.92 EUR |
250+ | 1.79 EUR |
500+ | 1.59 EUR |
1000+ | 1.25 EUR |
MC68HC908QY4CDTE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74CBTLVD3245DS,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
auf Bestellung 1482 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1110+ | 0.45 EUR |
SPC5606BK0VLQ6 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74ALVCH16373DL,118 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
430+ | 1.15 EUR |
BUJD203A,127 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 425V 4A TO-220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
Description: TRANS NPN 425V 4A TO-220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
auf Bestellung 1499 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
908+ | 0.55 EUR |
BUJD103AD,118 |
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Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJD103AD - POWER BIP
Description: NOW WEEN - BUJD103AD - POWER BIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MPC860ENVR50D4 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 2997 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 312.25 EUR |
MCF52212CAE50 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 23.95 EUR |
10+ | 18.91 EUR |
25+ | 17.65 EUR |
80+ | 16.45 EUR |
230+ | 15.66 EUR |