Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 475 nach 607
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KW45Z41082AFPBT | NXP USA Inc. |
Description: K4W1 HVQFN40Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KW45Z41053AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KW45Z41083AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KW45Z41053AFPBT | NXP USA Inc. |
Description: K4W1 40HVQFNPackaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Part Status: Active Number of I/O: 22 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KW45Z41052AFTBT | NXP USA Inc. |
Description: K4W1 HVQFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 14x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, HMI, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Part Status: Active Number of I/O: 29 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SAF3560HV/V1106Y | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Memory Size: 512kB SDRAM Type: TxRx Only Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V Supplier Device Package: 144-HLQFP (20x20) Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LX2160XC72232B | NXP USA Inc. |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075D-Q100118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14TSSOPPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 13880 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075PW-Q100118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14TSSOPPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Active Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
auf Bestellung 1911 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4075N,652 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC4075DB,112 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOPPackaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC4075DB,118 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14SSOPPackaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SAF4000EL/101Z233Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TEA2095DB1574 | NXP USA Inc. |
Description: TEA2095DB1574Packaging: Bulk Function: Rectifier Controller Type: Power Management Contents: Board(s) Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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TEA2208DB1576 | NXP USA Inc. |
Description: EVAL BOARD FOR TEA2208TPackaging: Bulk Function: Rectifier Controller Type: Power Management Contents: Board(s) Utilized IC / Part: TEA2208T Supplied Contents: Board(s) Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC1764FBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 70 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
auf Bestellung 390 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1764FBD100,551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPOperating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 70 Part Status: Discontinued at Digi-Key Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F8006VLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFPPackage / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 16 Program Memory Size: 16KB (8K x 16) Speed: 32MHz Mounting Type: Surface Mount |
auf Bestellung 1176 Stücke: Lieferzeit 10-14 Tag (e) |
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A3I35D025WNR1 | NXP USA Inc. |
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WBPackaging: Cut Tape (CT) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz RF Type: General Purpose Voltage - Supply: 28V Gain: 30.5dB P1dB: 42.6dBm Test Frequency: 3.8GHz ~ 4GHz Supplier Device Package: TO-270WB-17 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TJA1021BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 4421 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1021AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2891 Stücke: Lieferzeit 10-14 Tag (e) |
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P4040NSE7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P4 1.5GHZ 1295BGAPackaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (8), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BFU520X235 | NXP USA Inc. |
Description: NPN RF TRANSISTORPart Status: Active Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU520X215 | NXP USA Inc. |
Description: NPN RF TRANSISTORPart Status: Active Packaging: Bulk |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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KTY82/121,235 | NXP USA Inc. |
Description: SENSOR PTC 990OHM SOT23Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KTY82/121,235 | NXP USA Inc. |
Description: SENSOR PTC 990OHM SOT23Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 990 Ohms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KTY82/110/C1,215 | NXP USA Inc. |
Description: SENSOR PTC 1KOHM SOT23Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 1 kOhms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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KTY82/110/C1,235 | NXP USA Inc. |
Description: SENSOR PTC 1KOHM SOT23Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Supplier Device Package: SOT-23 (TO-236AB) Part Status: Last Time Buy Resistance @ 25°C: 1 kOhms |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| T4161NXN7TTB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.8GHZ 1932BGAPart Status: Active SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (13), 10Gbps (2) Supplier Device Package: 1932-FCPBGA (45x45) Core Processor: PowerPC e6500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.8GHz Mounting Type: Surface Mount Package / Case: 1932-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 12 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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TFF1024HN/N1,115 | NXP USA Inc. |
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN DigiKey Programmable: Not Verified Number of Circuits: 1 Part Status: Last Time Buy PLL: Yes Supplier Device Package: 16-DHVQFN (2.5x3.5) Differential - Input:Output: No/No Ratio - Input:Output: 2:1 Main Purpose: Ku band VSAT applications Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Input: Clock, Crystal Frequency - Max: 2.15MHz Output: Clock Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TFF1024HN/N1,115 | NXP USA Inc. |
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN DigiKey Programmable: Not Verified Number of Circuits: 1 Part Status: Last Time Buy PLL: Yes Supplier Device Package: 16-DHVQFN (2.5x3.5) Differential - Input:Output: No/No Ratio - Input:Output: 2:1 Main Purpose: Ku band VSAT applications Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Input: Clock, Crystal Frequency - Max: 2.15MHz Output: Clock Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 1636 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA6848HL/V3S518 | NXP USA Inc. |
Description: IC TUNER CAR RADIO 80LQFPPart Status: Active Packaging: Bulk Supplier Device Package: 80-LQFP (12x12) Secondary Attributes: I2C Interface RF Type: AM, FM Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz Function: Tuner Mounting Type: Surface Mount Package / Case: 80-LQFP |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6617T/V1518 | NXP USA Inc. |
Description: IC CAR RADIO SGL CHIP 32SOIC Packaging: Bulk Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2136FBD64/01EL | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 47 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 16x10b SAR; D/A 1x10b Core Processor: ARM7® Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 60MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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| MRF300ANBN-88MHZ | NXP USA Inc. |
Description: MRF300ANBN-88MHZPackaging: Bulk Part Status: Active Supplied Contents: Board(s) Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC56F82313VLC | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFPVoltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 16 Program Memory Size: 16KB (8K x 16) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 26 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: DMA, POR, PWM, WDT Connectivity: I²C, SCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34PF1510A2EP | NXP USA Inc. |
Description: PF1510Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AACK1VUCT | NXP USA Inc. |
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART |
auf Bestellung 418 Stücke: Lieferzeit 10-14 Tag (e) |
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S32G378AACK1VUCR | NXP USA Inc. |
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378ASCK1VUCT | NXP USA Inc. |
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378ASCK1VUCR | NXP USA Inc. |
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) USB: USB 2.0 OTG (1) Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Part Status: Active Ethernet: 2.5Gbps (3) Number of Cores/Bus Width: 4 Core, 32/64-Bit Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Speed: 400MHz, 1.3GHz Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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OM14500/TJA1101JP | NXP USA Inc. |
Description: EVALUATION BOARDPart Status: Active Supplied Contents: Board(s) Utilized IC / Part: TJA1101 Type: Interface Function: Ethernet Packaging: Bulk |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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BF904,235 | NXP USA Inc. |
Description: RF MOSFET 5V SOT143RCurrent - Test: 10 mA Voltage - Test: 5 V Voltage - Rated: 7 V Part Status: Obsolete Supplier Device Package: SOT-143R Noise Figure: 1dB Technology: MOSFET (Metal Oxide) Configuration: N-Channel Dual Gate Frequency: 200MHz Mounting Type: Surface Mount Current Rating (Amps): 30mA Package / Case: SOT-143R Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NVT2002TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR HXSON8UPackaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Data Rate: 33MHz Supplier Device Package: HXSON8U Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 13703 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC804M101JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC804M101JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFNPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 30 DigiKey Programmable: Not Verified |
auf Bestellung 10453 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4075N,652 | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC13892DJVK | NXP USA Inc. |
Description: IC PWR MGMT I.MX35/51 139BGAPackaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) Part Status: Active |
auf Bestellung 1986 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F8145VFGE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (64K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 128-LQFP (14x20) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68SEC000AE20 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64LQFPPart Status: Obsolete Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 64-LQFP (10x10) Voltage - I/O: 3.3V, 5.0V Core Processor: EC000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12E32CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 88W8997PA1-NXWI/AK | NXP USA Inc. |
Description: IC RF TXRX BLE 98HVQFNPart Status: Active Serial Interfaces: PCM, SDIO, UART, USB RF Family/Standard: Bluetooth Supplier Device Package: 98-HVQFN (9x9) Data Rate (Max): 2Mbps Protocol: 802.11ac, Bluetooth v5.1 Type: TxRx Only Frequency: 2.4GHz, 5GHz Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 88W8997PA1-NXWE/AK | NXP USA Inc. |
Description: IC RF TXRX BLE 98HVQFNPart Status: Active Serial Interfaces: PCM, SDIO, UART, USB RF Family/Standard: Bluetooth Supplier Device Package: 98-HVQFN (9x9) Data Rate (Max): 2Mbps Protocol: 802.11ac, Bluetooth v5.1 Type: TxRx Only Frequency: 2.4GHz, 5GHz Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 88W8997-A1-NXWE/AK | NXP USA Inc. |
Description: IC RF TXRX BLE 98HVQFNPart Status: Active Serial Interfaces: PCM, SDIO, UART, USB RF Family/Standard: Bluetooth Supplier Device Package: 98-HVQFN (9x9) Data Rate (Max): 2Mbps Protocol: 802.11ac, Bluetooth v5.1 Type: TxRx Only Frequency: 2.4GHz, 5GHz Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 88W8997-A1-NXWE/AZ | NXP USA Inc. |
Description: IC RF TXRX BLE 98HVQFNPart Status: Active Serial Interfaces: PCM, SDIO, UART, USB RF Family/Standard: Bluetooth Supplier Device Package: 98-HVQFN (9x9) Data Rate (Max): 2Mbps Protocol: 802.11ac, Bluetooth v5.1 Type: TxRx Only Frequency: 2.4GHz, 5GHz Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MSC8101VT1500F | NXP USA Inc. |
Description: IC DSP 16BIT 250MHZ 332FCBGAPart Status: Obsolete Supplier Device Package: 332-FCBGA (17x17) Clock Rate: 300MHz Voltage - Core: 1.60V Voltage - I/O: 3.30V On-Chip RAM: 512KB Non-Volatile Memory: External Operating Temperature: -40°C ~ 75°C (TJ) Type: SC140 Core Interface: Communications Processor Module (CPM) Mounting Type: Surface Mount Package / Case: 332-BFBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LPC802M001JDH16 | NXP USA Inc. |
Description: IC MCU 32BIT FLASH DigiKey Programmable: Not Verified Number of I/O: 13 Part Status: Active Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Packaging: Tube |
auf Bestellung 380 Stücke: Lieferzeit 10-14 Tag (e) |
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| KW45Z41082AFPBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 HVQFN40
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KW45Z41053AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KW45Z41083AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KW45Z41053AFPBT |
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Hersteller: NXP USA Inc.
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Description: K4W1 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 22
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KW45Z41052AFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 14x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, HMI, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 29
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SAF3560HV/V1106Y |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512kB SDRAM
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.32V, 3V ~ 3.6V
Supplier Device Package: 144-HLQFP (20x20)
Serial Interfaces: GPIO, I²C, I²S, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LX2160XC72232B |
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Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 1112.43 EUR |
| 74HC4075D-Q100118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1076+ | 0.47 EUR |
| 74HC4075PW118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 13880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1332+ | 0.38 EUR |
| 74HC4075PW-Q100118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 1911 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1298+ | 0.38 EUR |
| 74HC4075N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC4075DB,112 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC4075DB,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF4000EL/101Z233Y |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TEA2095DB1574 |
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Hersteller: NXP USA Inc.
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: TEA2095DB1574
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA2208DB1576 |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA2208T
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA2208T
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: EVAL BOARD FOR TEA2208T
Packaging: Bulk
Function: Rectifier Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA2208T
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1764FBD100K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 390 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.42 EUR |
| 10+ | 9.66 EUR |
| 25+ | 9.5 EUR |
| 100+ | 9.36 EUR |
| LPC1764FBD100,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F8006VLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
auf Bestellung 1176 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.63 EUR |
| 10+ | 8.19 EUR |
| 25+ | 7.58 EUR |
| 100+ | 6.91 EUR |
| 250+ | 6.59 EUR |
| 500+ | 6.4 EUR |
| A3I35D025WNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Description: IC AMP GPS 3.2GHZ-4GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
RF Type: General Purpose
Voltage - Supply: 28V
Gain: 30.5dB
P1dB: 42.6dBm
Test Frequency: 3.8GHz ~ 4GHz
Supplier Device Package: TO-270WB-17
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1021BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 0.56 EUR |
| TJA1021BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 4421 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 15+ | 1.18 EUR |
| 21+ | 0.84 EUR |
| 25+ | 0.76 EUR |
| 100+ | 0.66 EUR |
| 250+ | 0.62 EUR |
| 500+ | 0.59 EUR |
| 1000+ | 0.57 EUR |
| TJA1021AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 0.85 EUR |
| TJA1021AT/0Z |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2891 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.76 EUR |
| 14+ | 1.27 EUR |
| 25+ | 1.15 EUR |
| 100+ | 1.01 EUR |
| 250+ | 0.95 EUR |
| 500+ | 0.91 EUR |
| 1000+ | 0.88 EUR |
| P4040NSE7MMC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Description: IC MPU QORIQ P4 1.5GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFU520X235 |
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auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2323+ | 0.21 EUR |
| BFU520X215 |
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auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2323+ | 0.21 EUR |
| KTY82/121,235 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: SENSOR PTC 990OHM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen
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| KTY82/121,235 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Description: SENSOR PTC 990OHM SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 990 Ohms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KTY82/110/C1,215 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KTY82/110/C1,235 |
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Hersteller: NXP USA Inc.
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Description: SENSOR PTC 1KOHM SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T4161NXN7TTB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (13), 10Gbps (2)
Supplier Device Package: 1932-FCPBGA (45x45)
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1932-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Part Status: Active
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (13), 10Gbps (2)
Supplier Device Package: 1932-FCPBGA (45x45)
Core Processor: PowerPC e6500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.8GHz
Mounting Type: Surface Mount
Package / Case: 1932-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 12 Stücke
Im Einkaufswagen
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| TFF1024HN/N1,115 |
Hersteller: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Last Time Buy
PLL: Yes
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 2:1
Main Purpose: Ku band VSAT applications
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: Clock, Crystal
Frequency - Max: 2.15MHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Last Time Buy
PLL: Yes
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 2:1
Main Purpose: Ku band VSAT applications
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: Clock, Crystal
Frequency - Max: 2.15MHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TFF1024HN/N1,115 |
Hersteller: NXP USA Inc.
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Last Time Buy
PLL: Yes
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 2:1
Main Purpose: Ku band VSAT applications
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: Clock, Crystal
Frequency - Max: 2.15MHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC CLOCK 2.15MHZ 1CIR 16DHVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Last Time Buy
PLL: Yes
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Differential - Input:Output: No/No
Ratio - Input:Output: 2:1
Main Purpose: Ku band VSAT applications
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Input: Clock, Crystal
Frequency - Max: 2.15MHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1636 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.31 EUR |
| 10+ | 11.13 EUR |
| 25+ | 10.34 EUR |
| 100+ | 9.47 EUR |
| 250+ | 9.06 EUR |
| 500+ | 8.81 EUR |
| 1000+ | 8.6 EUR |
| TEA6848HL/V3S518 |
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Hersteller: NXP USA Inc.
Description: IC TUNER CAR RADIO 80LQFP
Part Status: Active
Packaging: Bulk
Supplier Device Package: 80-LQFP (12x12)
Secondary Attributes: I2C Interface
RF Type: AM, FM
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Description: IC TUNER CAR RADIO 80LQFP
Part Status: Active
Packaging: Bulk
Supplier Device Package: 80-LQFP (12x12)
Secondary Attributes: I2C Interface
RF Type: AM, FM
Frequency: 144kHz ~ 288kHz, 522kHz ~ 1.71MHz, 5.73MHz ~ 9.99MHz, 65MHz ~ 108MHz, 162.4MHz ~ 162.55MHz
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 80-LQFP
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 39+ | 12.64 EUR |
| TEF6617T/V1518 |
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 55+ | 9.23 EUR |
| LPC2136FBD64/01EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Description: IC MCU 16/32B 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 21.95 EUR |
| 10+ | 18.37 EUR |
| 25+ | 18.17 EUR |
| MRF300ANBN-88MHZ |
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Hersteller: NXP USA Inc.
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Description: MRF300ANBN-88MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F82313VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 16KB (8K x 16)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
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| MC34PF1510A2EP |
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Hersteller: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32G378AACK1VUCT |
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Hersteller: NXP USA Inc.
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
Description: IC MPU S32G3 1.3GZ/400MHZ 525BGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
auf Bestellung 418 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 217.98 EUR |
| 10+ | 184.16 EUR |
| 25+ | 175.72 EUR |
| S32G378AACK1VUCR |
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Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32G378ASCK1VUCT |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G378ASCK1VUCR |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
USB: USB 2.0 OTG (1)
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Part Status: Active
Ethernet: 2.5Gbps (3)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed: 400MHz, 1.3GHz
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OM14500/TJA1101JP |
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Hersteller: NXP USA Inc.
Description: EVALUATION BOARD
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: TJA1101
Type: Interface
Function: Ethernet
Packaging: Bulk
Description: EVALUATION BOARD
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: TJA1101
Type: Interface
Function: Ethernet
Packaging: Bulk
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 318.75 EUR |
| BF904,235 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Current - Test: 10 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Noise Figure: 1dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 200MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Description: RF MOSFET 5V SOT143R
Current - Test: 10 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Part Status: Obsolete
Supplier Device Package: SOT-143R
Noise Figure: 1dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 200MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NVT2002TLH |
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Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR HXSON8U
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Data Rate: 33MHz
Supplier Device Package: HXSON8U
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 13703 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 21+ | 0.84 EUR |
| 30+ | 0.59 EUR |
| 32+ | 0.56 EUR |
| 100+ | 0.52 EUR |
| 250+ | 0.48 EUR |
| 500+ | 0.47 EUR |
| LPC804M101JHI33Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6000+ | 1.72 EUR |
| LPC804M101JHI33Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 30
DigiKey Programmable: Not Verified
auf Bestellung 10453 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 3.91 EUR |
| 10+ | 3.05 EUR |
| 100+ | 2.45 EUR |
| 500+ | 2.32 EUR |
| 1000+ | 1.92 EUR |
| 2500+ | 1.79 EUR |
| 74HCT4075N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC13892DJVK |
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Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
Description: IC PWR MGMT I.MX35/51 139BGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Part Status: Active
auf Bestellung 1986 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 16.97 EUR |
| 10+ | 13.27 EUR |
| 25+ | 12.35 EUR |
| 100+ | 11.33 EUR |
| 250+ | 10.85 EUR |
| 500+ | 10.56 EUR |
| MC56F8145VFGE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (64K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 128-LQFP (14x20)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC68SEC000AE20 |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64LQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MPU M680X0 20MHZ 64LQFP
Part Status: Obsolete
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-LQFP (10x10)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12E32CFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 88W8997PA1-NXWI/AK |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 88W8997PA1-NXWE/AK |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 88W8997-A1-NXWE/AK |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 88W8997-A1-NXWE/AZ |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF TXRX BLE 98HVQFN
Part Status: Active
Serial Interfaces: PCM, SDIO, UART, USB
RF Family/Standard: Bluetooth
Supplier Device Package: 98-HVQFN (9x9)
Data Rate (Max): 2Mbps
Protocol: 802.11ac, Bluetooth v5.1
Type: TxRx Only
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 98-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8101VT1500F |
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Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Part Status: Obsolete
Supplier Device Package: 332-FCBGA (17x17)
Clock Rate: 300MHz
Voltage - Core: 1.60V
Voltage - I/O: 3.30V
On-Chip RAM: 512KB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 75°C (TJ)
Type: SC140 Core
Interface: Communications Processor Module (CPM)
Mounting Type: Surface Mount
Package / Case: 332-BFBGA, FCBGA
Packaging: Tray
Description: IC DSP 16BIT 250MHZ 332FCBGA
Part Status: Obsolete
Supplier Device Package: 332-FCBGA (17x17)
Clock Rate: 300MHz
Voltage - Core: 1.60V
Voltage - I/O: 3.30V
On-Chip RAM: 512KB
Non-Volatile Memory: External
Operating Temperature: -40°C ~ 75°C (TJ)
Type: SC140 Core
Interface: Communications Processor Module (CPM)
Mounting Type: Surface Mount
Package / Case: 332-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC802M001JDH16 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT FLASH
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Packaging: Tube
Description: IC MCU 32BIT FLASH
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Packaging: Tube
auf Bestellung 380 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 380+ | 2.32 EUR |




























