Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 470 nach 592
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MCIMX6QP5EVT2AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
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MCIMX6DP5EVT2AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
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| PCA9617ADP-ARD | NXP USA Inc. |
 Description: ARD FM+ I2C-BUS REPEATER EVAL BOPackaging: Box Function: Level Shifter Type: Interface Contents: Board(s) Utilized IC / Part: PCA9617A Platform: Arduino Part Status: Active |
Produkt ist nicht verfügbar |
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| SPX3078D | NXP USA Inc. | Description: SENSORS UNCOMP |
Produkt ist nicht verfügbar |
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| P2041NSE7PNC | NXP USA Inc. |
Description: QORIQ, 32-BIT POWER ARCH SOC, 4 Packaging: Bulk Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
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MCF54452VP266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
auf Bestellung 1450 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVO10AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MPC8349VVAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672TBGA |
Produkt ist nicht verfügbar |
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MK22DN512VLH5 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 18x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDMGD3160DCMHB | NXP USA Inc. |
Description: EVAL BOARD FOR GD3160, KL25Z Packaging: Bulk Function: Gate Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU |
Produkt ist nicht verfügbar |
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FRDMGD3160HB8EVM | NXP USA Inc. |
Description: HALF-BRIDGE EVAL BOARD GD3160 Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU Secondary Attributes: SPI Interface(s) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDMGD3160HBIEVM | NXP USA Inc. |
Description: GD3160 HALF-BRIDGE EVAL KIT Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU, 32-Bit Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMGD3160XM3EVM | NXP USA Inc. |
Description: EVAL BOARD FOR KL25Z, MC33GD3160 Packaging: Bulk Function: Gate Driver Type: Power Management Contents: Board(s), Cable(s), Accessories Utilized IC / Part: KL25Z, MC33GD3160 Supplied Contents: Board(s), Cable(s), Accessories Primary Attributes: 1-Channel (Single) Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM315EK | NXP USA Inc. |
Description: SNGL CH GATE DRIVER 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Current - Peak Output: 15A Current - Output High, Low: 15A, 15A Supplier Device Package: 32-SOIC Part Status: Active Number of Channels: 1 Voltage - Output Supply: 4.5V ~ 40V |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM335EK | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 15A 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: PWM, SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge Voltage - Supply: 4.5V ~ 40V Rds On (Typ): 500mOhm Applications: General Purpose Current - Output / Channel: 15A Technology: IGBT Voltage - Load: 12V ~ 25V Supplier Device Package: 32-SOIC Fault Protection: Over Temperature, Short Circuit Part Status: Active |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM535EK | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 15A 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: PWM, SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge Voltage - Supply: 4.75V ~ 40V Rds On (Typ): 500mOhm Applications: General Purpose Current - Output / Channel: 15A Technology: IGBT Voltage - Load: 12V ~ 25V Supplier Device Package: 32-SOIC Fault Protection: Over Temperature, Short Circuit |
Produkt ist nicht verfügbar |
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| MGD3160AM515EK | NXP USA Inc. | Description: EV INVERTER CONTROL; IGBT & SIC |
Produkt ist nicht verfügbar |
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MC33665ATS4AE | NXP USA Inc. |
Description: IC BMS TPL TXRX CAN GATEWAY Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Function: Power Management Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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MMG3001NT1 | NXP USA Inc. |
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4 Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 40MHz ~ 3.6GHz RF Type: General Purpose Voltage - Supply: 5.6V Gain: 20dB Current - Supply: 58mA Noise Figure: 4.1dB P1dB: 18.5dBm Test Frequency: 900MHz Supplier Device Package: SOT-89-4 |
Produkt ist nicht verfügbar |
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2PD602AS | NXP USA Inc. |
Description: 2PD602A - NPN GENERAL PURPOSE TR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BUK7613-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7613-60E - POWER |
Produkt ist nicht verfügbar |
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MC33FS6600M0ESR2 | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCU Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Safety Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
Produkt ist nicht verfügbar |
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MC35FS6501NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6501NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33592FTAR2 | NXP USA Inc. |
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP Packaging: Tape & Reel (TR) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33592FTAR2 | NXP USA Inc. |
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP Packaging: Cut Tape (CT) Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DSP56F801FA60E | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800 Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 11 DigiKey Programmable: Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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S908AB32AH3CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5746GK1MKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEP100W1MAGR | NXP USA Inc. | Description: IC MCU 16BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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FS32K146HAT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC32PF3000A4EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
Produkt ist nicht verfügbar |
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MRF6S18060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 26V TO270-4 Packaging: Bulk Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 1.99GHz Power - Output: 60W Gain: 15dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 26 V Current - Test: 600 mA |
auf Bestellung 642 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8UX6CVLDZAC | NXP USA Inc. | Description: I.MX8 QXP 21X21 |
Produkt ist nicht verfügbar |
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| MC33MR2001T2VK | NXP USA Inc. | Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA |
Produkt ist nicht verfügbar |
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MCF51MM128CLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80FQFP Packaging: Box Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 47 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33931EKR2 | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-SOIC-EP Motor Type - AC, DC: Brushed DC Part Status: Active Grade: Automotive |
auf Bestellung 987 Stücke: Lieferzeit 10-14 Tag (e) |
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| KIT33937AEKEVBE | NXP USA Inc. |
Description: KIT EVAL 3PHASE FET PRE-DRIVER Packaging: Box Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33937A Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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74LVT534D,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO |
Produkt ist nicht verfügbar |
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PEMI1QFN/WT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/23PF SMD Packaging: Cut Tape (CT) Package / Case: SC-101, SOT-883 Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 1 |
Produkt ist nicht verfügbar |
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PEMI1QFN/WT,315 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/23PF SMD Packaging: Bulk Package / Case: SC-101, SOT-883 Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 1 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDMGD31ECNEVM | NXP USA Inc. |
Description: GD3100 HALF-BRIDGE EVAL KIT Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3100, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU, 32-Bit Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1102SHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.8V, 3.3V Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 5793 Stücke: Lieferzeit 10-14 Tag (e) |
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NX3L1T384GM,115 | NXP USA Inc. |
Description: IC SW SPST-NCX1 750MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 6pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 40ns, 15ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SE98APW,118 | NXP USA Inc. |
Description: IC TEMP SENSOR DDR 8-TSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Function: Temp Monitoring System (Sensor) Accuracy: ±4°C(Max) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.7V ~ 3.6V Sensor Type: Internal Sensing Temperature: -40°C ~ 125°C Topology: ADC (Sigma Delta), Register Bank Output Alarm: Yes Output Fan: Yes Supplier Device Package: 8-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BFG410W,115 | NXP USA Inc. |
Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4 Packaging: Tape & Reel (TR) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 21dB Power - Max: 54mW Current - Collector (Ic) (Max): 12mA Voltage - Collector Emitter Breakdown (Max): 4.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V Frequency - Transition: 22GHz Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz Supplier Device Package: CMPAK-4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA6017AT/1Y | NXP USA Inc. |
Description: IC PFC LLC CONFIG CONTROLER SO16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 19V ~ 36V Frequency - Switching: 50kHz ~ 200kHz Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM) Supplier Device Package: 16-SO Part Status: Active Current - Startup: 890 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TEA6017AT/1Y | NXP USA Inc. |
Description: IC PFC LLC CONFIG CONTROLER SO16 Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 19V ~ 36V Frequency - Switching: 50kHz ~ 200kHz Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM) Supplier Device Package: 16-SO Part Status: Active Current - Startup: 890 µA |
auf Bestellung 3957 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA6017DK1005 | NXP USA Inc. |
Description: TEA6017AT DEV PROGRAM BOARD Packaging: Box Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA6017AT Supplied Contents: Board(s) Primary Attributes: ESD Protection Embedded: No Contents: Board(s) Secondary Attributes: I2C Interface(s) |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN25UN,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 6A 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6A (Ta) Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V Power Dissipation (Max): 530mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: SC-74 Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FRDM-KE17Z | NXP USA Inc. |
Description: FREEDOM KE12Z/KE13Z/KE17Z BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KE12Z, KE13Z, KE17Z Platform: Freedom |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5746BHK1AMMH6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 65 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SPC5746BSK1AVKU2 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5746BHK1AMKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SPC5746BBK1AMKU6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPC5746BK1AVKU2 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5746BBK1AMMH6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5746BTK1AVMH6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S08SH8MSC | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 8SOIC Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 5 DigiKey Programmable: Not Verified |
auf Bestellung 5390 Stücke: Lieferzeit 10-14 Tag (e) |
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| NHS3100UCODEDBUL | NXP USA Inc. |
Description: NHS3100 UCODE-I2C SOL EVAL BOARD Packaging: Bulk For Use With/Related Products: NHS3100 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCIMX6QP5EVT2AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6DP5EVT2AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9617ADP-ARD |
|
Hersteller: NXP USA Inc.
Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Packaging: Box
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9617A
Platform: Arduino
Part Status: Active
Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Packaging: Box
Function: Level Shifter
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9617A
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPX3078D |
Hersteller: NXP USA Inc.
Description: SENSORS UNCOMP
Description: SENSORS UNCOMP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2041NSE7PNC |
|
Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54452VP266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 60.1 EUR |
| 10+ | 48.86 EUR |
| 25+ | 46.05 EUR |
| 80+ | 43.38 EUR |
| 300+ | 41.23 EUR |
| MCIMX6X3EVO10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8349VVAGDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672TBGA
Description: IC MPU MPC83XX 400MHZ 672TBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MK22DN512VLH5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDMGD3160DCMHB |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDMGD3160HB8EVM |
|
Hersteller: NXP USA Inc.
Description: HALF-BRIDGE EVAL BOARD GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
Description: HALF-BRIDGE EVAL BOARD GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 824.14 EUR |
| FRDMGD3160HBIEVM |
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 670.35 EUR |
| FRDMGD3160XM3EVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 625.38 EUR |
| MGD3160AM315EK |
|
Hersteller: NXP USA Inc.
Description: SNGL CH GATE DRIVER 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 15A
Current - Output High, Low: 15A, 15A
Supplier Device Package: 32-SOIC
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 40V
Description: SNGL CH GATE DRIVER 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Current - Peak Output: 15A
Current - Output High, Low: 15A, 15A
Supplier Device Package: 32-SOIC
Part Status: Active
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 40V
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.44 EUR |
| 10+ | 14.86 EUR |
| MGD3160AM335EK |
|
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm
Applications: General Purpose
Current - Output / Channel: 15A
Technology: IGBT
Voltage - Load: 12V ~ 25V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Part Status: Active
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm
Applications: General Purpose
Current - Output / Channel: 15A
Technology: IGBT
Voltage - Load: 12V ~ 25V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.68 EUR |
| 10+ | 15.07 EUR |
| 42+ | 14.37 EUR |
| MGD3160AM535EK |
|
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.75V ~ 40V
Rds On (Typ): 500mOhm
Applications: General Purpose
Current - Output / Channel: 15A
Technology: IGBT
Voltage - Load: 12V ~ 25V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.75V ~ 40V
Rds On (Typ): 500mOhm
Applications: General Purpose
Current - Output / Channel: 15A
Technology: IGBT
Voltage - Load: 12V ~ 25V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MGD3160AM515EK |
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Description: EV INVERTER CONTROL; IGBT & SIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33665ATS4AE |
|
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.66 EUR |
| 10+ | 12.2 EUR |
| 25+ | 11.33 EUR |
| 80+ | 10.51 EUR |
| MMG3001NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: General Purpose
Voltage - Supply: 5.6V
Gain: 20dB
Current - Supply: 58mA
Noise Figure: 4.1dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: General Purpose
Voltage - Supply: 5.6V
Gain: 20dB
Current - Supply: 58mA
Noise Figure: 4.1dB
P1dB: 18.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2PD602AS |
|
Hersteller: NXP USA Inc.
Description: 2PD602A - NPN GENERAL PURPOSE TR
Packaging: Bulk
Part Status: Active
Description: 2PD602A - NPN GENERAL PURPOSE TR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK7613-60E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7613-60E - POWER
Description: NOW NEXPERIA BUK7613-60E - POWER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6600M0ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6501NAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6501NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33592FTAR2 |
|
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33592FTAR2 |
|
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Cut Tape (CT)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Cut Tape (CT)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DSP56F801FA60E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.2 EUR |
| 10+ | 23.34 EUR |
| 80+ | 19.71 EUR |
| 440+ | 19.59 EUR |
| S908AB32AH3CFUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746GK1MKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEP100W1MAGR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K146HAT0MLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF3000A4EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6S18060NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Bulk
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Bulk
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
auf Bestellung 642 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 123.31 EUR |
| MIMX8UX6CVLDZAC |
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Description: I.MX8 QXP 21X21
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33MR2001T2VK |
Hersteller: NXP USA Inc.
Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51MM128CLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33931EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
auf Bestellung 987 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.83 EUR |
| 10+ | 8.81 EUR |
| 25+ | 8.06 EUR |
| 100+ | 7.23 EUR |
| 250+ | 6.83 EUR |
| 500+ | 6.59 EUR |
| KIT33937AEKEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3PHASE FET PRE-DRIVER
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33937A
Supplied Contents: Board(s)
Part Status: Active
Description: KIT EVAL 3PHASE FET PRE-DRIVER
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33937A
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT534D,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Description: IC FF D-TYPE SNGL 8BIT 20SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI1QFN/WT,315 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI1QFN/WT,315 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4121+ | 0.12 EUR |
| FRDMGD31ECNEVM |
Hersteller: NXP USA Inc.
Description: GD3100 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3100, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Description: GD3100 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3100, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 677.05 EUR |
| TJA1102SHN/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5793 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.76 EUR |
| 10+ | 8.75 EUR |
| 25+ | 8 EUR |
| 100+ | 7.17 EUR |
| 250+ | 6.78 EUR |
| 500+ | 6.54 EUR |
| 1000+ | 6.34 EUR |
| NX3L1T384GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| SE98APW,118 |
|
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC TEMP SENSOR DDR 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFG410W,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 21dB
Power - Max: 54mW
Current - Collector (Ic) (Max): 12mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Frequency - Transition: 22GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 21dB
Power - Max: 54mW
Current - Collector (Ic) (Max): 12mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Frequency - Transition: 22GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA6017AT/1Y |
|
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19V ~ 36V
Frequency - Switching: 50kHz ~ 200kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 16-SO
Part Status: Active
Current - Startup: 890 µA
Description: IC PFC LLC CONFIG CONTROLER SO16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19V ~ 36V
Frequency - Switching: 50kHz ~ 200kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 16-SO
Part Status: Active
Current - Startup: 890 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA6017AT/1Y |
|
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19V ~ 36V
Frequency - Switching: 50kHz ~ 200kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 16-SO
Part Status: Active
Current - Startup: 890 µA
Description: IC PFC LLC CONFIG CONTROLER SO16
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19V ~ 36V
Frequency - Switching: 50kHz ~ 200kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 16-SO
Part Status: Active
Current - Startup: 890 µA
auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.58 EUR |
| 10+ | 4.2 EUR |
| 25+ | 3.85 EUR |
| 100+ | 3.47 EUR |
| 250+ | 3.29 EUR |
| 500+ | 3.18 EUR |
| 1000+ | 3.09 EUR |
| TEA6017DK1005 |
|
Hersteller: NXP USA Inc.
Description: TEA6017AT DEV PROGRAM BOARD
Packaging: Box
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA6017AT
Supplied Contents: Board(s)
Primary Attributes: ESD Protection
Embedded: No
Contents: Board(s)
Secondary Attributes: I2C Interface(s)
Description: TEA6017AT DEV PROGRAM BOARD
Packaging: Box
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA6017AT
Supplied Contents: Board(s)
Primary Attributes: ESD Protection
Embedded: No
Contents: Board(s)
Secondary Attributes: I2C Interface(s)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 89.27 EUR |
| PMN25UN,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Description: MOSFET N-CH 20V 6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDM-KE17Z |
|
Hersteller: NXP USA Inc.
Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Platform: Freedom
Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Platform: Freedom
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 75.72 EUR |
| SPC5746BHK1AMMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BSK1AVKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BHK1AMKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BBK1AMKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BK1AVKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BBK1AMMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5746BTK1AVMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08SH8MSC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 5
DigiKey Programmable: Not Verified
auf Bestellung 5390 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 125+ | 4.07 EUR |
| NHS3100UCODEDBUL |
Hersteller: NXP USA Inc.
Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH