Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35546) > Seite 470 nach 593
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PZM12NB2A,115 | NXP USA Inc. |
Description: DIODE ZENER 12V 220MW SMT3 Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 220 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 100 nA @ 9 V |
auf Bestellung 1317000 Stücke: Lieferzeit 10-14 Tag (e) |
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SA56004ED,112 | NXP USA Inc. |
 Description: SENSOR DIGITAL -40C-125C 8SOFeatures: Output Switch, Programmable Limit Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PSMN2R2-40PS | NXP USA Inc. |
Description: NOW NEXPERIA PSMN2R2-40BS - POWE |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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PSMN2R6-60PSQ127 | NXP USA Inc. |
Description: MOSFET N-CH 60V 150A TO220AB |
Produkt ist nicht verfügbar |
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| PSMN2R8-25MLC115 | NXP USA Inc. |
Description: NOW NEXPERIA PSMN2R8-25MLC 70A, |
Produkt ist nicht verfügbar |
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| PSMN2R2-40PS127 | NXP USA Inc. | Description: 100A, 40V, 0.0022OHM, N CHANNE |
Produkt ist nicht verfügbar |
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| PSMN3R5-80PS | NXP USA Inc. |
Description: NOW NEXPERIA PSMN3R5-80PS - POWE Packaging: Bulk |
Produkt ist nicht verfügbar |
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PSMN3R2-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 100A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V |
Produkt ist nicht verfügbar |
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PSMN3R2-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 100A LFPAK56 Packaging: Cut Tape (CT) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V |
Produkt ist nicht verfügbar |
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_SOT226%20Pkg.jpg "BUK7E1R6-30E,127") |
BUK7E1R6-30E,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 120A I2PAK |
auf Bestellung 295 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8347CZQAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8347CZQAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCIMX7S3DVK08SD | NXP USA Inc. |
Description: IC MPU I.MX7S 800MHZ 488TFBGA Packaging: Tray Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
Produkt ist nicht verfügbar |
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MMRF1312GSR5 | NXP USA Inc. |
Description: TRANS 960-1215MHZ 1000W PEAK 50V Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S GW Mounting Type: Surface Mount Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4S GULL Part Status: Active Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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PCA6416APW,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1971 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8536AVJAULA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC908JK1EMDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
Produkt ist nicht verfügbar |
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MC908JB8FBE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PEMI8QFN/HT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHMS ESD SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 20dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 8 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PR601HL/C1,557 | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader Operating Temperature: -25°C ~ 70°C Voltage - Supply: 3V ~ 5.5V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 100-LQFP (14x14) |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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| KIT33908MBEVBE | NXP USA Inc. |
Description: KIT EVAL MC33908 MOTHER BOARD PO Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: MC33908 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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| TEA19031AET/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Packaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 10MHz Internal Switch(s): Yes Output Isolation: Isolated Voltage - Supply (Vcc/Vdd): 0V ~ 21V Supplier Device Package: 10-SO Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Control Features: EN Part Status: Obsolete Power (Watts): 45 W |
Produkt ist nicht verfügbar |
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| TEA19031ADT/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Packaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 10MHz Internal Switch(s): Yes Output Isolation: Isolated Voltage - Supply (Vcc/Vdd): 0V ~ 21V Supplier Device Package: 10-SO Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Control Features: EN Part Status: Obsolete Power (Watts): 45 W |
Produkt ist nicht verfügbar |
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MPC5554AZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -55°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 256 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BUK7E2R3-40E,127-NXP | NXP USA Inc. |
Description: PFET, 120A I(D), 40V, 0.0023OHM, Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V Power Dissipation (Max): 293W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V |
Produkt ist nicht verfügbar |
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PCA9519PW118 | NXP USA Inc. |
Description: 4-CHANNEL LEVEL TRANSLATING I2C- Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Delay Time: 105ns Number of Channels: 4 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V Applications: I²C Current - Supply: 11.6mA Data Rate (Max): 400kHz Supplier Device Package: 20-TSSOP Capacitance - Input: 2 pF |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCA9518APW | NXP USA Inc. |
Description: INTERFACE CIRCUIT, CMOS, PDSO20 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| PCA9516APW | NXP USA Inc. |
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PCA9516APW,112 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Channels: 5 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Applications: I²C Current - Supply: 5mA Data Rate (Max): 400kHz Supplier Device Package: 16-TSSOP Part Status: Obsolete Capacitance - Input: 6 pF |
Produkt ist nicht verfügbar |
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74AHCT241BQ,115 | NXP USA Inc. |
Description: IC BUF NON-INVERT 5.5V 20DHVQFN Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-DHVQFN (4.5x2.5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PSMN070-200B | NXP USA Inc. |
Description: 35A, 200V, 0.07OHM, N-CHANNEL |
Produkt ist nicht verfügbar |
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MC9S12GC32CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33FS6512NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33FS6512NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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| MPC8572CLVJAULE | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 1023BGA |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8360VVALFHA | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCH SOC |
Produkt ist nicht verfügbar |
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MK22DN512VDC5 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 56 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK22FN256VMP12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5646CF0VMJ1R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 256MAPBGA |
Produkt ist nicht verfügbar |
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NCX2200GM,132 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
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NCX2200GM,132 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
auf Bestellung 245973 Stücke: Lieferzeit 10-14 Tag (e) |
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FXPS7250DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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FXPS7165DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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FXPS7400DI4T1 | NXP USA Inc. |
Description: 20-400 KPA BAP DIG I2C |
Produkt ist nicht verfügbar |
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FXPS7400DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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FXPS7165DI4T1 | NXP USA Inc. |
Description: 60-165 KPA BAP DIG I2C |
Produkt ist nicht verfügbar |
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FXPS7115DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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MC9328MXLCVM15R2 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 256MAPBGA |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9328MXLCVM15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 256MAPBGA |
Produkt ist nicht verfügbar |
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MC68302RC20C | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 132PGA Packaging: Tray Package / Case: 132-BPGA Exposed Pad Mounting Type: Through Hole Speed: 20MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: M68000 Voltage - I/O: 5.0V Supplier Device Package: 132-PGA (34.5x34.5) Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI |
Produkt ist nicht verfügbar |
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| MC68302EH20C | NXP USA Inc. |
Description: M68000 MICROPROCESSOR IC SERIES |
auf Bestellung 1268 Stücke: Lieferzeit 10-14 Tag (e) |
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PHPT60410PY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR, PNP Packaging: Bulk |
Produkt ist nicht verfügbar |
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PHPT60410NY115 | NXP USA Inc. |
Description: POWER BIPOLAR TRANSISTOR NPN Packaging: Bulk |
Produkt ist nicht verfügbar |
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SPC5746CFK1ACMH6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
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SPC5744CBK1ACMH6 | NXP USA Inc. | Description: IC MCU 32B 1.5MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BBY31,215 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 30V SOT-23 Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Voltage - Peak Reverse (Max): 30 V Capacitance Ratio: 8.3 |
Produkt ist nicht verfügbar |
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TJA1042AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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BSH207,135 | NXP USA Inc. |
Description: MOSFET P-CH 12V 1.52A 6TSOP Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta) Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V Power Dissipation (Max): 417mW (Ta) Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ) Supplier Device Package: 6-TSOP Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V |
auf Bestellung 50873 Stücke: Lieferzeit 10-14 Tag (e) |
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| NX20P5090UK041 | NXP USA Inc. |
Description: NX20P5090UK - BUFFER/INVERTER BA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCF5272VM66 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 16KB (4K x 32) RAM Size: 1K x 32 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROM Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PZM12NB2A,115 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 12V 220MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 220 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
Description: DIODE ZENER 12V 220MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 220 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
auf Bestellung 1317000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8876+ | 0.05 EUR |
| SA56004ED,112 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN2R2-40PS |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PSMN2R2-40BS - POWE
Description: NOW NEXPERIA PSMN2R2-40BS - POWE
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 202+ | 2.66 EUR |
| PSMN2R6-60PSQ127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 150A TO220AB
Description: MOSFET N-CH 60V 150A TO220AB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN2R8-25MLC115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PSMN2R8-25MLC 70A,
Description: NOW NEXPERIA PSMN2R8-25MLC 70A,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN2R2-40PS127 |
Hersteller: NXP USA Inc.
Description: 100A, 40V, 0.0022OHM, N CHANNE
Description: 100A, 40V, 0.0022OHM, N CHANNE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN3R2-25YLC,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN3R2-25YLC,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK7E1R6-30E,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A I2PAK
Description: MOSFET N-CH 30V 120A I2PAK
auf Bestellung 295 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 295+ | 2.18 EUR |
| MPC8347CZQAGDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 109.75 EUR |
| MPC8347CZQAGDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX7S3DVK08SD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMRF1312GSR5 |
|
Hersteller: NXP USA Inc.
Description: TRANS 960-1215MHZ 1000W PEAK 50V
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S GW
Mounting Type: Surface Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S GULL
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: TRANS 960-1215MHZ 1000W PEAK 50V
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S GW
Mounting Type: Surface Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S GULL
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA6416APW,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1971 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7+ | 2.53 EUR |
| 10+ | 1.85 EUR |
| 25+ | 1.68 EUR |
| 100+ | 1.49 EUR |
| 250+ | 1.40 EUR |
| 500+ | 1.35 EUR |
| 1000+ | 1.31 EUR |
| MPC8536AVJAULA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 440.48 EUR |
| MC908JK1EMDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908JB8FBE557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI8QFN/HT,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1567+ | 0.31 EUR |
| PR601HL/C1,557 |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 35+ | 18.93 EUR |
| KIT33908MBEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19031AET/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TEA19031ADT/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC5554AZP132 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BUK7E2R3-40E,127-NXP |
Hersteller: NXP USA Inc.
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Produkt ist nicht verfügbar
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| PCA9519PW118 |
|
Hersteller: NXP USA Inc.
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 119+ | 4.08 EUR |
| PCA9516APW |
|
Hersteller: NXP USA Inc.
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9516APW,112 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74AHCT241BQ,115 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PSMN070-200B |
|
Hersteller: NXP USA Inc.
Description: 35A, 200V, 0.07OHM, N-CHANNEL
Description: 35A, 200V, 0.07OHM, N-CHANNEL
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S12GC32CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33FS6512NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33FS6512NAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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| MPC8572CLVJAULE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 849.66 EUR |
| MPC8360VVALFHA |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MK22DN512VDC5 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MK22FN256VMP12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5646CF0VMJ1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NCX2200GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NCX2200GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 245973 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2070+ | 0.23 EUR |
| FXPS7250DI4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FXPS7165DI4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FXPS7400DI4T1 |
|
Hersteller: NXP USA Inc.
Description: 20-400 KPA BAP DIG I2C
Description: 20-400 KPA BAP DIG I2C
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FXPS7400DI4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| FXPS7165DI4T1 |
|
Hersteller: NXP USA Inc.
Description: 60-165 KPA BAP DIG I2C
Description: 60-165 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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| FXPS7115DI4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9328MXLCVM15R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256MAPBGA
Description: IC MPU I.MXL 150MHZ 256MAPBGA
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 10+ | 58.89 EUR |
| MC9328MXLCVM15 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256MAPBGA
Description: IC MPU I.MXL 150MHZ 256MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC68302RC20C |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
Packaging: Tray
Package / Case: 132-BPGA Exposed Pad
Mounting Type: Through Hole
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PGA (34.5x34.5)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Description: IC MPU M683XX 20MHZ 132PGA
Packaging: Tray
Package / Case: 132-BPGA Exposed Pad
Mounting Type: Through Hole
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PGA (34.5x34.5)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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| MC68302EH20C |
|
Hersteller: NXP USA Inc.
Description: M68000 MICROPROCESSOR IC SERIES
Description: M68000 MICROPROCESSOR IC SERIES
auf Bestellung 1268 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 166.63 EUR |
| SPC5746CFK1ACMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5744CBK1ACMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
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| BBY31,215 |
|
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
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| TJA1042AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2500+ | 1.35 EUR |
| BSH207,135 |
|
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
auf Bestellung 50873 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1025+ | 0.49 EUR |
| NX20P5090UK041 |
|
Hersteller: NXP USA Inc.
Description: NX20P5090UK - BUFFER/INVERTER BA
Description: NX20P5090UK - BUFFER/INVERTER BA
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| MCF5272VM66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
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