Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34774) > Seite 465 nach 580
| Foto | Bezeichnung | Hersteller | Beschreibung |
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NCF2951BTT/T0E080J | NXP USA Inc. | Description: IC ACTIC 4G 3D 38TSSOP |
Produkt ist nicht verfügbar |
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FXPS7115DI4T1 | NXP USA Inc. |
 Description: 40-115 KPA BAP DIG I2C |
Produkt ist nicht verfügbar |
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| FXTH870902DT1528 | NXP USA Inc. |
Description: TPMS 7X7 900KPA Z AXIS Packaging: Bulk |
Produkt ist nicht verfügbar |
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MWCT1001AVLHR528 | NXP USA Inc. |
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR |
Produkt ist nicht verfügbar |
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MWCT1001AVLH557 | NXP USA Inc. |
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR |
Produkt ist nicht verfügbar |
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MPL3150A2T1 | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 50/110KPA TSON |
Produkt ist nicht verfügbar |
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MPL3150A2 | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 50/110KPA TSON |
Produkt ist nicht verfügbar |
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| MC33FS8510B6ESR2 | NXP USA Inc. |
Description: FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MC33FS8510B6ES | NXP USA Inc. |
Description: FS8500 Packaging: Tray |
Produkt ist nicht verfügbar |
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| LPC11E13FBD48/301 | NXP USA Inc. | Description: IC MCU ARM CORTEX-M0 32BIT FLASH |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XET512BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XET512BVALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74ABT162245ADGG512 | NXP USA Inc. |
Description: BUS TRANSCEIVER, ABT SERIES |
auf Bestellung 975 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604CF2VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL28Z512VLL7R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 27x16b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 90 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MFS8603BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S912ZVC64F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVC64F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN16F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
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S9S12GN32F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
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| S9S12G48BCLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
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S9S12GN48F1CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
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MC9S08DZ16ACLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
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BZB784-C2V7,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C2V7 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-323 Part Status: Active Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V |
auf Bestellung 168000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C8V2,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C8V2 - ZENER Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V |
auf Bestellung 129290 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZB84-C75215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C75 - ZENER D |
Produkt ist nicht verfügbar |
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BZB84-C11215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C10 - ZENER D |
Produkt ist nicht verfügbar |
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BZX84-C2V7/LF1R | NXP USA Inc. |
Description: DIODE ZENER 2.7V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BZX84-C2V7/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 2.7V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.7 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 20 µA @ 1 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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BUK7640-100A118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7640-100A - POWE |
auf Bestellung 4269 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA |
Produkt ist nicht verfügbar |
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MCIMX250CJM4A | NXP USA Inc. |
Description: IC MPU IMX25 IND 400MAPBGA |
Produkt ist nicht verfügbar |
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| MVF50NS151CMK40 | NXP USA Inc. |
Description: VYBRID F 32-BIT MPU, ARM CORTEX- Packaging: Bulk Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Part Status: Active |
Produkt ist nicht verfügbar |
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MPC8260AZUPJDB-NXP | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSOR, |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8599TH/N2,512 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 85W 36HSOP Packaging: Tube Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
auf Bestellung 700 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8531HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
Produkt ist nicht verfügbar |
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TDF8534HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
Produkt ist nicht verfügbar |
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TDF8531HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tape & Reel (TR) Package / Case: 100-FQFP Exposed Pad Output Type: 3-Channel Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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TDF8534HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
Produkt ist nicht verfügbar |
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TDF8532HH/N3Y | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP |
Produkt ist nicht verfügbar |
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TDF8532HH/N3K | NXP USA Inc. |
Description: IC AMPLIFIER CLASS D 100HLQFP Packaging: Tray Package / Case: 100-FQFP Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 5.5V ~ 25V Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm Supplier Device Package: 100-HLQFP (14x14) |
Produkt ist nicht verfügbar |
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P1021NXN2DFB | NXP USA Inc. |
Description: IC MPU Q OR IQ 800MHZ 689TEBGA |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6L2EVN10ACR | NXP USA Inc. |
Description: I.MX 6SL ROM PERF ENHAN |
Produkt ist nicht verfügbar |
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LD6806F/18P,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 6XSON |
auf Bestellung 6669 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDMSTBI-B3115 | NXP USA Inc. |
Description: SENSOR TOOLBOX DEVELOPMENT PLATF Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Sensing Range: 20 ~ 110 kPa Part Status: Active |
Produkt ist nicht verfügbar |
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| BRKTSTBI-B3115 | NXP USA Inc. |
Description: SENSOR BREAKOUT BOARD FOR FXPQ31 Packaging: Bulk Interface: I2C, Serial Voltage - Supply: 2.5V Sensor Type: Pressure Utilized IC / Part: FXPQ3115BV Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FXPQ3115BV | NXP USA Inc. |
Description: PRESS SENSOR 2.5V 20/110KPA TSON |
Produkt ist nicht verfügbar |
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MPC8544VJALFA | NXP USA Inc. |
Description: IC MPU MPC85XX 667MHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF4210A0ESR2 | NXP USA Inc. |
Description: PF4210 |
Produkt ist nicht verfügbar |
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| TEA1936XDB1463UL | NXP USA Inc. |
Description: TEA1936X DEMOBOARD 1463 |
Produkt ist nicht verfügbar |
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| P302D217UD/T0K092V | NXP USA Inc. |
Description: P302D217UD/T0K092V Packaging: Bulk Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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| BLF8G10LS-160V,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V SOT502B Packaging: Tube Package / Case: SOT-502B Mounting Type: Flange Mount Frequency: 920MHz ~ 960MHz Power - Output: 35W Gain: 19.7dB Technology: LDMOS Supplier Device Package: SOT502B Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.1 A |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6815TD/33H,125 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 150MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3.3V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVMBA6F0WLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 5x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 15 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BLF10M6LS200U112 | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Bulk |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK9Y113-100E115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9Y113-100E 12A, |
Produkt ist nicht verfügbar |
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BUK7Y113-100E115 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7Y113-100E - POW |
Produkt ist nicht verfügbar |
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S9KEAZ128AVLHR | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 2910 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI8QFN/CT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/23PF SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 16dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI4QFN/LE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/8.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 11dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
auf Bestellung 120000 Stücke: Lieferzeit 10-14 Tag (e) |
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| NCF2951BTT/T0E080J |
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
| FXPS7115DI4T1 |
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Hersteller: NXP USA Inc.
Description: 40-115 KPA BAP DIG I2C
Description: 40-115 KPA BAP DIG I2C
Produkt ist nicht verfügbar
| FXTH870902DT1528 |
Produkt ist nicht verfügbar
| MWCT1001AVLHR528 |
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Hersteller: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Produkt ist nicht verfügbar
| MWCT1001AVLH557 |
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Hersteller: NXP USA Inc.
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Description: 5W, MULTI-COIL AUTO, 5V, STANDAR
Produkt ist nicht verfügbar
| MPL3150A2T1 |
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Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Produkt ist nicht verfügbar
| MPL3150A2 |
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Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Description: PRESS SENSOR 2.5V 50/110KPA TSON
Produkt ist nicht verfügbar
| MC33FS8510B6ESR2 |
Produkt ist nicht verfügbar
| MC33FS8510B6ES |
Produkt ist nicht verfügbar
| LPC11E13FBD48/301 |
Hersteller: NXP USA Inc.
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
Description: IC MCU ARM CORTEX-M0 32BIT FLASH
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 49+ | 9.52 EUR |
| S912XET512BVAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XET512BVALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74ABT162245ADGG512 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, ABT SERIES
Description: BUS TRANSCEIVER, ABT SERIES
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 704+ | 0.74 EUR |
| SPC5604CF2VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL28Z512VLL7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x16b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 90
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MFS8603BMDA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| S912ZVC64F0MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVC64F0MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12GN16F1CLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
| S9S12GN32F1CLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
| S9S12G48BCLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
| S9S12GN48F1CLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
| MC9S08DZ16ACLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
| BZB784-C2V7,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Description: NOW NEXPERIA BZB784-C2V7 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-323
Part Status: Active
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
auf Bestellung 168000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10452+ | 0.048 EUR |
| BZB784-C8V2,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Description: NOW NEXPERIA BZB784-C8V2 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 129290 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10452+ | 0.053 EUR |
| BZB84-C75215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C75 - ZENER D
Description: NOW NEXPERIA BZB84-C75 - ZENER D
Produkt ist nicht verfügbar
| BZB84-C11215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C10 - ZENER D
Description: NOW NEXPERIA BZB84-C10 - ZENER D
Produkt ist nicht verfügbar
| BZX84-C2V7/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| BZX84-C2V7/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 2.7V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| BUK7640-100A118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7640-100A - POWE
Description: NOW NEXPERIA BUK7640-100A - POWE
auf Bestellung 4269 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 478+ | 1.09 EUR |
| MCIMX250DJM4A |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
Description: IC MPU I.MX25 400MAPBGA
Produkt ist nicht verfügbar
| MCIMX250CJM4A |
|
Hersteller: NXP USA Inc.
Description: IC MPU IMX25 IND 400MAPBGA
Description: IC MPU IMX25 IND 400MAPBGA
Produkt ist nicht verfügbar
| MVF50NS151CMK40 |
|
Hersteller: NXP USA Inc.
Description: VYBRID F 32-BIT MPU, ARM CORTEX-
Packaging: Bulk
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Part Status: Active
Description: VYBRID F 32-BIT MPU, ARM CORTEX-
Packaging: Bulk
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Part Status: Active
Produkt ist nicht verfügbar
| MPC8260AZUPJDB-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR,
Description: POWERQUICC RISC MICROPROCESSOR,
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 465.72 EUR |
| TDF8599TH/N2,512 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 85W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 85W 36HSOP
Packaging: Tube
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 85W x 1 @ 1Ohm; 70W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 22.9 EUR |
| TDF8531HH/N3K |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Description: IC AMPLIFIER CLASS D 100HLQFP
Produkt ist nicht verfügbar
| TDF8534HH/N3K |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Description: IC AMPLIFIER CLASS D 100HLQFP
Produkt ist nicht verfügbar
| TDF8531HH/N3Y |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-FQFP Exposed Pad
Output Type: 3-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 3 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Produkt ist nicht verfügbar
| TDF8534HH/N3Y |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Description: IC AMPLIFIER CLASS D 100HLQFP
Produkt ist nicht verfügbar
| TDF8532HH/N3Y |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Description: IC AMPLIFIER CLASS D 100HLQFP
Produkt ist nicht verfügbar
| TDF8532HH/N3K |
|
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Tray
Package / Case: 100-FQFP Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 4 @ 2Ohm
Supplier Device Package: 100-HLQFP (14x14)
Produkt ist nicht verfügbar
| P1021NXN2DFB |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 148.36 EUR |
| MCIMX6L2EVN10ACR |
|
Hersteller: NXP USA Inc.
Description: I.MX 6SL ROM PERF ENHAN
Description: I.MX 6SL ROM PERF ENHAN
Produkt ist nicht verfügbar
| LD6806F/18P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Description: IC REG LINEAR 1.8V 200MA 6XSON
auf Bestellung 6669 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2404+ | 0.21 EUR |
| FRDMSTBI-B3115 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
Description: SENSOR TOOLBOX DEVELOPMENT PLATF
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Sensing Range: 20 ~ 110 kPa
Part Status: Active
Produkt ist nicht verfügbar
| BRKTSTBI-B3115 |
|
Hersteller: NXP USA Inc.
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
Description: SENSOR BREAKOUT BOARD FOR FXPQ31
Packaging: Bulk
Interface: I2C, Serial
Voltage - Supply: 2.5V
Sensor Type: Pressure
Utilized IC / Part: FXPQ3115BV
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| FXPQ3115BV |
|
Hersteller: NXP USA Inc.
Description: PRESS SENSOR 2.5V 20/110KPA TSON
Description: PRESS SENSOR 2.5V 20/110KPA TSON
Produkt ist nicht verfügbar
| MPC8544VJALFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 250.47 EUR |
| 10+ | 207.49 EUR |
| TEA1936XDB1463UL |
|
Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1463
Description: TEA1936X DEMOBOARD 1463
Produkt ist nicht verfügbar
| P302D217UD/T0K092V |
Produkt ist nicht verfügbar
| BLF8G10LS-160V,112 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Mounting Type: Flange Mount
Frequency: 920MHz ~ 960MHz
Power - Output: 35W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.1 A
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Mounting Type: Flange Mount
Frequency: 920MHz ~ 960MHz
Power - Output: 35W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.1 A
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 109.4 EUR |
| LD6815TD/33H,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LINEAR 3.3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| S912ZVMBA6F0WLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 5x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BLF10M6LS200U112 |
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 158.84 EUR |
| BUK9Y113-100E115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9Y113-100E 12A,
Description: NOW NEXPERIA BUK9Y113-100E 12A,
Produkt ist nicht verfügbar
| BUK7Y113-100E115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7Y113-100E - POW
Description: NOW NEXPERIA BUK7Y113-100E - POW
Produkt ist nicht verfügbar
| S9KEAZ128AVLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 2910 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.84 EUR |
| 10+ | 9.26 EUR |
| 100+ | 7.58 EUR |
| 500+ | 7.42 EUR |
| PEMI8QFN/CT,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 20 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1567+ | 0.31 EUR |
| PEMI4QFN/LE,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 120000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |