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MCIMX6QP4AVT8AA NXP USA Inc. PHGL-S-A0006655098-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
4+129.52 EUR
Mindestbestellmenge: 4
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MCIMX6DP6AVT1ABR MCIMX6DP6AVT1ABR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
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500+120.75 EUR
Mindestbestellmenge: 500
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MCIMX6DP6AVT1ABR MCIMX6DP6AVT1ABR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 500 Stücke:
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1+167.41 EUR
10+140.49 EUR
25+133.77 EUR
100+126.39 EUR
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S9S08SC4E0CTG S9S08SC4E0CTG NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 96 Stücke:
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4+4.51 EUR
10+3.51 EUR
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Mindestbestellmenge: 4
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MK51DN512CLQ10 MK51DN512CLQ10 NXP USA Inc. K51P144M100SF2V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24300NR3 MRF24300NR3 NXP USA Inc. Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRF24300NR3 MRF24300NR3 NXP USA Inc. Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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BLL6H1214L-250,112 NXP USA Inc. Description: TRANS L-BAND RADAR LDMOS SOT502A
Packaging: Tube
auf Bestellung 21 Stücke:
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1+605.09 EUR
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SPC5604BK0CLQ6R SPC5604BK0CLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5604BK0CLQ6 SPC5604BK0CLQ6 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64CPVE,557 NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Produkt ist nicht verfügbar
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MC9S12D64VFUE MC9S12D64VFUE NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64MPVE MC9S12D64MPVE NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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RD-UAMP-SENSOR RD-UAMP-SENSOR NXP USA Inc. UM11470.pdf Description: SUB-A CURRENT SENSOR BOARD
Packaging: Bulk
Interface: I2C
Contents: Board(s)
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 60nA ~ 5mA
Part Status: Active
auf Bestellung 2 Stücke:
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1+275.18 EUR
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MRF6V12500HR5 MRF6V12500HR5 NXP USA Inc. MRF6V12500H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
1+1054.42 EUR
10+984.3 EUR
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BZX84-C3V9/LF1R BZX84-C3V9/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.9V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Produkt ist nicht verfügbar
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PCA9539BSHP PCA9539BSHP NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TVR80A MPC852TVR80A NXP USA Inc. MPC852T.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC860SRZQ50D4 MPC860SRZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8542TS/N1,112 TDA8542TS/N1,112 NXP USA Inc. TDA8542TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tube
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8547TS/N1/02,11 NXP USA Inc. TDA8547TS.pdf Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tube
Features: Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC670D,652 74HC670D,652 NXP USA Inc. 74HC(T)670.pdf Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HC670D,653 74HC670D,653 NXP USA Inc. 74HC(T)670.pdf Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL,132 IP3253CZ8-4-TTL,132 NXP USA Inc. NEXP-S-A0002882664-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA CONSUMER CIRCUIT
Packaging: Bulk
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL132 IP3253CZ8-4-TTL132 NXP USA Inc. Description: Nexperia IP3253CZ8-4-TT - 4-chan
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12B64CFUE-NXP MC9S12B64CFUE-NXP NXP USA Inc. FSCL-S-A0000335998-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC908AP32ACFBE MC908AP32ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAER MC908AP32CFAER NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33903BS5EKR2 MCZ33903BS5EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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PCF8570T/F5,518 PCF8570T/F5,518 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF8570P/F5,112 PCF8570P/F5,112 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
Produkt ist nicht verfügbar
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PCF8570T/F5,512 PCF8570T/F5,512 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1832TS/1X TEA1832TS/1X NXP USA Inc. TEA1832TS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
auf Bestellung 2296 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.81 EUR
31+0.57 EUR
35+0.51 EUR
100+0.44 EUR
250+0.41 EUR
500+0.39 EUR
1000+0.38 EUR
Mindestbestellmenge: 22
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MCZ33904C5EKR2 MCZ33904C5EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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PEMI6QFN/BYP,132 PEMI6QFN/BYP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
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SPC5606SF2VLQ6 SPC5606SF2VLQ6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4851PW112 NXP USA Inc. 74HC_HCT4851.pdf Description: NOW NEXPERIA 74HCT4851PW - SINGL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCF51JM32VLD MCF51JM32VLD NXP USA Inc. FSCLS07441-1.pdf?t.download=true&u=5oefqw Description: MCF51JM 32-BIT MCU, COLDFIRE V1
Produkt ist nicht verfügbar
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MCF51JM128EVLD MCF51JM128EVLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
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CGD985HCI/01112 NXP USA Inc. PHGLS22646-1.pdf?t.download=true&u=5oefqw Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
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PDZ6.8B/ZLX NXP USA Inc. Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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LD6805K/14P,115 LD6805K/14P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.4V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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BZV49-C11115 NXP USA Inc. Description: DIODE ZENER 10V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
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LFSTBEB7361 LFSTBEB7361 NXP USA Inc. LFSBEB7361ACCQSG.pdf Description: EVAL BOARD FOR MMA7361L
Produkt ist nicht verfügbar
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NX3L1T3157GM NXP USA Inc. PHGLS20414-1.pdf?t.download=true&u=5oefqw Description: IC SWITCH SPDT 6XSON
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3L1T3157GM,115 NX3L1T3157GM,115 NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L1T3157GMZ NX3L1T3157GMZ NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.21 EUR
10000+0.2 EUR
Mindestbestellmenge: 5000
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MC9328MX1DVM20 MC9328MX1DVM20 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 200MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Obsolete
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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PCA6416AHF,128 PCA6416AHF,128 NXP USA Inc. PCA6416A.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 8992 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.41 EUR
11+1.76 EUR
25+1.6 EUR
100+1.42 EUR
250+1.33 EUR
500+1.28 EUR
1000+1.24 EUR
2500+1.2 EUR
Mindestbestellmenge: 8
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PSMN4R6-100XS,127 PSMN4R6-100XS,127 NXP USA Inc. PSMN4R6-100XS.pdf Description: MOSFET N-CH 100V 70.4A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70.4A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 15A, 10V
Power Dissipation (Max): 63.8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220F
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 153 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9900 pF @ 50 V
Produkt ist nicht verfügbar
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S912ZVMC64F1MKH S912ZVMC64F1MKH NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFX1K80H-27MHZ MRFX1K80H-27MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 27MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC17XS6400CEKR2 MC17XS6400CEKR2 NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC17XS6400CEK MC17XS6400CEK NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Produkt ist nicht verfügbar
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S9S12XS128J1MALR S9S12XS128J1MALR NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BF1206,115 BF1206,115 NXP USA Inc. BF1206_Rev_Oct2010.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
Produkt ist nicht verfügbar
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SC16C754BIBM,151 SC16C754BIBM,151 NXP USA Inc. SC16C754B.pdf Description: IC UART QUAD W/FIFO 64-LQFP
Packaging: Tray
Package / Case: 64-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 64-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G86GD,125 74AUP2G86GD,125 NXP USA Inc. 74AUP2G86.pdf Description: IC GATE XOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
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2049+0.25 EUR
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PMCPB5530X PMCPB5530X NXP USA Inc. PHGLS24967-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PMCPB5530X - SMALL
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC8306CVMACDCA557 NXP USA Inc. MPC8306EC.pdf Description: POWERQUICC POWER ARCH SOC, 200MH
auf Bestellung 84 Stücke:
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MCIMX6QP4AVT8AA PHGL-S-A0006655098-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 60 Stücke:
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Anzahl Preis
4+129.52 EUR
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MCIMX6DP6AVT1ABR IMX6DQPAEC.pdf
MCIMX6DP6AVT1ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+120.75 EUR
Mindestbestellmenge: 500
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MCIMX6DP6AVT1ABR IMX6DQPAEC.pdf
MCIMX6DP6AVT1ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 500 Stücke:
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Anzahl Preis
1+167.41 EUR
10+140.49 EUR
25+133.77 EUR
100+126.39 EUR
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S9S08SC4E0CTG
S9S08SC4E0CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 96 Stücke:
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Anzahl Preis
4+4.51 EUR
10+3.51 EUR
96+2.88 EUR
Mindestbestellmenge: 4
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MK51DN512CLQ10 K51P144M100SF2V2.pdf
MK51DN512CLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24300NR3
MRF24300NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRF24300NR3
MRF24300NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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BLL6H1214L-250,112
Hersteller: NXP USA Inc.
Description: TRANS L-BAND RADAR LDMOS SOT502A
Packaging: Tube
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+605.09 EUR
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SPC5604BK0CLQ6R
SPC5604BK0CLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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SPC5604BK0CLQ6
SPC5604BK0CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64CPVE,557
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Produkt ist nicht verfügbar
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MC9S12D64VFUE MC9S12DJ64%20Guide.pdf
MC9S12D64VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12D64MPVE MC9S12DJ64%20Guide.pdf
MC9S12D64MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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RD-UAMP-SENSOR UM11470.pdf
RD-UAMP-SENSOR
Hersteller: NXP USA Inc.
Description: SUB-A CURRENT SENSOR BOARD
Packaging: Bulk
Interface: I2C
Contents: Board(s)
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 60nA ~ 5mA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+275.18 EUR
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MRF6V12500HR5 MRF6V12500H.pdf
MRF6V12500HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1054.42 EUR
10+984.3 EUR
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BZX84-C3V9/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V9/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.9V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Produkt ist nicht verfügbar
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PCA9539BSHP PCA9539_PCA9539R.pdf
PCA9539BSHP
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC852TVR80A MPC852T.pdf
MPC852TVR80A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC860SRZQ50D4 MPC860EC.pdf
MPC860SRZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8542TS/N1,112 TDA8542TS.pdf
TDA8542TS/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tube
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8547TS/N1/02,11 TDA8547TS.pdf
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Packaging: Tube
Features: Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC670D,652 74HC(T)670.pdf
74HC670D,652
Hersteller: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HC670D,653 74HC(T)670.pdf
74HC670D,653
Hersteller: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL,132 NEXP-S-A0002882664-1.pdf?t.download=true&u=5oefqw
IP3253CZ8-4-TTL,132
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA CONSUMER CIRCUIT
Packaging: Bulk
Produkt ist nicht verfügbar
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IP3253CZ8-4-TTL132
IP3253CZ8-4-TTL132
Hersteller: NXP USA Inc.
Description: Nexperia IP3253CZ8-4-TT - 4-chan
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12B64CFUE-NXP FSCL-S-A0000335998-1.pdf?t.download=true&u=5oefqw
MC9S12B64CFUE-NXP
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC908AP32ACFBE MC68HC908AP64A.pdf
MC908AP32ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AP32CFAER MC68HC908AP64.pdf
MC908AP32CFAER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33903BS5EKR2 MC33903,4,5.pdf
MCZ33903BS5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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PCF8570T/F5,518 PCF8570.pdf
PCF8570T/F5,518
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF8570P/F5,112 PCF8570.pdf
PCF8570P/F5,112
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
Produkt ist nicht verfügbar
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PCF8570T/F5,512 PCF8570.pdf
PCF8570T/F5,512
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1832TS/1X TEA1832TS.pdf
TEA1832TS/1X
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
auf Bestellung 2296 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
22+0.81 EUR
31+0.57 EUR
35+0.51 EUR
100+0.44 EUR
250+0.41 EUR
500+0.39 EUR
1000+0.38 EUR
Mindestbestellmenge: 22
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MCZ33904C5EKR2 MC33903,4,5.pdf
MCZ33904C5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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PEMI6QFN/BYP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/BYP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.27 EUR
Mindestbestellmenge: 1902
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SPC5606SF2VLQ6 MPC5606S.pdf
SPC5606SF2VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT4851PW112 74HC_HCT4851.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4851PW - SINGL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCF51JM32VLD FSCLS07441-1.pdf?t.download=true&u=5oefqw
MCF51JM32VLD
Hersteller: NXP USA Inc.
Description: MCF51JM 32-BIT MCU, COLDFIRE V1
Produkt ist nicht verfügbar
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MCF51JM128EVLD MCF51JM128.pdf
MCF51JM128EVLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.24 EUR
10+16.01 EUR
25+14.96 EUR
160+14.54 EUR
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CGD985HCI/01112 PHGLS22646-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+62.92 EUR
Mindestbestellmenge: 8
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PDZ6.8B/ZLX
Hersteller: NXP USA Inc.
Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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LD6805K/14P,115 LD6805.pdf
LD6805K/14P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.4V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Produkt ist nicht verfügbar
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BZV49-C11115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 10V 1W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Produkt ist nicht verfügbar
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LFSTBEB7361 LFSBEB7361ACCQSG.pdf
LFSTBEB7361
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MMA7361L
Produkt ist nicht verfügbar
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NX3L1T3157GM PHGLS20414-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT 6XSON
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3L1T3157GM,115 NX3L1T3157.pdf
NX3L1T3157GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L1T3157GMZ NX3L1T3157.pdf
NX3L1T3157GMZ
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+0.21 EUR
10000+0.2 EUR
Mindestbestellmenge: 5000
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MC9328MX1DVM20 MC9328MX1.pdf
MC9328MX1DVM20
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Part Status: Obsolete
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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PCA6416AHF,128 PCA6416A.pdf
PCA6416AHF,128
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 8992 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.41 EUR
11+1.76 EUR
25+1.6 EUR
100+1.42 EUR
250+1.33 EUR
500+1.28 EUR
1000+1.24 EUR
2500+1.2 EUR
Mindestbestellmenge: 8
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PSMN4R6-100XS,127 PSMN4R6-100XS.pdf
PSMN4R6-100XS,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 70.4A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70.4A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 15A, 10V
Power Dissipation (Max): 63.8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220F
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 153 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9900 pF @ 50 V
Produkt ist nicht verfügbar
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S912ZVMC64F1MKH FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
S912ZVMC64F1MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFX1K80H-27MHZ MRFX1K80H.pdf
MRFX1K80H-27MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 27MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC17XS6400CEKR2 MC12XS6D1.pdf
MC17XS6400CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC17XS6400CEK MC12XS6D1.pdf
MC17XS6400CEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Produkt ist nicht verfügbar
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S9S12XS128J1MALR MC9S12XS256RMV1.pdf
S9S12XS128J1MALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BF1206,115 BF1206_Rev_Oct2010.pdf
BF1206,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
Produkt ist nicht verfügbar
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SC16C754BIBM,151 SC16C754B.pdf
SC16C754BIBM,151
Hersteller: NXP USA Inc.
Description: IC UART QUAD W/FIFO 64-LQFP
Packaging: Tray
Package / Case: 64-LQFP
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 64-LQFP (7x7)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G86GD,125 74AUP2G86.pdf
74AUP2G86GD,125
Hersteller: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 367044 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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PMCPB5530X PHGLS24967-1.pdf?t.download=true&u=5oefqw
PMCPB5530X
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMCPB5530X - SMALL
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC8306CVMACDCA557 MPC8306EC.pdf
Hersteller: NXP USA Inc.
Description: POWERQUICC POWER ARCH SOC, 200MH
auf Bestellung 84 Stücke:
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Anzahl Preis
13+41.37 EUR
Mindestbestellmenge: 13
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