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MPC8360VVALFHA NXP USA Inc. FSCLS05951-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
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MK22DN512VDC5 MK22DN512VDC5 NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN256VMP12 MK22FN256VMP12 NXP USA Inc. K22P121M120SF8.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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SPC5646CF0VMJ1R SPC5646CF0VMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
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NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
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NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 245973 Stücke:
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2070+0.23 EUR
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FXPS7250DI4ST1 FXPS7250DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7165DI4ST1 FXPS7165DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7400DI4T1 FXPS7400DI4T1 NXP USA Inc. FXPS7400D4.pdf Description: 20-400 KPA BAP DIG I2C
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FXPS7400DI4ST1 FXPS7400DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7165DI4T1 FXPS7165DI4T1 NXP USA Inc. FXPS7165D4.pdf Description: 60-165 KPA BAP DIG I2C
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FXPS7115DI4ST1 FXPS7115DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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MC9328MXLCVM15 MC9328MXLCVM15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 256BGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 256-PBGA (14x14)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68302RC20C MC68302RC20C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 20MHZ 132PGA
Packaging: Tray
Package / Case: 132-BPGA Exposed Pad
Mounting Type: Through Hole
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PGA (34.5x34.5)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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MC68302EH20C NXP USA Inc. MC68302.pdf Description: M68000 MICROPROCESSOR IC SERIES
auf Bestellung 1268 Stücke:
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5+166.63 EUR
Mindestbestellmenge: 5
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PHPT60410PY115 PHPT60410PY115 NXP USA Inc. PHPT60410PY.pdf Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
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PHPT60410NY115 PHPT60410NY115 NXP USA Inc. PHPT60410NY.pdf Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
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SPC5746CFK1ACMH6 SPC5746CFK1ACMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SPC5744CBK1ACMH6 SPC5744CBK1ACMH6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BBY31,215 BBY31,215 NXP USA Inc. DS_568_BBY31.pdf Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
Produkt ist nicht verfügbar
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TJA1042AT/0Z TJA1042AT/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.32 EUR
Mindestbestellmenge: 2500
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BSH207,135 BSH207,135 NXP USA Inc. PHGLS06940-1.pdf?t.download=true&u=5oefqw Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
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1025+0.49 EUR
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NX20P5090UK041 NXP USA Inc. PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF Description: NX20P5090UK - BUFFER/INVERTER BA
Produkt ist nicht verfügbar
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MCF5272VM66 MCF5272VM66 NXP USA Inc. MCF5272UM.pdf Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5206EAB40 MCF5206EAB40 NXP USA Inc. MCF5206EFS.pdf Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF24301HR5178 NXP USA Inc. ROCELEC_1.pdf?t.download=true&u=ovmfp3 Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
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mpc8250aczumhbc mpc8250aczumhbc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8250ACVVMHBC MPC8250ACVVMHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132N,112 NXP USA Inc. 74LV132.pdf Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
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74LV367D,112 74LV367D,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
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74LV367N,112 74LV367N,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 SPC5603BF2CLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTA113ZE,115 PDTA113ZE,115 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
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PDTA113EE,115 PDTA113EE,115 NXP USA Inc. PHGLS19170-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665ATF4AE NXP USA Inc. MC33665A_SDS.pdf Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.41 EUR
10+13.59 EUR
25+12.64 EUR
80+11.73 EUR
Mindestbestellmenge: 2
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A3I20D040WNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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A3I20D040WGNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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AFSC5G23D37T2 NXP USA Inc. AFSC5G23D37.pdf Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 NXP USA Inc. A3I35D012WN.pdf Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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PMGD130UN,115 PMGD130UN,115 NXP USA Inc. PMGD130UN.pdf Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 390mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8255ACVVMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8347ECVRADDB NXP USA Inc. MPC8347EAEC.pdf Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
3+179.06 EUR
Mindestbestellmenge: 3
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LPC4310FBD144,551 LPC4310FBD144,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP3G0434GD125 74AUP3G0434GD125 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
auf Bestellung 92750 Stücke:
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74AUP3G0434DC125 74AUP3G0434DC125 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
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74AUP3G0434GT115 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 8-XSON (1.95x1)
Produkt ist nicht verfügbar
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74AUP3G0434GS115 74AUP3G0434GS115 NXP USA Inc. 74AUP3G0434.pdf Description: INVERTER, AUP/ULP/V SERIES
Produkt ist nicht verfügbar
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S9S12ZVL16F0VLC S9S12ZVL16F0VLC NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR518 S9S08SG4E2VTGR518 NXP USA Inc. MC9S08SG8.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
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74AXP1T34GS,125 74AXP1T34GS,125 NXP USA Inc. PHGL-S-A0001360287-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
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74AXP1T34GN,125 74AXP1T34GN,125 NXP USA Inc. NEXP-S-A0003105714-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
auf Bestellung 3199 Stücke:
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74AXP1T34GN125 74AXP1T34GN125 NXP USA Inc. 74AXP1T34.pdf Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GM125 74AXP1T34GM125 NXP USA Inc. 74AXP1T34.pdf Description: 74AXP1T34GM - BUFFER, AXP SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AXP1T34GS125 74AXP1T34GS125 NXP USA Inc. 74AXP1T34.pdf Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GW125 74AXP1T34GW125 NXP USA Inc. 74AXP1T34.pdf Description: 74AXP1T34GW - BUFFER, AXP SERIES
Produkt ist nicht verfügbar
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74LV365N,112 74LV365N,112 NXP USA Inc. 74LV365.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
auf Bestellung 1768 Stücke:
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340+1.55 EUR
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74LV132DB,118 74LV132DB,118 NXP USA Inc. PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.9V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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1569+0.31 EUR
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74LV132DB,112 74LV132DB,112 NXP USA Inc. PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, LV/LV-A/LVX/H SERIES,
auf Bestellung 2492 Stücke:
Lieferzeit 10-14 Tag (e)
1443+0.37 EUR
Mindestbestellmenge: 1443
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MPC8360VVALFHA FSCLS05951-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
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MK22DN512VDC5
MK22DN512VDC5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FN256VMP12 K22P121M120SF8.pdf
MK22FN256VMP12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5646CF0VMJ1R
SPC5646CF0VMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 245973 Stücke:
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Anzahl Preis
2070+0.23 EUR
Mindestbestellmenge: 2070
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FXPS7250DI4ST1
FXPS7250DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7165DI4ST1
FXPS7165DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7400DI4T1 FXPS7400D4.pdf
FXPS7400DI4T1
Hersteller: NXP USA Inc.
Description: 20-400 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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FXPS7400DI4ST1
FXPS7400DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7165DI4T1 FXPS7165D4.pdf
FXPS7165DI4T1
Hersteller: NXP USA Inc.
Description: 60-165 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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FXPS7115DI4ST1
FXPS7115DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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MC9328MXLCVM15 MC9328MXL.pdf
MC9328MXLCVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256BGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 256-PBGA (14x14)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68302RC20C MC68302TIMING.pdf
MC68302RC20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
Packaging: Tray
Package / Case: 132-BPGA Exposed Pad
Mounting Type: Through Hole
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PGA (34.5x34.5)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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MC68302EH20C MC68302.pdf
Hersteller: NXP USA Inc.
Description: M68000 MICROPROCESSOR IC SERIES
auf Bestellung 1268 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+166.63 EUR
Mindestbestellmenge: 5
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PHPT60410PY115 PHPT60410PY.pdf
PHPT60410PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Produkt ist nicht verfügbar
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PHPT60410NY115 PHPT60410NY.pdf
PHPT60410NY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5746CFK1ACMH6
SPC5746CFK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5744CBK1ACMH6 MPC5746C-Datasheet.pdf
SPC5744CBK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BBY31,215 DS_568_BBY31.pdf
BBY31,215
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
Produkt ist nicht verfügbar
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TJA1042AT/0Z
TJA1042AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.32 EUR
Mindestbestellmenge: 2500
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BSH207,135 PHGLS06940-1.pdf?t.download=true&u=5oefqw
BSH207,135
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
auf Bestellung 50873 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1025+0.49 EUR
Mindestbestellmenge: 1025
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NX20P5090UK041 PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF
Hersteller: NXP USA Inc.
Description: NX20P5090UK - BUFFER/INVERTER BA
Produkt ist nicht verfügbar
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MCF5272VM66 MCF5272UM.pdf
MCF5272VM66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5206EAB40 MCF5206EFS.pdf
MCF5206EAB40
Hersteller: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF24301HR5178 ROCELEC_1.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
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mpc8250aczumhbc MPC8250.pdf
mpc8250aczumhbc
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8250ACVVMHBC MPC8250.pdf
MPC8250ACVVMHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132.pdf
74LV132N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
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74LV367D,112 74LV367.pdf
74LV367D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74LV367N,112 74LV367.pdf
74LV367N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 MPC5604BC.pdf
SPC5603BF2CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTA113ZE,115 PDTA113Z_SER.pdf
PDTA113ZE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
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PDTA113EE,115 PHGLS19170-1.pdf?t.download=true&u=5oefqw
PDTA113EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665A_SDS.pdf
MC33665ATF4AE
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.41 EUR
10+13.59 EUR
25+12.64 EUR
80+11.73 EUR
Mindestbestellmenge: 2
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A3I20D040WNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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A3I20D040WGNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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AFSC5G23D37T2 AFSC5G23D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Packaging: Cut Tape (CT)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE
Voltage - Supply: 0V ~ 32V
Gain: 31dB
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 A3I35D012WN.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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PMGD130UN,115 PMGD130UN.pdf
PMGD130UN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 390mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8260A.pdf
MPC8255ACVVMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8347ECVRADDB MPC8347EAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Active
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+179.06 EUR
Mindestbestellmenge: 3
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LPC4310FBD144,551 LPC4350_30_20_10.pdf
LPC4310FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP3G0434GD125 74AUP3G0434.pdf
74AUP3G0434GD125
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
auf Bestellung 92750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1031+0.48 EUR
Mindestbestellmenge: 1031
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74AUP3G0434DC125 74AUP3G0434.pdf
74AUP3G0434DC125
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-VSSOP
Part Status: Active
Number of Circuits: 3
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
764+0.64 EUR
Mindestbestellmenge: 764
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74AUP3G0434GT115 74AUP3G0434.pdf
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Supplier Device Package: 8-XSON (1.95x1)
Produkt ist nicht verfügbar
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74AUP3G0434GS115 74AUP3G0434.pdf
74AUP3G0434GS115
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Produkt ist nicht verfügbar
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S9S12ZVL16F0VLC S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL16F0VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR518 MC9S08SG8.pdf
S9S08SG4E2VTGR518
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
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74AXP1T34GS,125 PHGL-S-A0001360287-1.pdf?t.download=true&u=5oefqw
74AXP1T34GS,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
auf Bestellung 4967 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2402+0.21 EUR
Mindestbestellmenge: 2402
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74AXP1T34GN,125 NEXP-S-A0003105714-1.pdf?t.download=true&u=5oefqw
74AXP1T34GN,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1718+0.3 EUR
Mindestbestellmenge: 1718
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74AXP1T34GN125 74AXP1T34.pdf
74AXP1T34GN125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GM125 74AXP1T34.pdf
74AXP1T34GM125
Hersteller: NXP USA Inc.
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
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74AXP1T34GS125 74AXP1T34.pdf
74AXP1T34GS125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Produkt ist nicht verfügbar
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74AXP1T34GW125 74AXP1T34.pdf
74AXP1T34GW125
Hersteller: NXP USA Inc.
Description: 74AXP1T34GW - BUFFER, AXP SERIES
Produkt ist nicht verfügbar
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74LV365N,112 74LV365.pdf
74LV365N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
auf Bestellung 1768 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
340+1.55 EUR
Mindestbestellmenge: 340
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74LV132DB,118 PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw
74LV132DB,118
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.4V ~ 3.9V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1569+0.31 EUR
Mindestbestellmenge: 1569
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74LV132DB,112 PHGL-S-A0001367384-1.pdf?t.download=true&u=5oefqw
74LV132DB,112
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
auf Bestellung 2492 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1443+0.37 EUR
Mindestbestellmenge: 1443
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