Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 458 nach 611
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LPC54102J512BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFPSpeed: 100MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray Number of I/O: 50 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4/M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 104K x 8 Program Memory Size: 512KB (512K x 8) DigiKey Programmable: Not Verified |
auf Bestellung 184 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6X2AVN08AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGAAdditional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (17x17) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 200MHz, 800MHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC9S08JM8CLC | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SPC5607BK0CLU4 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SPC5607BK0CLU4R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFPData Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MCIMX6D5EZK08AD | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 569MAPBGAPackaging: Bulk Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 1648 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1082TT,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 14TSSOPGrade: Automotive Part Status: Obsolete Supplier Device Package: 14-TSSOP Voltage - Supply: 4.75V ~ 5.25V Interface: FlexRay Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BGS8L2X | NXP USA Inc. |
Description: IC RF AMP 728MHZ-960MHZ 6XSONPart Status: Active Supplier Device Package: 6-XSON (1.1x0.7) Noise Figure: 0.85dB Current - Supply: 5.2mA Gain: 13dB Voltage - Supply: 1.5V ~ 3.1V Frequency: 728MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BGS8L2X | NXP USA Inc. |
Description: IC RF AMP 728MHZ-960MHZ 6XSONPart Status: Active Supplier Device Package: 6-XSON (1.1x0.7) Noise Figure: 0.85dB Current - Supply: 5.2mA Gain: 13dB Voltage - Supply: 1.5V ~ 3.1V Frequency: 728MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Cut Tape (CT) |
auf Bestellung 2186 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH32VTL | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 28TSSOPCore Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 23 Supplier Device Package: 28-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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NVT4557HKX | NXP USA Inc. |
Description: SIM CARD INTERFACE LEVEL TRANSLAPackaging: Tape & Reel (TR) Package / Case: 10-XFQFN Mounting Type: Surface Mount Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V Applications: Modems, Mobile Phones, SIM Card Supplier Device Package: 10-XQFN (1.4x1.8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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NVT4557HKX | NXP USA Inc. |
Description: SIM CARD INTERFACE LEVEL TRANSLAPackaging: Cut Tape (CT) Package / Case: 10-XFQFN Mounting Type: Surface Mount Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V Applications: Modems, Mobile Phones, SIM Card Supplier Device Package: 10-XQFN (1.4x1.8) |
auf Bestellung 3990 Stücke: Lieferzeit 10-14 Tag (e) |
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| KITFS86AUTFRDMEM | NXP USA Inc. |
Description: EVAL BOARD FS86 12V Packaging: Tray Function: System Basis Chip (SBC) Type: Interface Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: FS86 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Secondary Attributes: USB Interface(s) Embedded: Yes, MCU, 32-Bit |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS86SKTFRDMEM | NXP USA Inc. |
Description: EVAL BOARD FS86 12V/24VPackaging: Tray Function: System Basis Chip (SBC) Type: Interface Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: FS86 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Secondary Attributes: USB Interface(s) Embedded: Yes, MCU, 32-Bit |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVC244D112 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC33879TEK | NXP USA Inc. |
Description: IC SW SERIAL OCTAL 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MC33879BPEK | NXP USA Inc. |
Description: IC SW SERIAL OCTAL 32SOICFeatures: Slew Rate Controlled, Status Flag Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: Relay, Solenoid Driver Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High/Low Side Rds On (Typ): 750mOhm Input Type: Non-Inverting Voltage - Load: 5.5V ~ 27.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1.2A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33879BPEKR2 | NXP USA Inc. |
Description: IC SW SERIAL OCTAL 32SOICFeatures: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High/Low Side Rds On (Typ): 750mOhm Input Type: Non-Inverting Voltage - Load: 5.5V ~ 27.5V Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V Current - Output (Max): 1.2A Ratio - Input:Output: 1:8 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMDUALK3664EVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33664ATLPackaging: Box Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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UBA2211BT/N1,518 | NXP USA Inc. |
Description: IC CFL/TL DRIVER 42.68KHZ 14SOCurrent - Output Source/Sink: 1.35A Dimming: No Supplier Device Package: 14-SO Voltage - Supply: 10.7V ~ 13.8V Operating Temperature: -40°C ~ 150°C Type: CFL/TL Driver Frequency: 40.05kHz ~ 42.68kHz Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 2769 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU7044,115 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOPPart Status: Active Supplier Device Package: 6-TSSOP Test Frequency: 1GHz P1dB: 13dBm Noise Figure: 2.8dB Current - Supply: 34mA Gain: 14dB Voltage - Supply: 3.1V ~ 3.5V RF Type: General Purpose Frequency: 40MHz ~ 1GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Bulk |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCF85263ATL/A115 | NXP USA Inc. |
Description: TINY REAL-TIME CLOCK/CALENDAR WIPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC100ES6111FAR2 | NXP USA Inc. |
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFPFrequency - Max: 2.7 GHz Supplier Device Package: 32-LQFP (7x7) Differential - Input:Output: Yes/Yes Ratio - Input:Output: 2:10 Voltage - Supply: 2.375V ~ 3.465V Operating Temperature: -40°C ~ 110°C Input: ECL, HSTL, PECL Type: Fanout Buffer (Distribution), Multiplexer Output: ECL, PECL Mounting Type: Surface Mount Number of Circuits: 1 Package / Case: 32-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC100ES6111FAR2 | NXP USA Inc. |
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFPFrequency - Max: 2.7 GHz Supplier Device Package: 32-LQFP (7x7) Differential - Input:Output: Yes/Yes Ratio - Input:Output: 2:10 Voltage - Supply: 2.375V ~ 3.465V Operating Temperature: -40°C ~ 110°C Input: ECL, HSTL, PECL Type: Fanout Buffer (Distribution), Multiplexer Output: ECL, PECL Mounting Type: Surface Mount Number of Circuits: 1 Package / Case: 32-LQFP Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BUK762R4-60E,118 | NXP USA Inc. |
Description: MOSFET N-CH 60V 120A D2PAK |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S912ZVML31F1WKF557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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74ABT540DB,118 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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LPC12D27FBD100/301 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 45MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| LX2122RE82029B | NXP USA Inc. |
Description: IC MPU QORIQ LX 2GHZ 1150FBGA Additional Interfaces: CANbus, I2C, PCIe, SPI, UART SATA: SATA 6Gbps (4) Graphics Acceleration: No RAM Controllers: DDR4, SDRAM Number of Cores/Bus Width: 12 Core, 64-Bit USB: USB 3.0 (1) Supplier Device Package: 1150-FBGA (23x23) Core Processor: ARM® Cortex®-A72 Operating Temperature: 5°C ~ 105°C (TA) Speed: 2GHz Mounting Type: Surface Mount Package / Case: 1150-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MK20DX64VFT5 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 29 Part Status: Active Supplier Device Package: 48-QFN-EP (7x7) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 11x16b Core Processor: ARM® Cortex®-M4 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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SGTL5000XNBA3R2 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32HVQFNPackaging: Tape & Reel (TR) Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| SGTL5000XNBA3 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32HVQFNPackaging: Tray Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
auf Bestellung 284 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U5DVM10ACR | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGAPackaging: Cut Tape (CT) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 1369 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI6QFN/CG,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/11PF SMDPackaging: Cut Tape (CT) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PEMI6QFN/CG,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/11PF SMDPackaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XD64F2MAA557 | NXP USA Inc. |
Description: 16-BIT MCU, S12X CORE, 64KB FLAS |
auf Bestellung 1260 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12XS128J1MAA557 | NXP USA Inc. |
Description: MICROCONTROLLER 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S912XEG128J2MAA557 | NXP USA Inc. |
Description: MICROCONTROLLER 16-BIT FLASH, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S912XD128F2MAA557 | NXP USA Inc. | Description: MICROCONTROLLER, 16-BIT, FLASH, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| AFT23H201-24SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V ACP1230S-4Current - Test: 500 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: ACP-1230S-4L2L Technology: LDMOS Gain: 15.6dB Power - Output: 210W Frequency: 2.3GHz ~ 2.4GHz Mounting Type: Chassis Mount Current Rating (Amps): 10µA Package / Case: ACP-1230S-4L2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| BGO807C/SC0112 | NXP USA Inc. |
Description: 870 MHZ OPTICAL RECEIVERSPackaging: Bulk Part Status: Active |
auf Bestellung 10848 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGO807C/FC0112 | NXP USA Inc. |
Description: 870 MHZ OPTICAL RECEIVERSPackaging: Bulk Part Status: Active |
auf Bestellung 16029 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16C752BIBS,157 | NXP USA Inc. |
Description: IC DUAL UART 64BYTE 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 64 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
auf Bestellung 1810 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DN32F2CLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFPNumber of I/O: 25 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 10x12b Core Processor: S08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.5K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC33772BTP2AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC33772BTC0AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFPPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC33772BSA2AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC33772BSP1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFPPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MC34PF3000A3EPR2,528 | NXP USA Inc. |
Description: IC BATT PWR MGMT Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MC32PF3000A2EP557 | NXP USA Inc. |
Description: IC BATT PWR MGMT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| SL3S1204FUD/BG/MVZ | NXP USA Inc. | Description: IC RFID CHIP UCODE 7 UNCASED |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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74LV86DB,118 | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14SSOPCurrent - Quiescent (Max): 40 µA Number of Circuits: 4 Part Status: Obsolete Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF Input Logic Level - Low: 0.3V ~ 0.8V Input Logic Level - High: 0.9V ~ 2V Supplier Device Package: 14-SSOP Number of Inputs: 2 Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: XOR (Exclusive OR) Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGAGraphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TA) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 256-BBGA Packaging: Tray Ethernet: 10Mbps (1) Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BZX84-C33/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 33V 250MW TO236AB |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BZX84-C33/LF1R | NXP USA Inc. |
Description: DIODE ZENER 33V 250MW SOT23Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MK30DX128VLL7 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 70 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 38x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P3041NXN7PNC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6L3EVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGACore Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 432-TFBGA Packaging: Tray Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (3) Ethernet: 10/100Mbps (1) Supplier Device Package: 432-MAPBGA (13x13) Voltage - I/O: 1.2V, 1.8V, 3.0V |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6X3CVN08AC | NXP USA Inc. |
Description: I.MX 6SX ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MKE02Z32VQH2 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64QFPPackaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 420 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC54102J512BD64QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 50
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
DigiKey Programmable: Not Verified
auf Bestellung 184 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.75 EUR |
| 10+ | 18.66 EUR |
| 25+ | 17.39 EUR |
| 160+ | 15.62 EUR |
| MCIMX6X2AVN08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08JM8CLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5607BK0CLU4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5607BK0CLU4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D5EZK08AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 113.47 EUR |
| TJA1082TT,112 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 14TSSOP
Grade: Automotive
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Voltage - Supply: 4.75V ~ 5.25V
Interface: FlexRay
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 14TSSOP
Grade: Automotive
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Voltage - Supply: 4.75V ~ 5.25V
Interface: FlexRay
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGS8L2X |
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Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Noise Figure: 0.85dB
Current - Supply: 5.2mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Noise Figure: 0.85dB
Current - Supply: 5.2mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BGS8L2X |
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Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Noise Figure: 0.85dB
Current - Supply: 5.2mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Part Status: Active
Supplier Device Package: 6-XSON (1.1x0.7)
Noise Figure: 0.85dB
Current - Supply: 5.2mA
Gain: 13dB
Voltage - Supply: 1.5V ~ 3.1V
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 2186 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 22+ | 0.99 EUR |
| 25+ | 0.86 EUR |
| 26+ | 0.81 EUR |
| 100+ | 0.74 EUR |
| 250+ | 0.69 EUR |
| 500+ | 0.67 EUR |
| 1000+ | 0.64 EUR |
| MC9S08SH32VTL |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NVT4557HKX |
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Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NVT4557HKX |
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Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
Description: SIM CARD INTERFACE LEVEL TRANSLA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Voltage - Supply: 1.08V ~ 1.95V, 1.65V ~ 3.6V
Applications: Modems, Mobile Phones, SIM Card
Supplier Device Package: 10-XQFN (1.4x1.8)
auf Bestellung 3990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.68 EUR |
| 15+ | 1.43 EUR |
| 16+ | 1.33 EUR |
| 25+ | 1.23 EUR |
| 50+ | 1.17 EUR |
| 100+ | 1.09 EUR |
| 500+ | 0.98 EUR |
| 1000+ | 0.94 EUR |
| KITFS86AUTFRDMEM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1038.3 EUR |
| KITFS86SKTFRDMEM |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1083.55 EUR |
| 74ALVC244D112 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33879TEK |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33879BPEK |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.64 EUR |
| 10+ | 8.13 EUR |
| 25+ | 7.5 EUR |
| MC33879BPEKR2 |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 5.88 EUR |
| UBA2211BT/N1,518 |
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Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Current - Output Source/Sink: 1.35A
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Current - Output Source/Sink: 1.35A
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2769 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.32 EUR |
| 11+ | 1.96 EUR |
| 25+ | 1.83 EUR |
| 100+ | 1.64 EUR |
| 250+ | 1.54 EUR |
| 500+ | 1.45 EUR |
| 1000+ | 1.38 EUR |
| BGU7044,115 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 13dBm
Noise Figure: 2.8dB
Current - Supply: 34mA
Gain: 14dB
Voltage - Supply: 3.1V ~ 3.5V
RF Type: General Purpose
Frequency: 40MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Part Status: Active
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 13dBm
Noise Figure: 2.8dB
Current - Supply: 34mA
Gain: 14dB
Voltage - Supply: 3.1V ~ 3.5V
RF Type: General Purpose
Frequency: 40MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1138+ | 0.51 EUR |
| PCF85263ATL/A115 |
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Hersteller: NXP USA Inc.
Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC100ES6111FAR2 |
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Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Frequency - Max: 2.7 GHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:10
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 110°C
Input: ECL, HSTL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: ECL, PECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Frequency - Max: 2.7 GHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:10
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 110°C
Input: ECL, HSTL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: ECL, PECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC100ES6111FAR2 |
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Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Frequency - Max: 2.7 GHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:10
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 110°C
Input: ECL, HSTL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: ECL, PECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Frequency - Max: 2.7 GHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:10
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 110°C
Input: ECL, HSTL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: ECL, PECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK762R4-60E,118 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 120A D2PAK
Description: MOSFET N-CH 60V 120A D2PAK
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVML31F1WKF557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT540DB,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SSOP
Description: IC BUFFER INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC12D27FBD100/301 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LX2122RE82029B |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MK20DX64VFT5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.95 EUR |
| 10+ | 7.66 EUR |
| 25+ | 7.54 EUR |
| SGTL5000XNBA3R2 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SGTL5000XNBA3 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 284 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.47 EUR |
| 10+ | 7.22 EUR |
| 25+ | 6.66 EUR |
| 100+ | 6.05 EUR |
| MCIMX6U5DVM10ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 1369 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 125.64 EUR |
| 10+ | 103.97 EUR |
| 25+ | 98.57 EUR |
| 100+ | 96.65 EUR |
| PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1902+ | 0.33 EUR |
| S912XD64F2MAA557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 24+ | 25.39 EUR |
| S9S12XS128J1MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S912XEG128J2MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT FLASH,
Description: MICROCONTROLLER 16-BIT FLASH,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XD128F2MAA557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Description: MICROCONTROLLER, 16-BIT, FLASH,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| AFT23H201-24SR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V ACP1230S-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: ACP-1230S-4L2L
Technology: LDMOS
Gain: 15.6dB
Power - Output: 210W
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: ACP-1230S-4L2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V ACP1230S-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: ACP-1230S-4L2L
Technology: LDMOS
Gain: 15.6dB
Power - Output: 210W
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: ACP-1230S-4L2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGO807C/SC0112 |
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auf Bestellung 10848 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 141.98 EUR |
| BGO807C/FC0112 |
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auf Bestellung 16029 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 135.95 EUR |
| SC16C752BIBS,157 |
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Hersteller: NXP USA Inc.
Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC DUAL UART 64BYTE 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
auf Bestellung 1810 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.39 EUR |
| 10+ | 14.33 EUR |
| 25+ | 13.32 EUR |
| 100+ | 12.2 EUR |
| 250+ | 11.66 EUR |
| 500+ | 11.34 EUR |
| S9S08DN32F2CLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Number of I/O: 25
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTP2AE |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTC0AER2 |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSA2AE |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSP1AER2 |
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Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF3000A2EP557 |
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Hersteller: NXP USA Inc.
Description: IC BATT PWR MGMT
Description: IC BATT PWR MGMT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SL3S1204FUD/BG/MVZ |
Hersteller: NXP USA Inc.
Description: IC RFID CHIP UCODE 7 UNCASED
Description: IC RFID CHIP UCODE 7 UNCASED
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LV86DB,118 |
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Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC GATE XOR 4CH 2-INP 14SSOP
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2959+ | 0.2 EUR |
| MPC852TVR100A |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C33/LF1VL |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Description: DIODE ZENER 33V 250MW TO236AB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C33/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Description: DIODE ZENER 33V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 23.1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MK30DX128VLL7 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 38x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 38x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| P3041NXN7PNC |
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Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
Description: IC MPU Q OR IQ 1.5GHZ 1295FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6L3EVN10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 65.59 EUR |
| 10+ | 53.26 EUR |
| 25+ | 50.18 EUR |
| 160+ | 45.92 EUR |
| 320+ | 44.83 EUR |
| MCIMX6X3CVN08AC |
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Hersteller: NXP USA Inc.
Description: I.MX 6SX ROM PERF ENHAN
Description: I.MX 6SX ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MKE02Z32VQH2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 420 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.83 EUR |
| 10+ | 5.93 EUR |
| 84+ | 4.99 EUR |
| 168+ | 4.77 EUR |
| 252+ | 4.68 EUR |



































