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74LVT534D,112 74LVT534D,112 NXP USA Inc. 74LVT534.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
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PEMI1QFN/WT,315 PEMI1QFN/WT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
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PEMI1QFN/WT,315 PEMI1QFN/WT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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FRDMGD31ECNEVM NXP USA Inc. Description: EVAL BOARD FOR GD3100, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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TJA1102SHN/0Z TJA1102SHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER 1/1 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Protocol: Ethernet
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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NX3L1T384GM,115 NX3L1T384GM,115 NXP USA Inc. NX3L1T384.pdf Description: IC SW SPST-NCX1 750MOHM 6XSON
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 6pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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SE98APW,118 SE98APW,118 NXP USA Inc. SE98A.pdf Description: IC TEMP SENSOR DDR 8-TSSOP
Part Status: Obsolete
Supplier Device Package: 8-TSSOP
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±4°C(Max)
Function: Temp Monitoring System (Sensor)
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
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BFG410W,115 BFG410W,115 NXP USA Inc. BFG410W.pdf Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Supplier Device Package: CMPAK-4
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Frequency - Transition: 22GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 4.5V
Current - Collector (Ic) (Max): 12mA
Power - Max: 54mW
Gain: 21dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
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TEA6017AT/1Y TEA6017AT/1Y NXP USA Inc. TEA6017AT.pdf Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TEA6017AT/1Y TEA6017AT/1Y NXP USA Inc. TEA6017AT.pdf Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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100+4.13 EUR
250+3.92 EUR
500+3.78 EUR
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TEA6017DK1005 TEA6017DK1005 NXP USA Inc. TEA6017AT.pdf Description: TEA6017AT DEV PROGRAM BOARD
Secondary Attributes: I2C Interface(s)
Contents: Board(s)
Embedded: No
Primary Attributes: ESD Protection
Supplied Contents: Board(s)
Utilized IC / Part: TEA6017AT
Type: Power Management
Function: Power Factor Correction
Packaging: Box
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PMN25UN,115 PMN25UN,115 NXP USA Inc. PMN25UN.pdf Description: MOSFET N-CH 20V 6A 6TSOP
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
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FRDM-KE17Z FRDM-KE17Z NXP USA Inc. FRDM-KE17ZUM.pdf Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Platform: Freedom
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SPC5746BHK1AMMH6 SPC5746BHK1AMMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 65
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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SPC5746BSK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BHK1AMKU6 SPC5746BHK1AMKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BBK1AMKU6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BBK1AMMH6 SPC5746BBK1AMMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SPC5746BTK1AVMH6 SPC5746BTK1AVMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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MC9S08SH8MSC MC9S08SH8MSC NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
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NHS3100UCODEDBUL NXP USA Inc. NHS3100.pdf Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Utilized IC / Part: NHS3100
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NHS3100
Packaging: Bulk
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74LVC821ABQ,118 74LVC821ABQ,118 NXP USA Inc. 74LVC821A.pdf Description: IC FF D-TYPE SNGL 10BIT 24DHVQFN
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Number of Bits per Element: 10
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Input Capacitance: 5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
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S912XEG128J2CALR S912XEG128J2CALR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
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S912XEG256J2CALR S912XEG256J2CALR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XEG256BCALR S912XEG256BCALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XET256BCALR S912XET256BCALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
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S912XEG384BCALR S912XEG384BCALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XEG384F0CALR S912XEG384F0CALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
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S912XEQ384F0CALR S912XEQ384F0CALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
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S912XEQ512F0CALR S912XEQ512F0CALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XEQ512J2CALR S912XEQ512J2CALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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MC9S12XEQ512CALR MC9S12XEQ512CALR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
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S912XEQ384J3CALR S912XEQ384J3CALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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SPC5744PK1AMLQ5R SPC5744PK1AMLQ5R NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
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SAC57D53MCVMOR SAC57D53MCVMOR NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 516MAPBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
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SAC57D53MCVMO SAC57D53MCVMO NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
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SPC5646CK0VLU1 SPC5646CK0VLU1 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5646CK0VLU1R SPC5646CK0VLU1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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CLF1G0035S-100 CLF1G0035S-100 NXP USA Inc. PHGL-S-A0000717691-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
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LPC2292FET144/01 NXP USA Inc. PHGLS22972-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT 256KB 144TFBGA
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FS32K144HFT0VMHR FS32K144HFT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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MC33FS6600M1ES MC33FS6600M1ES NXP USA Inc. FS6600.pdf Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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MPC8347ZUAJFB MPC8347ZUAJFB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 533MHZ 672TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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74HC4053PW-Q100118 74HC4053PW-Q100118 NXP USA Inc. 74HC_HCT4053_Q100.pdf Description: SINGLE-ENDED MUX, 3 FUNC
Part Status: Active
Packaging: Bulk
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LPC11U34FBD48/421, LPC11U34FBD48/421, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11U24FHI33/301 LPC11U24FHI33/301 NXP USA Inc. PHGLS29591-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 32KB FLASH 32HVQFN
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LPC11U24FBD48/40EL LPC11U24FBD48/40EL NXP USA Inc. LPC11U2X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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74LVT646PW,118 74LVT646PW,118 NXP USA Inc. 74LVT646.pdf Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Part Status: Obsolete
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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74LVT652PW,118 74LVT652PW,118 NXP USA Inc. 74LVT652.pdf Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74LVT646PW,112 74LVT646PW,112 NXP USA Inc. 74LVT646.pdf Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Part Status: Obsolete
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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BUK761R8-30C,118 BUK761R8-30C,118 NXP USA Inc. BUK761R8-30C.pdf Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Qualification: AEC-Q101
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MC17XSF500EK MC17XSF500EK NXP USA Inc. MC17XSF500EK.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
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MVF62NN151CMK40 MVF62NN151CMK40 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 167MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 167MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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S32K3X4EVB-T172 S32K3X4EVB-T172 NXP USA Inc. getting-started-with-the-s32k3x4evb-t172-evaluation-board-for-automotive-general-purpose:GS-S32K3X4EVB-T172 Description: EVAL BOARD S32K INDUSTRIAL / AUT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K342EHT0MPBST S32K342EHT0MPBST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT2 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit2
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbuS, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 172-QFP (16x16)
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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S32K341EHT0MPBST S32K341EHT0MPBST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT2 1MB FLASH 172QFP
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbuS, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit2
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tray
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74LVCH322245AEC 74LVCH322245AEC NXP USA Inc. PHGLS15047-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
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74LVCH322245AEC518 74LVCH322245AEC518 NXP USA Inc. PHGLS15047-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVCH322245AEC551 74LVCH322245AEC551 NXP USA Inc. PHGLS15047-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVT534D,112 74LVT534.pdf
74LVT534D,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
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PEMI1QFN/WT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
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PEMI1QFN/WT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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FRDMGD31ECNEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3100, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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TJA1102SHN/0Z TJA1102_SDS.pdf
TJA1102SHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Protocol: Ethernet
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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500+7 EUR
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NX3L1T384GM,115 NX3L1T384.pdf
NX3L1T384GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 6pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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SE98APW,118 SE98A.pdf
SE98APW,118
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 8-TSSOP
Part Status: Obsolete
Supplier Device Package: 8-TSSOP
Output Fan: Yes
Output Alarm: Yes
Topology: ADC (Sigma Delta), Register Bank
Sensing Temperature: -40°C ~ 125°C
Sensor Type: Internal
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Accuracy: ±4°C(Max)
Function: Temp Monitoring System (Sensor)
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
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BFG410W,115 BFG410W.pdf
BFG410W,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Supplier Device Package: CMPAK-4
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Frequency - Transition: 22GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 4.5V
Current - Collector (Ic) (Max): 12mA
Power - Max: 54mW
Gain: 21dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA6017AT/1Y TEA6017AT.pdf
TEA6017AT/1Y
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA6017AT/1Y TEA6017AT.pdf
TEA6017AT/1Y
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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4+6.64 EUR
10+5 EUR
25+4.58 EUR
100+4.13 EUR
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TEA6017DK1005 TEA6017AT.pdf
TEA6017DK1005
Hersteller: NXP USA Inc.
Description: TEA6017AT DEV PROGRAM BOARD
Secondary Attributes: I2C Interface(s)
Contents: Board(s)
Embedded: No
Primary Attributes: ESD Protection
Supplied Contents: Board(s)
Utilized IC / Part: TEA6017AT
Type: Power Management
Function: Power Factor Correction
Packaging: Box
auf Bestellung 7 Stücke:
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PMN25UN,115 PMN25UN.pdf
PMN25UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6A 6TSOP
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Produkt ist nicht verfügbar
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FRDM-KE17Z FRDM-KE17ZUM.pdf
FRDM-KE17Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Platform: Freedom
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SPC5746BHK1AMMH6
SPC5746BHK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 65
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5746BSK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BHK1AMKU6 MPC5746C.pdf
SPC5746BHK1AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BBK1AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BBK1AMMH6
SPC5746BBK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5746BTK1AVMH6
SPC5746BTK1AVMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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MC9S08SH8MSC MC9S08SH32.pdf
MC9S08SH8MSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
auf Bestellung 5390 Stücke:
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AnzahlPrivatkunde
99+5.46 EUR
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NHS3100UCODEDBUL NHS3100.pdf
Hersteller: NXP USA Inc.
Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Utilized IC / Part: NHS3100
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NHS3100
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC821ABQ,118 74LVC821A.pdf
74LVC821ABQ,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24DHVQFN
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Number of Bits per Element: 10
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Input Capacitance: 5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
auf Bestellung 3000 Stücke:
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567+1.02 EUR
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S912XEG128J2CALR
S912XEG128J2CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEG256J2CALR MC9S12XEP100RMV1.pdf
S912XEG256J2CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEG256BCALR
S912XEG256BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256BCALR
S912XET256BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEG384BCALR
S912XEG384BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEG384F0CALR
S912XEG384F0CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384F0CALR MC9S12XEPB.pdf
S912XEQ384F0CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ512F0CALR MC9S12XEPB.pdf
S912XEQ512F0CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEQ512J2CALR MC9S12XEPB.pdf
S912XEQ512J2CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S12XEQ512CALR MC9S12XEP100RMV1.pdf
MC9S12XEQ512CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEQ384J3CALR MC9S12XEPB.pdf
S912XEQ384J3CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5744PK1AMLQ5R
SPC5744PK1AMLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SAC57D53MCVMOR
SAC57D53MCVMOR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 516MAPBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Produkt ist nicht verfügbar
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SAC57D53MCVMO
SAC57D53MCVMO
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 516MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 516-MAPBGA (27x27)
Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-A5/M4/M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.3M x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz, 160MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 516-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5646CK0VLU1
SPC5646CK0VLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5646CK0VLU1R
SPC5646CK0VLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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CLF1G0035S-100 PHGL-S-A0000717691-1.pdf?t.download=true&u=5oefqw
CLF1G0035S-100
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Produkt ist nicht verfügbar
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LPC2292FET144/01 PHGLS22972-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
Produkt ist nicht verfügbar
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FS32K144HFT0VMHR S32K1xx.pdf
FS32K144HFT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS6600M1ES FS6600.pdf
MC33FS6600M1ES
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.79 EUR
10+17.86 EUR
25+16.64 EUR
100+15.29 EUR
260+14.63 EUR
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MPC8347ZUAJFB MPC8347EEC.pdf
MPC8347ZUAJFB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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74HC4053PW-Q100118 74HC_HCT4053_Q100.pdf
74HC4053PW-Q100118
Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 3 FUNC
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11U34FBD48/421, LPC11U6X.pdf
LPC11U34FBD48/421,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 958 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.87 EUR
10+7.53 EUR
25+6.95 EUR
100+6.31 EUR
250+6.01 EUR
500+5.82 EUR
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LPC11U24FHI33/301 PHGLS29591-1.pdf?t.download=true&u=5oefqw
LPC11U24FHI33/301
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Produkt ist nicht verfügbar
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LPC11U24FBD48/40EL LPC11U2X.pdf
LPC11U24FBD48/40EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1776 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.87 EUR
10+4.63 EUR
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74LVT646PW,118 74LVT646.pdf
74LVT646PW,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Part Status: Obsolete
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVT652PW,118 74LVT652.pdf
74LVT652PW,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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74LVT646PW,112 74LVT646.pdf
74LVT646PW,112
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24TSSOP
Part Status: Obsolete
Supplier Device Package: 24-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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BUK761R8-30C,118 BUK761R8-30C.pdf
BUK761R8-30C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Qualification: AEC-Q101
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MC17XSF500EK MC17XSF500EK.pdf
MC17XSF500EK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 5
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
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MVF62NN151CMK40 VYBRIDFSERIESEC.pdf
MVF62NN151CMK40
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 167MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32K3X4EVB-T172 getting-started-with-the-s32k3x4evb-t172-evaluation-board-for-automotive-general-purpose:GS-S32K3X4EVB-T172
S32K3X4EVB-T172
Hersteller: NXP USA Inc.
Description: EVAL BOARD S32K INDUSTRIAL / AUT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
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S32K342EHT0MPBST S32K3xx.pdf
S32K342EHT0MPBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT2 2MB FLASH 172QFP
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit2
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbuS, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 172-QFP (16x16)
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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S32K341EHT0MPBST S32K3xx.pdf
S32K341EHT0MPBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT2 1MB FLASH 172QFP
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbuS, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit2
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tray
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74LVCH322245AEC PHGLS15047-1.pdf?t.download=true&u=5oefqw
74LVCH322245AEC
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Bulk
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74LVCH322245AEC518 PHGLS15047-1.pdf?t.download=true&u=5oefqw
74LVCH322245AEC518
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
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74LVCH322245AEC551 PHGLS15047-1.pdf?t.download=true&u=5oefqw
74LVCH322245AEC551
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
auf Bestellung 1645 Stücke:
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