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SPC5603BK0VLH4R SPC5603BK0VLH4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LD6836TD/12P,125 LD6836TD/12P,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.2V 300MA 5TSOP
auf Bestellung 6670 Stücke:
Lieferzeit 10-14 Tag (e)
2885+0.17 EUR
Mindestbestellmenge: 2885
NZX11C,133 NXP USA Inc. PHGLS23734-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 11V 500MW ALF2
auf Bestellung 19880 Stücke:
Lieferzeit 10-14 Tag (e)
19880+0.034 EUR
Mindestbestellmenge: 19880
IMXRT600-AUD-EVK IMXRT600-AUD-EVK NXP USA Inc. Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
Produkt ist nicht verfügbar
74ALVCH16827DGGS 74ALVCH16827DGGS NXP USA Inc. 74ALVCH16827.pdf Description: IC BUF NON-INVERT 3.6V 56TSSOP
auf Bestellung 2605 Stücke:
Lieferzeit 10-14 Tag (e)
402+1.27 EUR
Mindestbestellmenge: 402
PCF1252-4T/F4,112 PCF1252-4T/F4,112 NXP USA Inc. PCF1252-X_Family.pdf Description: IC SUPERVISOR 1 CHANNEL 8SO
Produkt ist nicht verfügbar
BGU7258115 NXP USA Inc. PHGL-S-A0006118242-1.pdf?t.download=true&u=5oefqw Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
Produkt ist nicht verfügbar
SPC5644BAMLU8 SPC5644BAMLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCALR S912XEQ384BCALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCAL S912XEQ384BCAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384AVAL S912XEG384AVAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BAMLU8R SPC5644BAMLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BAMLU1R SPC5644BAMLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PRH601HL/C1,557 PRH601HL/C1,557 NXP USA Inc. PRH601.pdf Description: IC RFID RDR 125KZ/13.56MZ 100QFP
Produkt ist nicht verfügbar
MK10DX64VMP5 MK10DX64VMP5 NXP USA Inc. K10P64M50SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64MAPBGA
Produkt ist nicht verfügbar
MMDS36254HT1 MMDS36254HT1 NXP USA Inc. MMDS36254H.pdf Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Produkt ist nicht verfügbar
MMDS36254HT1 MMDS36254HT1 NXP USA Inc. MMDS36254H.pdf Description: ADAM - ADVANCED DOHERTY ALIGNMEN
auf Bestellung 7000 Stücke:
Lieferzeit 10-14 Tag (e)
34+24.13 EUR
Mindestbestellmenge: 34
74ALVC16245DL,112-NXP 74ALVC16245DL,112-NXP NXP USA Inc. Description: IC TXRX NON-INVERT 3.6V 48SSOP
Produkt ist nicht verfügbar
PEMB4,115 PEMB4,115 NXP USA Inc. PHGLS26737-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PEMB4 - SMALL SIGNA
auf Bestellung 56821 Stücke:
Lieferzeit 10-14 Tag (e)
7340+0.066 EUR
Mindestbestellmenge: 7340
PCAL6534EV-ARD PCAL6534EV-ARD NXP USA Inc. UM11712.pdf Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+217.8 EUR
OM-A5000ARD OM-A5000ARD NXP USA Inc. Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+123.59 EUR
S9KEAZ128ACLHR S9KEAZ128ACLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP100BMAGR S912XEP100BMAGR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96AVLHR S9S12G96AVLHR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
S912ZVC64F0VLFR S912ZVC64F0VLFR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
PTVS60VP1UTP,115 PTVS60VP1UTP,115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
PTVS64VP1UTP115 PTVS64VP1UTP115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: NOW NEXPERIA PTVS64VP1UTP TRANS
Produkt ist nicht verfügbar
PTVS60VP1UTP115 PTVS60VP1UTP115 NXP USA Inc. PTVSXP1UTP_SER.pdf Description: NOW NEXPERIA PTVS60VP1UTP - TRAN
Produkt ist nicht verfügbar
PCA8553DTT/AJ PCA8553DTT/AJ NXP USA Inc. PCA8553.pdf Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA8553DTT/AJ PCA8553DTT/AJ NXP USA Inc. PCA8553.pdf Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
LPC2290FBD144/01551 LPC2290FBD144/01551 NXP USA Inc. PHGLS14515-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
MC34PF8100F3EPR2 MC34PF8100F3EPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
K32W041K K32W041K NXP USA Inc. K32W061.pdf Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.55 EUR
10+ 11.5 EUR
25+ 10.45 EUR
80+ 9.41 EUR
230+ 8.62 EUR
440+ 7.84 EUR
Mindestbestellmenge: 2
A2T18H160-24SR3 NXP USA Inc. A2T18H160-24S.pdf Description: RF MOSFET LDMOS DL 28V NI780S
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
3+191.53 EUR
Mindestbestellmenge: 3
M68LC302CAF20VCT M68LC302CAF20VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 20MHZ 100LQFP
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
6+94.95 EUR
Mindestbestellmenge: 6
S912XEG384F1VAG,557 NXP USA Inc. Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
SP03160-01UL NXP USA Inc. Description: SP03160-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MC9S12XEQ384CAL MC9S12XEQ384CAL NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.92 EUR
10+ 33.62 EUR
80+ 28.71 EUR
S912XEQ384AMAL S912XEQ384AMAL NXP USA Inc. Description: 16-BIT MCU, S12X CORE, 384KB FLA
Produkt ist nicht verfügbar
S912XEQ384F1MAG S912XEQ384F1MAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 144LQFP
Produkt ist nicht verfügbar
S912XEQ384F1MAGR S912XEQ384F1MAGR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 144LQFP
Produkt ist nicht verfügbar
S912XEQ384BCAG S912XEQ384BCAG NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCAGR S912XEQ384BCAGR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384J3VALR S912XEQ384J3VALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384F1MAL S912XEQ384F1MAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384BCAAR S912XEQ384BCAAR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
S912XEQ384BVAA S912XEQ384BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
S912XEQ384ACAL S912XEQ384ACAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384ACALR S912XEQ384ACALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384BVAAR S912XEQ384BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
S912XEQ384BMAAR S912XEQ384BMAAR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
BB184,115 BB184,115 NXP USA Inc. BB184_Rev3.pdf Description: DIODE UHF VAR CAP 13V SOD523
Produkt ist nicht verfügbar
QN9021/D518 QN9021/D518 NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 14000 Stücke:
Lieferzeit 10-14 Tag (e)
125+3.96 EUR
Mindestbestellmenge: 125
QN9022/D518 QN9022/D518 NXP USA Inc. NEXP-S-A0003116189-1.pdf?t.download=true&u=5oefqw Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
138+3.58 EUR
Mindestbestellmenge: 138
QN9021/D QN9021/D NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SOC
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
125+3.96 EUR
Mindestbestellmenge: 125
QN9021/EY QN9021/EY NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
SPC5607BK0VLQ6 SPC5607BK0VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5607BK0VLQ6R SPC5607BK0VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MWCT1011BVLH557 MWCT1011BVLH557 NXP USA Inc. PHGL-S-A0008141776-1.pdf?t.download=true&u=5oefqw Description: WIRELESS CHARGING IC
auf Bestellung 99900 Stücke:
Lieferzeit 10-14 Tag (e)
48+11.56 EUR
Mindestbestellmenge: 48
NX5P2190UKZ NX5P2190UKZ NXP USA Inc. NX5P2190.pdf Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Produkt ist nicht verfügbar
SPC5603BK0VLH4R
SPC5603BK0VLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LD6836TD/12P,125 LD6836.pdf
LD6836TD/12P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 300MA 5TSOP
auf Bestellung 6670 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2885+0.17 EUR
Mindestbestellmenge: 2885
NZX11C,133 PHGLS23734-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 500MW ALF2
auf Bestellung 19880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
19880+0.034 EUR
Mindestbestellmenge: 19880
IMXRT600-AUD-EVK
IMXRT600-AUD-EVK
Hersteller: NXP USA Inc.
Description: I.MX RT685 AUDIO EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT685
Part Status: Active
Produkt ist nicht verfügbar
74ALVCH16827DGGS 74ALVCH16827.pdf
74ALVCH16827DGGS
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
auf Bestellung 2605 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
402+1.27 EUR
Mindestbestellmenge: 402
PCF1252-4T/F4,112 PCF1252-X_Family.pdf
PCF1252-4T/F4,112
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR 1 CHANNEL 8SO
Produkt ist nicht verfügbar
BGU7258115 PHGL-S-A0006118242-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP ISM 4.9GHZ-5.925GHZ 6DFN
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 15dB
Current - Supply: 13mA
Noise Figure: 1.6dB
P1dB: -4dBm
Test Frequency: 5.5GHz
Supplier Device Package: DFN1616-6
Produkt ist nicht verfügbar
SPC5644BAMLU8
SPC5644BAMLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCALR
S912XEQ384BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCAL
S912XEQ384BCAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384AVAL
S912XEG384AVAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BAMLU8R
SPC5644BAMLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5644BAMLU1R
SPC5644BAMLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PRH601HL/C1,557 PRH601.pdf
PRH601HL/C1,557
Hersteller: NXP USA Inc.
Description: IC RFID RDR 125KZ/13.56MZ 100QFP
Produkt ist nicht verfügbar
MK10DX64VMP5 K10P64M50SF0.pdf
MK10DX64VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64MAPBGA
Produkt ist nicht verfügbar
MMDS36254HT1 MMDS36254H.pdf
MMDS36254HT1
Hersteller: NXP USA Inc.
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
Produkt ist nicht verfügbar
MMDS36254HT1 MMDS36254H.pdf
MMDS36254HT1
Hersteller: NXP USA Inc.
Description: ADAM - ADVANCED DOHERTY ALIGNMEN
auf Bestellung 7000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
34+24.13 EUR
Mindestbestellmenge: 34
74ALVC16245DL,112-NXP
74ALVC16245DL,112-NXP
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 48SSOP
Produkt ist nicht verfügbar
PEMB4,115 PHGLS26737-1.pdf?t.download=true&u=5oefqw
PEMB4,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB4 - SMALL SIGNA
auf Bestellung 56821 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7340+0.066 EUR
Mindestbestellmenge: 7340
PCAL6534EV-ARD UM11712.pdf
PCAL6534EV-ARD
Hersteller: NXP USA Inc.
Description: 34-BIT GPIO ARDUINO SHIELD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6534
Platform: Arduino
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+217.8 EUR
OM-A5000ARD
OM-A5000ARD
Hersteller: NXP USA Inc.
Description: A5000 ARDUINO DEV KIT
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A5000
Platform: Arduino
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+123.59 EUR
S9KEAZ128ACLHR S9KEA128P80M48SF0.pdf
S9KEAZ128ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP100BMAGR
S912XEP100BMAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96AVLHR
S9S12G96AVLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
S912ZVC64F0VLFR S12ZVCFS.pdf
S912ZVC64F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
PTVS60VP1UTP,115 PTVSXP1UTP_SER.pdf
PTVS60VP1UTP,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 60VWM 96.8VC CFP5
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Applications: Automotive
Current - Peak Pulse (10/1000µs): 6.2A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 600W
Power Line Protection: No
Part Status: Active
Produkt ist nicht verfügbar
PTVS64VP1UTP115 PTVSXP1UTP_SER.pdf
PTVS64VP1UTP115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PTVS64VP1UTP TRANS
Produkt ist nicht verfügbar
PTVS60VP1UTP115 PTVSXP1UTP_SER.pdf
PTVS60VP1UTP115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PTVS60VP1UTP - TRAN
Produkt ist nicht verfügbar
PCA8553DTT/AJ PCA8553.pdf
PCA8553DTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA8553DTT/AJ PCA8553.pdf
PCA8553DTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 160 SEGMENT 56TSSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 160 Segment
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Part Status: Obsolete
Current - Supply: 1.8 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
LPC2290FBD144/01551 PHGLS14515-1.pdf?t.download=true&u=5oefqw
LPC2290FBD144/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
MC34PF8100F3EPR2 PF8100_PF8200.pdf
MC34PF8100F3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
K32W041K K32W061.pdf
K32W041K
Hersteller: NXP USA Inc.
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.55 EUR
10+ 11.5 EUR
25+ 10.45 EUR
80+ 9.41 EUR
230+ 8.62 EUR
440+ 7.84 EUR
Mindestbestellmenge: 2
A2T18H160-24SR3 A2T18H160-24S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS DL 28V NI780S
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+191.53 EUR
Mindestbestellmenge: 3
M68LC302CAF20VCT MC68LC302.pdf
M68LC302CAF20VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+94.95 EUR
Mindestbestellmenge: 6
S912XEG384F1VAG,557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
SP03160-01UL
Hersteller: NXP USA Inc.
Description: SP03160-01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MC9S12XEQ384CAL MC9S12XEP100RMV1.pdf
MC9S12XEQ384CAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+41.92 EUR
10+ 33.62 EUR
80+ 28.71 EUR
S912XEQ384AMAL
S912XEQ384AMAL
Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 384KB FLA
Produkt ist nicht verfügbar
S912XEQ384F1MAG MC9S12XEP100RMV1.pdf
S912XEQ384F1MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Produkt ist nicht verfügbar
S912XEQ384F1MAGR MC9S12XEPB.pdf
S912XEQ384F1MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Produkt ist nicht verfügbar
S912XEQ384BCAG
S912XEQ384BCAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384BCAGR
S912XEQ384BCAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384J3VALR MC9S12XEPB.pdf
S912XEQ384J3VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ384F1MAL MC9S12XEPB.pdf
S912XEQ384F1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384BCAAR
S912XEQ384BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
Produkt ist nicht verfügbar
S912XEQ384BVAA MC9S12XEPB.pdf
S912XEQ384BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
S912XEQ384ACAL
S912XEQ384ACAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384ACALR
S912XEQ384ACALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
S912XEQ384BVAAR MC9S12XEPB.pdf
S912XEQ384BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
S912XEQ384BMAAR
S912XEQ384BMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
BB184,115 BB184_Rev3.pdf
BB184,115
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 13V SOD523
Produkt ist nicht verfügbar
QN9021/D518 QN902X.pdf
QN9021/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 14000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
125+3.96 EUR
Mindestbestellmenge: 125
QN9022/D518 NEXP-S-A0003116189-1.pdf?t.download=true&u=5oefqw
QN9022/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
138+3.58 EUR
Mindestbestellmenge: 138
QN9021/D QN902X.pdf
QN9021/D
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SOC
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
125+3.96 EUR
Mindestbestellmenge: 125
QN9021/EY QN902X.pdf
QN9021/EY
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
SPC5607BK0VLQ6 MPC560XBFAMFS.pdf
SPC5607BK0VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5607BK0VLQ6R MPC560XBFAMFS.pdf
SPC5607BK0VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MWCT1011BVLH557 PHGL-S-A0008141776-1.pdf?t.download=true&u=5oefqw
MWCT1011BVLH557
Hersteller: NXP USA Inc.
Description: WIRELESS CHARGING IC
auf Bestellung 99900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
48+11.56 EUR
Mindestbestellmenge: 48
NX5P2190UKZ NX5P2190.pdf
NX5P2190UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Produkt ist nicht verfügbar
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