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LX2160SE72232B LX2160SE72232B NXP USA Inc. Description: SSL MATRIX CONTROLLER
Produkt ist nicht verfügbar
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SPC5644BF0MLU8 SPC5644BF0MLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644BF0MLU8R SPC5644BF0MLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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LX2120SC72232B LX2120SC72232B NXP USA Inc. Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
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SPC5603BK0VLQ4R SPC5603BK0VLQ4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
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MPC8347CVVAJDB MPC8347CVVAJDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Bulk
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LD6805K/20P,115 LD6805K/20P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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74AUP1G32GN,132 74AUP1G32GN,132 NXP USA Inc. 74AUP1G32.pdf Description: IC GATE OR 1CH 2-INP 6XSON
auf Bestellung 144600 Stücke:
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2002+0.25 EUR
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SPC5644CF0VLU1R SPC5644CF0VLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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MRF6V2300NR5578 NXP USA Inc. FSCLS05117-1.pdf?t.download=true&u=5oefqw Description: N CHANNEL ENHANCEMENT-MODE RF PO
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LPC54607J256ET180E LPC54607J256ET180E NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
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BUJ303B,127 BUJ303B,127 NXP USA Inc. PHGLS23281-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 400V 5A TO-220AB
Power - Max: 100 W
Voltage - Collector Emitter Breakdown (Max): 400 V
Current - Collector (Ic) (Max): 5 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 23 @ 800mA, 3V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 1A, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
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859+0.59 EUR
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LD6836TD/14P,125 LD6836TD/14P,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 5TSOP
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MC33FS8510D3ESR2 MC33FS8510D3ESR2 NXP USA Inc. Description: FS8510
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MC33FS8510D3ES MC33FS8510D3ES NXP USA Inc. Description: FS8510
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BGA7127,118 BGA7127,118 NXP USA Inc. BGA7127.pdf Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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S912ZVMC12F3MKHR S912ZVMC12F3MKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVMC12F3MKH S912ZVMC12F3MKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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P87C660X2FAA529 NXP USA Inc. RE_DSHEET_P8xC660X2-C661X2_REI.pdf?u=5oefqw Description: 80C51 8-BIT MCU FAMILY
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56+12.05 EUR
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PZM9.1NB2,115 PZM9.1NB2,115 NXP USA Inc. Description: DIODE ZENER 9.1V 300MW SMT3
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Supplier Device Package: SMT3; MPAK
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
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PZM12NB2A,115 PZM12NB2A,115 NXP USA Inc. Description: DIODE ZENER 12V 220MW SMT3
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 220 mW
Supplier Device Package: SMT3; MPAK
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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SA56004ED,112 SA56004ED,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Part Status: Obsolete
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
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PSMN2R2-40PS PSMN2R2-40PS NXP USA Inc. PSMN2R2-40PS.pdf Description: NOW NEXPERIA PSMN2R2-40BS - POWE
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PSMN2R6-60PSQ127 PSMN2R6-60PSQ127 NXP USA Inc. PSMN2R6-60PS.pdf Description: MOSFET N-CH 60V 150A TO220AB
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PSMN2R8-25MLC115 NXP USA Inc. PSMN2R8-25MLC.pdf Description: NOW NEXPERIA PSMN2R8-25MLC 70A,
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PSMN2R2-40PS127 NXP USA Inc. Description: 100A, 40V, 0.0022OHM, N CHANNE
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PSMN3R5-80PS NXP USA Inc. PHGLS22694-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PSMN3R5-80PS - POWE
Packaging: Bulk
Produkt ist nicht verfügbar
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PSMN3R2-25YLC,115 PSMN3R2-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
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PSMN3R2-25YLC,115 PSMN3R2-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
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BUK7E1R6-30E,127 BUK7E1R6-30E,127 NXP USA Inc. BUK7E1R6-30E.pdf Description: MOSFET N-CH 30V 120A I2PAK
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MPC8347CZQAGDB MPC8347CZQAGDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
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MPC8347CZQAGDB MPC8347CZQAGDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
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MCIMX7S3DVK08SD MCIMX7S3DVK08SD NXP USA Inc. IMX7SCEC.pdf Description: IC MPU I.MX7S 800MHZ 488TFBGA
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 488-TFBGA (12x12)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 488-TFBGA
Packaging: Tray
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MMRF1312GSR5 MMRF1312GSR5 NXP USA Inc. MMRF1312H.pdf Description: TRANS 960-1215MHZ 1000W PEAK 50V
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS
Gain: 19.6dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Mounting Type: Surface Mount
Package / Case: NI-1230-4S GW
Packaging: Tape & Reel (TR)
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PCA6416APW,118 PCA6416APW,118 NXP USA Inc. PCA6416A.pdf Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Clock Frequency: 400 kHz
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Cut Tape (CT)
Part Status: Active
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 24-TSSOP
Interrupt Output: Yes
DigiKey Programmable: Not Verified
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8+2.38 EUR
11+1.73 EUR
25+1.57 EUR
100+1.4 EUR
250+1.32 EUR
500+1.26 EUR
1000+1.22 EUR
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MPC8536AVJAULA MPC8536AVJAULA NXP USA Inc. MPC8535EEC.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 90°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Bulk
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MC908JK1EMDWE NXP USA Inc. MC68HC08JL3.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Produkt ist nicht verfügbar
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MC908JB8FBE557 MC908JB8FBE557 NXP USA Inc. MC68HC908JB8.pdf Description: MICROCONTROLLER, 8 BIT, HC08/S08
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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PEMI8QFN/HT,132 PEMI8QFN/HT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
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PR601HL/C1,557 PR601HL/C1,557 NXP USA Inc. PR601.pdf Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
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KIT33908MBEVBE NXP USA Inc. MC33907_8.pdf Description: KIT EVAL MC33908 MOTHER BOARD PO
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33908
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19031AET/1J TEA19031AET/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
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TEA19031ADT/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Power (Watts): 45 W
Part Status: Obsolete
Control Features: EN
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 10MHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC5554AZP132 MPC5554AZP132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -55°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Produkt ist nicht verfügbar
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BUK7E2R3-40E,127-NXP NXP USA Inc. Description: PFET, 120A I(D), 40V, 0.0023OHM,
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Packaging: Tube
Produkt ist nicht verfügbar
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PCA9519PW118 PCA9519PW118 NXP USA Inc. PCA9519.pdf Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Delay Time: 105ns
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Capacitance - Input: 2 pF
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
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PCA9518APW NXP USA Inc. PHGLS18251-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9516APW NXP USA Inc. PHGLS19265-1.pdf?t.download=true&u=5oefqw Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9516APW,112 PCA9516APW,112 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 16TSSOP
Capacitance - Input: 6 pF
Part Status: Obsolete
Supplier Device Package: 16-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 5mA
Applications: I²C
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 5
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74AHCT241BQ,115 74AHCT241BQ,115 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Part Status: Obsolete
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN070-200B PSMN070-200B NXP USA Inc. PHGLS21832-1.pdf?t.download=true&u=5oefqw Description: 35A, 200V, 0.07OHM, N-CHANNEL
Produkt ist nicht verfügbar
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MC9S12GC32CFUE MC9S12GC32CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33FS6512NAE MC33FS6512NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512NAER2 MC33FS6512NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MPC8572CLVJAULE NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.333GHZ 1023BGA
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MPC8360VVALFHA NXP USA Inc. FSCLS05951-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
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MK22DN512VDC5 MK22DN512VDC5 NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-XFBGA (8x8)
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MK22FN256VMP12 MK22FN256VMP12 NXP USA Inc. K22P121M120SF8.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5646CF0VMJ1R SPC5646CF0VMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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LX2160SE72232B
LX2160SE72232B
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Produkt ist nicht verfügbar
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SPC5644BF0MLU8
SPC5644BF0MLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BF0MLU8R
SPC5644BF0MLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2120SC72232B
LX2120SC72232B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Produkt ist nicht verfügbar
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SPC5603BK0VLQ4R MPC5602D.pdf
SPC5603BK0VLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8347CVVAJDB MPC8347EEC.pdf
MPC8347CVVAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Bulk
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LD6805K/20P,115 LD6805.pdf
LD6805K/20P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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74AUP1G32GN,132 74AUP1G32.pdf
74AUP1G32GN,132
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 6XSON
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2002+0.25 EUR
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SPC5644CF0VLU1R
SPC5644CF0VLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF6V2300NR5578 FSCLS05117-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: N CHANNEL ENHANCEMENT-MODE RF PO
Produkt ist nicht verfügbar
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LPC54607J256ET180E LPC546XX.pdf
LPC54607J256ET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
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1+17.67 EUR
10+13.85 EUR
25+12.9 EUR
189+11.49 EUR
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BUJ303B,127 PHGLS23281-1.pdf?t.download=true&u=5oefqw
BUJ303B,127
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 5A TO-220AB
Power - Max: 100 W
Voltage - Collector Emitter Breakdown (Max): 400 V
Current - Collector (Ic) (Max): 5 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 23 @ 800mA, 3V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 1A, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
auf Bestellung 3000 Stücke:
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AnzahlPreis
859+0.59 EUR
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LD6836TD/14P,125 LD6836.pdf
LD6836TD/14P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 5TSOP
Produkt ist nicht verfügbar
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MC33FS8510D3ESR2
MC33FS8510D3ESR2
Hersteller: NXP USA Inc.
Description: FS8510
Produkt ist nicht verfügbar
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MC33FS8510D3ES
MC33FS8510D3ES
Hersteller: NXP USA Inc.
Description: FS8510
Produkt ist nicht verfügbar
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BGA7127,118 BGA7127.pdf
BGA7127,118
Hersteller: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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AnzahlPreis
204+2.4 EUR
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S912ZVMC12F3MKHR S12ZVMFS.pdf
S912ZVMC12F3MKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVMC12F3MKH S12ZVMFS.pdf
S912ZVMC12F3MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P87C660X2FAA529 RE_DSHEET_P8xC660X2-C661X2_REI.pdf?u=5oefqw
Hersteller: NXP USA Inc.
Description: 80C51 8-BIT MCU FAMILY
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AnzahlPreis
56+12.05 EUR
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PZM9.1NB2,115
PZM9.1NB2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 9.1V 300MW SMT3
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Supplier Device Package: SMT3; MPAK
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
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AnzahlPreis
8876+0.049 EUR
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PZM12NB2A,115
PZM12NB2A,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 12V 220MW SMT3
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 220 mW
Supplier Device Package: SMT3; MPAK
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
8876+0.049 EUR
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SA56004ED,112 SA56004X.pdf
SA56004ED,112
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Part Status: Obsolete
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Produkt ist nicht verfügbar
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PSMN2R2-40PS PSMN2R2-40PS.pdf
PSMN2R2-40PS
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PSMN2R2-40BS - POWE
auf Bestellung 1500 Stücke:
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AnzahlPreis
202+2.66 EUR
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PSMN2R6-60PSQ127 PSMN2R6-60PS.pdf
PSMN2R6-60PSQ127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 150A TO220AB
Produkt ist nicht verfügbar
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PSMN2R8-25MLC115 PSMN2R8-25MLC.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PSMN2R8-25MLC 70A,
Produkt ist nicht verfügbar
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PSMN2R2-40PS127
Hersteller: NXP USA Inc.
Description: 100A, 40V, 0.0022OHM, N CHANNE
Produkt ist nicht verfügbar
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PSMN3R5-80PS PHGLS22694-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PSMN3R5-80PS - POWE
Packaging: Bulk
Produkt ist nicht verfügbar
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PSMN3R2-25YLC,115
PSMN3R2-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN3R2-25YLC,115
PSMN3R2-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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BUK7E1R6-30E,127 BUK7E1R6-30E.pdf
BUK7E1R6-30E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A I2PAK
auf Bestellung 295 Stücke:
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AnzahlPreis
295+2.18 EUR
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MPC8347CZQAGDB MPC8347EEC.pdf
MPC8347CZQAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
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AnzahlPreis
4+113.08 EUR
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MPC8347CZQAGDB MPC8347EEC.pdf
MPC8347CZQAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Produkt ist nicht verfügbar
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MCIMX7S3DVK08SD IMX7SCEC.pdf
MCIMX7S3DVK08SD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 488-TFBGA (12x12)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 488-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MMRF1312GSR5 MMRF1312H.pdf
MMRF1312GSR5
Hersteller: NXP USA Inc.
Description: TRANS 960-1215MHZ 1000W PEAK 50V
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S GULL
Technology: LDMOS
Gain: 19.6dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Mounting Type: Surface Mount
Package / Case: NI-1230-4S GW
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA6416APW,118 PCA6416A.pdf
PCA6416APW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Clock Frequency: 400 kHz
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Cut Tape (CT)
Part Status: Active
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 24-TSSOP
Interrupt Output: Yes
DigiKey Programmable: Not Verified
auf Bestellung 3575 Stücke:
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AnzahlPreis
8+2.38 EUR
11+1.73 EUR
25+1.57 EUR
100+1.4 EUR
250+1.32 EUR
500+1.26 EUR
1000+1.22 EUR
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MPC8536AVJAULA MPC8535EEC.pdf
MPC8536AVJAULA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 90°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Bulk
auf Bestellung 10 Stücke:
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AnzahlPreis
2+440.48 EUR
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MC908JK1EMDWE MC68HC08JL3.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Produkt ist nicht verfügbar
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MC908JB8FBE557 MC68HC908JB8.pdf
MC908JB8FBE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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PEMI8QFN/HT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 12000 Stücke:
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AnzahlPreis
1567+0.31 EUR
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PR601HL/C1,557 PR601.pdf
PR601HL/C1,557
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
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AnzahlPreis
35+18.93 EUR
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KIT33908MBEVBE MC33907_8.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL MC33908 MOTHER BOARD PO
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33908
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19031AET/1J TEA19031AT.pdf
TEA19031AET/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
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TEA19031ADT/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Power (Watts): 45 W
Part Status: Obsolete
Control Features: EN
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 10MHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC5554AZP132 MPC5554.pdf
MPC5554AZP132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -55°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Produkt ist nicht verfügbar
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BUK7E2R3-40E,127-NXP
Hersteller: NXP USA Inc.
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Packaging: Tube
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PCA9519PW118 PCA9519.pdf
PCA9519PW118
Hersteller: NXP USA Inc.
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Delay Time: 105ns
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Capacitance - Input: 2 pF
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
auf Bestellung 2500 Stücke:
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AnzahlPreis
119+4.08 EUR
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PCA9518APW PHGLS18251-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
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PCA9516APW PHGLS19265-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9516APW,112 PCA9516A.pdf
PCA9516APW,112
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Capacitance - Input: 6 pF
Part Status: Obsolete
Supplier Device Package: 16-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 5mA
Applications: I²C
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 5
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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74AHCT241BQ,115 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241BQ,115
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Part Status: Obsolete
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN070-200B PHGLS21832-1.pdf?t.download=true&u=5oefqw
PSMN070-200B
Hersteller: NXP USA Inc.
Description: 35A, 200V, 0.07OHM, N-CHANNEL
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MC9S12GC32CFUE MC9S12C128V1.pdf
MC9S12GC32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC33FS6512NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS6512NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MPC8572CLVJAULE MPC8572E.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+849.66 EUR
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MPC8360VVALFHA FSCLS05951-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
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MK22DN512VDC5
MK22DN512VDC5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-XFBGA (8x8)
Produkt ist nicht verfügbar
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MK22FN256VMP12 K22P121M120SF8.pdf
MK22FN256VMP12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5646CF0VMJ1R
SPC5646CF0VMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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