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PEMI8QFN/HT,132 PEMI8QFN/HT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
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PR601HL/C1,557 PR601HL/C1,557 NXP USA Inc. PR601.pdf Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
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KIT33908MBEVBE NXP USA Inc. MC33907_8.pdf Description: KIT EVAL MC33908 MOTHER BOARD PO
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33908
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19031AET/1J TEA19031AET/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
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TEA19031ADT/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Power (Watts): 45 W
Part Status: Obsolete
Control Features: EN
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 10MHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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MPC5554AZP132 MPC5554AZP132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -55°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
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BUK7E2R3-40E,127-NXP NXP USA Inc. Description: PFET, 120A I(D), 40V, 0.0023OHM,
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Packaging: Tube
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PCA9519PW118 PCA9519PW118 NXP USA Inc. PCA9519.pdf Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Delay Time: 105ns
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Capacitance - Input: 2 pF
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
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PCA9518APW NXP USA Inc. PHGLS18251-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
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PCA9516APW NXP USA Inc. PHGLS19265-1.pdf?t.download=true&u=5oefqw Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9516APW,112 PCA9516APW,112 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 16TSSOP
Capacitance - Input: 6 pF
Part Status: Obsolete
Supplier Device Package: 16-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 5mA
Applications: I²C
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 5
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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74AHCT241BQ,115 74AHCT241BQ,115 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Part Status: Obsolete
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PSMN070-200B PSMN070-200B NXP USA Inc. PHGLS21832-1.pdf?t.download=true&u=5oefqw Description: 35A, 200V, 0.07OHM, N-CHANNEL
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MC9S12GC32CFUE MC9S12GC32CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC33FS6512NAE MC33FS6512NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512NAER2 MC33FS6512NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MPC8572CLVJAULE NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.333GHZ 1023BGA
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MPC8360VVALFHA NXP USA Inc. FSCLS05951-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
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MK22DN512VDC5 MK22DN512VDC5 NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-XFBGA (8x8)
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MK22FN256VMP12 MK22FN256VMP12 NXP USA Inc. K22P121M120SF8.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
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SPC5646CF0VMJ1R SPC5646CF0VMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
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NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Bulk
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
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FXPS7250DI4ST1 FXPS7250DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7165DI4ST1 FXPS7165DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7400DI4T1 FXPS7400DI4T1 NXP USA Inc. FXPS7400D4.pdf Description: 20-400 KPA BAP DIG I2C
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FXPS7400DI4ST1 FXPS7400DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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FXPS7165DI4T1 FXPS7165DI4T1 NXP USA Inc. FXPS7165D4.pdf Description: 60-165 KPA BAP DIG I2C
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FXPS7115DI4ST1 FXPS7115DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
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MC9328MXLCVM15 MC9328MXLCVM15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 256BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
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MC68302RC20C MC68302RC20C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 20MHZ 132PGA
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PGA (34.5x34.5)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 132-BPGA Exposed Pad
Packaging: Tray
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MC68302EH20C NXP USA Inc. MC68302.pdf Description: M68000 MICROPROCESSOR IC SERIES
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PHPT60410PY115 PHPT60410PY115 NXP USA Inc. PHPT60410PY.pdf Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
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PHPT60410NY115 PHPT60410NY115 NXP USA Inc. PHPT60410NY.pdf Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
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SPC5746CFK1ACMH6 SPC5746CFK1ACMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SPC5744CBK1ACMH6 SPC5744CBK1ACMH6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
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BBY31,215 BBY31,215 NXP USA Inc. DS_568_BBY31.pdf Description: DIODE UHF VAR CAP 30V SOT-23
Capacitance Ratio: 8.3
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
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TJA1042AT/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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NX20P5090UK041 NXP USA Inc. PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF Description: NX20P5090UK - BUFFER/INVERTER BA
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MCF5272VM66 MCF5272VM66 NXP USA Inc. MCF5272UM.pdf Description: IC MCU 32BIT 16KB ROM 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROM
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 1K x 32
Program Memory Size: 16KB (4K x 32)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
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MCF5206EAB40 MCF5206EAB40 NXP USA Inc. MCF5206EFS.pdf Description: IC MPU MCF520X 40MHZ 160QFP
Part Status: Obsolete
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 160-QFP (28x28)
Voltage - I/O: 3.3V
Core Processor: Coldfire V2
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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MRF24301HR5178 NXP USA Inc. ROCELEC_1.pdf?t.download=true&u=ovmfp3 Description: 300W 32V RF POWER TRANSISTOR
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mpc8250aczumhbc mpc8250aczumhbc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8250ACVVMHBC MPC8250ACVVMHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132N,112 NXP USA Inc. 74LV132.pdf Description: IC GATE NAND 4CH 2IN 14DIP
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74LV367D,112 74LV367D,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16SO
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Produkt ist nicht verfügbar
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74LV367N,112 74LV367N,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 SPC5603BF2CLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
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PDTA113ZE,115 PDTA113ZE,115 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
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PDTA113EE,115 PDTA113EE,115 NXP USA Inc. PHGLS19170-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Emitter Base (R2): 1 kOhms
Resistor - Base (R1): 1 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665ATF4AE NXP USA Inc. MC33665A_SDS.pdf Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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100+13.02 EUR
250+12.46 EUR
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A3I20D040WNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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A3I20D040WGNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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AFSC5G23D37T2 NXP USA Inc. AFSC5G23D37.pdf Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35D37T2 NXP USA Inc. AFSC5G35D37.pdf Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Supplier Device Package: 26-HLQFN (10x6)
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 NXP USA Inc. A3I35D012WN.pdf Description: AIRFAST RF LDMOS WIDEBAND INTEGR
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PMGD130UN,115 PMGD130UN,115 NXP USA Inc. PMGD130UN.pdf Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Supplier Device Package: 6-TSSOP
Vgs(th) (Max) @ Id: 1V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Drain to Source Voltage (Vdss): 20V
Power - Max: 390mW
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8255ACVVMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
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MPC8347ECVRADDB NXP USA Inc. MPC8347EAEC.pdf Description: IC MPU MPC83XX 266MHZ 620BGA
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-PBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Additional Interfaces: DUART, I2C, PCI, SPI
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PEMI8QFN/HT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
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PR601HL/C1,557 PR601.pdf
PR601HL/C1,557
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 100-LQFP (14x14)
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35+22.53 EUR
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KIT33908MBEVBE MC33907_8.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL MC33908 MOTHER BOARD PO
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33908
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA19031AET/1J TEA19031AT.pdf
TEA19031AET/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
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TEA19031ADT/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Power (Watts): 45 W
Part Status: Obsolete
Control Features: EN
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Supplier Device Package: 10-SO
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Output Isolation: Isolated
Internal Switch(s): Yes
Frequency - Switching: 10MHz
Operating Temperature: -25°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC5554AZP132 MPC5554.pdf
MPC5554AZP132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -55°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
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BUK7E2R3-40E,127-NXP
Hersteller: NXP USA Inc.
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 293W (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Packaging: Tube
Produkt ist nicht verfügbar
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PCA9519PW118 PCA9519.pdf
PCA9519PW118
Hersteller: NXP USA Inc.
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Delay Time: 105ns
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Capacitance - Input: 2 pF
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
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PCA9518APW PHGLS18251-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
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PCA9516APW PHGLS19265-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9516APW,112 PCA9516A.pdf
PCA9516APW,112
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Capacitance - Input: 6 pF
Part Status: Obsolete
Supplier Device Package: 16-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 5mA
Applications: I²C
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 5
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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74AHCT241BQ,115 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241BQ,115
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Part Status: Obsolete
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN070-200B PHGLS21832-1.pdf?t.download=true&u=5oefqw
PSMN070-200B
Hersteller: NXP USA Inc.
Description: 35A, 200V, 0.07OHM, N-CHANNEL
Produkt ist nicht verfügbar
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MC9S12GC32CFUE MC9S12C128V1.pdf
MC9S12GC32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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MC33FS6512NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS6512NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MPC8572CLVJAULE MPC8572E.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
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MPC8360VVALFHA FSCLS05951-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
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MK22DN512VDC5
MK22DN512VDC5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-XFBGA (8x8)
Produkt ist nicht verfügbar
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MK22FN256VMP12 K22P121M120SF8.pdf
MK22FN256VMP12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
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SPC5646CF0VMJ1R
SPC5646CF0VMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 6µA
Propagation Delay (Max): 800ns
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 6-XFDFN
Packaging: Bulk
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA @ 5.5V
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FXPS7250DI4ST1
FXPS7250DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7165DI4ST1
FXPS7165DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7400DI4T1 FXPS7400D4.pdf
FXPS7400DI4T1
Hersteller: NXP USA Inc.
Description: 20-400 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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FXPS7400DI4ST1
FXPS7400DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
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FXPS7165DI4T1 FXPS7165D4.pdf
FXPS7165DI4T1
Hersteller: NXP USA Inc.
Description: 60-165 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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FXPS7115DI4ST1
FXPS7115DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MC9328MXLCVM15 MC9328MXL.pdf
MC9328MXLCVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256BGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Produkt ist nicht verfügbar
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MC68302RC20C MC68302TIMING.pdf
MC68302RC20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PGA (34.5x34.5)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 132-BPGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC68302EH20C MC68302.pdf
Hersteller: NXP USA Inc.
Description: M68000 MICROPROCESSOR IC SERIES
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PHPT60410PY115 PHPT60410PY.pdf
PHPT60410PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Produkt ist nicht verfügbar
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PHPT60410NY115 PHPT60410NY.pdf
PHPT60410NY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Produkt ist nicht verfügbar
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SPC5746CFK1ACMH6
SPC5746CFK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5744CBK1ACMH6 MPC5746C-Datasheet.pdf
SPC5744CBK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BBY31,215 DS_568_BBY31.pdf
BBY31,215
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOT-23
Capacitance Ratio: 8.3
Voltage - Peak Reverse (Max): 30 V
Part Status: Obsolete
Supplier Device Package: SOT-23 (TO-236AB)
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TJA1042AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
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2500+2.13 EUR
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NX20P5090UK041 PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF
Hersteller: NXP USA Inc.
Description: NX20P5090UK - BUFFER/INVERTER BA
Produkt ist nicht verfügbar
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MCF5272VM66 MCF5272UM.pdf
MCF5272VM66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROM
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 1K x 32
Program Memory Size: 16KB (4K x 32)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MCF5206EAB40 MCF5206EFS.pdf
MCF5206EAB40
Hersteller: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Part Status: Obsolete
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 160-QFP (28x28)
Voltage - I/O: 3.3V
Core Processor: Coldfire V2
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MRF24301HR5178 ROCELEC_1.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
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mpc8250aczumhbc MPC8250.pdf
mpc8250aczumhbc
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8250ACVVMHBC MPC8250.pdf
MPC8250ACVVMHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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74LV132N,112 74LV132.pdf
74LV132N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
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74LV367D,112 74LV367.pdf
74LV367D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Supplier Device Package: 16-SO
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Produkt ist nicht verfügbar
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74LV367N,112 74LV367.pdf
74LV367N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 2, 4 (Hex)
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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SPC5603BF2CLL6 MPC5604BC.pdf
SPC5603BF2CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTA113ZE,115 PDTA113Z_SER.pdf
PDTA113ZE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
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PDTA113EE,115 PHGLS19170-1.pdf?t.download=true&u=5oefqw
PDTA113EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Resistor - Emitter Base (R2): 1 kOhms
Resistor - Base (R1): 1 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Transistor Type: PNP - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33665ATF4AE MC33665A_SDS.pdf
MC33665ATF4AE
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
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AnzahlPrivatkunde
2+19.54 EUR
10+15.26 EUR
25+14.2 EUR
100+13.02 EUR
250+12.46 EUR
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A3I20D040WNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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A3I20D040WGNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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AFSC5G23D37T2 AFSC5G23D37.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 27DB HLQFN26
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
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AFSC5G35D37T2 AFSC5G35D37.pdf
Hersteller: NXP USA Inc.
Description: IC AMP 5G LTE 3.4-3.6GHZ 26HLQFN
Supplier Device Package: 26-HLQFN (10x6)
Gain: 31dB
Voltage - Supply: 0V ~ 32V
RF Type: 5G, LTE
Frequency: 3.4GHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: 26-LQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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A3I35D012WGNR1 A3I35D012WN.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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PMGD130UN,115 PMGD130UN.pdf
PMGD130UN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 1.2A 6TSSOP
Supplier Device Package: 6-TSSOP
Vgs(th) (Max) @ Id: 1V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 4.5V
Rds On (Max) @ Id, Vgs: 145mOhm @ 1.2A, 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 83pF @ 10V
Current - Continuous Drain (Id) @ 25°C: 1.2A
Drain to Source Voltage (Vdss): 20V
Power - Max: 390mW
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC8255ACVVMHBB MPC8260A.pdf
MPC8255ACVVMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC8347ECVRADDB MPC8347EAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-PBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Bulk
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+213.08 EUR
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