Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34435) > Seite 451 nach 574
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PZU602DB2115 | NXP USA Inc. |
 Description: DIODE ZENER |
auf Bestellung 5987 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT16212DGG,112 | NXP USA Inc. |
Description: IC BUS FET EXC SW 12X2:2 56TSSOP Packaging: Tube Package / Case: 56-TFSOP (0.240", 6.10mm Width) Mounting Type: Surface Mount Circuit: 12 x 2:2 Type: Bus FET Exchange Switch Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 56-TSSOP |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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| 8MPLUSLPD4-PEVK | NXP USA Inc. |
Description: I.MX 8M PLUS EVAL KIT Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply Core Processor: ARM® Cortex®-A53, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX 8 Operating System: Android, FreeRTOS, Linux Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16374ADL,112-NXP | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2- Packaging: Tube Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 20 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 48-SSOP Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74LVC16374ADGG-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74LVC163D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC163D - BINARY |
Produkt ist nicht verfügbar |
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| S32K148EVB-Q144 | NXP USA Inc. |
Description: S32K148 EVAL BRD |
Produkt ist nicht verfügbar |
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| MCIMX286CVM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
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| MCIMX286DVM4CR | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
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MCIMX286CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
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| MCIMX285AVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Produkt ist nicht verfügbar |
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MC9S12DJ256CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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| CBT3306PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
auf Bestellung 2729 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3306D-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
Produkt ist nicht verfügbar |
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BZX84-C3V3/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V |
Produkt ist nicht verfügbar |
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| MC908KX2CDWE-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 2KB (2K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 4263 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F280BN,602 | NXP USA Inc. |
Description: IC PARITY GEN/CHKER 9-BIT 14DIP |
Produkt ist nicht verfügbar |
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LPC1827JET100E | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100TFBGA |
Produkt ist nicht verfügbar |
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| PSMN9RO-25YLC115 | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
Produkt ist nicht verfügbar |
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74ABT821DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 10BIT 24SSOP |
auf Bestellung 708 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F5074D,602 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F273AN,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Non-Inverted Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 38 mA Current - Output High, Low: 1mA, 20mA Trigger Type: Positive Edge Clock Frequency: 170 MHz Supplier Device Package: 20-DIP Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
auf Bestellung 1852 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9516AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 400KHZ 16SO |
Produkt ist nicht verfügbar |
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BZX84-C3V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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| 74LVC14AWP112 | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC9S08DN32AMLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041AK | NXP USA Inc. |
Description: IC MCU K32W041 +15DBM 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5744PK1AMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K148HFT0VLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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MCIMX6Q5EYM10ADR | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA Packaging: Cut Tape (CT) Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 292 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54452CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-BGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
auf Bestellung 599 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82733MFM | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 100MHz Program Memory Size: 48KB (24K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC11U68JBD48K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 1358 Stücke: Lieferzeit 10-14 Tag (e) |
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_SOT226%20Pkg.jpg "BUK7E11-55B,127") |
BUK7E11-55B,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A I2PAK Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V Power Dissipation (Max): 157W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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BCP56135 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MCF52100CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA Packaging: Tray Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Part Status: Not For New Designs Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX884-B5V6315 | NXP USA Inc. |
Description: NOW NEXPERIA BZX884-B5V6 ZENER D |
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FS32K144MST0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Obsolete Number of I/O: 58 DigiKey Programmable: Not Verified |
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SPC5605BK0MLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
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SPC5605BK0MLQ4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC5536JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1730 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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PN7161B1EV/C100K | NXP USA Inc. |
Description: IC NFC CONTROLLER SPI VFBGA64 Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC Supplier Device Package: 64-VFBGA (4x4) Part Status: Active |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE18F256VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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~ES~56.jpg "MVR5510AMDAHESR2") |
MVR5510AMDAHESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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MVR5510AMDAHES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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BAS116L315 | NXP USA Inc. |
Description: BAS116L - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCZ33904C5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MC10XS6200EK574 | NXP USA Inc. |
Description: BUFFER/INVERTER PERIPHL DRIVER |
Produkt ist nicht verfügbar |
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MCZ33905CS3EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MCZ33903CP3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
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MCZ33905CD3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
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MCZ33905CD5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MC34903CP5EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP WITH CAN HIGH |
Produkt ist nicht verfügbar |
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| SAF7770EL/101S13AK | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S500K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray |
Produkt ist nicht verfügbar |
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| MHT2001NR1 | NXP USA Inc. | Description: RF LDMOS INTEGRATED POWER AMPLIF |
Produkt ist nicht verfügbar |
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QN9080CHN518 | NXP USA Inc. |
Description: BTLE SOC |
Produkt ist nicht verfügbar |
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MC33772BTA1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BTA1AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
| PZU602DB2115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 5987 Stücke:
Lieferzeit 10-14 Tag (e)| CBT16212DGG,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 494+ | 0.98 EUR |
| 8MPLUSLPD4-PEVK |
|
Hersteller: NXP USA Inc.
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1157.85 EUR |
| 74LVC16374ADL,112-NXP |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
| 74LVC163D112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC163D - BINARY
Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
| MCIMX286CVM4CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
| MCIMX286DVM4CR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
| MCIMX286CVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
| MCIMX285AVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
| MC9S12DJ256CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Description: IC MCU 16BIT 256KB FLASH 80QFP
Produkt ist nicht verfügbar
| CBT3306PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2729+ | 0.23 EUR |
| CBT3306D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
| BZX84-C3V3/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Produkt ist nicht verfügbar
| MC908KX2CDWE-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 4263 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 52+ | 10.26 EUR |
| N74F280BN,602 |
|
Hersteller: NXP USA Inc.
Description: IC PARITY GEN/CHKER 9-BIT 14DIP
Description: IC PARITY GEN/CHKER 9-BIT 14DIP
Produkt ist nicht verfügbar
| LPC1827JET100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
| PSMN9RO-25YLC115 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
| 74ABT821DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 489+ | 1 EUR |
| N74F5074D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 286+ | 1.69 EUR |
| N74F273AN,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 1852 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 642+ | 0.77 EUR |
| PCA9516AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
| BZX84-C3V3/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 3.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| 74LVC14AWP112 |
Produkt ist nicht verfügbar
| MC9S08DN32AMLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 108+ | 7.69 EUR |
| K32W041AK |
Hersteller: NXP USA Inc.
Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC MCU K32W041 +15DBM 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5744PK1AMLQ8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| FS32K148HFT0VLQT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
| MCIMX6Q5EYM10ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 133.88 EUR |
| 10+ | 110.59 EUR |
| 100+ | 101.86 EUR |
| MCF54452CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 58.47 EUR |
| 10+ | 46.88 EUR |
| 80+ | 40.04 EUR |
| MC56F82733MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC11U68JBD48K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1358 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.01 EUR |
| 10+ | 10.21 EUR |
| 80+ | 8.45 EUR |
| 1000+ | 7.37 EUR |
| BUK7E11-55B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 370+ | 1.43 EUR |
| MCF52100CVM80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 21+ | 42.43 EUR |
| BZX884-B5V6315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
| FS32K144MST0CLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5605BK0MLQ4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5605BK0MLQ4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC5536JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.48 EUR |
| 10+ | 14.51 EUR |
| 160+ | 12.02 EUR |
| 960+ | 10.48 EUR |
| LPC5534JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 17.11 EUR |
| 10+ | 13.44 EUR |
| PN7161B1EV/C100K |
|
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.4 EUR |
| 10+ | 14.12 EUR |
| 25+ | 12.84 EUR |
| 80+ | 11.55 EUR |
| 230+ | 10.59 EUR |
| 440+ | 9.63 EUR |
| MKE18F256VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
| MVR5510AMDAHESR2 |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| MVR5510AMDAHES |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| MCZ33904C5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
| MC10XS6200EK574 |
|
Hersteller: NXP USA Inc.
Description: BUFFER/INVERTER PERIPHL DRIVER
Description: BUFFER/INVERTER PERIPHL DRIVER
Produkt ist nicht verfügbar
| MCZ33905CS3EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
| MCZ33905CD5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
| MC34903CP5EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Produkt ist nicht verfügbar
| SAF7770EL/101S13AK |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
| SAF4000EL/101S500K |
Produkt ist nicht verfügbar
| MHT2001NR1 |
Hersteller: NXP USA Inc.
Description: RF LDMOS INTEGRATED POWER AMPLIF
Description: RF LDMOS INTEGRATED POWER AMPLIF
Produkt ist nicht verfügbar
| MC33772BTA1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
| MC33772BTA1AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar