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74AHCT00BQ-Q100X 74AHCT00BQ-Q100X NXP USA Inc. PHGLS27999-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
auf Bestellung 2400 Stücke:
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2400+0.22 EUR
Mindestbestellmenge: 2400
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AFV10700HSR5 AFV10700HSR5 NXP USA Inc. AFV10700H.pdf Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 193 Stücke:
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1+785.24 EUR
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MCHC11F1VFNE4R NXP USA Inc. Description: HC11 SERIES MICROCONTROLLER IC 8
auf Bestellung 2340 Stücke:
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6+74.6 EUR
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SPC5746CBK1AMMH6 SPC5746CBK1AMMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5604BF2VLQ6R SPC5604BF2VLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AUP2G08GF,115 74AUP2G08GF,115 NXP USA Inc. PHGLS25971-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 2CH 2-INP 8XSON
auf Bestellung 173880 Stücke:
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1655+0.29 EUR
Mindestbestellmenge: 1655
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LPC3240FET296/01551 LPC3240FET296/01551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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LPC3240FET296/01,551 LPC3240FET296/01,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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LD6805K/12H,115 LD6805K/12H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 39750 Stücke:
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2959+0.17 EUR
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BZB84-B5V6215 BZB84-B5V6215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA BZB84-B5V6 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C12215 BZB84-C12215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA ZENER DIODE, 12V, 5
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
auf Bestellung 81600 Stücke:
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11632+0.048 EUR
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BZB84-C6V8,215 BZB84-C6V8,215 NXP USA Inc. PHGLS18928-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Produkt ist nicht verfügbar
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BGD702N,112 BGD702N,112 NXP USA Inc. BGD702N.pdf Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 435 mA
auf Bestellung 100 Stücke:
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10+55.2 EUR
Mindestbestellmenge: 10
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BZA862AVL,115 BZA862AVL,115 NXP USA Inc. BZA800AVL_SERIES.pdf Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1P2101DUF/02V NXP USA Inc. MF1P_H_X1Y1_SDS.pdf Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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MF1P4131DUD/02V NXP USA Inc. MF1P_H_X1Y1_SDS.pdf Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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MF1P2101DUD/02V NXP USA Inc. Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC908AP64CFAE,557 NXP USA Inc. Description: MICROCONTROLLER, 8 BIT, HC08/S08
Produkt ist nicht verfügbar
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BLF184XR112 NXP USA Inc. ROCELEC_blf184xr_blf184xrs.pdf?t.download=true&u=ovmfp3 Description: RF MOSFET LDMOS
Packaging: Bulk
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
1+905.92 EUR
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PCA9614DPZ PCA9614DPZ NXP USA Inc. PCA9614.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Produkt ist nicht verfügbar
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PCA9614DPZ PCA9614DPZ NXP USA Inc. PCA9614.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 1778 Stücke:
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3+5.88 EUR
10+4.42 EUR
25+4.05 EUR
100+3.65 EUR
250+3.46 EUR
500+3.35 EUR
1000+3.25 EUR
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74AXP1G06GNH 74AXP1G06GNH NXP USA Inc. PHGLS29168-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 159500 Stücke:
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2002+0.25 EUR
Mindestbestellmenge: 2002
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74AUP1G06GN,132 74AUP1G06GN,132 NXP USA Inc. PHGLS24870-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 5000 Stücke:
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2179+0.23 EUR
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74AUP1G06GFH 74AUP1G06GFH NXP USA Inc. PHGLS24870-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 14656 Stücke:
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1697+0.29 EUR
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74AUP2G06GF,132 74AUP2G06GF,132 NXP USA Inc. PHGLS25893-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 2CH 2-INP 6XSON
auf Bestellung 96533 Stücke:
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2036+0.25 EUR
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MCF54418CMJ250R MCF54418CMJ250R NXP USA Inc. MCF54418.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
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S912XDT384J1MAL S912XDT384J1MAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT384J1VAL S912XDT384J1VAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT384J1MALR S912XDT384J1MALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54S018JET180K LPC54S018JET180K NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
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2+17.02 EUR
10+13.34 EUR
25+12.42 EUR
189+11.06 EUR
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MKV31F256VLL12 MKV31F256VLL12 NXP USA Inc. KV31P100M120SF8.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTD1113ET215 PDTD1113ET215 NXP USA Inc. PDTD113E_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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A2T18S260W12NR3 NXP USA Inc. A2T18S260W12N.pdf Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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BAT54/6215 BAT54/6215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 18000 Stücke:
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18000+0.036 EUR
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MPC8321VRAFDCA MPC8321VRAFDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
auf Bestellung 40 Stücke:
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9+59.65 EUR
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LS1027AXN7HNA LS1027AXN7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MC68EN360VR25VL MC68EN360VR25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
auf Bestellung 32 Stücke:
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3+214.43 EUR
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NX3008NBKT115 NX3008NBKT115 NXP USA Inc. NX3008NBKT.pdf Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
auf Bestellung 217719 Stücke:
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9616+0.049 EUR
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TJA1442BT/0Z TJA1442BT/0Z NXP USA Inc. TJR1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
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2500+1.22 EUR
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TJA1442BT/0Z TJA1442BT/0Z NXP USA Inc. TJR1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11633 Stücke:
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7+2.73 EUR
10+2 EUR
25+1.82 EUR
100+1.62 EUR
250+1.52 EUR
500+1.46 EUR
1000+1.42 EUR
Mindestbestellmenge: 7
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NCF2951BTT/T0E081J NXP USA Inc. Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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BGM1014,115 BGM1014,115 NXP USA Inc. BGM1014.pdf Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Produkt ist nicht verfügbar
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TL431ASDT,215 TL431ASDT,215 NXP USA Inc. TL431_Family.pdf Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F5AZESR2 MMPF0100F5AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
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K32W061K K32W061K NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
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230+6.81 EUR
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PXT4403115 PXT4403115 NXP USA Inc. PXT4403.pdf Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
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S9S12ZVLS1F0VFM S9S12ZVLS1F0VFM NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 32QFN
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PCA24S08AD,118 PCA24S08AD,118 NXP USA Inc. PCA24S08A.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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S912ZVMC64F3WKH S912ZVMC64F3WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT00PW,118 74LVT00PW,118 NXP USA Inc. 74LVT00.pdf Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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MC68SEC000CAA16 MC68SEC000CAA16 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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RDGD31603PSMKEVM RDGD31603PSMKEVM NXP USA Inc. Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDGD31603PHSEVM RDGD31603PHSEVM NXP USA Inc. Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
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74AHCT123APW-Q100118 74AHCT123APW-Q100118 NXP USA Inc. 74AHC_AHCT123A_Q100.pdf Description: IC MULTIVIBRATOR
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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100+1.29 EUR
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500+1.16 EUR
1000+1.12 EUR
2500+1.08 EUR
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MPC885CVR66 MPC885CVR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC875VR66-NXP MPC875VR66-NXP NXP USA Inc. FSCLS03852-1.pdf?t.download=true&u=5oefqw Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Active
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74AHC164D112 74AHC164D112 NXP USA Inc. 74AHC_AHCT164.pdf Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T/1J NXP USA Inc. TEA2206T.pdf Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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74AHCT00BQ-Q100X PHGLS27999-1.pdf?t.download=true&u=5oefqw
74AHCT00BQ-Q100X
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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Anzahl Preis
2400+0.22 EUR
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AFV10700HSR5 AFV10700H.pdf
AFV10700HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 193 Stücke:
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Anzahl Preis
1+785.24 EUR
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MCHC11F1VFNE4R
Hersteller: NXP USA Inc.
Description: HC11 SERIES MICROCONTROLLER IC 8
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6+74.6 EUR
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SPC5746CBK1AMMH6
SPC5746CBK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5604BF2VLQ6R
SPC5604BF2VLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AUP2G08GF,115 PHGLS25971-1.pdf?t.download=true&u=5oefqw
74AUP2G08GF,115
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8XSON
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Anzahl Preis
1655+0.29 EUR
Mindestbestellmenge: 1655
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LPC3240FET296/01551 LPC3220_30_40_50.pdf
LPC3240FET296/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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LPC3240FET296/01,551 LPC3220_30_40_50.pdf
LPC3240FET296/01,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
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LD6805K/12H,115 LD6805.pdf
LD6805K/12H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 39750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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BZB84-B5V6215 BZB84_SER.pdf
BZB84-B5V6215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B5V6 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZB84-C12215 BZB84_SER.pdf
BZB84-C12215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 12V, 5
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Qualification: AEC-Q101
auf Bestellung 81600 Stücke:
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Anzahl Preis
11632+0.048 EUR
Mindestbestellmenge: 11632
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BZB84-C6V8,215 PHGLS18928-1.pdf?t.download=true&u=5oefqw
BZB84-C6V8,215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Produkt ist nicht verfügbar
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BGD702N,112 BGD702N.pdf
BGD702N,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 435 mA
auf Bestellung 100 Stücke:
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Anzahl Preis
10+55.2 EUR
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BZA862AVL,115 BZA800AVL_SERIES.pdf
BZA862AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1P2101DUF/02V MF1P_H_X1Y1_SDS.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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MF1P4131DUD/02V MF1P_H_X1Y1_SDS.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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MF1P2101DUD/02V
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MC908AP64CFAE,557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Produkt ist nicht verfügbar
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BLF184XR112 ROCELEC_blf184xr_blf184xrs.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Bulk
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+905.92 EUR
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PCA9614DPZ PCA9614.pdf
PCA9614DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Produkt ist nicht verfügbar
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PCA9614DPZ PCA9614.pdf
PCA9614DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 1778 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+5.88 EUR
10+4.42 EUR
25+4.05 EUR
100+3.65 EUR
250+3.46 EUR
500+3.35 EUR
1000+3.25 EUR
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74AXP1G06GNH PHGLS29168-1.pdf?t.download=true&u=5oefqw
74AXP1G06GNH
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.6V
Input Logic Level - Low: 0.7V
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 159500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2002+0.25 EUR
Mindestbestellmenge: 2002
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74AUP1G06GN,132 PHGLS24870-1.pdf?t.download=true&u=5oefqw
74AUP1G06GN,132
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2179+0.23 EUR
Mindestbestellmenge: 2179
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74AUP1G06GFH PHGLS24870-1.pdf?t.download=true&u=5oefqw
74AUP1G06GFH
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 14656 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1697+0.29 EUR
Mindestbestellmenge: 1697
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74AUP2G06GF,132 PHGLS25893-1.pdf?t.download=true&u=5oefqw
74AUP2G06GF,132
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP 6XSON
auf Bestellung 96533 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2036+0.25 EUR
Mindestbestellmenge: 2036
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MCF54418CMJ250R MCF54418.pdf
MCF54418CMJ250R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
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S912XDT384J1MAL
S912XDT384J1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT384J1VAL
S912XDT384J1VAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDT384J1MALR
S912XDT384J1MALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC54S018JET180K LPC540xx.pdf
LPC54S018JET180K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.02 EUR
10+13.34 EUR
25+12.42 EUR
189+11.06 EUR
Mindestbestellmenge: 2
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MKV31F256VLL12 KV31P100M120SF8.pdf
MKV31F256VLL12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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PDTD1113ET215 PDTD113E_SER.pdf
PDTD1113ET215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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A2T18S260W12NR3 A2T18S260W12N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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BAT54/6215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54/6215
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18000+0.036 EUR
Mindestbestellmenge: 18000
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MPC8321VRAFDCA MPC8323EEC.pdf
MPC8321VRAFDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+59.65 EUR
Mindestbestellmenge: 9
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LS1027AXN7HNA
LS1027AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MC68EN360VR25VL MC68360.pdf
MC68EN360VR25VL
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+214.43 EUR
Mindestbestellmenge: 3
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NX3008NBKT115 NX3008NBKT.pdf
NX3008NBKT115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
auf Bestellung 217719 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9616+0.049 EUR
Mindestbestellmenge: 9616
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TJA1442BT/0Z TJR1442.pdf
TJA1442BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.22 EUR
Mindestbestellmenge: 2500
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TJA1442BT/0Z TJR1442.pdf
TJA1442BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11633 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
10+2 EUR
25+1.82 EUR
100+1.62 EUR
250+1.52 EUR
500+1.46 EUR
1000+1.42 EUR
Mindestbestellmenge: 7
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NCF2951BTT/T0E081J
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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BGM1014,115 BGM1014.pdf
BGM1014,115
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Produkt ist nicht verfügbar
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TL431ASDT,215 TL431_Family.pdf
TL431ASDT,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F5AZESR2
MMPF0100F5AZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Produkt ist nicht verfügbar
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K32W061K K32W061.pdf
K32W061K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.72 EUR
10+9.04 EUR
25+8.24 EUR
80+7.42 EUR
230+6.81 EUR
440+6.59 EUR
Mindestbestellmenge: 2
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PXT4403115 PXT4403.pdf
PXT4403115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
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S9S12ZVLS1F0VFM S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS1F0VFM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Produkt ist nicht verfügbar
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PCA24S08AD,118 PCA24S08A.pdf
PCA24S08AD,118
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)
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S912ZVMC64F3WKH S12ZVMFS.pdf
S912ZVMC64F3WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT00PW,118 74LVT00.pdf
74LVT00PW,118
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 992 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
683+0.71 EUR
Mindestbestellmenge: 683
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MC68SEC000CAA16 MC68SEC000.pdf
MC68SEC000CAA16
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 1544 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+47.55 EUR
Mindestbestellmenge: 11
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RDGD31603PSMKEVM
RDGD31603PSMKEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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RDGD31603PHSEVM
RDGD31603PHSEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1650.99 EUR
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74AHCT123APW-Q100118 74AHC_AHCT123A_Q100.pdf
74AHCT123APW-Q100118
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+1.05 EUR
Mindestbestellmenge: 6000
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11614 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.22 EUR
11+1.6 EUR
25+1.45 EUR
100+1.29 EUR
250+1.21 EUR
500+1.16 EUR
1000+1.12 EUR
2500+1.08 EUR
Mindestbestellmenge: 8
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MPC885CVR66 MPC885EC.pdf
MPC885CVR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+96.46 EUR
Mindestbestellmenge: 6
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MPC875VR66-NXP FSCLS03852-1.pdf?t.download=true&u=5oefqw
MPC875VR66-NXP
Hersteller: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Active
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+51.73 EUR
Mindestbestellmenge: 10
Im Einkaufswagen  Stück im Wert von  UAH
74AHC164D112 74AHC_AHCT164.pdf
74AHC164D112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T.pdf
TEA2206T/1J
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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