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A3G26D055NT4 A3G26D055NT4 NXP USA Inc. A3G26D055N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
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A3G26D055NT4 A3G26D055NT4 NXP USA Inc. A3G26D055N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Cut Tape (CT)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 1796 Stücke:
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1+47.63 EUR
10+38.54 EUR
25+36.27 EUR
100+35.78 EUR
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A3G26D055N-2515 A3G26D055N-2515 NXP USA Inc. A3G26D055N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
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A3G26D055N-1805 A3G26D055N-1805 NXP USA Inc. A3G26D055N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 2 Stücke:
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1+495.26 EUR
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BYV10X-600P127 NXP USA Inc. PHGLS29129-1.pdf?t.download=true&u=5oefqw Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Produkt ist nicht verfügbar
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74AHCT139D,112 74AHCT139D,112 NXP USA Inc. PHGLS15529-1.pdf?t.download=true&u=5oefqw Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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2664+0.18 EUR
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AFIC10275NR5 AFIC10275NR5 NXP USA Inc. AFIC10275N.pdf Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
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MC9328MXLCVM15,557 MC9328MXLCVM15,557 NXP USA Inc. FSCLS05271-1.pdf?t.download=true&u=5oefqw Description: DRAGONBALL CORSICA
Produkt ist nicht verfügbar
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CLF1G0060S-10 CLF1G0060S-10 NXP USA Inc. PHGL-S-A0001943897-1.pdf?t.download=true&u=5oefqw Description: RF PFET, 1-ELEMENT, C BAND, GALL
auf Bestellung 384 Stücke:
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4+137.9 EUR
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MC34VR500VAES MC34VR500VAES NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500VAESR2 MC34VR500VAESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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74LV365DB,112 74LV365DB,112 NXP USA Inc. 74LV365.pdf Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
auf Bestellung 1092 Stücke:
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784+0.64 EUR
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JN5178/001K NXP USA Inc. JN517x.pdf Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Produkt ist nicht verfügbar
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TL431MFDT TL431MFDT NXP USA Inc. PHGL-S-A0001540004-1.pdf?t.download=true&u=5oefqw Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPF5020AMMA0ES MPF5020AMMA0ES NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 293 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.68 EUR
10+9.58 EUR
25+9.06 EUR
80+7.85 EUR
230+7.45 EUR
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MPF5023AMMA0ES MPF5023AMMA0ES NXP USA Inc. Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.7 EUR
10+8.76 EUR
25+8.35 EUR
80+7.25 EUR
230+6.92 EUR
490+6.31 EUR
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TDA18275AHN/C1518 TDA18275AHN/C1518 NXP USA Inc. TDA18275_SDS.pdf Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
auf Bestellung 833034 Stücke:
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446+1.08 EUR
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TDA18273HN/C1/S3518 TDA18273HN/C1/S3518 NXP USA Inc. PHGLS22818-1.pdf?t.download=true&u=5oefqw Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
auf Bestellung 8000 Stücke:
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96+5.21 EUR
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TDA18212HN/M/C1/S3518 TDA18212HN/M/C1/S3518 NXP USA Inc. Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 5026 Stücke:
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TDA18211HD/C2/S2551 TDA18211HD/C2/S2551 NXP USA Inc. _tda18211hd.pdf?t.download=true&u=ovmfp3 Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 46110 Stücke:
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SC18IS606-EVB SC18IS606-EVB NXP USA Inc. UM11666.pdf Description: EVAL BOARD FOR SC18IS606
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s)
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
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1+44 EUR
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SC18IS604-EVB SC18IS604-EVB NXP USA Inc. UM11665.pdf Description: EVAL BOARD FOR SC18IS604
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s)
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMI2QFN/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
auf Bestellung 10000 Stücke:
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4121+0.13 EUR
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LPC4317JBD144551 LPC4317JBD144551 NXP USA Inc. PHGLS25854-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
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LPC2210FBD144/01551 LPC2210FBD144/01551 NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Produkt ist nicht verfügbar
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MC56F82748VLH557 NXP USA Inc. MC56F827XXDS.pdf Description: MICROCONTROLLER 32-BIT FLASH
Produkt ist nicht verfügbar
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OM67200JP OM67200JP NXP USA Inc. A1006.pdf Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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PHN203,518-NX PHN203,518-NX NXP USA Inc. Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
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LD6805K/22P,115 LD6805K/22P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
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3206+0.16 EUR
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LD6805K/25H,115 LD6805K/25H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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3206+0.16 EUR
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LD6806F/18H,115 LD6806F/18H,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2219+0.23 EUR
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PZU602DB2115 PZU602DB2115 NXP USA Inc. PZUXDB2_SER.pdf Description: DIODE ZENER
auf Bestellung 5987 Stücke:
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CBT16212DGG,112 CBT16212DGG,112 NXP USA Inc. PHGLS15875-1.pdf?t.download=true&u=5oefqw Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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494+0.98 EUR
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8MPLUSLPD4-PEVK 8MPLUSLPD4-PEVK NXP USA Inc. IMX8MPLUSEVKFS.pdf Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
auf Bestellung 14 Stücke:
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1+1075.89 EUR
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74LVC16374ADL,112-NXP 74LVC16374ADL,112-NXP NXP USA Inc. Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC16374ADGG-Q100118 74LVC16374ADGG-Q100118 NXP USA Inc. 74LVC_LVCH16374A_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC163D112 NXP USA Inc. 74LVC163.pdf Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
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S32K148EVB-Q144 NXP USA Inc. S32K1xx.pdf Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
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MCIMX286CVM4CR2 NXP USA Inc. FSCLS07330-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286DVM4CR NXP USA Inc. FSCLS07330-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286CVM4C MCIMX286CVM4C NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX285AVM4C NXP USA Inc. IMX28AEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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CBT3306PW-Q100118 NXP USA Inc. CBT3306_Q100.pdf Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
Lieferzeit 10-14 Tag (e)
2729+0.23 EUR
Mindestbestellmenge: 2729
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CBT3306D-Q100118 CBT3306D-Q100118 NXP USA Inc. CBT3306_Q100.pdf Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1VL BZX84-C3V3/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC908KX2CDWE-NXP NXP USA Inc. FSCLS06738-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 4263 Stücke:
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52+10.26 EUR
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N74F280BN,602 N74F280BN,602 NXP USA Inc. N74F280B.pdf Description: IC PARITY GEN/CHKER 9-BIT 14DIP
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PSMN9RO-25YLC115 NXP USA Inc. Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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74ABT821DB,112 74ABT821DB,112 NXP USA Inc. 74ABT821.pdf Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
Lieferzeit 10-14 Tag (e)
489+1 EUR
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N74F5074D,602 N74F5074D,602 NXP USA Inc. 74F5074.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)
286+1.69 EUR
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PCA9516AD,118 PCA9516AD,118 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1R BZX84-C3V3/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC14AWP112 NXP USA Inc. Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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K32W041AK K32W041AK NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.5 EUR
Mindestbestellmenge: 3
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SPC5744PK1AMLQ8 SPC5744PK1AMLQ8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0VLQT FS32K148HFT0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR MCIMX6Q5EYM10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 751 Stücke:
Lieferzeit 10-14 Tag (e)
1+128.81 EUR
10+107.32 EUR
25+101.95 EUR
100+96.05 EUR
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MCF54452CVP200 MCF54452CVP200 NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.47 EUR
10+46.88 EUR
80+40.04 EUR
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MC56F82733MFM MC56F82733MFM NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U68JBD48K LPC11U68JBD48K NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1304 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.1 EUR
10+7.01 EUR
25+6.49 EUR
80+6.02 EUR
Mindestbestellmenge: 2
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A3G26D055NT4 A3G26D055N.pdf
A3G26D055NT4
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
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A3G26D055NT4 A3G26D055N.pdf
A3G26D055NT4
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Cut Tape (CT)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 1796 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+47.63 EUR
10+38.54 EUR
25+36.27 EUR
100+35.78 EUR
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A3G26D055N-2515 A3G26D055N.pdf
A3G26D055N-2515
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
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A3G26D055N-1805 A3G26D055N.pdf
A3G26D055N-1805
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+495.26 EUR
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BYV10X-600P127 PHGLS29129-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Produkt ist nicht verfügbar
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74AHCT139D,112 PHGLS15529-1.pdf?t.download=true&u=5oefqw
74AHCT139D,112
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 8950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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AFIC10275NR5 AFIC10275N.pdf
AFIC10275NR5
Hersteller: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
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MC9328MXLCVM15,557 FSCLS05271-1.pdf?t.download=true&u=5oefqw
MC9328MXLCVM15,557
Hersteller: NXP USA Inc.
Description: DRAGONBALL CORSICA
Produkt ist nicht verfügbar
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CLF1G0060S-10 PHGL-S-A0001943897-1.pdf?t.download=true&u=5oefqw
CLF1G0060S-10
Hersteller: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, C BAND, GALL
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+137.9 EUR
Mindestbestellmenge: 4
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MC34VR500VAES MC34VR500.pdf
MC34VR500VAES
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC34VR500VAESR2 MC34VR500.pdf
MC34VR500VAESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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74LV365DB,112 74LV365.pdf
74LV365DB,112
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
auf Bestellung 1092 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
784+0.64 EUR
Mindestbestellmenge: 784
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JN5178/001K JN517x.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Produkt ist nicht verfügbar
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TL431MFDT PHGL-S-A0001540004-1.pdf?t.download=true&u=5oefqw
TL431MFDT
Hersteller: NXP USA Inc.
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPF5020AMMA0ES
MPF5020AMMA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 293 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.68 EUR
10+9.58 EUR
25+9.06 EUR
80+7.85 EUR
230+7.45 EUR
Mindestbestellmenge: 2
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MPF5023AMMA0ES
MPF5023AMMA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.7 EUR
10+8.76 EUR
25+8.35 EUR
80+7.25 EUR
230+6.92 EUR
490+6.31 EUR
Mindestbestellmenge: 2
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TDA18275AHN/C1518 TDA18275_SDS.pdf
TDA18275AHN/C1518
Hersteller: NXP USA Inc.
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
auf Bestellung 833034 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
446+1.08 EUR
Mindestbestellmenge: 446
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TDA18273HN/C1/S3518 PHGLS22818-1.pdf?t.download=true&u=5oefqw
TDA18273HN/C1/S3518
Hersteller: NXP USA Inc.
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
96+5.21 EUR
Mindestbestellmenge: 96
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TDA18212HN/M/C1/S3518
TDA18212HN/M/C1/S3518
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 5026 Stücke:
Lieferzeit 10-14 Tag (e)
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TDA18211HD/C2/S2551 _tda18211hd.pdf?t.download=true&u=ovmfp3
TDA18211HD/C2/S2551
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 46110 Stücke:
Lieferzeit 10-14 Tag (e)
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SC18IS606-EVB UM11666.pdf
SC18IS606-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SC18IS606
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s)
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
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Anzahl Preis
1+44 EUR
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SC18IS604-EVB UM11665.pdf
SC18IS604-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SC18IS604
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Contents: Board(s)
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
auf Bestellung 10000 Stücke:
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Anzahl Preis
4121+0.13 EUR
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LPC4317JBD144551 PHGLS25854-1.pdf?t.download=true&u=5oefqw
LPC4317JBD144551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
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LPC2210FBD144/01551 LPC2210_2220.pdf
LPC2210FBD144/01551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Produkt ist nicht verfügbar
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MC56F82748VLH557 MC56F827XXDS.pdf
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Produkt ist nicht verfügbar
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OM67200JP A1006.pdf
OM67200JP
Hersteller: NXP USA Inc.
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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PHN203,518-NX
PHN203,518-NX
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
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LD6805K/22P,115 LD6805.pdf
LD6805K/22P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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3206+0.16 EUR
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LD6805K/25H,115 LD6805.pdf
LD6805K/25H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 54231 Stücke:
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Anzahl Preis
3206+0.16 EUR
Mindestbestellmenge: 3206
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LD6806F/18H,115 LD6806_Series.pdf
LD6806F/18H,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2219+0.23 EUR
Mindestbestellmenge: 2219
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PZU602DB2115 PZUXDB2_SER.pdf
PZU602DB2115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 5987 Stücke:
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CBT16212DGG,112 PHGLS15875-1.pdf?t.download=true&u=5oefqw
CBT16212DGG,112
Hersteller: NXP USA Inc.
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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494+0.98 EUR
Mindestbestellmenge: 494
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8MPLUSLPD4-PEVK IMX8MPLUSEVKFS.pdf
8MPLUSLPD4-PEVK
Hersteller: NXP USA Inc.
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
auf Bestellung 14 Stücke:
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Anzahl Preis
1+1075.89 EUR
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74LVC16374ADL,112-NXP
74LVC16374ADL,112-NXP
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC16374ADGG-Q100118 74LVC_LVCH16374A_Q100.pdf
74LVC16374ADGG-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC163D112 74LVC163.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
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S32K148EVB-Q144 S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
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MCIMX286CVM4CR2 FSCLS07330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286DVM4CR FSCLS07330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286CVM4C IMX28CEC.pdf
MCIMX286CVM4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX285AVM4C IMX28AEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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CBT3306PW-Q100118 CBT3306_Q100.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2729+0.23 EUR
Mindestbestellmenge: 2729
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CBT3306D-Q100118 CBT3306_Q100.pdf
CBT3306D-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V3/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC908KX2CDWE-NXP FSCLS06738-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 4263 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
52+10.26 EUR
Mindestbestellmenge: 52
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N74F280BN,602 N74F280B.pdf
N74F280BN,602
Hersteller: NXP USA Inc.
Description: IC PARITY GEN/CHKER 9-BIT 14DIP
Produkt ist nicht verfügbar
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PSMN9RO-25YLC115
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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74ABT821DB,112 74ABT821.pdf
74ABT821DB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
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Anzahl Preis
489+1 EUR
Mindestbestellmenge: 489
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N74F5074D,602 74F5074.pdf
N74F5074D,602
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
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Anzahl Preis
286+1.69 EUR
Mindestbestellmenge: 286
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PCA9516AD,118 PCA9516A.pdf
PCA9516AD,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V3/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC14AWP112
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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K32W041AK K32W041AM.pdf
K32W041AK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.5 EUR
Mindestbestellmenge: 3
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SPC5744PK1AMLQ8 MPC5744P.pdf
SPC5744PK1AMLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0VLQT S32K1xx.pdf
FS32K148HFT0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR IMX6DQAEC.pdf
MCIMX6Q5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 751 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+128.81 EUR
10+107.32 EUR
25+101.95 EUR
100+96.05 EUR
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MCF54452CVP200 MCF54455.pdf
MCF54452CVP200
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.47 EUR
10+46.88 EUR
80+40.04 EUR
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MC56F82733MFM MC56F827XXDS.pdf
MC56F82733MFM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U68JBD48K LPC11U6X.pdf
LPC11U68JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.1 EUR
10+7.01 EUR
25+6.49 EUR
80+6.02 EUR
Mindestbestellmenge: 2
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