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S912ZVMC64F3WKH S912ZVMC64F3WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT00PW,118 74LVT00PW,118 NXP USA Inc. 74LVT00.pdf Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 992 Stücke:
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683+0.71 EUR
Mindestbestellmenge: 683
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MC68SEC000CAA16 MC68SEC000CAA16 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 1544 Stücke:
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11+41.87 EUR
Mindestbestellmenge: 11
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RDGD31603PSMKEVM RDGD31603PSMKEVM NXP USA Inc. Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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RDGD31603PHSEVM RDGD31603PHSEVM NXP USA Inc. Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
auf Bestellung 4 Stücke:
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1+1650.99 EUR
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74AHCT123APW-Q100118 74AHCT123APW-Q100118 NXP USA Inc. 74AHC_AHCT123A_Q100.pdf Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
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6000+1.05 EUR
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11614 Stücke:
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8+2.22 EUR
11+1.6 EUR
25+1.45 EUR
100+1.29 EUR
250+1.21 EUR
500+1.16 EUR
1000+1.12 EUR
2500+1.08 EUR
Mindestbestellmenge: 8
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MPC885CVR66 MPC885CVR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 54 Stücke:
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6+84.98 EUR
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MPC875VR66-NXP MPC875VR66-NXP NXP USA Inc. FSCLS03852-1.pdf?t.download=true&u=5oefqw Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
10+51.73 EUR
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74AHC164D112 74AHC164D112 NXP USA Inc. 74AHC_AHCT164.pdf Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T/1J NXP USA Inc. TEA2206T.pdf Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T/1J NXP USA Inc. TEA2206T.pdf Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4464 Stücke:
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3+7.37 EUR
10+5.62 EUR
25+5.18 EUR
100+4.7 EUR
250+4.47 EUR
500+4.33 EUR
1000+4.21 EUR
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74ABT162245ADL112 74ABT162245ADL112 NXP USA Inc. 74ABT_ABTH162245A.pdf Description: NOW NEXPERIA 74ABT162245ADL - BU
auf Bestellung 816 Stücke:
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512+1.02 EUR
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SC18IS606PWJ SC18IS606PWJ NXP USA Inc. SC18IS606.pdf Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
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2500+3.09 EUR
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SC18IS606PWJ SC18IS606PWJ NXP USA Inc. SC18IS606.pdf Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3419 Stücke:
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4+5.76 EUR
10+4.33 EUR
25+3.98 EUR
100+3.58 EUR
250+3.4 EUR
500+3.28 EUR
1000+3.19 EUR
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SC18IS604PWJ SC18IS604PWJ NXP USA Inc. SC18IS604.pdf Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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SC18IS604PWJ SC18IS604PWJ NXP USA Inc. SC18IS604.pdf Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2200 Stücke:
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4+5.83 EUR
10+4.4 EUR
25+4.05 EUR
100+3.65 EUR
250+3.47 EUR
500+3.35 EUR
1000+3.26 EUR
Mindestbestellmenge: 4
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MCIMX6Q4AVT10ADR518 NXP USA Inc. IMX6DQCPOPEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC32PW/S400118 74AHC32PW/S400118 NXP USA Inc. PHGLS15531-1.pdf?t.download=true&u=5oefqw Description: OR GATE, AHC SERIES
Produkt ist nicht verfügbar
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S912XEQ512F1VAA S912XEQ512F1VAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512F1VAAR S912XEQ512F1VAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OMA1007TL-SKT NXP USA Inc. Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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MC32PF1550A3EP MC32PF1550A3EP NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC33VR5500V3ES NXP USA Inc. Description: VR5500
Produkt ist nicht verfügbar
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FRDMGD3160DSBHB FRDMGD3160DSBHB NXP USA Inc. UM11658.pdf Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: Graphical User Interface (GUI)
auf Bestellung 2 Stücke:
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1+1222.72 EUR
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BGA2771,115 BGA2771,115 NXP USA Inc. BGA2771_Rev_Nov2010.pdf Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G07GX147 74AUP2G07GX147 NXP USA Inc. 74AUP2G07.pdf Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
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945+0.48 EUR
Mindestbestellmenge: 945
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74ABT162245ADL653 74ABT162245ADL653 NXP USA Inc. 74ABT_ABTH162245A.pdf Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Produkt ist nicht verfügbar
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LPC11E67JBD48K LPC11E67JBD48K NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.92 EUR
10+6.83 EUR
25+6.31 EUR
100+5.74 EUR
250+5.46 EUR
500+5.3 EUR
Mindestbestellmenge: 2
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SCIMX6S6AVM083C NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tray
Produkt ist nicht verfügbar
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8CH-DMIC 8CH-DMIC NXP USA Inc. 8CH-DMIC-UM.pdf Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Contents: Board(s)
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Secondary Attributes: On-Board LEDs
Embedded: Yes
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+157.91 EUR
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LD6806TD/22P,125 LD6806TD/22P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
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2959+0.16 EUR
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P1014NSE5HFB557 NXP USA Inc. P1010EC.pdf Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
7+75.42 EUR
Mindestbestellmenge: 7
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FXLS8962AFR1 FXLS8962AFR1 NXP USA Inc. FXLS8962AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXLS8962AFR1 FXLS8962AFR1 NXP USA Inc. FXLS8962AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PEMI8QFN/LP,132 PEMI8QFN/LP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
1567+0.32 EUR
Mindestbestellmenge: 1567
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BF1102,115 BF1102,115 NXP USA Inc. BF1102%28R%29.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 15 mA
auf Bestellung 3000 Stücke:
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1110+0.45 EUR
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A2I09VD015GNR1 NXP USA Inc. A2I09VD015N.pdf Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Produkt ist nicht verfügbar
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MC33FS6510NAER2 MC33FS6510NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC07XSF517BEK MC07XSF517BEK NXP USA Inc. MC07XSF517EK.pdf Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
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P5040NSE72QC NXP USA Inc. FSCLS11784-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 64-BIT POWER ARCH SOC, 4
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T2081NSE8PTB NXP USA Inc. PHGL-S-A0004582645-1.pdf?t.download=true&u=5oefqw Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
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BLF6G20LS-180RN112 NXP USA Inc. Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BLF6G10LS-160RN112 BLF6G10LS-160RN112 NXP USA Inc. Description: RF MOSFET
Packaging: Bulk
Part Status: Active
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BLF6G10LS-135RN112 BLF6G10LS-135RN112 NXP USA Inc. Description: RF MOSFET LDMOS SOT502
Packaging: Bulk
Part Status: Active
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MCIMX6S5EVM10AD MCIMX6S5EVM10AD NXP USA Inc. IMX6SDLIEC.pdf Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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N74F27D,623 N74F27D,623 NXP USA Inc. 74F27.pdf Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
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TJA1463AT/0Z TJA1463AT/0Z NXP USA Inc. TJA1463.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
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TJA1463AT/0Z TJA1463AT/0Z NXP USA Inc. TJA1463.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2502 Stücke:
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100+1.63 EUR
250+1.54 EUR
500+1.48 EUR
1000+1.43 EUR
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PCF85063TP-ARD PCF85063TP-ARD NXP USA Inc. Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
auf Bestellung 10 Stücke:
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PCF85263ATT1/AZ PCF85263ATT1/AZ NXP USA Inc. PCF85263A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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PCF85263ATT1/AZ PCF85263ATT1/AZ NXP USA Inc. PCF85263A.pdf Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6648 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.29 EUR
10+2.04 EUR
25+1.93 EUR
100+1.59 EUR
250+1.48 EUR
500+1.31 EUR
1000+1.04 EUR
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PMCM6501VNE023 PMCM6501VNE023 NXP USA Inc. PMCM6501VNE.pdf Description: PMCM6501 N-CHANNEL, MOSFET
Produkt ist nicht verfügbar
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PMCM6501VPE023 PMCM6501VPE023 NXP USA Inc. PMCM6501VPE.pdf Description: SMALL SIGNAL FIELD-EFFECT TRANSI
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74LVC138APW/AU118 NXP USA Inc. PHGLS23389-1.pdf?t.download=true&u=5oefqw Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 49760 Stücke:
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2959+0.18 EUR
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74LVC138APW-Q100118 74LVC138APW-Q100118 NXP USA Inc. 74LVC138A_Q100.pdf Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 22994 Stücke:
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74ABT573AN,112 74ABT573AN,112 NXP USA Inc. 74ABT573A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 1332 Stücke:
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567+0.86 EUR
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MWCT1011CFM MWCT1011CFM NXP USA Inc. Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 83788 Stücke:
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86+5.92 EUR
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MK20DX256VMC7R MK20DX256VMC7R NXP USA Inc. K20P100M72SF1.pdf Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Produkt ist nicht verfügbar
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S912ZVMC64F3WKH S12ZVMFS.pdf
S912ZVMC64F3WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT00PW,118 74LVT00.pdf
74LVT00PW,118
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 992 Stücke:
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683+0.71 EUR
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MC68SEC000CAA16 MC68SEC000.pdf
MC68SEC000CAA16
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 1544 Stücke:
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11+41.87 EUR
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RDGD31603PSMKEVM
RDGD31603PSMKEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Box
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 6-Channel (Hex)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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RDGD31603PHSEVM
RDGD31603PHSEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
auf Bestellung 4 Stücke:
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Anzahl Preis
1+1650.99 EUR
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74AHCT123APW-Q100118 74AHC_AHCT123A_Q100.pdf
74AHCT123APW-Q100118
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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Anzahl Preis
6000+1.05 EUR
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11614 Stücke:
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Anzahl Preis
8+2.22 EUR
11+1.6 EUR
25+1.45 EUR
100+1.29 EUR
250+1.21 EUR
500+1.16 EUR
1000+1.12 EUR
2500+1.08 EUR
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MPC885CVR66 MPC885EC.pdf
MPC885CVR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 54 Stücke:
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Anzahl Preis
6+84.98 EUR
Mindestbestellmenge: 6
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MPC875VR66-NXP FSCLS03852-1.pdf?t.download=true&u=5oefqw
MPC875VR66-NXP
Hersteller: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+51.73 EUR
Mindestbestellmenge: 10
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74AHC164D112 74AHC_AHCT164.pdf
74AHC164D112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T.pdf
TEA2206T/1J
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T.pdf
TEA2206T/1J
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4464 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.37 EUR
10+5.62 EUR
25+5.18 EUR
100+4.7 EUR
250+4.47 EUR
500+4.33 EUR
1000+4.21 EUR
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74ABT162245ADL112 74ABT_ABTH162245A.pdf
74ABT162245ADL112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT162245ADL - BU
auf Bestellung 816 Stücke:
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Anzahl Preis
512+1.02 EUR
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SC18IS606PWJ SC18IS606.pdf
SC18IS606PWJ
Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+3.09 EUR
Mindestbestellmenge: 2500
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SC18IS606PWJ SC18IS606.pdf
SC18IS606PWJ
Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3419 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.76 EUR
10+4.33 EUR
25+3.98 EUR
100+3.58 EUR
250+3.4 EUR
500+3.28 EUR
1000+3.19 EUR
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SC18IS604PWJ SC18IS604.pdf
SC18IS604PWJ
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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SC18IS604PWJ SC18IS604.pdf
SC18IS604PWJ
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.83 EUR
10+4.4 EUR
25+4.05 EUR
100+3.65 EUR
250+3.47 EUR
500+3.35 EUR
1000+3.26 EUR
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MCIMX6Q4AVT10ADR518 IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC32PW/S400118 PHGLS15531-1.pdf?t.download=true&u=5oefqw
74AHC32PW/S400118
Hersteller: NXP USA Inc.
Description: OR GATE, AHC SERIES
Produkt ist nicht verfügbar
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S912XEQ512F1VAA MC9S12XEPB.pdf
S912XEQ512F1VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512F1VAAR MC9S12XEPB.pdf
S912XEQ512F1VAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OMA1007TL-SKT
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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MC32PF1550A3EP
MC32PF1550A3EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC33VR5500V3ES
Hersteller: NXP USA Inc.
Description: VR5500
Produkt ist nicht verfügbar
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FRDMGD3160DSBHB UM11658.pdf
FRDMGD3160DSBHB
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU, 32-Bit
Secondary Attributes: Graphical User Interface (GUI)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1222.72 EUR
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BGA2771,115 BGA2771_Rev_Nov2010.pdf
BGA2771,115
Hersteller: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AUP2G07GX147 74AUP2G07.pdf
74AUP2G07GX147
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
945+0.48 EUR
Mindestbestellmenge: 945
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74ABT162245ADL653 74ABT_ABTH162245A.pdf
74ABT162245ADL653
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Produkt ist nicht verfügbar
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LPC11E67JBD48K LPC11E1X.pdf
LPC11E67JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.92 EUR
10+6.83 EUR
25+6.31 EUR
100+5.74 EUR
250+5.46 EUR
500+5.3 EUR
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SCIMX6S6AVM083C
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tray
Produkt ist nicht verfügbar
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8CH-DMIC 8CH-DMIC-UM.pdf
8CH-DMIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Contents: Board(s)
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Secondary Attributes: On-Board LEDs
Embedded: Yes
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+157.91 EUR
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LD6806TD/22P,125 LD6806_Series.pdf
LD6806TD/22P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
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Anzahl Preis
2959+0.16 EUR
Mindestbestellmenge: 2959
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P1014NSE5HFB557 P1010EC.pdf
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
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Anzahl Preis
7+75.42 EUR
Mindestbestellmenge: 7
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FXLS8962AFR1 FXLS8962AF.pdf
FXLS8962AFR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FXLS8962AFR1 FXLS8962AF.pdf
FXLS8962AFR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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PEMI8QFN/LP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/LP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 4000 Stücke:
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Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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BF1102,115 BF1102%28R%29.pdf
BF1102,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 15 mA
auf Bestellung 3000 Stücke:
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Anzahl Preis
1110+0.45 EUR
Mindestbestellmenge: 1110
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A2I09VD015GNR1 A2I09VD015N.pdf
Hersteller: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Produkt ist nicht verfügbar
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MC33FS6510NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6510NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC07XSF517BEK MC07XSF517EK.pdf
MC07XSF517BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Produkt ist nicht verfügbar
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P5040NSE72QC FSCLS11784-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
auf Bestellung 8 Stücke:
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Anzahl Preis
1+835.91 EUR
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T2081NSE8PTB PHGL-S-A0004582645-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
auf Bestellung 11 Stücke:
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Anzahl Preis
1+535.6 EUR
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BLF6G20LS-180RN112
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BLF6G10LS-160RN112
BLF6G10LS-160RN112
Hersteller: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
Part Status: Active
auf Bestellung 20 Stücke:
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Anzahl Preis
4+147.97 EUR
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BLF6G10LS-135RN112
BLF6G10LS-135RN112
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS SOT502
Packaging: Bulk
Part Status: Active
auf Bestellung 92 Stücke:
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Anzahl Preis
4+127.17 EUR
Mindestbestellmenge: 4
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MCIMX6S5EVM10AD IMX6SDLIEC.pdf
MCIMX6S5EVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+64.59 EUR
10+52.73 EUR
60+47.58 EUR
120+46.18 EUR
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N74F27D,623 74F27.pdf
N74F27D,623
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
auf Bestellung 22500 Stücke:
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Anzahl Preis
2420+0.19 EUR
Mindestbestellmenge: 2420
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TJA1463AT/0Z TJA1463.pdf
TJA1463AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.38 EUR
Mindestbestellmenge: 2500
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TJA1463AT/0Z TJA1463.pdf
TJA1463AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2502 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.75 EUR
10+2.02 EUR
25+1.84 EUR
100+1.63 EUR
250+1.54 EUR
500+1.48 EUR
1000+1.43 EUR
Mindestbestellmenge: 7
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PCF85063TP-ARD
PCF85063TP-ARD
Hersteller: NXP USA Inc.
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+165.44 EUR
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PCF85263ATT1/AZ PCF85263A.pdf
PCF85263ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.97 EUR
5000+0.92 EUR
Mindestbestellmenge: 2500
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PCF85263ATT1/AZ PCF85263A.pdf
PCF85263ATT1/AZ
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.29 EUR
10+2.04 EUR
25+1.93 EUR
100+1.59 EUR
250+1.48 EUR
500+1.31 EUR
1000+1.04 EUR
Mindestbestellmenge: 8
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PMCM6501VNE023 PMCM6501VNE.pdf
PMCM6501VNE023
Hersteller: NXP USA Inc.
Description: PMCM6501 N-CHANNEL, MOSFET
Produkt ist nicht verfügbar
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PMCM6501VPE023 PMCM6501VPE.pdf
PMCM6501VPE023
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
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74LVC138APW/AU118 PHGLS23389-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 49760 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.18 EUR
Mindestbestellmenge: 2959
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74LVC138APW-Q100118 74LVC138A_Q100.pdf
74LVC138APW-Q100118
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 22994 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2228+0.23 EUR
Mindestbestellmenge: 2228
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74ABT573AN,112 74ABT573A.pdf
74ABT573AN,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 1332 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
567+0.86 EUR
Mindestbestellmenge: 567
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MWCT1011CFM
MWCT1011CFM
Hersteller: NXP USA Inc.
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 83788 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
86+5.92 EUR
Mindestbestellmenge: 86
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MK20DX256VMC7R K20P100M72SF1.pdf
MK20DX256VMC7R
Hersteller: NXP USA Inc.
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Produkt ist nicht verfügbar
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