Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34503) > Seite 442 nach 576
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MC33772CTP2AE | NXP USA Inc. |
 Description: IC 6-CH LI-ION BATT CTRL 48LQFPPackaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
auf Bestellung 465 Stücke: Lieferzeit 10-14 Tag (e) |
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MD7IC2012NR1 | NXP USA Inc. |
Description: IC AMP CDMA 1.805-2.17GHZ TO270 Packaging: Bulk Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 2.17GHz RF Type: W-CDMA Voltage - Supply: 24V ~ 32V Gain: 31.5dB Current - Supply: 70mA P1dB: 40dBm Supplier Device Package: TO-270 WB-14 Part Status: Obsolete |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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RB521CS30L315 | NXP USA Inc. |
Description: 100MA LOW VF MEGA SCHOTTKY BARRI |
Produkt ist nicht verfügbar |
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MC9S08JS16LCFK | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 24QFN Packaging: Bulk Package / Case: 24-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM Supplier Device Package: 24-HVQFN (5x5) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1046ASE8Q1A | NXP USA Inc. |
Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM |
Produkt ist nicht verfügbar |
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SPC5605BK0MLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| T1042NXN7MQB | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
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| MC908GR32ACFAE-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 37 DigiKey Programmable: Not Verified |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8547BHT/AY | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 11 Characters, 22 Characters, 176 Elements Supplier Device Package: 64-TQFP (10x10) Part Status: Obsolete Current - Supply: 90 µA |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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NCF3340AHN/00311Y | NXP USA Inc. |
Description: IC RFID RDR/TRAN 27.12MZ 40HVQFN |
Produkt ist nicht verfügbar |
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LS1020ASE8KQB | NXP USA Inc. |
Description: LS1020 32BIT ARM SOC 1GHZ DDR3 |
Produkt ist nicht verfügbar |
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| SLN-VIZN3D-IOT | NXP USA Inc. |
Description: DEV KIT I.MXRT117F 3D FACE REC Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: RT117F Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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FXPS7550A4T1 | NXP USA Inc. |
Description: PRESSURE SENSOR, 3.3V/5V, 20/550 Packaging: Bulk Part Status: Active |
auf Bestellung 1658 Stücke: Lieferzeit 10-14 Tag (e) |
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FXPS7550DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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| FXPS7550A4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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| FXPS7550DS4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
Produkt ist nicht verfügbar |
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NX3DV2567HR-Q100X | NXP USA Inc. |
Description: IC ANLG SWITCH 4PDT 16HXQFN Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: Networking On-State Resistance (Max): 700mOhm -3db Bandwidth: 160MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Switch Circuit: 4PDT Grade: Automotive Part Status: Active Number of Channels: 1 Qualification: AEC-Q100 |
auf Bestellung 1435 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5675KF0MJM2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK20DN512VLQ10557 | NXP USA Inc. |
Description: KINETIS K10: CORTEX M4 RISC MICR Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 100 |
Produkt ist nicht verfügbar |
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74AUP1G08GX/S500125 | NXP USA Inc. |
Description: IC GATE AND 1CH 2-INP 5X2SON |
auf Bestellung 1278900 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1G08GM/S711115 | NXP USA Inc. |
Description: IC GATE AND 1CH 2-INP 6XSON |
auf Bestellung 344009 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC06APW-Q100J | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14TSSOP Features: Open Drain Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 5.5V Current - Output High, Low: -, 32mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 10 µA |
auf Bestellung 5322 Stücke: Lieferzeit 10-14 Tag (e) |
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| ON5441518 | NXP USA Inc. |
Description: NOW NEXPERIA ON5441 - RF MOSFET Packaging: Bulk Part Status: Active |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM5596/N5441C3U02, | NXP USA Inc. | Description: BOARD DEMO NFC |
Produkt ist nicht verfügbar |
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MPC8247VRTIEA557 | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC |
Produkt ist nicht verfügbar |
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| PHPT610035PK115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PEMI8QFN/RR,132 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHM/21PF SMD |
Produkt ist nicht verfügbar |
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| LPC12D27FBD100/301551 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DZ60F2MLFR | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP Packaging: Cut Tape (CT) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PZU16BL315 | NXP USA Inc. |
Description: NOW NEXPERIA PZU16BL ZENER DIODE Packaging: Bulk Part Status: Active |
auf Bestellung 139300 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU15DB2115 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 114000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU11B3A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU11B3A ZENER DIOD |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU10BL315 | NXP USA Inc. |
Description: NOW NEXPERIA PZU10BL ZENER DIODE |
auf Bestellung 95000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU18B3A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU18B3A ZENER DIOD |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU10DB2,115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU10DB2 - ZENER DI |
Produkt ist nicht verfügbar |
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PZU18BA,115 | NXP USA Inc. |
Description: ZENER DIODE, 18V, 5%, 0.49W |
Produkt ist nicht verfügbar |
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| PZU15BA115 | NXP USA Inc. | Description: DIODE ZENER SINGLE |
Produkt ist nicht verfügbar |
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PZU14B2A115 | NXP USA Inc. |
Description: DIODE ZENER SINGLE |
Produkt ist nicht verfügbar |
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PZU15B1115 | NXP USA Inc. |
Description: DIODE ZENER 14.15V 0.31W 2% SIL |
Produkt ist nicht verfügbar |
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PZU16B1A115 | NXP USA Inc. |
Description: DIODE ZENER 16V 320MW SOD323 Tolerance: ±2% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOD-323 Part Status: Active Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 12 V |
Produkt ist nicht verfügbar |
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| PZU13B1A115 | NXP USA Inc. |
Description: DIODE ZENER SINGLE Tolerance: ±2% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SOD-323 Part Status: Active Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 100 nA @ 10 V |
Produkt ist nicht verfügbar |
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PZU16B2A115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PZU16BA115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU16BA ZENER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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LPC54114J256BD64151 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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BZX84-C15/CH/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 15V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 15 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V |
Produkt ist nicht verfügbar |
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MC34VR500V1ES557 | NXP USA Inc. |
Description: SWITCHING REGULATOR 13.7A 4000 |
Produkt ist nicht verfügbar |
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SPC5645BF0VLU1R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5645BF0VLU1 | NXP USA Inc. | Description: IC MCU 32BIT 2MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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PEMB1,115 | NXP USA Inc. |
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 2 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V Resistor - Base (R1): 22kOhms Resistor - Emitter Base (R2): 22kOhms Supplier Device Package: SOT-666 Part Status: Active |
auf Bestellung 62840 Stücke: Lieferzeit 10-14 Tag (e) |
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OM15080-K32W | NXP USA Inc. |
Description: EVAL BOARD K32W041 K32W061 Packaging: Bulk For Use With/Related Products: K32W041, K32W061 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84J-B22,115 | NXP USA Inc. |
Description: DIODE ZENER 22V 550MW SOD323F Packaging: Bulk Tolerance: ±2% Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 22 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: SOD-323F Power - Max: 550 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V |
auf Bestellung 22665 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCF8553DTT/AY | NXP USA Inc. |
Description: LCD DRIVER Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C, SPI Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Current - Supply: 1.2 µA Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8248CZQTIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BUK6218-40C | NXP USA Inc. |
Description: PFET, 42A I(D), 40V, 0.028OHM, 1 Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 42A (Tc) Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V Power Dissipation (Max): 60W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V |
Produkt ist nicht verfügbar |
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74LVC332PWJ | NXP USA Inc. |
Description: IC GATE OR 3CH 3-INP 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 3 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 3 Current - Quiescent (Max): 10 µA |
Produkt ist nicht verfügbar |
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| RDDRONE-BMS772 | NXP USA Inc. |
Description: BMS772 DRONE BATT DEV KIT Packaging: Bulk Function: Battery Cell Controller Type: Power Management Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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PTN36043BXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 18DHXQFN Packaging: Tape & Reel (TR) Package / Case: 18-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Applications: USB Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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PTN36043BXZ | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 18DHXQFN Packaging: Cut Tape (CT) Package / Case: 18-XFQFN Exposed Pad Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 1.9V Applications: USB Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
Produkt ist nicht verfügbar |
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LD6816CX4/18H,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 150MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 26950 Stücke: Lieferzeit 10-14 Tag (e) |
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| UCANS32K1SIC | NXP USA Inc. | Description: CAN IMPROVEMENT CAPABILITY EVB |
Produkt ist nicht verfügbar |
| MC33772CTP2AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 465 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.94 EUR |
| 10+ | 17.11 EUR |
| 25+ | 16.31 EUR |
| 80+ | 14.16 EUR |
| 250+ | 13.52 EUR |
| MD7IC2012NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 1.805-2.17GHZ TO270
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 31.5dB
Current - Supply: 70mA
P1dB: 40dBm
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
Description: IC AMP CDMA 1.805-2.17GHZ TO270
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 31.5dB
Current - Supply: 70mA
P1dB: 40dBm
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 103+ | 8.62 EUR |
| RB521CS30L315 |
|
Hersteller: NXP USA Inc.
Description: 100MA LOW VF MEGA SCHOTTKY BARRI
Description: 100MA LOW VF MEGA SCHOTTKY BARRI
Produkt ist nicht verfügbar
| MC9S08JS16LCFK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 157+ | 5.63 EUR |
| LS1046ASE8Q1A |
|
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
Produkt ist nicht verfügbar
| SPC5605BK0MLQ6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| T1042NXN7MQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
| MC908GR32ACFAE-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 26+ | 20.89 EUR |
| PCA8547BHT/AY |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 64-TQFP (10x10)
Part Status: Obsolete
Current - Supply: 90 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 64-TQFP (10x10)
Part Status: Obsolete
Current - Supply: 90 µA
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.44 EUR |
| 10+ | 4.89 EUR |
| NCF3340AHN/00311Y |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 27.12MZ 40HVQFN
Description: IC RFID RDR/TRAN 27.12MZ 40HVQFN
Produkt ist nicht verfügbar
| LS1020ASE8KQB |
|
Hersteller: NXP USA Inc.
Description: LS1020 32BIT ARM SOC 1GHZ DDR3
Description: LS1020 32BIT ARM SOC 1GHZ DDR3
Produkt ist nicht verfügbar
| SLN-VIZN3D-IOT |
|
Hersteller: NXP USA Inc.
Description: DEV KIT I.MXRT117F 3D FACE REC
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: RT117F
Part Status: Active
Description: DEV KIT I.MXRT117F 3D FACE REC
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: RT117F
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 569.99 EUR |
| FXPS7550A4T1 |
Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR, 3.3V/5V, 20/550
Packaging: Bulk
Part Status: Active
Description: PRESSURE SENSOR, 3.3V/5V, 20/550
Packaging: Bulk
Part Status: Active
auf Bestellung 1658 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 73+ | 6.8 EUR |
| FXPS7550DI4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
| FXPS7550A4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
| FXPS7550DS4ST1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
| NX3DV2567HR-Q100X |
|
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Grade: Automotive
Part Status: Active
Number of Channels: 1
Qualification: AEC-Q100
Description: IC ANLG SWITCH 4PDT 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Grade: Automotive
Part Status: Active
Number of Channels: 1
Qualification: AEC-Q100
auf Bestellung 1435 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 2.31 EUR |
| 10+ | 2.06 EUR |
| 25+ | 1.96 EUR |
| 100+ | 1.61 EUR |
| 250+ | 1.5 EUR |
| 500+ | 1.33 EUR |
| SPC5675KF0MJM2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK20DN512VLQ10557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K10: CORTEX M4 RISC MICR
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
Description: KINETIS K10: CORTEX M4 RISC MICR
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
Produkt ist nicht verfügbar
| 74AUP1G08GX/S500125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5X2SON
Description: IC GATE AND 1CH 2-INP 5X2SON
auf Bestellung 1278900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4948+ | 0.11 EUR |
| 74AUP1G08GM/S711115 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 6XSON
Description: IC GATE AND 1CH 2-INP 6XSON
auf Bestellung 344009 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4121+ | 0.12 EUR |
| 74LVC06APW-Q100J |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Features: Open Drain
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
Description: IC INVERTER 6CH 1-INP 14TSSOP
Features: Open Drain
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.5ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
auf Bestellung 5322 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3050+ | 0.16 EUR |
| ON5441518 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ON5441 - RF MOSFET
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA ON5441 - RF MOSFET
Packaging: Bulk
Part Status: Active
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 381+ | 1.39 EUR |
| MPC8247VRTIEA557 |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Description: POWERQUICC 32 BIT POWER ARCHITEC
Produkt ist nicht verfügbar
| PHPT610035PK115 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| PEMI8QFN/RR,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/21PF SMD
Description: FILTER RC(PI) 100 OHM/21PF SMD
Produkt ist nicht verfügbar
| LPC12D27FBD100/301551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 54+ | 9.94 EUR |
| S9S08DZ60F2MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PZU16BL315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU16BL ZENER DIODE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PZU16BL ZENER DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 139300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.035 EUR |
| PZU15DB2115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)| PZU11B3A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU11B3A ZENER DIOD
Description: NOW NEXPERIA PZU11B3A ZENER DIOD
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| PZU10BL315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU10BL ZENER DIODE
Description: NOW NEXPERIA PZU10BL ZENER DIODE
auf Bestellung 95000 Stücke:
Lieferzeit 10-14 Tag (e)| PZU18B3A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU18B3A ZENER DIOD
Description: NOW NEXPERIA PZU18B3A ZENER DIOD
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| PZU10DB2,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU10DB2 - ZENER DI
Description: NOW NEXPERIA PZU10DB2 - ZENER DI
Produkt ist nicht verfügbar
| PZU18BA,115 |
|
Hersteller: NXP USA Inc.
Description: ZENER DIODE, 18V, 5%, 0.49W
Description: ZENER DIODE, 18V, 5%, 0.49W
Produkt ist nicht verfügbar
| PZU15B1115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 14.15V 0.31W 2% SIL
Description: DIODE ZENER 14.15V 0.31W 2% SIL
Produkt ist nicht verfügbar
| PZU16B1A115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 16V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
Description: DIODE ZENER 16V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
Produkt ist nicht verfügbar
| PZU13B1A115 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER SINGLE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Description: DIODE ZENER SINGLE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Produkt ist nicht verfügbar
| PZU16BA115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| LPC54114J256BD64151 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
| BZX84-C15/CH/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
| MC34VR500V1ES557 |
|
Hersteller: NXP USA Inc.
Description: SWITCHING REGULATOR 13.7A 4000
Description: SWITCHING REGULATOR 13.7A 4000
Produkt ist nicht verfügbar
| SPC5645BF0VLU1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5645BF0VLU1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
| PEMB1,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
auf Bestellung 62840 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7340+ | 0.07 EUR |
| OM15080-K32W |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 58.38 EUR |
| BZX84J-B22,115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 550MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
Description: DIODE ZENER 22V 550MW SOD323F
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 22665 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8768+ | 0.053 EUR |
| PCF8553DTT/AY |
Hersteller: NXP USA Inc.
Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 1.2 µA
Grade: Automotive
Qualification: AEC-Q100
Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 1.2 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 1.23 EUR |
| MPC8248CZQTIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
| BUK6218-40C |
|
Hersteller: NXP USA Inc.
Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
Produkt ist nicht verfügbar
| 74LVC332PWJ |
|
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
Description: IC GATE OR 3CH 3-INP 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
Produkt ist nicht verfügbar
| RDDRONE-BMS772 |
Hersteller: NXP USA Inc.
Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Supplied Contents: Board(s)
Part Status: Active
Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| PTN36043BXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| PTN36043BXZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
| LD6816CX4/18H,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 26950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| UCANS32K1SIC |
Hersteller: NXP USA Inc.
Description: CAN IMPROVEMENT CAPABILITY EVB
Description: CAN IMPROVEMENT CAPABILITY EVB
Produkt ist nicht verfügbar