Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 442 nach 610
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MC34PF1550A5EP | NXP USA Inc. |
 Description: PF1550 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC32PF1550A5EP | NXP USA Inc. |
Description: PF1550 Supplier Device Package: 40-HVQFN (5x5) Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Voltage - Supply: 3.8V ~ 7V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC32PF1550A0EPR2 | NXP USA Inc. | Description: POWER MANAGEMENT IC: 3 BUCK REGS |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PBSS5220PAPS115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS5220PAPS SMALL Part Status: Active Packaging: Bulk Qualification: AEC-Q101 Grade: Automotive Supplier Device Package: DFN2020D-6 Frequency - Transition: 95MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V Current - Collector Cutoff (Max): 100nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A Voltage - Collector Emitter Breakdown (Max): 20V Current - Collector (Ic) (Max): 2A Power - Max: 370mW Operating Temperature: 150°C (TJ) Transistor Type: 2 PNP Mounting Type: Surface Mount Package / Case: 6-UDFN Exposed Pad |
auf Bestellung 7440 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH16CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP DigiKey Programmable: Not Verified Supplier Device Package: 16-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) Number of I/O: 13 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8248CZQMIBA-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 516-PBGA (27x27) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Packaging: Bulk |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8245TVV300D-NXP | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32 BIT, PO Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Bulk Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC™ MPC603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 300MHz |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN3DVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 169 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8537BH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Current - Supply: 200 µA Supplier Device Package: 64-TQFP (10x10) Digits or Characters: 22 Characters, 44 Characters, 352 Elements Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 95°C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2S Package / Case: 64-TQFP Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Display Type: LCD |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Current - Supply: 200 µA Supplier Device Package: 64-TQFP (10x10) Digits or Characters: 22 Characters, 44 Characters, 352 Elements Voltage - Supply: 1.8V ~ 5.5V Interface: I2S Mounting Type: Surface Mount Display Type: LCD Package / Case: 64-TQFP Packaging: Cut Tape (CT) Operating Temperature: -40°C ~ 95°C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1062XVN5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 77 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1062DVN6B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Number of I/O: 149 Part Status: Active Supplier Device Package: 225-MAPBGA (13x13) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: ROM Oscillator Type: Internal Operating Temperature: 0°C ~ 95°C (TJ) RAM Size: 1M x 8 Program Memory Size: 128KB (128K x 8) Speed: 600MHz Mounting Type: Surface Mount Package / Case: 225-LFBGA Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 727 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC4851PW118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC4851PW SINGLE-E Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MAC57D5-208DC | NXP USA Inc. |
Description: MAC57D5XX EVAL BRD Utilized IC / Part: MAC57D5xx Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA DigiKey Programmable: Not Verified Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Processor: e200z4, e200z7 (2) EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.5M x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz, 240MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Bulk |
auf Bestellung 292 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA DigiKey Programmable: Not Verified Part Status: Active Supplier Device Package: 257-LFBGA (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Processor: e200z4, e200z7 (2) EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.5M x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz, 240MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LPC43S67JET256551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 16x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Size: 1MB (1M x 8) Speed: 204MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Bulk EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 154K x 8 DigiKey Programmable: Not Verified Number of I/O: 164 Part Status: Active Supplier Device Package: 256-LBGA (17x17) Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LPC43S50FET180551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Number of I/O: 118 Part Status: Active Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 264K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LPC4330FET180/CP3342 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA RAM Size: 264K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 118 Part Status: Active Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LPC43S50FET180E551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Number of I/O: 118 Part Status: Active Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 264K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5604BF2MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| OM13480UL | NXP USA Inc. |
Description: NVT4555UK SIM CARD LT/LDO WL CSP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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CBT3257ADB112 | NXP USA Inc. |
Description: NOW NEXPERIA CBT3257ADB - MULTIP |
auf Bestellung 2886 Stücke: Lieferzeit 10-14 Tag (e) |
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MC17XSG500EKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AHCT125PW/C1118 | NXP USA Inc. |
Description: BUS DRIVER, AHCT/VHCT/VT SERIES |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC8313CVRAGDC | NXP USA Inc. |
Description: IC MPU POWERQUICC II PRO 516PBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC68711E20MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMX8MM2CVTKZAA | NXP USA Inc. |
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5602BF2VLL6R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PNX9530E/V140518 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 1758 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/28P,115 | NXP USA Inc. |
Description: IC REG LIN 2.8V 150MA DFN1010C-4 Current - Supply (Max): 150 µA Protection Features: Over Current, Transient Voltage Voltage Dropout (Max): 0.25V @ 150mA PSRR: 75dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 2.8V Supplier Device Package: DFN1010C-4 Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 35 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 150mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-UDFN Exposed Pad Packaging: Bulk |
auf Bestellung 8753 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8053X | NXP USA Inc. |
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON Part Status: Active Supplier Device Package: 8-HWSON (2x2) Test Frequency: 2.5GHz P1dB: 18dBm Noise Figure: 0.56dB Current - Supply: 48mA Gain: 18.5dB Voltage - Supply: 4.75V ~ 5.25V RF Type: GSM, LTE, W-CDMA Frequency: 2GHz ~ 4GHz Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 2913 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF2131-ARD | NXP USA Inc. |
Description: PCF2131 RTC EVAL BOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF2131 Platform: Arduino |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5602BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 24K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FS32K144UAT0VLHT,557 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74ALVCH16821DGG118 | NXP USA Inc. |
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP Number of Bits per Element: 10 Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF Supplier Device Package: 56-TSSOP Input Capacitance: 5 pF Clock Frequency: 350 MHz Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Current - Quiescent (Iq): 40 µA Voltage - Supply: 2.3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Standard Number of Elements: 2 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 56-TFSOP (0.240", 6.10mm Width) Packaging: Bulk |
auf Bestellung 31014 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16500DGG118 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Part Status: Active Packaging: Bulk Supplier Device Package: 56-TSSOP Current - Output High, Low: 24mA, 24mA Voltage - Supply: 2.3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Logic Type: Universal Bus Transceiver Mounting Type: Surface Mount Number of Circuits: 18 Package / Case: 56-TFSOP (0.240", 6.10mm Width) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH162244ADGG118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVCH162244ADGG - Packaging: Bulk Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9901DP,118 | NXP USA Inc. |
Description: IC LED DRIVER LINEAR 20MA 8TSSOP Packaging: Cut Tape (CT) Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 2.7V Supplier Device Package: 8-TSSOP Internal Switch(s): Yes Current - Output / Channel: 20mA Operating Temperature: -40°C ~ 85°C (TA) Type: Linear Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| CBTL05024BS128 | NXP USA Inc. |
Description: HIGH PERFORMANCE MULTIPLEXER/DEM Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UEL/S500,147 | NXP USA Inc. |
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2004 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UEL147 | NXP USA Inc. |
Description: P-CHANNEL MOSFET |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3396 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3572 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S912B32E4VFUE8R | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PIMD3115 | NXP USA Inc. |
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BZX84-B56,215 | NXP USA Inc. |
Description: DIODE ZENER 56V 250MW SOT23 Supplier Device Package: SOT-23 Impedance (Max) (Zzt): 200 Ohms Voltage - Zener (Nom) (Vz): 56 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±2% Packaging: Bulk Qualification: AEC-Q101 Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Grade: Automotive |
auf Bestellung 35000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B51/DG/B2215 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX84-B51215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-B51 - ZENER D |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P3041NSE7NNC557 | NXP USA Inc. |
Description: QORIQ, 32 BIT POWER ARCH SOC, 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MKV44F64VLH16557 | NXP USA Inc. |
Description: CORTEX M4F RISC MICROCONTROLLER |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV42F64VLH16557 | NXP USA Inc. |
Description: CORTEX M4F RISC MICROCONTROLLER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 71 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV44F256VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV44F256VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV44F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV44F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV42F64VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MKV44F64VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 29x12b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SPI, UART/USART Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 168MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MC34PF1550A5EP |
|
Hersteller: NXP USA Inc.
Description: PF1550
Description: PF1550
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1550A5EP |
Hersteller: NXP USA Inc.
Description: PF1550
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: PF1550
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1550A0EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PBSS5220PAPS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: DFN2020D-6
Frequency - Transition: 95MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Current - Collector (Ic) (Max): 2A
Power - Max: 370mW
Operating Temperature: 150°C (TJ)
Transistor Type: 2 PNP
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: DFN2020D-6
Frequency - Transition: 95MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Current - Collector (Ic) (Max): 2A
Power - Max: 370mW
Operating Temperature: 150°C (TJ)
Transistor Type: 2 PNP
Mounting Type: Surface Mount
Package / Case: 6-UDFN Exposed Pad
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1734+ | 0.32 EUR |
| MC9S08SH16CTGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Number of I/O: 13
Part Status: Active
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Number of I/O: 13
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8248CZQMIBA-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
Description: POWERQUICC 32 BIT POWER ARCHITEC
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 95.75 EUR |
| MPC8245TVV300D-NXP |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, PO
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Bulk
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC™ MPC603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Description: RISC MICROPROCESSOR, 32 BIT, PO
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Bulk
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC™ MPC603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 246.39 EUR |
| MIMX8MN3DVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 169 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.81 EUR |
| 10+ | 27.72 EUR |
| 25+ | 25.94 EUR |
| 168+ | 23.44 EUR |
| PCA8537BH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Description: IC DRVR 7 SEGMENT 64TQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 200 µA
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2S
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Display Type: LCD
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 200 µA
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2S
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Display Type: LCD
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 200 µA
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Voltage - Supply: 1.8V ~ 5.5V
Interface: I2S
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 200 µA
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Voltage - Supply: 1.8V ~ 5.5V
Interface: I2S
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1062XVN5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.99 EUR |
| 10+ | 23.75 EUR |
| 25+ | 22.19 EUR |
| MIMXRT1062DVN6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Number of I/O: 149
Part Status: Active
Supplier Device Package: 225-MAPBGA (13x13)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Number of I/O: 149
Part Status: Active
Supplier Device Package: 225-MAPBGA (13x13)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 128KB (128K x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 727 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.61 EUR |
| 10+ | 20.18 EUR |
| 25+ | 18.84 EUR |
| 100+ | 17.34 EUR |
| 250+ | 16.64 EUR |
| MAC57D5-208DC |
Hersteller: NXP USA Inc.
Description: MAC57D5XX EVAL BRD
Utilized IC / Part: MAC57D5xx
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MAC57D5XX EVAL BRD
Utilized IC / Part: MAC57D5xx
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Processor: e200z4, e200z7 (2)
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.5M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz, 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Bulk
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Processor: e200z4, e200z7 (2)
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.5M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz, 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Bulk
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 70.02 EUR |
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Processor: e200z4, e200z7 (2)
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.5M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz, 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Processor: e200z4, e200z7 (2)
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.5M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz, 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| LPC43S67JET256551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
DigiKey Programmable: Not Verified
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Bulk
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 154K x 8
DigiKey Programmable: Not Verified
Number of I/O: 164
Part Status: Active
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Description: IC MCU 32BIT ROMLESS 180TFBGA
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4330FET180/CP3342 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32BIT ROMLESS 180TFBGA
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180E551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Description: IC MCU 32BIT ROMLESS 180TFBGA
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BF2MLL6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| OM13480UL |
|
Hersteller: NXP USA Inc.
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| CBT3257ADB112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA CBT3257ADB - MULTIP
Description: NOW NEXPERIA CBT3257ADB - MULTIP
auf Bestellung 2886 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1367+ | 0.43 EUR |
| MC17XSG500EKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74AHCT125PW/C1118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| MPC8313CVRAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Description: IC MPU POWERQUICC II PRO 516PBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
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| MC68711E20MFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MM2CVTKZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 72.86 EUR |
| 10+ | 59.38 EUR |
| 25+ | 56.01 EUR |
| SPC5602BF2VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| PNX9530E/V140518 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 75.83 EUR |
| LD6805K/28P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
auf Bestellung 8753 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3206+ | 0.19 EUR |
| BGU8053X |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 2.5GHz
P1dB: 18dBm
Noise Figure: 0.56dB
Current - Supply: 48mA
Gain: 18.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 2GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 2.5GHz
P1dB: 18dBm
Noise Figure: 0.56dB
Current - Supply: 48mA
Gain: 18.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 2GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2913 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.89 EUR |
| 10+ | 3.36 EUR |
| 25+ | 3.17 EUR |
| 100+ | 2.92 EUR |
| 250+ | 2.76 EUR |
| 500+ | 2.64 EUR |
| 1000+ | 2.55 EUR |
| PCF2131-ARD |
|
Hersteller: NXP USA Inc.
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 45.42 EUR |
| SPC5602BK0CLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32K144UAT0VLHT,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74ALVCH16821DGG118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP
Number of Bits per Element: 10
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Supplier Device Package: 56-TSSOP
Input Capacitance: 5 pF
Clock Frequency: 350 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP
Number of Bits per Element: 10
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Supplier Device Package: 56-TSSOP
Input Capacitance: 5 pF
Clock Frequency: 350 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
auf Bestellung 31014 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 301+ | 1.78 EUR |
| 74ALVCH16500DGG118 |
|
Hersteller: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Part Status: Active
Packaging: Bulk
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: Universal Bus Transceiver
Mounting Type: Surface Mount
Number of Circuits: 18
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Description: REGISTERED BUS TRANSCEIVER
Part Status: Active
Packaging: Bulk
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: Universal Bus Transceiver
Mounting Type: Surface Mount
Number of Circuits: 18
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 350+ | 1.64 EUR |
| 74LVCH162244ADGG118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 709+ | 0.83 EUR |
| PCA9901DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Supplier Device Package: 8-TSSOP
Internal Switch(s): Yes
Current - Output / Channel: 20mA
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Supplier Device Package: 8-TSSOP
Internal Switch(s): Yes
Current - Output / Channel: 20mA
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL05024BS128 |
|
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL/S500,147 |
|
Hersteller: NXP USA Inc.
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Produkt ist nicht verfügbar
Mindestbestellmenge: 2004 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL147 |
|
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Description: P-CHANNEL MOSFET
Produkt ist nicht verfügbar
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| PMCXB900UE147 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
Produkt ist nicht verfügbar
Mindestbestellmenge: 3572 Stücke
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| S912B32E4VFUE8R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| PIMD3115 |
|
Hersteller: NXP USA Inc.
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
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| BZX84-B56,215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 56V 250MW SOT23
Supplier Device Package: SOT-23
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
Description: DIODE ZENER 56V 250MW SOT23
Supplier Device Package: SOT-23
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Bulk
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Grade: Automotive
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13172+ | 0.04 EUR |
| BZX84-B51/DG/B2215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7212+ | 0.084 EUR |
| BZX84-B51215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Produkt ist nicht verfügbar
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| P3041NSE7NNC557 |
|
Hersteller: NXP USA Inc.
Description: QORIQ, 32 BIT POWER ARCH SOC, 4
Description: QORIQ, 32 BIT POWER ARCH SOC, 4
Produkt ist nicht verfügbar
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| MKV44F64VLH16557 |
|
Hersteller: NXP USA Inc.
Description: CORTEX M4F RISC MICROCONTROLLER
Description: CORTEX M4F RISC MICROCONTROLLER
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 61+ | 9.73 EUR |
| MKV42F64VLH16557 |
|
Hersteller: NXP USA Inc.
Description: CORTEX M4F RISC MICROCONTROLLER
Description: CORTEX M4F RISC MICROCONTROLLER
Produkt ist nicht verfügbar
Mindestbestellmenge: 71 Stücke
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| MKV44F256VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
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| MKV44F256VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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| MKV44F128VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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| MKV44F128VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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| MKV42F64VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
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| MKV44F64VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 29x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 29x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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