Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 438 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MC32PF1550A3EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Package / Case: 40-VFQFN Exposed Pad Packaging: Tray Supplier Device Package: 40-HVQFN (5x5) Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Voltage - Supply: 3.8V ~ 7V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC33VR5500V3ES | NXP USA Inc. | Description: VR5500 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FRDMGD3160DSBHB | NXP USA Inc. |
Description: GD3160 HALF-BRIDGE EVAL KITSecondary Attributes: Graphical User Interface (GUI) Embedded: Yes, MCU, 32-Bit Primary Attributes: 1-Channel (Single) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Type: Power Management Function: Gate Driver Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA2771,115 | NXP USA Inc. |
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOPPart Status: Obsolete Supplier Device Package: 6-TSSOP Test Frequency: 1GHz P1dB: 12.1dBm Noise Figure: 4.5dB Current - Supply: 33.3mA Gain: 21.4dB Voltage - Supply: 3V ~ 4V RF Type: ISM Frequency: 20MHz ~ 2.5GHz Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AUP2G07GX147 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 3.6V 6-X2SONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-X2SON (1.0x0.8) Part Status: Active |
auf Bestellung 80000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT162245ADL653 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5VPart Status: Active Number of Bits per Element: 8 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 995 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC11E67JBD48K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x12b SAR Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 20K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
auf Bestellung 510 Stücke: Lieferzeit 10-14 Tag (e) |
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| SCIMX6S6AVM083C | NXP USA Inc. |
Description: I.MX 6 SERIES 32-BIT MPU ARM COR Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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8CH-DMIC | NXP USA Inc. |
Description: EVAL BOARD FOR SPH0641LM4H-1Packaging: Box Function: Microphone Type: Audio Utilized IC / Part: SPH0641LM4H-1 Supplied Contents: Board(s) Primary Attributes: 8-Channel (Octal) Embedded: Yes Part Status: Active Contents: Board(s) Secondary Attributes: On-Board LEDs |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/22P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.2V 200MA 5TSOPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 2.2V Supplier Device Package: 5-TSOP Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: SC-74A, SOT-753 Packaging: Bulk |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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| P1014NSE5HFB557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 32-BIPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLS8962AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFNPart Status: Obsolete Supplier Device Package: 10-DFN (2x2) Acceleration Range: ±2g, 4g, 8g, 16g Axis: X, Y, Z Package / Case: 10-VFDFN Packaging: Tape & Reel (TR) Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FXLS8962AFR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-16G 10DFNPart Status: Obsolete Supplier Device Package: 10-DFN (2x2) Acceleration Range: ±2g, 4g, 8g, 16g Axis: X, Y, Z Mounting Type: Surface Mount Package / Case: 10-VFDFN Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BF1102,115 | NXP USA Inc. |
Description: RF MOSFET 5V 6TSSOPCurrent - Test: 15 mA Voltage - Test: 5 V Voltage - Rated: 7 V Supplier Device Package: 6-TSSOP Noise Figure: 2dB Technology: MOSFET (Metal Oxide) Configuration: N-Channel Dual Gate Frequency: 800MHz Mounting Type: Surface Mount Current Rating (Amps): 40mA Package / Case: 6-TSSOP, SC-88, SOT-363 Packaging: Bulk |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| A2I09VD015GNR1 | NXP USA Inc. |
Description: IC AMP GPS 575-960MHZ TO270WBGSupplier Device Package: TO-270WBG-15 Test Frequency: 920MHz Current - Supply: 84mA Gain: 34dB Voltage - Supply: 48V ~ 55V RF Type: General Purpose Frequency: 575MHz ~ 960MHz Mounting Type: Surface Mount Package / Case: TO-270-15 Variant, Gull Wing Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC33FS6510NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCOSupplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC07XSF517BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| P5040NSE72QC | NXP USA Inc. |
Description: QORIQ, 64-BIT POWER ARCH SOC, 4 |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| T2081NSE8PTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGAPackaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF6G20LS-180RN112 | NXP USA Inc. |
Description: RF MOSFET Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BLF6G10LS-160RN112 | NXP USA Inc. |
Description: RF MOSFET Part Status: Active Packaging: Bulk |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G10LS-135RN112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT502 Part Status: Active Packaging: Bulk |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S5EVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGAPackaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F27D,623 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 3 |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1463AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOQualification: AEC-Q100 Grade: Automotive Part Status: Active Duplex: Half Receiver Hysteresis: 100 mV Supplier Device Package: 14-SO Protocol: CANbus Data Rate: 8Mbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1463AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOQualification: AEC-Q100 Grade: Automotive Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) Part Status: Active Duplex: Half Receiver Hysteresis: 100 mV Supplier Device Package: 14-SO Protocol: CANbus Data Rate: 8Mbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver |
auf Bestellung 2502 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCF85063TP-ARD | NXP USA Inc. |
Description: RTC W/ CAL&ALARM EVAL BOARD Packaging: Box Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF85063TP Platform: Arduino Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOPFeatures: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 10TSSOPFeatures: Alarm, Leap Year, Watchdog Timer Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 4747 Stücke: Lieferzeit 10-14 Tag (e) |
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PMCM6501VNE023 | NXP USA Inc. |
Description: PMCM6501 N-CHANNEL, MOSFET |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1535 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PMCM6501VPE023 | NXP USA Inc. |
Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1535 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 74LVC138APW/AU118 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
auf Bestellung 49760 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC138APW-Q100118 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
auf Bestellung 22994 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1011CFM | NXP USA Inc. |
Description: 15W SINGLE-COIL CONSUMER STAND Packaging: Bulk Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Applications: General Purpose Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad |
auf Bestellung 83788 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VMC7R | NXP USA Inc. |
Description: KINETIS K20 - 72MHZ CORTEX-M4 P |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCIMX7D5EVM10SC | NXP USA Inc. |
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Display & Interface Controllers: Keypad, LCD, MIPI Graphics Acceleration: No RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 541-MAPBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 541-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC2244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SOPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 20-SO Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCIMX6U1AVM08ACR | NXP USA Inc. |
Description: IC MPU 800MHZ 624MAPBGAPart Status: Not For New Designs Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Graphics Acceleration: Yes RAM Controllers: DDR3, DDR3L, LPDDR2 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tape & Reel (TR) |
auf Bestellung 934 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVHY32F1VLQ | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W-001-T10 | NXP USA Inc. |
Description: K32W061/41 UPGRADE BOARDPackaging: Bulk For Use With/Related Products: K32W061 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNCurrent - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0 Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth DigiKey Programmable: Not Verified GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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K32W061Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNCurrent - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0 Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) Part Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
auf Bestellung 986 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C24/LF1R | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW SOT23Impedance (Max) (Zzt): 70 Ohms Voltage - Zener (Nom) (Vz): 24 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Tape & Reel (TR) Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Qualification: AEC-Q101 Grade: Automotive Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PSMN028-100YS115 | NXP USA Inc. |
Description: NOW NEXPERIA 30A, 100V, 0.0275OH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| S9S12XS256J0CAL,557 | NXP USA Inc. | Description: 16 BIT MCU, S12X CORE, 256KB FLA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 41 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| S912XET256J2CAL557 | NXP USA Inc. |
Description: 16-BIT MCU, S12X CORE, 256KB FLA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 27 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| S9S12XS128J1CAL557 | NXP USA Inc. |
Description: 16-BIT MCU, S12X CORE, 128KB FLA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 47 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LPC5536JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 23x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 1097 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 100HLQFPDigiKey Programmable: Not Verified Number of I/O: 66 Part Status: Active Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 23x16b; D/A 2x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 128KB (128K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JHI48/00E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5536JHI48/00E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 344 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JHI48/00K | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48HVQFNOscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 128KB (128K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 32 Part Status: Active Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5536JHI48/00K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFNDigiKey Programmable: Not Verified Number of I/O: 32 Part Status: Active Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 256KB (256K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 1179 Stücke: Lieferzeit 10-14 Tag (e) |
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| NT4H2421G0DUD/02Z | NXP USA Inc. |
Description: CLHW |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25977 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NT4H2421G0DUD/02V | NXP USA Inc. |
Description: CLHW |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 129886 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PCAL6524EV-ARD | NXP USA Inc. |
Description: 24-BIT GPIO ARDUINO SHIELDPart Status: Active Platform: Arduino Utilized IC / Part: PCAL6524 Contents: Board(s) Type: Interface Function: I/O Expansion Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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TJR1442BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PUMB2/L135 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
auf Bestellung 340000 Stücke: Lieferzeit 10-14 Tag (e) |
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PUMB2/DG/B3115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
auf Bestellung 84000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC32PF1550A3EP |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33VR5500V3ES |
Hersteller: NXP USA Inc.
Description: VR5500
Description: VR5500
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FRDMGD3160DSBHB |
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Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 1222.72 EUR |
| BGA2771,115 |
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Hersteller: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 12.1dBm
Noise Figure: 4.5dB
Current - Supply: 33.3mA
Gain: 21.4dB
Voltage - Supply: 3V ~ 4V
RF Type: ISM
Frequency: 20MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 12.1dBm
Noise Figure: 4.5dB
Current - Supply: 33.3mA
Gain: 21.4dB
Voltage - Supply: 3V ~ 4V
RF Type: ISM
Frequency: 20MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP2G07GX147 |
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Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
Description: IC BUFF NON-INVERT 3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 403+ | 1.12 EUR |
| 74ABT162245ADL653 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V
Part Status: Active
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Packaging: Bulk
Description: IC TXRX NON-INVERT 5.5V
Part Status: Active
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 995 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E67JBD48K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 8.92 EUR |
| 10+ | 6.83 EUR |
| 25+ | 6.31 EUR |
| 100+ | 5.74 EUR |
| 250+ | 5.46 EUR |
| 500+ | 5.3 EUR |
| SCIMX6S6AVM083C |
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 8CH-DMIC |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 163.75 EUR |
| LD6806TD/22P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| P1014NSE5HFB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 75.42 EUR |
| FXLS8962AFR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Obsolete
Supplier Device Package: 10-DFN (2x2)
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Package / Case: 10-VFDFN
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Obsolete
Supplier Device Package: 10-DFN (2x2)
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Package / Case: 10-VFDFN
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLS8962AFR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Obsolete
Supplier Device Package: 10-DFN (2x2)
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Mounting Type: Surface Mount
Package / Case: 10-VFDFN
Packaging: Cut Tape (CT)
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Obsolete
Supplier Device Package: 10-DFN (2x2)
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Mounting Type: Surface Mount
Package / Case: 10-VFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BF1102,115 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Current - Test: 15 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Supplier Device Package: 6-TSSOP
Noise Figure: 2dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 800MHz
Mounting Type: Surface Mount
Current Rating (Amps): 40mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
Description: RF MOSFET 5V 6TSSOP
Current - Test: 15 mA
Voltage - Test: 5 V
Voltage - Rated: 7 V
Supplier Device Package: 6-TSSOP
Noise Figure: 2dB
Technology: MOSFET (Metal Oxide)
Configuration: N-Channel Dual Gate
Frequency: 800MHz
Mounting Type: Surface Mount
Current Rating (Amps): 40mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1110+ | 0.45 EUR |
| A2I09VD015GNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Supplier Device Package: TO-270WBG-15
Test Frequency: 920MHz
Current - Supply: 84mA
Gain: 34dB
Voltage - Supply: 48V ~ 55V
RF Type: General Purpose
Frequency: 575MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-15 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 575-960MHZ TO270WBG
Supplier Device Package: TO-270WBG-15
Test Frequency: 920MHz
Current - Supply: 84mA
Gain: 34dB
Voltage - Supply: 48V ~ 55V
RF Type: General Purpose
Frequency: 575MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-15 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS6510NAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC07XSF517BEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P5040NSE72QC |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 835.91 EUR |
| T2081NSE8PTB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 535.6 EUR |
| BLF6G10LS-160RN112 |
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 147.97 EUR |
| BLF6G10LS-135RN112 |
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 127.17 EUR |
| MCIMX6S5EVM10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 64.59 EUR |
| 10+ | 52.73 EUR |
| 60+ | 47.58 EUR |
| 120+ | 46.18 EUR |
| N74F27D,623 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2420+ | 0.19 EUR |
| TJA1463AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 100 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Data Rate: 8Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC TRANSCEIVER HALF 1/1 14SO
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Duplex: Half
Receiver Hysteresis: 100 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Data Rate: 8Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 1.38 EUR |
| TJA1463AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Active
Duplex: Half
Receiver Hysteresis: 100 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Data Rate: 8Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Description: IC TRANSCEIVER HALF 1/1 14SO
Qualification: AEC-Q100
Grade: Automotive
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Active
Duplex: Half
Receiver Hysteresis: 100 mV
Supplier Device Package: 14-SO
Protocol: CANbus
Data Rate: 8Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
auf Bestellung 2502 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.75 EUR |
| 10+ | 2.02 EUR |
| 25+ | 1.84 EUR |
| 100+ | 1.63 EUR |
| 250+ | 1.54 EUR |
| 500+ | 1.48 EUR |
| 1000+ | 1.43 EUR |
| PCF85063TP-ARD |
Hersteller: NXP USA Inc.
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 186.74 EUR |
| PCF85263ATT1/AZ |
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Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2500+ | 0.94 EUR |
| PCF85263ATT1/AZ |
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Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 4747 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 1.94 EUR |
| 13+ | 1.4 EUR |
| 25+ | 1.27 EUR |
| 100+ | 1.12 EUR |
| 250+ | 1.05 EUR |
| 500+ | 1.01 EUR |
| 1000+ | 0.98 EUR |
| PMCM6501VNE023 |
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Hersteller: NXP USA Inc.
Description: PMCM6501 N-CHANNEL, MOSFET
Description: PMCM6501 N-CHANNEL, MOSFET
Produkt ist nicht verfügbar
Mindestbestellmenge: 1535 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PMCM6501VPE023 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
Mindestbestellmenge: 1535 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC138APW/AU118 |
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Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 49760 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.18 EUR |
| 74LVC138APW-Q100118 |
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Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 22994 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2228+ | 0.23 EUR |
| MWCT1011CFM |
Hersteller: NXP USA Inc.
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Applications: General Purpose
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Applications: General Purpose
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
auf Bestellung 83788 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 86+ | 5.92 EUR |
| MK20DX256VMC7R |
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Hersteller: NXP USA Inc.
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX7D5EVM10SC |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: Keypad, LCD, MIPI
Graphics Acceleration: No
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 541-MAPBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 541-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC2244AD,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1347+ | 0.36 EUR |
| MCIMX6U1AVM08ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU 800MHZ 624MAPBGA
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU 800MHZ 624MAPBGA
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 130.42 EUR |
| S912ZVHY32F1VLQ |
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Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 34+ | 13.13 EUR |
| K32W-001-T10 |
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Hersteller: NXP USA Inc.
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 58.84 EUR |
| K32W061Z |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
DigiKey Programmable: Not Verified
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
DigiKey Programmable: Not Verified
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| K32W061Z |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
auf Bestellung 986 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.7 EUR |
| 10+ | 13.47 EUR |
| 25+ | 12.25 EUR |
| 100+ | 11.02 EUR |
| 250+ | 10.1 EUR |
| 500+ | 9.19 EUR |
| K32W061Y |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4000+ | 7.58 EUR |
| BZX84-C24/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Qualification: AEC-Q101
Grade: Automotive
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Description: DIODE ZENER 24V 250MW SOT23
Impedance (Max) (Zzt): 70 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Qualification: AEC-Q101
Grade: Automotive
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PSMN028-100YS115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 30A, 100V, 0.0275OH
Description: NOW NEXPERIA 30A, 100V, 0.0275OH
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S9S12XS256J0CAL,557 |
Hersteller: NXP USA Inc.
Description: 16 BIT MCU, S12X CORE, 256KB FLA
Description: 16 BIT MCU, S12X CORE, 256KB FLA
Produkt ist nicht verfügbar
Mindestbestellmenge: 41 Stücke
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| S912XET256J2CAL557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 256KB FLA
Description: 16-BIT MCU, S12X CORE, 256KB FLA
Produkt ist nicht verfügbar
Mindestbestellmenge: 27 Stücke
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| S9S12XS128J1CAL557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 128KB FLA
Description: 16-BIT MCU, S12X CORE, 128KB FLA
Produkt ist nicht verfügbar
Mindestbestellmenge: 47 Stücke
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| LPC5536JBD100E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1097 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.36 EUR |
| 10+ | 10.37 EUR |
| 90+ | 8.85 EUR |
| 180+ | 8.53 EUR |
| 270+ | 8.38 EUR |
| 540+ | 8.14 EUR |
| 1080+ | 7.95 EUR |
| LPC5534JBD100E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 23x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 15.8 EUR |
| 10+ | 12.3 EUR |
| 25+ | 11.43 EUR |
| 90+ | 10.53 EUR |
| LPC5534JHI48/00E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.72 EUR |
| 10+ | 9.05 EUR |
| 25+ | 8.38 EUR |
| 100+ | 7.65 EUR |
| 260+ | 7.29 EUR |
| LPC5536JHI48/00E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 344 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.68 EUR |
| 10+ | 8.23 EUR |
| 25+ | 7.61 EUR |
| 100+ | 6.94 EUR |
| 260+ | 6.6 EUR |
| LPC5534JHI48/00K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.58 EUR |
| 10+ | 9.73 EUR |
| 25+ | 9.01 EUR |
| 80+ | 8.33 EUR |
| 230+ | 7.88 EUR |
| 440+ | 7.66 EUR |
| 1300+ | 6.99 EUR |
| LPC5536JHI48/00K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1179 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.09 EUR |
| 10+ | 9.36 EUR |
| 25+ | 8.68 EUR |
| 100+ | 7.93 EUR |
| 250+ | 7.57 EUR |
| 500+ | 7.36 EUR |
| NT4H2421G0DUD/02Z |
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Hersteller: NXP USA Inc.
Description: CLHW
Description: CLHW
Produkt ist nicht verfügbar
Mindestbestellmenge: 25977 Stücke
Im Einkaufswagen
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| NT4H2421G0DUD/02V |
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Hersteller: NXP USA Inc.
Description: CLHW
Description: CLHW
Produkt ist nicht verfügbar
Mindestbestellmenge: 129886 Stücke
Im Einkaufswagen
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| PCAL6524EV-ARD |
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Hersteller: NXP USA Inc.
Description: 24-BIT GPIO ARDUINO SHIELD
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCAL6524
Contents: Board(s)
Type: Interface
Function: I/O Expansion
Packaging: Bulk
Description: 24-BIT GPIO ARDUINO SHIELD
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCAL6524
Contents: Board(s)
Type: Interface
Function: I/O Expansion
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 241.7 EUR |
| TJR1442BTK/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
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| PUMB2/L135 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
auf Bestellung 340000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7212+ | 0.067 EUR |
| PUMB2/DG/B3115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
auf Bestellung 84000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9616+ | 0.05 EUR |
































