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BLF184XR112 NXP USA Inc. ROCELEC_blf184xr_blf184xrs.pdf?t.download=true&u=ovmfp3 Description: RF MOSFET LDMOS
Packaging: Bulk
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PCA9614DPZ PCA9614DPZ NXP USA Inc. PCA9614.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
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PCA9614DPZ PCA9614DPZ NXP USA Inc. PCA9614.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
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250+3.31 EUR
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1000+3.11 EUR
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74AXP1G06GNH 74AXP1G06GNH NXP USA Inc. PHGLS29168-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Input Logic Level - Low: 0.7V
Input Logic Level - High: 1.6V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Features: Open Drain
Packaging: Bulk
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74AUP1G06GN,132 74AUP1G06GN,132 NXP USA Inc. PHGLS24870-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
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74AUP1G06GFH 74AUP1G06GFH NXP USA Inc. PHGLS24870-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 1CH 1-INP 6XSON
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74AUP2G06GF,132 74AUP2G06GF,132 NXP USA Inc. PHGLS25893-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER OD 2CH 2-INP 6XSON
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MCF54418CMJ250R MCF54418CMJ250R NXP USA Inc. MCF54418.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
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S912XDT384J1MAL S912XDT384J1MAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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S912XDT384J1VAL S912XDT384J1VAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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S912XDT384J1MALR S912XDT384J1MALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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LPC54S018JET180K LPC54S018JET180K NXP USA Inc. LPC540xx.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
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PDTD1113ET215 PDTD1113ET215 NXP USA Inc. PDTD113E_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
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A2T18S260W12NR3 NXP USA Inc. A2T18S260W12N.pdf Description: RF MOSFET LDMOS 28V OM880X-2L2L
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: OM-880X-2L2L
Technology: LDMOS
Gain: 18.7dB
Power - Output: 280W
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: OM-880X-2L2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAT54/6215 BAT54/6215 NXP USA Inc. PHGLS25648-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, SCHOTTKY
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MPC8321VRAFDCA MPC8321VRAFDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 333MHZ PBGA516
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
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LS1027AXN7HNA LS1027AXN7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
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NX3008NBKT115 NX3008NBKT115 NXP USA Inc. NX3008NBKT.pdf Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
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TJA1442BT/0Z TJA1442BT/0Z NXP USA Inc. TJR1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1442BT/0Z TJA1442BT/0Z NXP USA Inc. TJR1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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10+2.59 EUR
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100+2.11 EUR
250+1.99 EUR
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NCF2951BTT/T0E081J NXP USA Inc. Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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BGM1014,115 BGM1014,115 NXP USA Inc. BGM1014.pdf Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
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TL431ASDT,215 TL431ASDT,215 NXP USA Inc. TL431_Family.pdf Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F5AZESR2 MMPF0100F5AZESR2 NXP USA Inc. Description: IC REG CONV I.MX6 12OUT 56QFN
Produkt ist nicht verfügbar
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K32W061K K32W061K NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
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2+15.62 EUR
10+13.54 EUR
25+12.82 EUR
100+11.83 EUR
250+11.23 EUR
500+10.82 EUR
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PXT4403115 PXT4403115 NXP USA Inc. PXT4403.pdf Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
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S9S12ZVLS1F0VFM S9S12ZVLS1F0VFM NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 16KB FLASH 32QFN
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S912ZVMC64F3WKH S912ZVMC64F3WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
DigiKey Programmable: Not Verified
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74LVT00PW,118 74LVT00PW,118 NXP USA Inc. 74LVT00.pdf Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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RDGD31603PSMKEVM RDGD31603PSMKEVM NXP USA Inc. Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Box
Produkt ist nicht verfügbar
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RDGD31603PHSEVM RDGD31603PHSEVM NXP USA Inc. Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
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74AHCT123APW-Q100118 74AHCT123APW-Q100118 NXP USA Inc. 74AHC_AHCT123A_Q100.pdf Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TJA1441BTK/0Z TJA1441BTK/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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250+1.56 EUR
500+1.5 EUR
1000+1.49 EUR
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MPC885CVR66 MPC885CVR66 NXP USA Inc. MPC885EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC875VR66-NXP MPC875VR66-NXP NXP USA Inc. FSCLS03852-1.pdf?t.download=true&u=5oefqw Description: IC MPU 66MHZ 256BGA
Part Status: Active
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (1), 10/100Mbps (2)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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74AHC164D112 74AHC164D112 NXP USA Inc. 74AHC_AHCT164.pdf Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T/1J NXP USA Inc. TEA2206T.pdf Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
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TEA2206T/1J TEA2206T/1J NXP USA Inc. TEA2206T.pdf Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
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74ABT162245ADL112 74ABT162245ADL112 NXP USA Inc. 74ABT_ABTH162245A.pdf Description: NOW NEXPERIA 74ABT162245ADL - BU
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SC18IS606PWJ SC18IS606PWJ NXP USA Inc. SC18IS606.pdf Description: IC I2C TO SPI BRIDGE
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 16-TSSOP
Protocol: I2C
DigiKey Programmable: Not Verified
Current - Supply: 4mA
Voltage - Supply: 1.71V ~ 3.6V
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SC18IS606PWJ SC18IS606PWJ NXP USA Inc. SC18IS606.pdf Description: IC I2C TO SPI BRIDGE
Part Status: Active
Supplier Device Package: 16-TSSOP
Protocol: I2C
Current - Supply: 4mA
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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SC18IS604PWJ SC18IS604PWJ NXP USA Inc. SC18IS604.pdf Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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SC18IS604PWJ SC18IS604PWJ NXP USA Inc. SC18IS604.pdf Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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25+5.24 EUR
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500+4.34 EUR
1000+4.22 EUR
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MCIMX6Q4AVT10ADR518 NXP USA Inc. IMX6DQCPOPEC.pdf Description: CORTEX A9 RISC MICROPROCESSOR 32
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHC32PW/S400118 74AHC32PW/S400118 NXP USA Inc. PHGLS15531-1.pdf?t.download=true&u=5oefqw Description: OR GATE, AHC SERIES
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S912XEQ512F1VAA S912XEQ512F1VAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XEQ512F1VAAR S912XEQ512F1VAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OMA1007TL-SKT NXP USA Inc. Description: EVAL BOARD FOR A1007TL
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: A1007TL
Type: Interface
Function: Anti Tamper and Security
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MC32PF1550A3EP MC32PF1550A3EP NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
 Mindestbestellmenge: 490 Stücke
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MC33VR5500V3ES NXP USA Inc. Description: VR5500
Produkt ist nicht verfügbar
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FRDMGD3160DSBHB FRDMGD3160DSBHB NXP USA Inc. UM11658.pdf Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 2 Stücke:
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BGA2771,115 BGA2771,115 NXP USA Inc. BGA2771_Rev_Nov2010.pdf Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 12.1dBm
Noise Figure: 4.5dB
Current - Supply: 33.3mA
Gain: 21.4dB
Voltage - Supply: 3V ~ 4V
RF Type: ISM
Frequency: 20MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74AUP2G07GX147 74AUP2G07GX147 NXP USA Inc. 74AUP2G07.pdf Description: IC BUFF 0.8V/3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
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403+1.36 EUR
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74ABT162245ADL653 74ABT162245ADL653 NXP USA Inc. 74ABT_ABTH162245A.pdf Description: IC TXRX NON-INVERT 5.5V
Part Status: Active
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 995 Stücke
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LPC11E67JBD48K LPC11E67JBD48K NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.61 EUR
10+8.13 EUR
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100+6.83 EUR
250+6.5 EUR
500+6.31 EUR
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SCIMX6S6AVM083C NXP USA Inc. Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 60 Stücke
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8CH-DMIC 8CH-DMIC NXP USA Inc. RT600.pdf Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 5 Stücke:
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1+194.86 EUR
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LD6806TD/22P,125 LD6806TD/22P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.2V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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P1014NSE5HFB557 NXP USA Inc. P1010EC.pdf Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
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BLF184XR112 ROCELEC_blf184xr_blf184xrs.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Bulk
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1+1078.04 EUR
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PCA9614DPZ PCA9614.pdf
PCA9614DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
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2500+3.01 EUR
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PCA9614DPZ PCA9614.pdf
PCA9614DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 3776 Stücke:
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4+5.65 EUR
10+4.24 EUR
25+3.89 EUR
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250+3.31 EUR
500+3.2 EUR
1000+3.11 EUR
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74AXP1G06GNH PHGLS29168-1.pdf?t.download=true&u=5oefqw
74AXP1G06GNH
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Input Logic Level - Low: 0.7V
Input Logic Level - High: 1.6V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Features: Open Drain
Packaging: Bulk
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2002+0.3 EUR
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74AUP1G06GN,132 PHGLS24870-1.pdf?t.download=true&u=5oefqw
74AUP1G06GN,132
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
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2179+0.27 EUR
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74AUP1G06GFH PHGLS24870-1.pdf?t.download=true&u=5oefqw
74AUP1G06GFH
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
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74AUP2G06GF,132 PHGLS25893-1.pdf?t.download=true&u=5oefqw
74AUP2G06GF,132
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP 6XSON
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2036+0.3 EUR
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MCF54418CMJ250R MCF54418.pdf
MCF54418CMJ250R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
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S912XDT384J1MAL
S912XDT384J1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XDT384J1VAL
S912XDT384J1VAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XDT384J1MALR
S912XDT384J1MALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC54S018JET180K LPC540xx.pdf
LPC54S018JET180K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 927 Stücke:
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AnzahlPrivatkunde
1+23.29 EUR
10+18.3 EUR
25+17.05 EUR
189+15.22 EUR
378+14.79 EUR
567+14.58 EUR
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PDTD1113ET215 PDTD113E_SER.pdf
PDTD1113ET215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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A2T18S260W12NR3 A2T18S260W12N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: OM-880X-2L2L
Technology: LDMOS
Gain: 18.7dB
Power - Output: 280W
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: OM-880X-2L2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAT54/6215 PHGLS25648-1.pdf?t.download=true&u=5oefqw
BAT54/6215
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
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MPC8321VRAFDCA MPC8323EEC.pdf
MPC8321VRAFDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
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LS1027AXN7HNA
LS1027AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Produkt ist nicht verfügbar
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NX3008NBKT115 NX3008NBKT.pdf
NX3008NBKT115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
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9616+0.058 EUR
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TJA1442BT/0Z TJR1442.pdf
TJA1442BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7160 Stücke:
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2500+1.82 EUR
5000+1.78 EUR
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TJA1442BT/0Z TJR1442.pdf
TJA1442BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7617 Stücke:
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6+3.52 EUR
10+2.59 EUR
25+2.36 EUR
100+2.11 EUR
250+1.99 EUR
500+1.92 EUR
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NCF2951BTT/T0E081J
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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BGM1014,115 BGM1014.pdf
BGM1014,115
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Produkt ist nicht verfügbar
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TL431ASDT,215 TL431_Family.pdf
TL431ASDT,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMPF0100F5AZESR2
MMPF0100F5AZESR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Produkt ist nicht verfügbar
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K32W061K K32W061.pdf
K32W061K
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
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2+15.62 EUR
10+13.54 EUR
25+12.82 EUR
100+11.83 EUR
250+11.23 EUR
500+10.82 EUR
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PXT4403115 PXT4403.pdf
PXT4403115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
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S9S12ZVLS1F0VFM S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVLS1F0VFM
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Produkt ist nicht verfügbar
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S912ZVMC64F3WKH S12ZVMFS.pdf
S912ZVMC64F3WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT00PW,118 74LVT00.pdf
74LVT00PW,118
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
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RDGD31603PSMKEVM
RDGD31603PSMKEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Box
Produkt ist nicht verfügbar
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RDGD31603PHSEVM
RDGD31603PHSEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
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1+1964.68 EUR
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74AHCT123APW-Q100118 74AHC_AHCT123A_Q100.pdf
74AHCT123APW-Q100118
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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6000+1.39 EUR
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TJA1441BTK/0Z TJA1441.pdf
TJA1441BTK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11614 Stücke:
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8+2.81 EUR
11+2.06 EUR
25+1.87 EUR
100+1.65 EUR
250+1.56 EUR
500+1.5 EUR
1000+1.49 EUR
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MPC885CVR66 MPC885EC.pdf
MPC885CVR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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6+101.13 EUR
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MPC875VR66-NXP FSCLS03852-1.pdf?t.download=true&u=5oefqw
MPC875VR66-NXP
Hersteller: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Part Status: Active
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (1), 10/100Mbps (2)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
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10+61.56 EUR
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74AHC164D112 74AHC_AHCT164.pdf
74AHC164D112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T.pdf
TEA2206T/1J
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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TEA2206T/1J TEA2206T.pdf
TEA2206T/1J
Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4447 Stücke:
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3+9.03 EUR
10+6.87 EUR
25+6.33 EUR
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74ABT162245ADL112 74ABT_ABTH162245A.pdf
74ABT162245ADL112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT162245ADL - BU
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512+1.21 EUR
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SC18IS606PWJ SC18IS606.pdf
SC18IS606PWJ
Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 16-TSSOP
Protocol: I2C
DigiKey Programmable: Not Verified
Current - Supply: 4mA
Voltage - Supply: 1.71V ~ 3.6V
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2500+3.68 EUR
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SC18IS606PWJ SC18IS606.pdf
SC18IS606PWJ
Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Part Status: Active
Supplier Device Package: 16-TSSOP
Protocol: I2C
Current - Supply: 4mA
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Controller
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 3419 Stücke:
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4+6.85 EUR
10+5.15 EUR
25+4.74 EUR
100+4.26 EUR
250+4.05 EUR
500+3.9 EUR
1000+3.8 EUR
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SC18IS604PWJ SC18IS604.pdf
SC18IS604PWJ
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+4.09 EUR
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SC18IS604PWJ SC18IS604.pdf
SC18IS604PWJ
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3461 Stücke:
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3+7.54 EUR
10+5.7 EUR
25+5.24 EUR
100+4.72 EUR
250+4.49 EUR
500+4.34 EUR
1000+4.22 EUR
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MCIMX6Q4AVT10ADR518 IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHC32PW/S400118 PHGLS15531-1.pdf?t.download=true&u=5oefqw
74AHC32PW/S400118
Hersteller: NXP USA Inc.
Description: OR GATE, AHC SERIES
Produkt ist nicht verfügbar
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S912XEQ512F1VAA MC9S12XEPB.pdf
S912XEQ512F1VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XEQ512F1VAAR MC9S12XEPB.pdf
S912XEQ512F1VAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OMA1007TL-SKT
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR A1007TL
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: A1007TL
Type: Interface
Function: Anti Tamper and Security
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MC32PF1550A3EP
MC32PF1550A3EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MC33VR5500V3ES
Hersteller: NXP USA Inc.
Description: VR5500
Produkt ist nicht verfügbar
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FRDMGD3160DSBHB UM11658.pdf
FRDMGD3160DSBHB
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+1455.04 EUR
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BGA2771,115 BGA2771_Rev_Nov2010.pdf
BGA2771,115
Hersteller: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Test Frequency: 1GHz
P1dB: 12.1dBm
Noise Figure: 4.5dB
Current - Supply: 33.3mA
Gain: 21.4dB
Voltage - Supply: 3V ~ 4V
RF Type: ISM
Frequency: 20MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74AUP2G07GX147 74AUP2G07.pdf
74AUP2G07GX147
Hersteller: NXP USA Inc.
Description: IC BUFF 0.8V/3.6V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
403+1.36 EUR
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74ABT162245ADL653 74ABT_ABTH162245A.pdf
74ABT162245ADL653
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V
Part Status: Active
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC11E67JBD48K LPC11E1X.pdf
LPC11E67JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.61 EUR
10+8.13 EUR
25+7.51 EUR
100+6.83 EUR
250+6.5 EUR
500+6.31 EUR
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SCIMX6S6AVM083C
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM COR
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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8CH-DMIC RT600.pdf
8CH-DMIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: Yes
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
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1+194.86 EUR
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LD6806TD/22P,125 LD6806_Series.pdf
LD6806TD/22P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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2959+0.19 EUR
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P1014NSE5HFB557 P1010EC.pdf
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
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AnzahlPrivatkunde
7+89.75 EUR
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