Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36787) > Seite 434 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| P2020NXE2HHC | NXP USA Inc. |
Description: QORIQ, 32-BIT POWER ARCH SOC, 2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
TEA2016AAT/1J | NXP USA Inc. |
Description: RESONANT POWER SUPPLY WITH PFCPackaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 2.35V ~ 4.5V Applications: Digital Power Controller Supplier Device Package: 16-SO Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1093 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
SPC5744PK1AMLQ8R | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PMEG4005EGW,118 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY, 0.5A,Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
PMEG4005EGW115 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPart Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PSMN1RS-40ES127 | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
MCIMX6Y1DVK05AB | NXP USA Inc. |
Description: I.MX6ULL ROM PERF ENHAN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
PTN5100BSMP | NXP USA Inc. |
Description: IC USB PD PHY TYPE C 20HVQFNDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 20-HVQFN (4x4) Protocol: USB Operating Temperature: -20°C ~ 85°C Interface: USB Function: Controller Package / Case: 20-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 4463 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AHCT00BQ-Q100X | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14DHVQFNCurrent - Quiescent (Max): 2 µA Number of Circuits: 4 Part Status: Active Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-DHVQFN (2.5x3) Number of Inputs: 2 Current - Output High, Low: 8mA, 8mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 14-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 2599 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
AFV10700HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780Packaging: Bulk Package / Case: NI-780S-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.03GHz ~ 1.09GHz Configuration: Dual Power - Output: 770W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780S-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 591 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| MCHC11F1VFNE4R | NXP USA Inc. | Description: HC11 SERIES MICROCONTROLLER IC 8 |
auf Bestellung 2340 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
|
SPC5746CBK1AMMH6 | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
SPC5604BF2VLQ6R | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
74AUP2G08GF,115 | NXP USA Inc. |
Description: IC GATE AND 2CH 2-INP 8XSON |
auf Bestellung 173880 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
LPC3240FET296/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGANumber of I/O: 51 Part Status: Active Supplier Device Package: 296-TFBGA (15x15) Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 3x10b Core Processor: ARM926EJ-S Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256K x 8 Speed: 266MHz Mounting Type: Surface Mount Packaging: Bulk Package / Case: 296-TFBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
LPC3240FET296/01,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGANumber of I/O: 51 Part Status: Active Supplier Device Package: 296-TFBGA (15x15) Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 3x10b Core Processor: ARM926EJ-S Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256K x 8 Speed: 266MHz Mounting Type: Surface Mount Package / Case: 296-TFBGA Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
BZB84-B5V6215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-B5V6 - ZENERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
BZB84-C12215 | NXP USA Inc. |
Description: NOW NEXPERIA ZENER DIODE, 12V, 5Qualification: AEC-Q101 Current - Reverse Leakage @ Vr: 100 nA @ 8 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 300 mW Grade: Automotive Supplier Device Package: TO-236AB Impedance (Max) (Zzt): 25 Ohms Voltage - Zener (Nom) (Vz): 12 V Operating Temperature: 150°C (TJ) Configuration: 1 Pair Common Anode Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Bulk |
auf Bestellung 81600 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
BZB84-C6V8,215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-C6V8 - ZENER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MF1P2101DUF/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 35892 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MF1P4131DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 35892 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MF1P2101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 Packaging: Tray Package / Case: Die Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MC908AP64CFAE,557 | NXP USA Inc. | Description: MICROCONTROLLER, 8 BIT, HC08/S08 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 30 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| BLF184XR112 | NXP USA Inc. |
Description: RF MOSFET LDMOSPackaging: Bulk |
auf Bestellung 80 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
|
PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOPPackaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
PCA9614DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOPPackaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400kHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 7 pF |
auf Bestellung 3776 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AXP1G06GNH | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSONCurrent - Quiescent (Max): 600 nA Number of Circuits: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF Input Logic Level - Low: 0.7V Input Logic Level - High: 1.6V Supplier Device Package: 6-XSON (0.9x1) Number of Inputs: 1 Current - Output High, Low: -, 8mA Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C Logic Type: Inverter Mounting Type: Surface Mount Package / Case: 6-XFDFN Features: Open Drain Packaging: Bulk |
auf Bestellung 159500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AUP1G06GN,132 | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSON |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AUP1G06GFH | NXP USA Inc. |
Description: IC INVERTER OD 1CH 1-INP 6XSON |
auf Bestellung 14656 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AUP2G06GF,132 | NXP USA Inc. |
Description: IC INVERTER OD 2CH 2-INP 6XSON |
auf Bestellung 96533 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
MCF54418CMJ250R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
S912XDT384J1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 20K x 8 Program Memory Size: 384KB (384K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
S912XDT384J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 20K x 8 Program Memory Size: 384KB (384K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
S912XDT384J1MALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 20K x 8 Program Memory Size: 384KB (384K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
LPC54S018JET180K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGAPackaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 1052 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
PDTD1113ET215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| A2T18S260W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2LCurrent - Test: 1.5 A Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: OM-880X-2L2L Technology: LDMOS Gain: 18.7dB Power - Output: 280W Frequency: 1.805GHz ~ 1.88GHz Mounting Type: Chassis Mount Current Rating (Amps): 10µA Package / Case: OM-880X-2L2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
BAT54/6215 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKY |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
MPC8321VRAFDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 516-PBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c2 Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Packaging: Bulk Part Status: Active Graphics Acceleration: No |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
LS1027AXN7HNA | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 448FBGA Ethernet: 1Gbps (1), 2.5Gbps (5) Supplier Device Package: 448-FBGA (17x17) Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 448-BFBGA Packaging: Tray Additional Interfaces: CANbus, I2C, SPI, UART Part Status: Active SATA: SATA 6Gbps (1) RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Number of Cores/Bus Width: 2 Core, 64-Bit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
NX3008NBKT115 | NXP USA Inc. |
Description: SMALL SIGNAL FETPackaging: Bulk Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 350mA (Ta) Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V Power Dissipation (Max): 250mW (Ta), 770mW (Tc) Vgs(th) (Max) @ Id: 1.1V @ 250µA Supplier Device Package: SC-75 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V |
auf Bestellung 217719 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 7160 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
TJA1442BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 7617 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| NCF2951BTT/T0E081J | NXP USA Inc. | Description: IC ACTIC 4G 3D 38TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
BGM1014,115 | NXP USA Inc. |
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
TL431ASDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 1% TO236ABTolerance: ±1% Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Grade: Automotive Part Status: Obsolete Current - Cathode: 600 µA Current - Output: 100 mA Voltage - Output (Max): 36 V Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
MMPF0100F5AZESR2 | NXP USA Inc. | Description: IC REG CONV I.MX6 12OUT 56QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
K32W061K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNPart Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0 Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 2429 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
PXT4403115 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 950 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
S9S12ZVLS1F0VFM | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
S912ZVMC64F3WKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPConnectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 9x12b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray Number of I/O: 31 Part Status: Active Supplier Device Package: 64-HLQFP (10x10) Peripherals: DMA, POR, PWM, WDT DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
74LVT00PW,118 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14TSSOPPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Current - Output High, Low: 20mA, 32mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 992 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
RDGD31603PSMKEVM | NXP USA Inc. |
Description: EVAL BOARD FOR GD3160, KL25Z Contents: Board(s), Cable(s) Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU Primary Attributes: 6-Channel (Hex) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Type: Power Management Function: Gate Driver Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
RDGD31603PHSEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS6500 Packaging: Bulk Function: Gate Driver Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: FS6500, GD3160, MPC5777C Secondary Attributes: SPI Interface(s) Embedded: Yes, MCU |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AHCT123APW-Q100118 | NXP USA Inc. |
Description: IC MULTIVIBRATOR |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
TJA1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 11614 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
MPC885CVR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGASecurity Features: Cryptography Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10Mbps (3), 10/100Mbps (2) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 100°C (TA) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
MPC875VR66-NXP | NXP USA Inc. |
Description: IC MPU 66MHZ 256BGAPart Status: Active Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10Mbps (1), 10/100Mbps (2) Supplier Device Package: 256-PBGA (23x23) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TA) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 256-BBGA Packaging: Bulk Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
74AHC164D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHC164D - SERIAL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| P2020NXE2HHC |
![]() |
Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 2
Description: QORIQ, 32-BIT POWER ARCH SOC, 2
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TEA2016AAT/1J |
![]() |
Hersteller: NXP USA Inc.
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1093 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8 EUR |
| 10+ | 6.06 EUR |
| 25+ | 5.57 EUR |
| 100+ | 5.05 EUR |
| 250+ | 4.78 EUR |
| 500+ | 4.77 EUR |
| SPC5744PK1AMLQ8R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PMEG4005EGW,118 |
![]() |
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY, 0.5A,
Part Status: Active
Packaging: Bulk
Description: RECTIFIER DIODE, SCHOTTKY, 0.5A,
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN1RS-40ES127 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6Y1DVK05AB |
![]() |
Hersteller: NXP USA Inc.
Description: I.MX6ULL ROM PERF ENHAN
Description: I.MX6ULL ROM PERF ENHAN
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PTN5100BSMP |
![]() |
Hersteller: NXP USA Inc.
Description: IC USB PD PHY TYPE C 20HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 20-HVQFN (4x4)
Protocol: USB
Operating Temperature: -20°C ~ 85°C
Interface: USB
Function: Controller
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC USB PD PHY TYPE C 20HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 20-HVQFN (4x4)
Protocol: USB
Operating Temperature: -20°C ~ 85°C
Interface: USB
Function: Controller
Package / Case: 20-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 4463 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.94 EUR |
| 10+ | 3.69 EUR |
| 25+ | 3.37 EUR |
| 100+ | 3.02 EUR |
| 250+ | 2.86 EUR |
| 500+ | 2.75 EUR |
| 1000+ | 2.67 EUR |
| 2500+ | 2.58 EUR |
| 74AHCT00BQ-Q100X |
![]() |
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Description: IC GATE NAND 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 2599 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 729+ | 0.74 EUR |
| AFV10700HSR5 |
![]() |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 591 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1290.17 EUR |
| MCHC11F1VFNE4R |
Hersteller: NXP USA Inc.
Description: HC11 SERIES MICROCONTROLLER IC 8
Description: HC11 SERIES MICROCONTROLLER IC 8
auf Bestellung 2340 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 88.77 EUR |
| SPC5746CBK1AMMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BF2VLQ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP2G08GF,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8XSON
Description: IC GATE AND 2CH 2-INP 8XSON
auf Bestellung 173880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1655+ | 0.35 EUR |
| LPC3240FET296/01551 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Packaging: Bulk
Package / Case: 296-TFBGA
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Packaging: Bulk
Package / Case: 296-TFBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC3240FET296/01,551 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Bulk
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZB84-B5V6215 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B5V6 - ZENER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZB84-B5V6 - ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZB84-C12215 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 12V, 5
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
Description: NOW NEXPERIA ZENER DIODE, 12V, 5
Qualification: AEC-Q101
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 300 mW
Grade: Automotive
Supplier Device Package: TO-236AB
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Operating Temperature: 150°C (TJ)
Configuration: 1 Pair Common Anode
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 81600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11632+ | 0.057 EUR |
| BZB84-C6V8,215 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Description: NOW NEXPERIA BZB84-C6V8 - ZENER
Produkt ist nicht verfügbar
Mindestbestellmenge: 5900 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF1P2101DUF/02V |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
Mindestbestellmenge: 35892 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF1P4131DUD/02V |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
Mindestbestellmenge: 35892 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF1P2101DUD/02V |
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE PLUS EV1
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908AP64CFAE,557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Produkt ist nicht verfügbar
Mindestbestellmenge: 30 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BLF184XR112 |
![]() |
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1078.04 EUR |
| PCA9614DPZ |
![]() |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 3.01 EUR |
| PCA9614DPZ |
![]() |
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400kHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 3776 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.65 EUR |
| 10+ | 4.24 EUR |
| 25+ | 3.89 EUR |
| 100+ | 3.5 EUR |
| 250+ | 3.31 EUR |
| 500+ | 3.2 EUR |
| 1000+ | 3.11 EUR |
| 74AXP1G06GNH |
![]() |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Input Logic Level - Low: 0.7V
Input Logic Level - High: 1.6V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Features: Open Drain
Packaging: Bulk
Description: IC INVERTER OD 1CH 1-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 2.5V, 5pF
Input Logic Level - Low: 0.7V
Input Logic Level - High: 1.6V
Supplier Device Package: 6-XSON (0.9x1)
Number of Inputs: 1
Current - Output High, Low: -, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Features: Open Drain
Packaging: Bulk
auf Bestellung 159500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2002+ | 0.3 EUR |
| 74AUP1G06GN,132 |
![]() |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2179+ | 0.27 EUR |
| 74AUP1G06GFH |
![]() |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
auf Bestellung 14656 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1697+ | 0.35 EUR |
| 74AUP2G06GF,132 |
![]() |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP 6XSON
Description: IC INVERTER OD 2CH 2-INP 6XSON
auf Bestellung 96533 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2036+ | 0.3 EUR |
| MCF54418CMJ250R |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XDT384J1MAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XDT384J1VAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XDT384J1MALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 20K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC54S018JET180K |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 1052 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.41 EUR |
| 10+ | 19.96 EUR |
| 50+ | 17.78 EUR |
| 100+ | 17.11 EUR |
| 189+ | 16.59 EUR |
| 567+ | 15.9 EUR |
| PDTD1113ET215 |
![]() |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| A2T18S260W12NR3 |
![]() |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: OM-880X-2L2L
Technology: LDMOS
Gain: 18.7dB
Power - Output: 280W
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: OM-880X-2L2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: OM-880X-2L2L
Technology: LDMOS
Gain: 18.7dB
Power - Output: 280W
Frequency: 1.805GHz ~ 1.88GHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: OM-880X-2L2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAT54/6215 |
![]() |
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 18000+ | 0.043 EUR |
| MPC8321VRAFDCA |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
Description: IC MPU MPC83XX 333MHZ PBGA516
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 7+ | 75.09 EUR |
| LS1027AXN7HNA |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Description: IC MPU QORIQ 800MHZ 448FBGA
Ethernet: 1Gbps (1), 2.5Gbps (5)
Supplier Device Package: 448-FBGA (17x17)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 448-BFBGA
Packaging: Tray
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
SATA: SATA 6Gbps (1)
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Number of Cores/Bus Width: 2 Core, 64-Bit
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NX3008NBKT115 |
![]() |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Description: SMALL SIGNAL FET
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
auf Bestellung 217719 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9616+ | 0.058 EUR |
| TJA1442BT/0Z |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7160 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 1.82 EUR |
| 5000+ | 1.78 EUR |
| TJA1442BT/0Z |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 7617 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.52 EUR |
| 10+ | 2.59 EUR |
| 25+ | 2.36 EUR |
| 100+ | 2.11 EUR |
| 250+ | 1.99 EUR |
| 500+ | 1.92 EUR |
| NCF2951BTT/T0E081J |
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGM1014,115 |
![]() |
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Description: IC RF AMP ISM 0HZ-2.2GHZ 6TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TL431ASDT,215 |
![]() |
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMPF0100F5AZESR2 |
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Description: IC REG CONV I.MX6 12OUT 56QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W061K |
![]() |
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.62 EUR |
| 10+ | 13.54 EUR |
| 25+ | 12.82 EUR |
| 100+ | 11.83 EUR |
| 250+ | 11.23 EUR |
| 500+ | 10.82 EUR |
| PXT4403115 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
Mindestbestellmenge: 950 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12ZVLS1F0VFM |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
Description: IC MCU 16BIT 16KB FLASH 32QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVMC64F3WKH |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 31
Part Status: Active
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVT00PW,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Current - Output High, Low: 20mA, 32mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 2.7ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 992 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 683+ | 0.84 EUR |
| RDGD31603PSMKEVM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Box
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 6-Channel (Hex)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| RDGD31603PHSEVM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS6500, GD3160, MPC5777C
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1964.68 EUR |
| 74AHCT123APW-Q100118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR
Description: IC MULTIVIBRATOR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1441BTK/0Z |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6000+ | 1.39 EUR |
| TJA1441BTK/0Z |
![]() |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11614 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.81 EUR |
| 11+ | 2.06 EUR |
| 25+ | 1.87 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.56 EUR |
| 500+ | 1.5 EUR |
| 1000+ | 1.49 EUR |
| MPC885CVR66 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (3), 10/100Mbps (2)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 101.13 EUR |
| MPC875VR66-NXP |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU 66MHZ 256BGA
Part Status: Active
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (1), 10/100Mbps (2)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU 66MHZ 256BGA
Part Status: Active
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10Mbps (1), 10/100Mbps (2)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Bulk
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 61.56 EUR |
| 74AHC164D112 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC164D - SERIAL
Description: NOW NEXPERIA 74AHC164D - SERIAL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH







































