Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 434 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
74LVC16374ADGG-Q100118 | NXP USA Inc. |
 Description: BUS DRIVER, LVC/LCX/Z SERIESPart Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 74LVC163D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC163D - BINARY |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| S32K148EVB-Q144 | NXP USA Inc. |
Description: S32K148 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MCIMX286CVM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MCIMX286DVM4CR | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -20°C ~ 70°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
MCIMX286CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keyboard, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: LVDDR, LVDDR2, DDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCIMX285AVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| CBT3306PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
auf Bestellung 2729 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||
 |
CBT3306D-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1917 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
BZX84-C3V3/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW SOT23 Current - Reverse Leakage @ Vr: 5 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 95 Ohms Voltage - Zener (Nom) (Vz): 3.3 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Tape & Reel (TR) Qualification: AEC-Q101 Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MC908KX2CDWE-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOIC Number of I/O: 13 Part Status: Active Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b DigiKey Programmable: Not Verified Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Program Memory Size: 2KB (2K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
auf Bestellung 4263 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||
| PSMN9RO-25YLC115 | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
74ABT821DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 10BIT 24SSOP |
auf Bestellung 708 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
N74F5074D,602 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
PCA9516AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 400KHZ 16SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
BZX84-C3V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW SOT23 Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 74LVC14AWP112 | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
K32W041AK | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tray Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM DigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 |
auf Bestellung 2440 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
SPC5744PK1AMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 384K x 8 Program Memory Size: 2.5MB (2.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
FS32K148HFT0VLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 128 Supplier Device Package: 144-LQFP (20x20) Peripherals: I2S, POR, PWM, WDT Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCIMX6Q5EYM10ADR | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA Part Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Packaging: Cut Tape (CT) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 751 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCF54452CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA DigiKey Programmable: Not Verified Number of I/O: 132 Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray |
auf Bestellung 599 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MC56F82733MFM | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 26 Packaging: Tray Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 16 Program Memory Size: 48KB (24K x 16) Speed: 100MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
LPC11U68JBD48K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x12b SAR Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 36K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
auf Bestellung 675 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
BUK7E11-55B,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A I2PAK Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Obsolete Supplier Device Package: I2PAK Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 157W (Tc) Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Packaging: Tube |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
BCP56135 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCF52100CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA Packaging: Tray Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Part Status: Not For New Designs Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||
 |
BZX884-B5V6315 | NXP USA Inc. |
Description: NOW NEXPERIA BZX884-B5V6 ZENER D |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 15000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
FS32K144MST0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 58 Part Status: Obsolete Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
SPC5605BK0MLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 121 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 15x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
SPC5605BK0MLQ4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
LPC5536JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFP DigiKey Programmable: Not Verified Number of I/O: 39 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 13x16b; D/A 1x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 256KB (256K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray |
auf Bestellung 545 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
LPC5534JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFP Program Memory Size: 128KB (128K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 39 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 13x16b; D/A 1x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
PN7161B1EV/C100K | NXP USA Inc. |
Description: IC NFC CONTROLLER SPI VFBGA64 Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC Supplier Device Package: 64-VFBGA (4x4) Part Status: Active |
auf Bestellung 1609 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MKE18F256VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MVR5510AMDAHESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Qualification: AEC-Q100 Grade: Automotive Part Status: Active Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MVR5510AMDAHES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray Part Status: Active |
auf Bestellung 143 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
BAS116L315 | NXP USA Inc. |
Description: BAS116L - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCZ33904C5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 86 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC10XS6200EK574 | NXP USA Inc. |
Description: BUFFER/INVERTER PERIPHL DRIVER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 61 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MCZ33905CS3EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MCZ33903CP3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 70 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCZ33905CD3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MCZ33905CD5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC34903CP5EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP WITH CAN HIGH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SAF7770EL/101S13AK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Supplier Device Package: 364-LFBGA (15x15) Type: Audio, Car Signal Processor Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SAF4000EL/101S500K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MHT2001NR1 | NXP USA Inc. |
Description: IC AMP GPS 902MHZ-928MHZ TO270 Supplier Device Package: TO-270 WB-14 Test Frequency: 902MHz ~ 928MHz P1dB: 55.2dBm Gain: 33.8dB Voltage - Supply: 50V RF Type: General Purpose Frequency: 902MHz ~ 928MHz Mounting Type: Surface Mount Package / Case: TO-270-14 Variant, Flat Leads Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
QN9080CHN518 | NXP USA Inc. |
Description: BTLE SOC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MC33772BTA1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772BTA1AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772CTA2AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFP Part Status: Active Fault Protection: Over/Under Voltage Supplier Device Package: 48-HLQFP (7x7) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 125°C (TA) Interface: I2C, SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 3 ~ 6 Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772BSP2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772BSA2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772CTP1AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFP Part Status: Active Fault Protection: Over/Under Voltage Supplier Device Package: 48-HLQFP (7x7) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 125°C (TA) Interface: I2C, SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 3 ~ 6 Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 236 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MC33772BSA1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772BTP2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC33772BTP1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 74LVC1G53GS115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G53GS SINGLE- |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
74HCT2G14GW-Q100125 | NXP USA Inc. |
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: Inverter Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Features: Schmitt Trigger Packaging: Bulk Current - Quiescent (Max): 1 µA Number of Circuits: 2 Part Status: Active Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Input Logic Level - Low: 0.5V ~ 0.6V Input Logic Level - High: 1.9V ~ 2.1V Supplier Device Package: SOT-363 Number of Inputs: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74LVC16374ADGG-Q100118 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC163D112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC163D - BINARY
Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K148EVB-Q144 |
|
Hersteller: NXP USA Inc.
Description: S32K148 EVAL BRD
Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX286CVM4CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX286DVM4CR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX286CVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX285AVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CBT3306PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2729+ | 0.27 EUR |
| CBT3306D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
Mindestbestellmenge: 1917 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C3V3/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 95 Ohms
Voltage - Zener (Nom) (Vz): 3.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Description: DIODE ZENER 3.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 95 Ohms
Voltage - Zener (Nom) (Vz): 3.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908KX2CDWE-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
DigiKey Programmable: Not Verified
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
DigiKey Programmable: Not Verified
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 4263 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 52+ | 12.21 EUR |
| PSMN9RO-25YLC115 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT821DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 489+ | 1.19 EUR |
| N74F5074D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 286+ | 2.01 EUR |
| PCA9516AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C3V3/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W041AK |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.53 EUR |
| 10+ | 8.23 EUR |
| 25+ | 7.79 EUR |
| 100+ | 7.18 EUR |
| 250+ | 6.81 EUR |
| 500+ | 6.54 EUR |
| SPC5744PK1AMLQ8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148HFT0VLQT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6Q5EYM10ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 751 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 149.56 EUR |
| 10+ | 124.6 EUR |
| 25+ | 118.37 EUR |
| 100+ | 111.53 EUR |
| MCF54452CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 79.84 EUR |
| 10+ | 65.22 EUR |
| 25+ | 61.57 EUR |
| 100+ | 57.56 EUR |
| 300+ | 55.32 EUR |
| MC56F82733MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Packaging: Tray
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Description: IC MCU 32BIT 48KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Packaging: Tray
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U68JBD48K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 675 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.19 EUR |
| 10+ | 9.39 EUR |
| 25+ | 8.69 EUR |
| 100+ | 7.91 EUR |
| 250+ | 7.54 EUR |
| 500+ | 7.33 EUR |
| BUK7E11-55B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 157W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 157W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 342+ | 1.76 EUR |
| MCF52100CVM80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 50.49 EUR |
| BZX884-B5V6315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
Mindestbestellmenge: 15000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32K144MST0CLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BK0MLQ4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 768KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BK0MLQ4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC5536JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 545 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.89 EUR |
| 10+ | 11.53 EUR |
| 25+ | 10.69 EUR |
| 160+ | 9.52 EUR |
| 320+ | 9.22 EUR |
| LPC5534JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Program Memory Size: 128KB (128K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.36 EUR |
| 10+ | 15.99 EUR |
| PN7161B1EV/C100K |
|
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 1609 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.14 EUR |
| 10+ | 13.14 EUR |
| 25+ | 12.44 EUR |
| 100+ | 11.48 EUR |
| 250+ | 10.9 EUR |
| 500+ | 10.5 EUR |
| MKE18F256VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AMDAHESR2 |
|
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PMIC VR5510 ASIL-D
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AMDAHES |
|
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Description: IC PMIC VR5510 ASIL-D
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.17 EUR |
| 10+ | 18.21 EUR |
| 25+ | 16.98 EUR |
| 100+ | 15.62 EUR |
| MCZ33904C5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Mindestbestellmenge: 86 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC10XS6200EK574 |
|
Hersteller: NXP USA Inc.
Description: BUFFER/INVERTER PERIPHL DRIVER
Description: BUFFER/INVERTER PERIPHL DRIVER
Produkt ist nicht verfügbar
Mindestbestellmenge: 61 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CS3EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903CP3EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
Mindestbestellmenge: 70 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CD3EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CD5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34903CP5EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/101S13AK |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Supplier Device Package: 364-LFBGA (15x15)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Description: SOFTWARE DEFINED RADIO
Supplier Device Package: 364-LFBGA (15x15)
Type: Audio, Car Signal Processor
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MHT2001NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 902MHZ-928MHZ TO270
Supplier Device Package: TO-270 WB-14
Test Frequency: 902MHz ~ 928MHz
P1dB: 55.2dBm
Gain: 33.8dB
Voltage - Supply: 50V
RF Type: General Purpose
Frequency: 902MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 902MHZ-928MHZ TO270
Supplier Device Package: TO-270 WB-14
Test Frequency: 902MHz ~ 928MHz
P1dB: 55.2dBm
Gain: 33.8dB
Voltage - Supply: 50V
RF Type: General Purpose
Frequency: 902MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| QN9080CHN518 |
|
Hersteller: NXP USA Inc.
Description: BTLE SOC
Description: BTLE SOC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTA1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTA1AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772CTA2AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Part Status: Active
Fault Protection: Over/Under Voltage
Supplier Device Package: 48-HLQFP (7x7)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 125°C (TA)
Interface: I2C, SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 3 ~ 6
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Part Status: Active
Fault Protection: Over/Under Voltage
Supplier Device Package: 48-HLQFP (7x7)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 125°C (TA)
Interface: I2C, SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 3 ~ 6
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSP2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSA2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772CTP1AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Part Status: Active
Fault Protection: Over/Under Voltage
Supplier Device Package: 48-HLQFP (7x7)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 125°C (TA)
Interface: I2C, SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 3 ~ 6
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Part Status: Active
Fault Protection: Over/Under Voltage
Supplier Device Package: 48-HLQFP (7x7)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 125°C (TA)
Interface: I2C, SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 3 ~ 6
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 236 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.72 EUR |
| 10+ | 16.24 EUR |
| 25+ | 15.11 EUR |
| 100+ | 13.89 EUR |
| MC33772BSA1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTP2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTP1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC1G53GS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G53GS SINGLE-
Description: NOW NEXPERIA 74LVC1G53GS SINGLE-
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT2G14GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: SOT-363
Number of Inputs: 2
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 1 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: SOT-363
Number of Inputs: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH