Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 434 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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A3G26D055N-1805 | NXP USA Inc. |
 Description: RF MOSFET GAN 48V 6DFNCurrent - Test: 40 mA Voltage - Test: 48 V Voltage - Rated: 125 V Part Status: Active Supplier Device Package: 6-PDFN (7x6.5) Technology: GaN Gain: 13.9dB Power - Output: 8W Frequency: 100MHz ~ 2.69GHz Mounting Type: Surface Mount Package / Case: 6-LDFN Exposed Pad Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| BYV10X-600P127 | NXP USA Inc. |
Description: DIODE GEN PURP 600V 10A TO220F Current - Reverse Leakage @ Vr: 10 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Active Operating Temperature - Junction: 175°C Supplier Device Package: TO-220F Current - Average Rectified (Io): 10A Technology: Standard Reverse Recovery Time (trr): 50 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Full Pack Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74AHCT139D,112 | NXP USA Inc. |
Description: DECODER/DRIVER, AHCT/VHCT SERIES Supplier Device Package: 16-SO Voltage Supply Source: Single Supply Current - Output High, Low: 8mA, 8mA Independent Circuits: 2 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Type: Decoder/Demultiplexer Circuit: 1 x 2:4 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tube |
auf Bestellung 8950 Stücke: Lieferzeit 10-14 Tag (e) |
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AFIC10275NR5 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Gain: 32dB Voltage - Supply: 50V Frequency: 978MHz ~ 1.09GHz Mounting Type: Chassis Mount Package / Case: TO-270-14 Variant, Flat Leads Packaging: Tape & Reel (TR) Supplier Device Package: TO-270 WB-14 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9328MXLCVM15,557 | NXP USA Inc. |
Description: DRAGONBALL CORSICA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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CLF1G0060S-10 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, C BAND, GALL |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34VR500VAES | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Supplier Device Package: 56-QFN-EP (8x8) Current - Supply: 15mA Applications: QorlQ LS1/T1 Communications Processors Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC34VR500VAESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Supplier Device Package: 56-QFN-EP (8x8) Current - Supply: 15mA Applications: QorlQ LS1/T1 Communications Processors Voltage - Supply: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LV365DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 16SSOP Supplier Device Package: 16-SSOP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 6 Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Tube |
auf Bestellung 1092 Stücke: Lieferzeit 10-14 Tag (e) |
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| JN5178/001K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40VFQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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TL431MFDT | NXP USA Inc. |
Description: TL431 - ADJUSTABLE PRECISION SHU Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPF5020AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Supplier Device Package: 40-HVQFN (6x6) Current - Supply: 10µA Applications: High Performance i.MX 8, S32x Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 293 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5023AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Supplier Device Package: 40-HVQFN (6x6) Current - Supply: 10µA Applications: High Performance i.MX 8, S32x Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18275AHN/C1518 | NXP USA Inc. |
Description: TDA18275AHN - HYBRID SILICON TUN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 32-HVQFN (5x5) Control Interface: I²C |
auf Bestellung 833034 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18273HN/C1/S3518 | NXP USA Inc. |
Description: TDA18273 - IC SILICON TUNER HYBR Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 40-HVQFN (6x6) Part Status: Active Control Interface: I²C DigiKey Programmable: Not Verified |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18212HN/M/C1/S3518 | NXP USA Inc. | Description: SILICON TUNER FOR TERRESTRIAL AN |
auf Bestellung 5026 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 222 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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TDA18211HD/C2/S2551 | NXP USA Inc. |
Description: SILICON TUNER FOR TERRESTRIAL AN |
auf Bestellung 46110 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 57 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SC18IS606-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR SC18IS606 Contents: Board(s) Part Status: Active Embedded: No Primary Attributes: 1.71V ~ 3.6V Operating Range Supplied Contents: Board(s) Utilized IC / Part: SC18IS606 Type: Interface Function: I2C to SPI Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS604-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR SC18IS604 Contents: Board(s) Packaging: Bulk Part Status: Active Embedded: No Primary Attributes: 1.71V ~ 3.6V Operating Range Supplied Contents: Board(s) Utilized IC / Part: SC18IS604 Type: Interface Function: I2C to SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PEMI2QFN/WM,115 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/16PF SMD |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4317JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC2210FBD144/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 76 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MC56F82748VLH557 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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OM67200JP | NXP USA Inc. |
Description: A1006 DEVELOPER KIT Contents: Board(s) Part Status: Active Supplied Contents: Board(s) Utilized IC / Part: A1006 Type: Interface Function: Anti Tamper and Security Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PHN203,518-NX | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1087 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LD6805K/22P,115 | NXP USA Inc. |
Description: IC REG LIN 2.2V 150MA DFN1010C-4 Current - Supply (Max): 150 µA Protection Features: Over Current, Transient Voltage Voltage Dropout (Max): 0.25V @ 150mA PSRR: 75dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 2.2V Supplier Device Package: DFN1010C-4 Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 35 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 150mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-UDFN Exposed Pad Packaging: Bulk |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/25H,115 | NXP USA Inc. |
Description: IC REG LIN 2.5V 150MA DFN1010C-4 Control Features: Enable Voltage - Output (Min/Fixed): 2.5V Supplier Device Package: DFN1010C-4 Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 35 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 150mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-UDFN Exposed Pad Packaging: Bulk Current - Supply (Max): 150 µA Protection Features: Over Current, Transient Voltage Voltage Dropout (Max): 0.25V @ 150mA PSRR: 75dB (1kHz) Part Status: Obsolete |
auf Bestellung 54231 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806F/18H,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 6XSON Supplier Device Package: 6-XSON, SOT886 (1.45x1) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 6-XFDFN Packaging: Bulk Current - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 1.8V |
auf Bestellung 7746 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU602DB2115 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 5987 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 5987 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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8MPLUSLPD4-PEVK | NXP USA Inc. |
Description: I.MX 8M PLUS EVAL KIT Part Status: Active Operating System: Android, FreeRTOS, Linux Utilized IC / Part: i.MX 8 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A53, Cortex®-M7 Contents: Board(s), Cable(s), Power Supply Type: MPU Mounting Type: Fixed Packaging: Bulk |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16374ADL,112-NXP | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2- Number of Bits per Element: 8 Part Status: Active Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Supplier Device Package: 48-SSOP Input Capacitance: 5 pF Clock Frequency: 300 MHz Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Current - Quiescent (Iq): 20 µA Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type Function: Standard Number of Elements: 2 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 48-BSSOP (0.295", 7.50mm Width) Packaging: Tube Voltage - Supply: 1.65V ~ 3.6V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC16374ADGG-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 74LVC163D112 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC163D - BINARY |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| S32K148EVB-Q144 | NXP USA Inc. |
Description: S32K148 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MCIMX286CVM4CR2 | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MCIMX286DVM4CR | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -20°C ~ 70°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX286CVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keyboard, LCD, Touchscreen Graphics Acceleration: No RAM Controllers: LVDDR, LVDDR2, DDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCIMX285AVM4C | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray Graphics Acceleration: No RAM Controllers: DDR2, LVDDR, LVDDR2 Co-Processors/DSP: Data; DCP Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 289-MAPBGA (14x14) Voltage - I/O: 1.8V, 3.3V Core Processor: ARM926EJ-S Operating Temperature: -40°C ~ 85°C (TA) Speed: 454MHz Security Features: Boot Security, Cryptography, Hardware ID Display & Interface Controllers: Keypad, LCD, Touchscreen |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| CBT3306PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
auf Bestellung 2729 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3306D-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, CBT SERIES |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1917 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZX84-C3V3/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW SOT23 Current - Reverse Leakage @ Vr: 5 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 95 Ohms Voltage - Zener (Nom) (Vz): 3.3 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±5% Packaging: Tape & Reel (TR) Qualification: AEC-Q101 Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MC908KX2CDWE-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOIC Number of I/O: 13 Part Status: Active Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b DigiKey Programmable: Not Verified Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Program Memory Size: 2KB (2K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
auf Bestellung 4263 Stücke: Lieferzeit 10-14 Tag (e) |
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| PSMN9RO-25YLC115 | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74ABT821DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 10BIT 24SSOP |
auf Bestellung 708 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F5074D,602 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9516AD,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 400KHZ 16SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZX84-C3V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW SOT23 Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.3 V Impedance (Max) (Zzt): 95 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 5 µA @ 1 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 74LVC14AWP112 | NXP USA Inc. |
Description: INVERTER, LVC/LCX/Z SERIES Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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K32W041AK | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tray Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM DigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 |
auf Bestellung 2440 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5744PK1AMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 384K x 8 Program Memory Size: 2.5MB (2.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K148HFT0VLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 128 Supplier Device Package: 144-LQFP (20x20) Peripherals: I2S, POR, PWM, WDT Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCIMX6Q5EYM10ADR | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA Part Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA, FCBGA Packaging: Cut Tape (CT) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 751 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF54452CVP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA DigiKey Programmable: Not Verified Number of I/O: 132 Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray |
auf Bestellung 599 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F82733MFM | NXP USA Inc. |
Description: IC MCU 32BIT 48KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 26 Packaging: Tray Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b; D/A 2x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 16 Program Memory Size: 48KB (24K x 16) Speed: 100MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC11U68JBD48K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 34 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x12b SAR Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 36K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
auf Bestellung 675 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7E11-55B,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A I2PAK Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Obsolete Supplier Device Package: I2PAK Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 157W (Tc) Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Packaging: Tube |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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BCP56135 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCF52100CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA Packaging: Tray Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Part Status: Not For New Designs Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX884-B5V6315 | NXP USA Inc. |
Description: NOW NEXPERIA BZX884-B5V6 ZENER D |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 15000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K144MST0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 58 Part Status: Obsolete Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH |
| A3G26D055N-1805 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Current - Test: 40 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 13.9dB
Power - Output: 8W
Frequency: 100MHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Bulk
Description: RF MOSFET GAN 48V 6DFN
Current - Test: 40 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 13.9dB
Power - Output: 8W
Frequency: 100MHz ~ 2.69GHz
Mounting Type: Surface Mount
Package / Case: 6-LDFN Exposed Pad
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 495.26 EUR |
| BYV10X-600P127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 600V 10A TO220F
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: TO-220F
Current - Average Rectified (Io): 10A
Technology: Standard
Reverse Recovery Time (trr): 50 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Bulk
Description: DIODE GEN PURP 600V 10A TO220F
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Active
Operating Temperature - Junction: 175°C
Supplier Device Package: TO-220F
Current - Average Rectified (Io): 10A
Technology: Standard
Reverse Recovery Time (trr): 50 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT139D,112 |
|
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Decoder/Demultiplexer
Circuit: 1 x 2:4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 8950 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2664+ | 0.18 EUR |
| AFIC10275NR5 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Gain: 32dB
Voltage - Supply: 50V
Frequency: 978MHz ~ 1.09GHz
Mounting Type: Chassis Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Supplier Device Package: TO-270 WB-14
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Gain: 32dB
Voltage - Supply: 50V
Frequency: 978MHz ~ 1.09GHz
Mounting Type: Chassis Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9328MXLCVM15,557 |
|
Hersteller: NXP USA Inc.
Description: DRAGONBALL CORSICA
Description: DRAGONBALL CORSICA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CLF1G0060S-10 |
|
Hersteller: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, C BAND, GALL
Description: RF PFET, 1-ELEMENT, C BAND, GALL
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 137.9 EUR |
| MC34VR500VAES |
|
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Supplier Device Package: 56-QFN-EP (8x8)
Current - Supply: 15mA
Applications: QorlQ LS1/T1 Communications Processors
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: REGULATOR BUCK QUAD WITH UP TO 4
Supplier Device Package: 56-QFN-EP (8x8)
Current - Supply: 15mA
Applications: QorlQ LS1/T1 Communications Processors
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34VR500VAESR2 |
|
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Supplier Device Package: 56-QFN-EP (8x8)
Current - Supply: 15mA
Applications: QorlQ LS1/T1 Communications Processors
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: REGULATOR BUCK QUAD WITH UP TO 4
Supplier Device Package: 56-QFN-EP (8x8)
Current - Supply: 15mA
Applications: QorlQ LS1/T1 Communications Processors
Voltage - Supply: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74LV365DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16SSOP
Supplier Device Package: 16-SSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Description: IC BUF NON-INVERT 3.6V 16SSOP
Supplier Device Package: 16-SSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
auf Bestellung 1092 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 784+ | 0.64 EUR |
| JN5178/001K |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TL431MFDT |
|
Hersteller: NXP USA Inc.
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPF5020AMMA0ES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 293 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.68 EUR |
| 10+ | 9.58 EUR |
| 25+ | 9.06 EUR |
| 80+ | 7.85 EUR |
| 230+ | 7.45 EUR |
| MPF5023AMMA0ES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.7 EUR |
| 10+ | 8.76 EUR |
| 25+ | 8.35 EUR |
| 80+ | 7.25 EUR |
| 230+ | 6.92 EUR |
| 490+ | 6.31 EUR |
| TDA18275AHN/C1518 |
|
Hersteller: NXP USA Inc.
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
auf Bestellung 833034 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 446+ | 1.08 EUR |
| TDA18273HN/C1/S3518 |
|
Hersteller: NXP USA Inc.
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Control Interface: I²C
DigiKey Programmable: Not Verified
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 96+ | 5.21 EUR |
| TDA18212HN/M/C1/S3518 |
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 5026 Stücke:
Lieferzeit 10-14 Tag (e)
| TDA18211HD/C2/S2551 |
|
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 46110 Stücke:
Lieferzeit 10-14 Tag (e)
| SC18IS606-EVB |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SC18IS606
Contents: Board(s)
Part Status: Active
Embedded: No
Primary Attributes: 1.71V ~ 3.6V Operating Range
Supplied Contents: Board(s)
Utilized IC / Part: SC18IS606
Type: Interface
Function: I2C to SPI
Packaging: Bulk
Description: EVAL BOARD FOR SC18IS606
Contents: Board(s)
Part Status: Active
Embedded: No
Primary Attributes: 1.71V ~ 3.6V Operating Range
Supplied Contents: Board(s)
Utilized IC / Part: SC18IS606
Type: Interface
Function: I2C to SPI
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 44 EUR |
| SC18IS604-EVB |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SC18IS604
Contents: Board(s)
Packaging: Bulk
Part Status: Active
Embedded: No
Primary Attributes: 1.71V ~ 3.6V Operating Range
Supplied Contents: Board(s)
Utilized IC / Part: SC18IS604
Type: Interface
Function: I2C to SPI
Description: EVAL BOARD FOR SC18IS604
Contents: Board(s)
Packaging: Bulk
Part Status: Active
Embedded: No
Primary Attributes: 1.71V ~ 3.6V Operating Range
Supplied Contents: Board(s)
Utilized IC / Part: SC18IS604
Type: Interface
Function: I2C to SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI2QFN/WM,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Description: FILTER RC(PI) 200 OHM/16PF SMD
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4121+ | 0.13 EUR |
| LPC4317JBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2210FBD144/01551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F82748VLH557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Description: MICROCONTROLLER 32-BIT FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM67200JP |
|
Hersteller: NXP USA Inc.
Description: A1006 DEVELOPER KIT
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: A1006
Type: Interface
Function: Anti Tamper and Security
Packaging: Bulk
Description: A1006 DEVELOPER KIT
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: A1006
Type: Interface
Function: Anti Tamper and Security
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PHN203,518-NX |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
Mindestbestellmenge: 1087 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LD6805K/22P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3206+ | 0.16 EUR |
| LD6805K/25H,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Bulk
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
auf Bestellung 54231 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3206+ | 0.16 EUR |
| LD6806F/18H,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
Description: IC REG LINEAR 1.8V 200MA 6XSON
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.8V
auf Bestellung 7746 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2219+ | 0.23 EUR |
| PZU602DB2115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 5987 Stücke:
Lieferzeit 10-14 Tag (e)
| 8MPLUSLPD4-PEVK |
|
Hersteller: NXP USA Inc.
Description: I.MX 8M PLUS EVAL KIT
Part Status: Active
Operating System: Android, FreeRTOS, Linux
Utilized IC / Part: i.MX 8
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: I.MX 8M PLUS EVAL KIT
Part Status: Active
Operating System: Android, FreeRTOS, Linux
Utilized IC / Part: i.MX 8
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 909.53 EUR |
| 74LVC16374ADL,112-NXP |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 48-SSOP
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 20 µA
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Voltage - Supply: 1.65V ~ 3.6V
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Number of Bits per Element: 8
Part Status: Active
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 48-SSOP
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 20 µA
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Voltage - Supply: 1.65V ~ 3.6V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC16374ADGG-Q100118 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| 74LVC163D112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC163D - BINARY
Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K148EVB-Q144 |
|
Hersteller: NXP USA Inc.
Description: S32K148 EVAL BRD
Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX286CVM4CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MCIMX286DVM4CR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -20°C ~ 70°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MCIMX286CVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Graphics Acceleration: No
RAM Controllers: LVDDR, LVDDR2, DDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| MCIMX285AVM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR2, LVDDR, LVDDR2
Co-Processors/DSP: Data; DCP
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 454MHz
Security Features: Boot Security, Cryptography, Hardware ID
Display & Interface Controllers: Keypad, LCD, Touchscreen
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| CBT3306PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2729+ | 0.23 EUR |
| CBT3306D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
Mindestbestellmenge: 1917 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C3V3/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 95 Ohms
Voltage - Zener (Nom) (Vz): 3.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Description: DIODE ZENER 3.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 95 Ohms
Voltage - Zener (Nom) (Vz): 3.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908KX2CDWE-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
DigiKey Programmable: Not Verified
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Number of I/O: 13
Part Status: Active
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
DigiKey Programmable: Not Verified
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 4263 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 52+ | 10.26 EUR |
| PSMN9RO-25YLC115 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT821DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 489+ | 1 EUR |
| N74F5074D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 286+ | 1.69 EUR |
| PCA9516AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-C3V3/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W041AK |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.01 EUR |
| 10+ | 6.92 EUR |
| 25+ | 6.55 EUR |
| 100+ | 6.03 EUR |
| 250+ | 5.72 EUR |
| 500+ | 5.5 EUR |
| SPC5744PK1AMLQ8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 2.5MB (2.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| FS32K148HFT0VLQT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 144-LQFP (20x20)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCIMX6Q5EYM10ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Cut Tape (CT)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 751 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 125.68 EUR |
| 10+ | 104.71 EUR |
| 25+ | 99.47 EUR |
| 100+ | 93.72 EUR |
| MCF54452CVP200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 360BGA
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 58.47 EUR |
| 10+ | 46.88 EUR |
| 80+ | 40.04 EUR |
| MC56F82733MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Packaging: Tray
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Description: IC MCU 32BIT 48KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Packaging: Tray
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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| LPC11U68JBD48K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 675 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.24 EUR |
| 10+ | 7.89 EUR |
| 25+ | 7.3 EUR |
| 100+ | 6.65 EUR |
| 250+ | 6.34 EUR |
| 500+ | 6.16 EUR |
| BUK7E11-55B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 157W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Description: MOSFET N-CH 55V 75A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 157W (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 342+ | 1.48 EUR |
| MCF52100CVM80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 21+ | 42.43 EUR |
| BZX884-B5V6315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
Mindestbestellmenge: 15000 Stücke
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| FS32K144MST0CLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 58
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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