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SP5748GSK0AMKU6R SP5748GSK0AMKU6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GTK0AMMJ6R SP5748GTK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GSK0AMMJ6R SP5748GSK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Produkt ist nicht verfügbar
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SP5748GHK0AMMJ6R SP5748GHK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Produkt ist nicht verfügbar
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SP5748GSK0AVMJ2R SP5748GSK0AVMJ2R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GBK0AVMJ6R SP5748GBK0AVMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GBK0AMMN6R SP5748GBK0AMMN6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GTK0AMKU6R SP5748GTK0AMKU6R NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GHK0AMMN6R SP5748GHK0AMMN6R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA2017DK1002 TEA2017DK1002 NXP USA Inc. UM11606.pdf Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Part Status: Active
Utilized IC / Part: TEA2017
auf Bestellung 3 Stücke:
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1+84.59 EUR
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PEMI4QFN/HP,132 PEMI4QFN/HP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
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2959+0.17 EUR
Mindestbestellmenge: 2959
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PEMI1QFN/HP,315 PEMI1QFN/HP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/18.5PF SMD
auf Bestellung 10000 Stücke:
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PEMI8QFN/HP,132 PEMI8QFN/HP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
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1567+0.32 EUR
Mindestbestellmenge: 1567
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NT2H1611G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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MC56F81866VLF MC56F81866VLF NXP USA Inc. MC56F81XXX.pdf Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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SCC2698BC1A84 SCC2698BC1A84 NXP USA Inc. PHGLS14345-1.pdf?t.download=true&u=5oefqw Description: OCTAL UART
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Produkt ist nicht verfügbar
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SPC5673KAVJM1R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5673KAVJM1 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1311F0DTL125 NXP USA Inc. PHGL-S-A0001295466-1.pdf?t.download=true&u=5oefqw Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Produkt ist nicht verfügbar
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NT2H1311TTDUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT2H1311G0DUFV NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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NT2H1311TTDUFZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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SPC5607BK0MLL6R SPC5607BK0MLL6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
Produkt ist nicht verfügbar
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PEMI8QFN/WM,132 PEMI8QFN/WM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 4000 Stücke:
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1567+0.32 EUR
Mindestbestellmenge: 1567
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SPC5748CSK0AVMJ2 SPC5748CSK0AVMJ2 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0MLL6 SPC5607BK0MLL6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169ATK/FZ UJA1169ATK/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
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3000+3.27 EUR
Mindestbestellmenge: 3000
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UJA1169ATK/FZ UJA1169ATK/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 6280 Stücke:
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3+6.04 EUR
10+4.56 EUR
25+4.19 EUR
100+3.79 EUR
250+3.6 EUR
500+3.48 EUR
1000+3.39 EUR
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UJA1169ATKZ UJA1169ATKZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 9000 Stücke:
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3000+2.8 EUR
Mindestbestellmenge: 3000
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UJA1169ATKZ UJA1169ATKZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
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10+3.94 EUR
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100+3.26 EUR
250+3.09 EUR
500+2.99 EUR
1000+2.9 EUR
Mindestbestellmenge: 4
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UJA1169ATK/F/3Z UJA1169ATK/F/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 3000 Stücke:
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3000+3.08 EUR
Mindestbestellmenge: 3000
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UJA1169ATK/F/3Z UJA1169ATK/F/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 5698 Stücke:
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10+4.66 EUR
25+4.28 EUR
100+3.87 EUR
250+3.67 EUR
500+3.55 EUR
1000+3.45 EUR
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UJA1169ATK/3Z UJA1169ATK/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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UJA1169ATK/3Z UJA1169ATK/3Z NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
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UJA1169ATK/XZ UJA1169ATK/XZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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UJA1169ATK/XZ UJA1169ATK/XZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
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Lieferzeit 10-14 Tag (e)
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10+4.21 EUR
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100+3.49 EUR
250+3.31 EUR
500+3.2 EUR
1000+3.11 EUR
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UJA1169ATK/X/FZ UJA1169ATK/X/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
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UJA1169ATK/X/FZ UJA1169ATK/X/FZ NXP USA Inc. UJA1169A.pdf Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 4670 Stücke:
Lieferzeit 10-14 Tag (e)
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10+4.91 EUR
25+4.52 EUR
100+4.09 EUR
250+3.89 EUR
500+3.76 EUR
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UJA1169ATK/F/3 UJA1169ATK/F/3 NXP USA Inc. UJA1169.pdf Description: IC SBC CAN HIGH SPEED 20HVSON
Packaging: Bulk
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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T4241NXN7PQB T4241NXN7PQB NXP USA Inc. T4240T4160FS.pdf Description: QORIQ 64B POWER 24X 1.5GHZ THR
Produkt ist nicht verfügbar
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MCW68332A NXP USA Inc. Description: 32BIT MCU2KRAMTPUQSM
Produkt ist nicht verfügbar
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MC56F8247VLH MC56F8247VLH NXP USA Inc. FSCLS11848-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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PFXPS7140D4T1 NXP USA Inc. Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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S9S12VR48F2VLCR S9S12VR48F2VLCR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Produkt ist nicht verfügbar
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A2I09VD015NR1 NXP USA Inc. A2I09VD015N.pdf Description: IC AMP GPS 575MHZ-960MHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WB-15
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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MC68HC908QT1CPE-NXP MC68HC908QT1CPE-NXP NXP USA Inc. Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF3560HV/V1100,55 NXP USA Inc. SAF3560.pdf Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA3022518 BGA3022518 NXP USA Inc. _BGA3022.pdf?t.download=true&u=ovmfp3 Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1.2GHz
RF Type: CATV
Voltage - Supply: 7.6V ~ 8.4V
Gain: 18dB
Current - Supply: 350mA
Noise Figure: 5.1dB
P1dB: 30dBm
Test Frequency: 40MHz ~ 1.2GHz
Supplier Device Package: 8-HSO
auf Bestellung 22332 Stücke:
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125+4.01 EUR
Mindestbestellmenge: 125
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MD7IC2012GNR1,528 NXP USA Inc. FSCLS09595-1.pdf?t.download=true&u=5oefqw Description: IC AMP WCDMA 2.17GHZ TO270WB
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: WCDMA
Voltage - Supply: 24V ~ 32V
Gain: 34.7dB
Current - Supply: 70mA
P1dB: 40dBm
Test Frequency: 2.17GHz
Supplier Device Package: TO-270WB-14
Part Status: Active
Produkt ist nicht verfügbar
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MC9RS08KB12CSG MC9RS08KB12CSG NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 12KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Last Time Buy
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
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3+6.2 EUR
10+4.83 EUR
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74AUP1G374GW-Q100125 74AUP1G374GW-Q100125 NXP USA Inc. 74AUP1G374_Q100.pdf Description: IC FF D-TYPE SNGL 1BIT 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: SOT-363
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 81698 Stücke:
Lieferzeit 10-14 Tag (e)
4691+0.11 EUR
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74AUP1Z04GW/C125 74AUP1Z04GW/C125 NXP USA Inc. PHGLS25190-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter, X-Tal Driver
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 0.8V ~ 3.6V
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
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74AUP2G0604GW125 74AUP2G0604GW125 NXP USA Inc. 74AUP2G0604.pdf Description: IC INVERTER OD 2CH 2-INP SOT363
Produkt ist nicht verfügbar
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74AUP2G16GW125 74AUP2G16GW125 NXP USA Inc. 74AUP2G16.pdf Description: IC BUFFER NON-INVERT 3.6V SOT363
Produkt ist nicht verfügbar
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PCA9632DP2Z PCA9632DP2Z NXP USA Inc. PCA9632.pdf Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9632DP2Z PCA9632DP2Z NXP USA Inc. PCA9632.pdf Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 1095 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.38 EUR
11+1.74 EUR
25+1.58 EUR
100+1.4 EUR
250+1.32 EUR
500+1.27 EUR
1000+1.23 EUR
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PCA9632TK118 PCA9632TK118 NXP USA Inc. PCA9632.pdf Description: IC LED DRVR LIN DIM 25MA 8HVSON
Produkt ist nicht verfügbar
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MMZ27333BT1147 NXP USA Inc. PHGL-S-A0003205089-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF Description: 2 W HIGH GAIN POWER AMPLIFIER FO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMZ27333BT1 NXP USA Inc. Description: IC AMP GPS 1.5GHZ-2.7GHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 35.8dB
Current - Supply: 430mA
P1dB: 32.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Produkt ist nicht verfügbar
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NZX27B,133 NXP USA Inc. PHGLS23734-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 500MW ALF2
auf Bestellung 24048 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.036 EUR
Mindestbestellmenge: 15000
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SP5748GSK0AMKU6R MPC5646C.pdf
SP5748GSK0AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GTK0AMMJ6R
SP5748GTK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GSK0AMMJ6R
SP5748GSK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Produkt ist nicht verfügbar
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SP5748GHK0AMMJ6R
SP5748GHK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Produkt ist nicht verfügbar
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SP5748GSK0AVMJ2R MPC5746C.pdf
SP5748GSK0AVMJ2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GBK0AVMJ6R
SP5748GBK0AVMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GBK0AMMN6R MPC5746C.pdf
SP5748GBK0AMMN6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GTK0AMKU6R MPC5748G.pdf
SP5748GTK0AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5748GHK0AMMN6R MPC5646C.pdf
SP5748GHK0AMMN6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA2017DK1002 UM11606.pdf
TEA2017DK1002
Hersteller: NXP USA Inc.
Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Part Status: Active
Utilized IC / Part: TEA2017
auf Bestellung 3 Stücke:
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Anzahl Preis
1+84.59 EUR
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PEMI4QFN/HP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
Im Einkaufswagen  Stück im Wert von  UAH
PEMI1QFN/HP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/HP,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4121+0.12 EUR
Mindestbestellmenge: 4121
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PEMI8QFN/HP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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NT2H1611G0DUFV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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MC56F81866VLF MC56F81XXX.pdf
MC56F81866VLF
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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SCC2698BC1A84 PHGLS14345-1.pdf?t.download=true&u=5oefqw
SCC2698BC1A84
Hersteller: NXP USA Inc.
Description: OCTAL UART
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Produkt ist nicht verfügbar
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SPC5673KAVJM1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5673KAVJM1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NT2H1311F0DTL125 PHGL-S-A0001295466-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Produkt ist nicht verfügbar
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NT2H1311TTDUDZ NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT2H1311G0DUFV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
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NT2H1311TTDUFZ NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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SPC5607BK0MLL6R MPC560XBFAMFS.pdf
SPC5607BK0MLL6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
Produkt ist nicht verfügbar
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PEMI8QFN/WM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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SPC5748CSK0AVMJ2 MPC5748G.pdf
SPC5748CSK0AVMJ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BK0MLL6 MPC560XBFAMFS.pdf
SPC5607BK0MLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169ATK/FZ UJA1169A.pdf
UJA1169ATK/FZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+3.27 EUR
Mindestbestellmenge: 3000
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UJA1169ATK/FZ UJA1169A.pdf
UJA1169ATK/FZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 6280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.04 EUR
10+4.56 EUR
25+4.19 EUR
100+3.79 EUR
250+3.6 EUR
500+3.48 EUR
1000+3.39 EUR
Mindestbestellmenge: 3
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UJA1169ATKZ UJA1169A.pdf
UJA1169ATKZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+2.8 EUR
Mindestbestellmenge: 3000
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UJA1169ATKZ UJA1169A.pdf
UJA1169ATKZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 11095 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.24 EUR
10+3.94 EUR
25+3.62 EUR
100+3.26 EUR
250+3.09 EUR
500+2.99 EUR
1000+2.9 EUR
Mindestbestellmenge: 4
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UJA1169ATK/F/3Z UJA1169A.pdf
UJA1169ATK/F/3Z
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+3.08 EUR
Mindestbestellmenge: 3000
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UJA1169ATK/F/3Z UJA1169A.pdf
UJA1169ATK/F/3Z
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 5698 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.16 EUR
10+4.66 EUR
25+4.28 EUR
100+3.87 EUR
250+3.67 EUR
500+3.55 EUR
1000+3.45 EUR
Mindestbestellmenge: 3
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UJA1169ATK/3Z UJA1169A.pdf
UJA1169ATK/3Z
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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UJA1169ATK/3Z UJA1169A.pdf
UJA1169ATK/3Z
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 2761 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.12 EUR
10+3.85 EUR
25+3.53 EUR
100+3.18 EUR
250+3.02 EUR
500+2.92 EUR
1000+2.83 EUR
Mindestbestellmenge: 4
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UJA1169ATK/XZ UJA1169A.pdf
UJA1169ATK/XZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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UJA1169ATK/XZ UJA1169A.pdf
UJA1169ATK/XZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 2845 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.58 EUR
10+4.21 EUR
25+3.86 EUR
100+3.49 EUR
250+3.31 EUR
500+3.2 EUR
1000+3.11 EUR
Mindestbestellmenge: 4
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UJA1169ATK/X/FZ UJA1169A.pdf
UJA1169ATK/X/FZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+3.53 EUR
Mindestbestellmenge: 3000
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UJA1169ATK/X/FZ UJA1169A.pdf
UJA1169ATK/X/FZ
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 4670 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.48 EUR
10+4.91 EUR
25+4.52 EUR
100+4.09 EUR
250+3.89 EUR
500+3.76 EUR
1000+3.66 EUR
Mindestbestellmenge: 3
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UJA1169ATK/F/3 UJA1169.pdf
UJA1169ATK/F/3
Hersteller: NXP USA Inc.
Description: IC SBC CAN HIGH SPEED 20HVSON
Packaging: Bulk
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
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T4241NXN7PQB T4240T4160FS.pdf
T4241NXN7PQB
Hersteller: NXP USA Inc.
Description: QORIQ 64B POWER 24X 1.5GHZ THR
Produkt ist nicht verfügbar
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MCW68332A
Hersteller: NXP USA Inc.
Description: 32BIT MCU2KRAMTPUQSM
Produkt ist nicht verfügbar
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MC56F8247VLH FSCLS11848-1.pdf?t.download=true&u=5oefqw
MC56F8247VLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
37+14.61 EUR
Mindestbestellmenge: 37
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PFXPS7140D4T1
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
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S9S12VR48F2VLCR
S9S12VR48F2VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Produkt ist nicht verfügbar
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A2I09VD015NR1 A2I09VD015N.pdf
Hersteller: NXP USA Inc.
Description: IC AMP GPS 575MHZ-960MHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WB-15
Part Status: Last Time Buy
Produkt ist nicht verfügbar
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MC68HC908QT1CPE-NXP
MC68HC908QT1CPE-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF3560HV/V1100,55 SAF3560.pdf
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA3022518 _BGA3022.pdf?t.download=true&u=ovmfp3
BGA3022518
Hersteller: NXP USA Inc.
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1.2GHz
RF Type: CATV
Voltage - Supply: 7.6V ~ 8.4V
Gain: 18dB
Current - Supply: 350mA
Noise Figure: 5.1dB
P1dB: 30dBm
Test Frequency: 40MHz ~ 1.2GHz
Supplier Device Package: 8-HSO
auf Bestellung 22332 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
125+4.01 EUR
Mindestbestellmenge: 125
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MD7IC2012GNR1,528 FSCLS09595-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP WCDMA 2.17GHZ TO270WB
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: WCDMA
Voltage - Supply: 24V ~ 32V
Gain: 34.7dB
Current - Supply: 70mA
P1dB: 40dBm
Test Frequency: 2.17GHz
Supplier Device Package: TO-270WB-14
Part Status: Active
Produkt ist nicht verfügbar
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MC9RS08KB12CSG MC9RS08KB12.pdf
MC9RS08KB12CSG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Last Time Buy
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.2 EUR
10+4.83 EUR
Mindestbestellmenge: 3
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74AUP1G374GW-Q100125 74AUP1G374_Q100.pdf
74AUP1G374GW-Q100125
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: SOT-363
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 81698 Stücke:
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Anzahl Preis
4691+0.11 EUR
Mindestbestellmenge: 4691
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74AUP1Z04GW/C125 PHGLS25190-1.pdf?t.download=true&u=5oefqw
74AUP1Z04GW/C125
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter, X-Tal Driver
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 0.8V ~ 3.6V
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
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74AUP2G0604GW125 74AUP2G0604.pdf
74AUP2G0604GW125
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP SOT363
Produkt ist nicht verfügbar
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74AUP2G16GW125 74AUP2G16.pdf
74AUP2G16GW125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V SOT363
Produkt ist nicht verfügbar
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PCA9632DP2Z PCA9632.pdf
PCA9632DP2Z
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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PCA9632DP2Z PCA9632.pdf
PCA9632DP2Z
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 1095 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.38 EUR
11+1.74 EUR
25+1.58 EUR
100+1.4 EUR
250+1.32 EUR
500+1.27 EUR
1000+1.23 EUR
Mindestbestellmenge: 8
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PCA9632TK118 PCA9632.pdf
PCA9632TK118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN DIM 25MA 8HVSON
Produkt ist nicht verfügbar
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MMZ27333BT1147 PHGL-S-A0003205089-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF
Hersteller: NXP USA Inc.
Description: 2 W HIGH GAIN POWER AMPLIFIER FO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMZ27333BT1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 1.5GHZ-2.7GHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 35.8dB
Current - Supply: 430mA
P1dB: 32.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Produkt ist nicht verfügbar
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NZX27B,133 PHGLS23734-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 500MW ALF2
auf Bestellung 24048 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.036 EUR
Mindestbestellmenge: 15000
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