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S9KEAZN64ACLH S9KEAZN64ACLH NXP USA Inc. QP1010FS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCU-LINK-PRO MCU-LINK-PRO NXP USA Inc. UM11673.pdf Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
auf Bestellung 149 Stücke:
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1+75.66 EUR
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74HC11PW-Q100118 74HC11PW-Q100118 NXP USA Inc. 74HC_HCT11_Q100.pdf Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC9S08SE4MWL MC9S08SE4MWL NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 4KB FLASH 28SOIC
auf Bestellung 3666 Stücke:
Lieferzeit 10-14 Tag (e)
171+3.23 EUR
Mindestbestellmenge: 171
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
auf Bestellung 3000 Stücke:
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2219+0.23 EUR
Mindestbestellmenge: 2219
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S9S12GN16AMLFR S9S12GN16AMLFR NXP USA Inc. S12G Family Fact Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2082RC82029B NXP USA Inc. Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Produkt ist nicht verfügbar
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BAP70AM135 BAP70AM135 NXP USA Inc. BAP70-03.pdf Description: DIODE PIN 50V 100MA 6TSSOP
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BAP70AM/A115 BAP70AM/A115 NXP USA Inc. PHGLS29507-1.pdf?t.download=true&u=5oefqw Description: BAP70AM - PIN DIODE
Produkt ist nicht verfügbar
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LX2160XC72029B LX2160XC72029B NXP USA Inc. Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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74AHC126D,112 74AHC126D,112 NXP USA Inc. PHGLS19988-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-SO
Part Status: Active
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2458+0.2 EUR
Mindestbestellmenge: 2458
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74AHC126PW-Q100118 74AHC126PW-Q100118 NXP USA Inc. 74AHC_AHCT126_Q100.pdf Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31,115 NXP USA Inc. BFG31.pdf Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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BFG310/XR,215 BFG310/XR,215 NXP USA Inc. BFG310_XR.pdf Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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MC9S12DT256MPVE MC9S12DT256MPVE NXP USA Inc. 9S12DT256DGV3.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
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MC33797BPEWR2518 NXP USA Inc. FSCLS11648-1.pdf?t.download=true&u=5oefqw Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BA591/A115 NXP USA Inc. _BA591.pdf?t.download=true&u=ovmfp3 Description: MIXER DIODE, VERY HIGH FREQUENCY
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Grade: Automotive
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Qualification: AEC-Q101
auf Bestellung 6000 Stücke:
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3806+0.13 EUR
Mindestbestellmenge: 3806
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74AVCH4T245PW118 74AVCH4T245PW118 NXP USA Inc. 74AVCH4T245.pdf Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Produkt ist nicht verfügbar
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MIMXRT117FCVM8A MIMXRT117FCVM8A NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+30.29 EUR
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100+21.34 EUR
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MIMXRT117FDVMAA MIMXRT117FDVMAA NXP USA Inc. IMXRT1170CEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+26.89 EUR
10+21.56 EUR
80+21.33 EUR
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PXLS83722AESR2 NXP USA Inc. Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW-Q100118 74AVC8T245PW-Q100118 NXP USA Inc. 74AVC8T245_Q100.pdf Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74AVC8T245PW112 74AVC8T245PW112 NXP USA Inc. NEXP-S-A0002881984-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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UJA1167ATK/X/0Z UJA1167ATK/X/0Z NXP USA Inc. UJA1167A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1VL BZX84-C5V6/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1R BZX84-C5V6/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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LPC1776FBD208K LPC1776FBD208K NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NHS3100/A1Z NHS3100/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 1788 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.53 EUR
10+4.78 EUR
25+4.52 EUR
100+4.16 EUR
250+3.94 EUR
500+3.79 EUR
Mindestbestellmenge: 4
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MC33772CTC0AE MC33772CTC0AE NXP USA Inc. MC33772C-DS.pdf Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 255 Stücke:
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2+13.96 EUR
10+10.86 EUR
25+10.08 EUR
100+9.23 EUR
250+8.83 EUR
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SPC5643LF2MLQ1R,528 NXP USA Inc. Description: 32 BIT MCU, DUAL- POWER ARCHITEC
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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WLAN3002CZ NXP USA Inc. WLAN3002C.pdf Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04GW125 NXP USA Inc. 74AUP2GU04.pdf Description: IC INVERTER 2CH 2-INP 6TSSOP
Produkt ist nicht verfügbar
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74LV32PW 74LV32PW NXP USA Inc. PHGLS15081-1.pdf?t.download=true&u=5oefqw Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
auf Bestellung 17500 Stücke:
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MF1P4101DUD/01V NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL BZX84-C27/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C27/LF1R BZX84-C27/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY NXP USA Inc. TFF1044HN.pdf Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 SPC5747CK1CMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3L4684TK,115 NX3L4684TK,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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PHB110NQ06LT,118 PHB110NQ06LT,118 NXP USA Inc. PHB110NQ06LT.pdf Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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S32G274AABK0VUCT S32G274AABK0VUCT NXP USA Inc. S32G2.pdf Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
Produkt ist nicht verfügbar
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
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TEA1723DT/N1,118 TEA1723DT/N1,118 NXP USA Inc. TEA1723DT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PTVS12VZ1USKN315 PTVS12VZ1USKN315 NXP USA Inc. PTVS12VZ1USKN.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 0603 (1608 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 430pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.5A
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: DSN1608-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 21.8V
Power - Peak Pulse: 1900W (1.9kW)
Power Line Protection: No
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PCA9574PW,118 PCA9574PW,118 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9574PW,112 PCA9574PW,112 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SPC5566MVR132,557 NXP USA Inc. Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144 SPC5566MZP144 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132R SPC5566MZP132R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144R SPC5566MZP144R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP112R SPC5566MZP112R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB784-C4V7115 BZB784-C4V7115 NXP USA Inc. BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306DC1Z NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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SEN-SPI-BOX NXP USA Inc. Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300GNR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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RDK-S32R274 RDK-S32R274 NXP USA Inc. RDK-S32R274_FS.pdf Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: S32R274
Produkt ist nicht verfügbar
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S9KEAZN64ACLH QP1010FS.pdf
S9KEAZN64ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCU-LINK-PRO UM11673.pdf
MCU-LINK-PRO
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
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1+75.66 EUR
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74HC11PW-Q100118 74HC_HCT11_Q100.pdf
74HC11PW-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC9S08SE4MWL MC9S08SE8.pdf
MC9S08SE4MWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
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Anzahl Preis
171+3.23 EUR
Mindestbestellmenge: 171
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
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Anzahl Preis
2219+0.23 EUR
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S9S12GN16AMLFR S12G Family Fact Sheet.pdf
S9S12GN16AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2082RC82029B
Hersteller: NXP USA Inc.
Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Produkt ist nicht verfügbar
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BAP70AM135 BAP70-03.pdf
BAP70AM135
Hersteller: NXP USA Inc.
Description: DIODE PIN 50V 100MA 6TSSOP
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BAP70AM/A115 PHGLS29507-1.pdf?t.download=true&u=5oefqw
BAP70AM/A115
Hersteller: NXP USA Inc.
Description: BAP70AM - PIN DIODE
Produkt ist nicht verfügbar
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LX2160XC72029B
LX2160XC72029B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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74AHC126D,112 PHGLS19988-1.pdf?t.download=true&u=5oefqw
74AHC126D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 14-SO
Part Status: Active
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
2458+0.2 EUR
Mindestbestellmenge: 2458
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74AHC126PW-Q100118 74AHC_AHCT126_Q100.pdf
74AHC126PW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31.pdf
BFG31,115
Hersteller: NXP USA Inc.
Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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BFG310/XR,215 BFG310_XR.pdf
BFG310/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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MC9S12DT256MPVE 9S12DT256DGV3.pdf
MC9S12DT256MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
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MC33797BPEWR2518 FSCLS11648-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BA591/A115 _BA591.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: MIXER DIODE, VERY HIGH FREQUENCY
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: Standard - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 35V
Supplier Device Package: SOD-323
Grade: Automotive
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Qualification: AEC-Q101
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
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74AVCH4T245PW118 74AVCH4T245.pdf
74AVCH4T245PW118
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Produkt ist nicht verfügbar
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MIMXRT117FCVM8A
MIMXRT117FCVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 752 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.29 EUR
10+24.3 EUR
25+22.8 EUR
100+21.34 EUR
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MIMXRT117FDVMAA IMXRT1170CEC.pdf
MIMXRT117FDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 759 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.89 EUR
10+21.56 EUR
80+21.33 EUR
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PXLS83722AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW-Q100118 74AVC8T245_Q100.pdf
74AVC8T245PW-Q100118
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74AVC8T245PW112 NEXP-S-A0002881984-1.pdf?t.download=true&u=5oefqw
74AVC8T245PW112
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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UJA1167ATK/X/0Z UJA1167A.pdf
UJA1167ATK/X/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C5V6/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C5V6/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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LPC1776FBD208K LPC178X_7X.pdf
LPC1776FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NHS3100/A1Z NHS3100.pdf
NHS3100/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 1788 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.53 EUR
10+4.78 EUR
25+4.52 EUR
100+4.16 EUR
250+3.94 EUR
500+3.79 EUR
Mindestbestellmenge: 4
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MC33772CTC0AE MC33772C-DS.pdf
MC33772CTC0AE
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.96 EUR
10+10.86 EUR
25+10.08 EUR
100+9.23 EUR
250+8.83 EUR
Mindestbestellmenge: 2
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SPC5643LF2MLQ1R,528
Hersteller: NXP USA Inc.
Description: 32 BIT MCU, DUAL- POWER ARCHITEC
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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WLAN3002CZ WLAN3002C.pdf
Hersteller: NXP USA Inc.
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04.pdf
74AUP2GU04GW125
Hersteller: NXP USA Inc.
Description: IC INVERTER 2CH 2-INP 6TSSOP
Produkt ist nicht verfügbar
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74LV32PW PHGLS15081-1.pdf?t.download=true&u=5oefqw
74LV32PW
Hersteller: NXP USA Inc.
Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
auf Bestellung 17500 Stücke:
Lieferzeit 10-14 Tag (e)
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MF1P4101DUD/01V MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C27/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY TFF1044HN.pdf
Hersteller: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 MPC5748G.pdf
SPC5747CK1CMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3L4684TK,115 NX3L4684.pdf
NX3L4684TK,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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PHB110NQ06LT,118 PHB110NQ06LT.pdf
PHB110NQ06LT,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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S32G274AABK0VUCT S32G2.pdf
S32G274AABK0VUCT
Hersteller: NXP USA Inc.
Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
auf Bestellung 6081 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.25 EUR
10+7.65 EUR
25+6.72 EUR
100+5.68 EUR
250+5.17 EUR
500+4.87 EUR
1000+4.61 EUR
2500+4.35 EUR
Mindestbestellmenge: 2
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TEA1723DT/N1,118 TEA1723DT.pdf
TEA1723DT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PTVS12VZ1USKN315 PTVS12VZ1USKN.pdf
PTVS12VZ1USKN315
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 0603 (1608 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 430pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.5A
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: DSN1608-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 21.8V
Power - Peak Pulse: 1900W (1.9kW)
Power Line Protection: No
auf Bestellung 1530000 Stücke:
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Anzahl Preis
5323+0.097 EUR
Mindestbestellmenge: 5323
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PCA9574PW,118 PCA9574.pdf
PCA9574PW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2770 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.48 EUR
10+1.81 EUR
25+1.65 EUR
100+1.46 EUR
250+1.38 EUR
500+1.33 EUR
1000+1.28 EUR
Mindestbestellmenge: 8
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PCA9574PW,112 PCA9574.pdf
PCA9574PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 6432 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
452+1.08 EUR
Mindestbestellmenge: 452
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SPC5566MVR132,557
Hersteller: NXP USA Inc.
Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144 MPC5566.pdf
SPC5566MZP144
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132R MPC5566.pdf
SPC5566MZP132R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144R MPC5566.pdf
SPC5566MZP144R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP112R MPC5566.pdf
SPC5566MZP112R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB784-C4V7115 BZB784_SERIES.pdf
BZB784-C4V7115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306.pdf
PCA9306DC1Z
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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SEN-SPI-BOX
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300N.pdf
MRFE6VP5300GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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RDK-S32R274 RDK-S32R274_FS.pdf
RDK-S32R274
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: S32R274
Produkt ist nicht verfügbar
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