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WLAN3002CZ NXP USA Inc. WLAN3002C.pdf Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04GW125 NXP USA Inc. 74AUP2GU04.pdf Description: IC INVERTER 2CH 2-INP 6TSSOP
Produkt ist nicht verfügbar
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74LV32PW 74LV32PW NXP USA Inc. PHGLS15081-1.pdf?t.download=true&u=5oefqw Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
auf Bestellung 17500 Stücke:
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MF1P4101DUD/01V NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL BZX84-C27/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
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BZX84-C27/LF1R BZX84-C27/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY NXP USA Inc. TFF1044HN.pdf Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 SPC5747CK1CMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
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NX3L4684TK,115 NX3L4684TK,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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PHB110NQ06LT,118 PHB110NQ06LT,118 NXP USA Inc. PHB110NQ06LT.pdf Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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S32G274AABK0VUCT S32G274AABK0VUCT NXP USA Inc. S32G2.pdf Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
auf Bestellung 6081 Stücke:
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2+11.25 EUR
10+7.65 EUR
25+6.72 EUR
100+5.68 EUR
250+5.17 EUR
500+4.87 EUR
1000+4.61 EUR
2500+4.35 EUR
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TEA1723DT/N1,118 TEA1723DT/N1,118 NXP USA Inc. TEA1723DT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PTVS12VZ1USKN315 PTVS12VZ1USKN315 NXP USA Inc. PTVS12VZ1USKN.pdf Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 0603 (1608 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 430pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.5A
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: DSN1608-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 21.8V
Power - Peak Pulse: 1900W (1.9kW)
Power Line Protection: No
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PCA9574PW,118 PCA9574PW,118 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
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10+1.81 EUR
25+1.65 EUR
100+1.46 EUR
250+1.38 EUR
500+1.33 EUR
1000+1.28 EUR
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PCA9574PW,112 PCA9574PW,112 NXP USA Inc. PCA9574.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SPC5566MVR132,557 NXP USA Inc. Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144 SPC5566MZP144 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132R SPC5566MZP132R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP144R SPC5566MZP144R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
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SPC5566MZP112R SPC5566MZP112R NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB784-C4V7115 BZB784-C4V7115 NXP USA Inc. BZB784_SERIES.pdf Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306DC1Z NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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SEN-SPI-BOX NXP USA Inc. Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300GNR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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RDK-S32R274 RDK-S32R274 NXP USA Inc. RDK-S32R274_FS.pdf Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: S32R274
Produkt ist nicht verfügbar
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MC9S08DZ96MLL NXP USA Inc. FSCLS06295-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 96KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 87
DigiKey Programmable: Not Verified
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MVF60NS151CMK40 NXP USA Inc. FSCL-S-A0000149011-1.pdf?t.download=true&u=5oefqw Description: VYBRID F 32-BIT MPU, ARM CORTEX-
Produkt ist nicht verfügbar
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MVF60NS152CMK50 MVF60NS152CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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UJA1168ATK/F/0Z UJA1168ATK/F/0Z NXP USA Inc. UJA1168A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Qualification: AEC-Q100
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3+6.32 EUR
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100+3.96 EUR
250+3.75 EUR
500+3.63 EUR
1000+3.53 EUR
2500+3.43 EUR
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MC9S08SE8VWL MC9S08SE8VWL NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
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LS1023ASE8MNLB LS1023ASE8MNLB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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S9S12G240F0VLFR S9S12G240F0VLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 240KB FLASH 48LQFP
Produkt ist nicht verfügbar
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PEMI8QFN/HE,132 PEMI8QFN/HE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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MMG3015NT1-NXP MMG3015NT1-NXP NXP USA Inc. FSCL-S-A0000226252-1.pdf?t.download=true&u=5oefqw Description: WIDE BAND LOW POWER AMPLIFIER, 0
Packaging: Bulk
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PEMI6QFN/LP,132 PEMI6QFN/LP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
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74AVC16835ADGV,112 74AVC16835ADGV,112 NXP USA Inc. 74AVC16835A_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 3.6V 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 18
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
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PBHV9560Z115 PBHV9560Z115 NXP USA Inc. PBHV9560Z.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN3460BS/F4518 PTN3460BS/F4518 NXP USA Inc. PTN3460I.pdf Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F3518 PTN3460BS/F3518 NXP USA Inc. PHGLS28090-1.pdf?t.download=true&u=5oefqw Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F4 NXP USA Inc. PTN3460I.pdf Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9959HN-ARD PCA9959HN-ARD NXP USA Inc. UM11581.pdf Description: EVK ARDUINO SHIELD LED CTRL
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PCA9959
Platform: Arduino
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S9S08SG32E1VTLR S9S08SG32E1VTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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S9S08SG32E1VTLR S9S08SG32E1VTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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P80C51FA-4B557 P80C51FA-4B557 NXP USA Inc. RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 44-PQFP (10x10)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
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SPC5607BF1VLQ6 SPC5607BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AMLFR S9S12G96AMLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVC96F0CLF S912ZVC96F0CLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AMLF S9S12G96AMLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PSMN130-200D,118 PSMN130-200D,118 NXP USA Inc. PSMN130-200D.pdf Description: MOSFET N-CH 200V 20A DPAK
Produkt ist nicht verfügbar
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PCA24S08ADP,118 PCA24S08ADP,118 NXP USA Inc. PCA24S08A.pdf Description: IC EEPROM 8KBIT I2C 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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919+0.56 EUR
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PN7161A1EV/C100K PN7161A1EV/C100K NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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2+11.44 EUR
10+9.91 EUR
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100+8.65 EUR
250+8.22 EUR
500+7.91 EUR
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MC33772CTP2AE MC33772CTP2AE NXP USA Inc. MC33772C-DS.pdf Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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2+16.35 EUR
10+12.79 EUR
25+11.9 EUR
100+10.92 EUR
250+10.45 EUR
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RB521CS30L315 RB521CS30L315 NXP USA Inc. RB521CS30L.pdf Description: 100MA LOW VF MEGA SCHOTTKY BARRI
Produkt ist nicht verfügbar
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LS1046ASE8Q1A LS1046ASE8Q1A NXP USA Inc. LS1046A.pdf Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
Produkt ist nicht verfügbar
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SPC5605BK0MLQ6R SPC5605BK0MLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1042NXN7MQB NXP USA Inc. T1FAMILYFS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MC908GR32ACFAE-NXP NXP USA Inc. FSCL-S-A0001046826-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 990 Stücke:
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26+20.89 EUR
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WLAN3002CZ WLAN3002C.pdf
Hersteller: NXP USA Inc.
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04.pdf
74AUP2GU04GW125
Hersteller: NXP USA Inc.
Description: IC INVERTER 2CH 2-INP 6TSSOP
Produkt ist nicht verfügbar
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74LV32PW PHGLS15081-1.pdf?t.download=true&u=5oefqw
74LV32PW
Hersteller: NXP USA Inc.
Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
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MF1P4101DUD/01V MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BZX84-C27/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY TFF1044HN.pdf
Hersteller: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 MPC5748G.pdf
SPC5747CK1CMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3L4684TK,115 NX3L4684.pdf
NX3L4684TK,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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PHB110NQ06LT,118 PHB110NQ06LT.pdf
PHB110NQ06LT,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
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S32G274AABK0VUCT S32G2.pdf
S32G274AABK0VUCT
Hersteller: NXP USA Inc.
Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Tape & Reel (TR)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Packaging: Cut Tape (CT)
Package / Case: 36-WFLGA Exposed Pad
Delay Time: 70ps
Number of Channels: 4
Mounting Type: Surface Mount
Output: Differential
Type: ReDriver
Input: Differential
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: DisplayPort
Current - Supply: 250mA
Data Rate (Max): 20Gbps
Supplier Device Package: 36-HWFLGA (2.1x6)
Signal Conditioning: Input Equalization
Part Status: Last Time Buy
Capacitance - Input: 10 pF
auf Bestellung 6081 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.25 EUR
10+7.65 EUR
25+6.72 EUR
100+5.68 EUR
250+5.17 EUR
500+4.87 EUR
1000+4.61 EUR
2500+4.35 EUR
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TEA1723DT/N1,118 TEA1723DT.pdf
TEA1723DT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PTVS12VZ1USKN315 PTVS12VZ1USKN.pdf
PTVS12VZ1USKN315
Hersteller: NXP USA Inc.
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 0603 (1608 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 430pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.5A
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: DSN1608-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 21.8V
Power - Peak Pulse: 1900W (1.9kW)
Power Line Protection: No
auf Bestellung 1530000 Stücke:
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Anzahl Preis
5323+0.097 EUR
Mindestbestellmenge: 5323
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PCA9574PW,118 PCA9574.pdf
PCA9574PW,118
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2770 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.48 EUR
10+1.81 EUR
25+1.65 EUR
100+1.46 EUR
250+1.38 EUR
500+1.33 EUR
1000+1.28 EUR
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PCA9574PW,112 PCA9574.pdf
PCA9574PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 6432 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
452+1.08 EUR
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SPC5566MVR132,557
Hersteller: NXP USA Inc.
Description: NXP 32 BIT MCU, POWER ARCHITECTU
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144 MPC5566.pdf
SPC5566MZP144
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP132R MPC5566.pdf
SPC5566MZP132R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP144R MPC5566.pdf
SPC5566MZP144R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5566MZP112R MPC5566.pdf
SPC5566MZP112R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB784-C4V7115 BZB784_SERIES.pdf
BZB784-C4V7115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C4V7 ZENER D
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9306DC1Z PCA9306.pdf
PCA9306DC1Z
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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SEN-SPI-BOX
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SENSOR EVAL KIT
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300N.pdf
MRFE6VP5300GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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RDK-S32R274 RDK-S32R274_FS.pdf
RDK-S32R274
Hersteller: NXP USA Inc.
Description: S32R274 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: S32R274
Produkt ist nicht verfügbar
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MC9S08DZ96MLL FSCLS06295-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 87
DigiKey Programmable: Not Verified
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
26+20.89 EUR
Mindestbestellmenge: 26
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MVF60NS151CMK40 FSCL-S-A0000149011-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: VYBRID F 32-BIT MPU, ARM CORTEX-
Produkt ist nicht verfügbar
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MVF60NS152CMK50 VYBRIDFSERIESEC.pdf
MVF60NS152CMK50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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UJA1168ATK/F/0Z UJA1168A.pdf
UJA1168ATK/F/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5065 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.32 EUR
10+4.77 EUR
25+4.38 EUR
100+3.96 EUR
250+3.75 EUR
500+3.63 EUR
1000+3.53 EUR
2500+3.43 EUR
Mindestbestellmenge: 3
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MC9S08SE8VWL MC9S08SE8.pdf
MC9S08SE8VWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Produkt ist nicht verfügbar
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LS1023ASE8MNLB LS1043AFS.pdf
LS1023ASE8MNLB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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S9S12G240F0VLFR MC9S12GRMV1.pdf
S9S12G240F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 48LQFP
Produkt ist nicht verfügbar
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PEMI8QFN/HE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 8000 Stücke:
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Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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MMG3015NT1-NXP FSCL-S-A0000226252-1.pdf?t.download=true&u=5oefqw
MMG3015NT1-NXP
Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER, 0
Packaging: Bulk
auf Bestellung 712 Stücke:
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Anzahl Preis
189+2.46 EUR
Mindestbestellmenge: 189
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PEMI6QFN/LP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/LP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.25 EUR
Mindestbestellmenge: 1902
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74AVC16835ADGV,112 74AVC16835A_Rev_Feb2017.pdf
74AVC16835ADGV,112
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 18
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
auf Bestellung 8850 Stücke:
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Anzahl Preis
376+1.26 EUR
Mindestbestellmenge: 376
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PBHV9560Z115 PBHV9560Z.pdf
PBHV9560Z115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PTN3460BS/F4518 PTN3460I.pdf
PTN3460BS/F4518
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F3518 PHGLS28090-1.pdf?t.download=true&u=5oefqw
PTN3460BS/F3518
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PTN3460BS/F4 PTN3460I.pdf
Hersteller: NXP USA Inc.
Description: EDP TO LVDS BRIDGE IC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PCA9959HN-ARD UM11581.pdf
PCA9959HN-ARD
Hersteller: NXP USA Inc.
Description: EVK ARDUINO SHIELD LED CTRL
Packaging: Bulk
Function: LED Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PCA9959
Platform: Arduino
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+223.41 EUR
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S9S08SG32E1VTLR MC9S08SG32.pdf
S9S08SG32E1VTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+4.3 EUR
Mindestbestellmenge: 2500
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S9S08SG32E1VTLR MC9S08SG32.pdf
S9S08SG32E1VTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.78 EUR
Mindestbestellmenge: 3
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P80C51FA-4B557 RE_DSHEET_80C51_REI.pdf?t.download=true&u=5oefqw
P80C51FA-4B557
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Bulk
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 44-PQFP (10x10)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1915 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+23.64 EUR
Mindestbestellmenge: 21
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SPC5607BF1VLQ6 MPC560XBFAMFS.pdf
SPC5607BF1VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AMLFR
S9S12G96AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVC96F0CLF
S912ZVC96F0CLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12G96AMLF
S9S12G96AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PSMN130-200D,118 PSMN130-200D.pdf
PSMN130-200D,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 20A DPAK
Produkt ist nicht verfügbar
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PCA24S08ADP,118 PCA24S08A.pdf
PCA24S08ADP,118
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
919+0.56 EUR
Mindestbestellmenge: 919
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PN7161A1EV/C100K PN7160_PN7161.pdf
PN7161A1EV/C100K
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 2768 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.44 EUR
10+9.91 EUR
25+9.38 EUR
100+8.65 EUR
250+8.22 EUR
500+7.91 EUR
Mindestbestellmenge: 2
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MC33772CTP2AE MC33772C-DS.pdf
MC33772CTP2AE
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 330 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.35 EUR
10+12.79 EUR
25+11.9 EUR
100+10.92 EUR
250+10.45 EUR
Mindestbestellmenge: 2
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RB521CS30L315 RB521CS30L.pdf
RB521CS30L315
Hersteller: NXP USA Inc.
Description: 100MA LOW VF MEGA SCHOTTKY BARRI
Produkt ist nicht verfügbar
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LS1046ASE8Q1A LS1046A.pdf
LS1046ASE8Q1A
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE 4XA72 64BIT ARM
Produkt ist nicht verfügbar
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SPC5605BK0MLQ6R MPC560XBFAMFS.pdf
SPC5605BK0MLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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T1042NXN7MQB T1FAMILYFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
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MC908GR32ACFAE-NXP FSCL-S-A0001046826-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
26+20.89 EUR
Mindestbestellmenge: 26
Im Einkaufswagen  Stück im Wert von  UAH
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