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PZU14B2A115 PZU14B2A115 NXP USA Inc. PZUXBA_SER.pdf Description: DIODE ZENER SINGLE
Produkt ist nicht verfügbar
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PZU15B1115 PZU15B1115 NXP USA Inc. PZUXB_SER.pdf Description: DIODE ZENER 14.15V 0.31W 2% SIL
Produkt ist nicht verfügbar
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PZU16B1A115 PZU16B1A115 NXP USA Inc. PZUXBA_SER.pdf Description: DIODE ZENER 16V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
Produkt ist nicht verfügbar
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PZU13B1A115 NXP USA Inc. Description: DIODE ZENER SINGLE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Produkt ist nicht verfügbar
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PZU16B2A115 PZU16B2A115 NXP USA Inc. PZUXBA_SER.pdf Description: SINGLE ZENER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU16BA115 NXP USA Inc. PZUXBA_SER.pdf Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC54114J256BD64151 LPC54114J256BD64151 NXP USA Inc. PHGL-S-A0005068187-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
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BZX84-C15/CH/LF1VL BZX84-C15/CH/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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MC34VR500V1ES557 MC34VR500V1ES557 NXP USA Inc. MC34VR500.pdf Description: SWITCHING REGULATOR 13.7A 4000
Produkt ist nicht verfügbar
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SPC5645BF0VLU1R SPC5645BF0VLU1R NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5645BF0VLU1 SPC5645BF0VLU1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
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PEMB1,115 PEMB1,115 NXP USA Inc. PIRSS01225-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
auf Bestellung 62840 Stücke:
Lieferzeit 10-14 Tag (e)
7340+0.07 EUR
Mindestbestellmenge: 7340
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OM15080-K32W OM15080-K32W NXP USA Inc. OM15080-K32W-QSG.pdf Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: K32W041, K32W061
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.52 EUR
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BZX84J-B22,115 BZX84J-B22,115 NXP USA Inc. PHGLS23150-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 22V 550MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 22665 Stücke:
Lieferzeit 10-14 Tag (e)
8768+0.053 EUR
Mindestbestellmenge: 8768
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PCF8553DTT/AY NXP USA Inc. Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+1.23 EUR
Mindestbestellmenge: 2000
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MPC8248CZQTIEA MPC8248CZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK6218-40C BUK6218-40C NXP USA Inc. NEXP-S-A0003105635-1.pdf?t.download=true&u=5oefqw Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
Produkt ist nicht verfügbar
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RDDRONE-BMS772 RDDRONE-BMS772 NXP USA Inc. Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+182.51 EUR
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PTN36043BXZ PTN36043BXZ NXP USA Inc. PTN36043.pdf Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36043BXZ PTN36043BXZ NXP USA Inc. PTN36043.pdf Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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UCANS32K1SIC UCANS32K1SIC NXP USA Inc. getting-started-with-the-ucans32k1sic-evaluation-board:GS-UCANS32K1SIC Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: S32K1, SE050, TJA1463
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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KIT-UCANS32K1SIC KIT-UCANS32K1SIC NXP USA Inc. Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.43 EUR
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TJA1441BT/0Z TJA1441BT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.97 EUR
Mindestbestellmenge: 2500
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TJA1441BT/0Z TJA1441BT/0Z NXP USA Inc. TJA1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3189 Stücke:
Lieferzeit 10-14 Tag (e)
9+1.99 EUR
13+1.44 EUR
25+1.31 EUR
100+1.16 EUR
250+1.09 EUR
500+1.04 EUR
1000+1.01 EUR
Mindestbestellmenge: 9
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TJA1145ATK/0Z TJA1145ATK/0Z NXP USA Inc. TJA1145A.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 7639 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.52 EUR
10+3.38 EUR
25+3.1 EUR
100+2.78 EUR
250+2.63 EUR
500+2.54 EUR
1000+2.47 EUR
2500+2.39 EUR
Mindestbestellmenge: 4
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TJA1442AT/0Z TJA1442AT/0Z NXP USA Inc. TJA1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1442AT/0Z TJA1442AT/0Z NXP USA Inc. TJA1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1972 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.5 EUR
10+1.84 EUR
25+1.67 EUR
100+1.48 EUR
250+1.4 EUR
500+1.34 EUR
1000+1.3 EUR
Mindestbestellmenge: 8
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TJA1145ATK/FD/0Z TJA1145ATK/FD/0Z NXP USA Inc. TJA1145A.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3361 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.73 EUR
10+3.55 EUR
25+3.25 EUR
100+2.93 EUR
250+2.77 EUR
500+2.68 EUR
1000+2.6 EUR
2500+2.52 EUR
Mindestbestellmenge: 4
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TJA1101BHN/0Z TJA1101BHN/0Z NXP USA Inc. TJA1101B.pdf Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+2.44 EUR
Mindestbestellmenge: 4000
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TJA1101BHN/0Z TJA1101BHN/0Z NXP USA Inc. TJA1101B.pdf Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 6401 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.84 EUR
10+2.99 EUR
25+2.89 EUR
100+2.81 EUR
250+2.71 EUR
500+2.63 EUR
Mindestbestellmenge: 5
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TJA1462BT/0Z TJA1462BT/0Z NXP USA Inc. TJA1462.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1 EUR
Mindestbestellmenge: 2500
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TJA1443ATK/0Z TJA1443ATK/0Z NXP USA Inc. TJA1443.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1443ATK/0Z TJA1443ATK/0Z NXP USA Inc. TJA1443.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3178 Stücke:
Lieferzeit 10-14 Tag (e)
10+1.88 EUR
13+1.37 EUR
25+1.24 EUR
100+1.1 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.95 EUR
2500+0.92 EUR
Mindestbestellmenge: 10
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74AHCT2G126DP-Q100125 NXP USA Inc. 74AHC_AHCT2G126_Q100.pdf Description: BUS DRIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SC16C554DBIA68512 NXP USA Inc. Description: IC UART QUAD
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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BUK661R8-30C,118 BUK661R8-30C,118 NXP USA Inc. PHGLS23130-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 30V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
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BUK764R2-80E,118 BUK764R2-80E,118 NXP USA Inc. PHGLS25532-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 80V 120A D2PAK
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202+2.53 EUR
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S912XEP100BVALR S912XEP100BVALR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DJ128CFUE557 MC9S12DJ128CFUE557 NXP USA Inc. FSCLS04317-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, FLASH,
auf Bestellung 240 Stücke:
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QN9020/D518 QN9020/D518 NXP USA Inc. PHGL-S-A0006655104-1.pdf?t.download=true&u=5oefqw Description: ULTRA LOW POWER BLUETOOTH LE SYS
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105+4.73 EUR
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QN9020DK NXP USA Inc. Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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QN9020DKUL NXP USA Inc. Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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QN9020/EY QN9020/EY NXP USA Inc. QN902X.pdf Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
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QN9020/DY QN9020/DY NXP USA Inc. QN902X.pdf Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575D,118 PCA8575D,118 NXP USA Inc. PCA8575.pdf Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAMTK/1J NXP USA Inc. TEA19051BTK.pdf Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
190+2.4 EUR
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SPC5746CSK1MMJ6,557 NXP USA Inc. Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 SPC5744PFK1AMLQ8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB84-C3V9215 BZB84-C3V9215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
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BZX84-C30/LF1R BZX84-C30/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE S908AZ60AH3CFUE NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64QFP
auf Bestellung 452 Stücke:
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18+30.75 EUR
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S908EY16AE0CFJER S908EY16AE0CFJER NXP USA Inc. MC68HC908EY16A.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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47+9.89 EUR
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G1120B0MIPI G1120B0MIPI NXP USA Inc. IMXRT500RT600FS.pdf Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
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FRDM-K32W042 NXP USA Inc. Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2 NXP USA Inc. Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 74HCT244BQ-Q100 NXP USA Inc. PHGLS25316-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
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PCAL6408A-ARD PCAL6408A-ARD NXP USA Inc. getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
auf Bestellung 4 Stücke:
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1+186.37 EUR
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PZU14B2A115 PZUXBA_SER.pdf
PZU14B2A115
Hersteller: NXP USA Inc.
Description: DIODE ZENER SINGLE
Produkt ist nicht verfügbar
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PZU15B1115 PZUXB_SER.pdf
PZU15B1115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 14.15V 0.31W 2% SIL
Produkt ist nicht verfügbar
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PZU16B1A115 PZUXBA_SER.pdf
PZU16B1A115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 16V 320MW SOD323
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
Produkt ist nicht verfügbar
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PZU13B1A115
Hersteller: NXP USA Inc.
Description: DIODE ZENER SINGLE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-323
Part Status: Active
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Produkt ist nicht verfügbar
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PZU16B2A115 PZUXBA_SER.pdf
PZU16B2A115
Hersteller: NXP USA Inc.
Description: SINGLE ZENER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PZU16BA115 PZUXBA_SER.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU16BA ZENER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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LPC54114J256BD64151 PHGL-S-A0005068187-1.pdf?t.download=true&u=5oefqw
LPC54114J256BD64151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
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BZX84-C15/CH/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C15/CH/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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MC34VR500V1ES557 MC34VR500.pdf
MC34VR500V1ES557
Hersteller: NXP USA Inc.
Description: SWITCHING REGULATOR 13.7A 4000
Produkt ist nicht verfügbar
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SPC5645BF0VLU1R MPC5646C.pdf
SPC5645BF0VLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5645BF0VLU1
SPC5645BF0VLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
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PEMB1,115 PIRSS01225-1.pdf?t.download=true&u=5oefqw
PEMB1,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
Part Status: Active
auf Bestellung 62840 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7340+0.07 EUR
Mindestbestellmenge: 7340
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OM15080-K32W OM15080-K32W-QSG.pdf
OM15080-K32W
Hersteller: NXP USA Inc.
Description: EVAL BOARD K32W041 K32W061
Packaging: Bulk
For Use With/Related Products: K32W041, K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: K32W041, K32W061
Supplied Contents: Board(s)
Part Status: Active
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1+59.52 EUR
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BZX84J-B22,115 PHGLS23150-1.pdf?t.download=true&u=5oefqw
BZX84J-B22,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 550MW SOD323F
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-323F
Power - Max: 550 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
auf Bestellung 22665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8768+0.053 EUR
Mindestbestellmenge: 8768
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PCF8553DTT/AY
Hersteller: NXP USA Inc.
Description: LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C, SPI
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 1.2 µA
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+1.23 EUR
Mindestbestellmenge: 2000
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MPC8248CZQTIEA MPC8272EC.pdf
MPC8248CZQTIEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK6218-40C NEXP-S-A0003105635-1.pdf?t.download=true&u=5oefqw
BUK6218-40C
Hersteller: NXP USA Inc.
Description: PFET, 42A I(D), 40V, 0.028OHM, 1
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1170 pF @ 25 V
Produkt ist nicht verfügbar
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RDDRONE-BMS772
RDDRONE-BMS772
Hersteller: NXP USA Inc.
Description: BMS772 DRONE BATT DEV KIT
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+182.51 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PTN36043BXZ PTN36043.pdf
PTN36043BXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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PTN36043BXZ PTN36043.pdf
PTN36043BXZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 18DHXQFN
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
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UCANS32K1SIC getting-started-with-the-ucans32k1sic-evaluation-board:GS-UCANS32K1SIC
UCANS32K1SIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s)
Utilized IC / Part: S32K1, SE050, TJA1463
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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KIT-UCANS32K1SIC
KIT-UCANS32K1SIC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S32K1
Packaging: Box
Function: CAN Transceiver
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: S32K1, SE050, TJA1463
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 5V Power Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.43 EUR
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TJA1441BT/0Z TJA1441.pdf
TJA1441BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.97 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
TJA1441BT/0Z TJA1441.pdf
TJA1441BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+1.99 EUR
13+1.44 EUR
25+1.31 EUR
100+1.16 EUR
250+1.09 EUR
500+1.04 EUR
1000+1.01 EUR
Mindestbestellmenge: 9
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TJA1145ATK/0Z TJA1145A.pdf
TJA1145ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 7639 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.52 EUR
10+3.38 EUR
25+3.1 EUR
100+2.78 EUR
250+2.63 EUR
500+2.54 EUR
1000+2.47 EUR
2500+2.39 EUR
Mindestbestellmenge: 4
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TJA1442AT/0Z TJA1442.pdf
TJA1442AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1442AT/0Z TJA1442.pdf
TJA1442AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1972 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.5 EUR
10+1.84 EUR
25+1.67 EUR
100+1.48 EUR
250+1.4 EUR
500+1.34 EUR
1000+1.3 EUR
Mindestbestellmenge: 8
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TJA1145ATK/FD/0Z TJA1145A.pdf
TJA1145ATK/FD/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3361 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.73 EUR
10+3.55 EUR
25+3.25 EUR
100+2.93 EUR
250+2.77 EUR
500+2.68 EUR
1000+2.6 EUR
2500+2.52 EUR
Mindestbestellmenge: 4
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TJA1101BHN/0Z TJA1101B.pdf
TJA1101BHN/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2.44 EUR
Mindestbestellmenge: 4000
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TJA1101BHN/0Z TJA1101B.pdf
TJA1101BHN/0Z
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 36-HVQFN (6x6)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 6401 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.84 EUR
10+2.99 EUR
25+2.89 EUR
100+2.81 EUR
250+2.71 EUR
500+2.63 EUR
Mindestbestellmenge: 5
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TJA1462BT/0Z TJA1462.pdf
TJA1462BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1 EUR
Mindestbestellmenge: 2500
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TJA1443ATK/0Z TJA1443.pdf
TJA1443ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1443ATK/0Z TJA1443.pdf
TJA1443ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 3178 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.88 EUR
13+1.37 EUR
25+1.24 EUR
100+1.1 EUR
250+1.03 EUR
500+0.99 EUR
1000+0.95 EUR
2500+0.92 EUR
Mindestbestellmenge: 10
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74AHCT2G126DP-Q100125 74AHC_AHCT2G126_Q100.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SC16C554DBIA68512
Hersteller: NXP USA Inc.
Description: IC UART QUAD
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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SPC5675KFF0VJM2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Produkt ist nicht verfügbar
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BUK661R8-30C,118 PHGLS23130-1.pdf?t.download=true&u=5oefqw
BUK661R8-30C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10918 pF @ 25 V
auf Bestellung 1473 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
245+2.16 EUR
Mindestbestellmenge: 245
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BUK764R2-80E,118 PHGLS25532-1.pdf?t.download=true&u=5oefqw
BUK764R2-80E,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 80V 120A D2PAK
auf Bestellung 338 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
202+2.53 EUR
Mindestbestellmenge: 202
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S912XEP100BVALR
S912XEP100BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12DJ128CFUE557 FSCLS04317-1.pdf?t.download=true&u=5oefqw
MC9S12DJ128CFUE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
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QN9020/D518 PHGL-S-A0006655104-1.pdf?t.download=true&u=5oefqw
QN9020/D518
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
auf Bestellung 44903 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
105+4.73 EUR
Mindestbestellmenge: 105
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QN9020DK
Hersteller: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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QN9020DKUL
Hersteller: NXP USA Inc.
Description: QN9020 DEVELOPMENT KIT
Packaging: Bulk
For Use With/Related Products: QN902x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Contents: Board(s)
Utilized IC / Part: QN902x
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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QN9020/EY QN902X.pdf
QN9020/EY
Hersteller: NXP USA Inc.
Description: ULTRA LOW POWER BLUETOOTH LE SYS
Produkt ist nicht verfügbar
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QN9020/DY QN902X.pdf
QN9020/DY
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 9.2mA
Current - Transmitting: 8.8mA
Supplier Device Package: 48-HVQFN (6x6)
GPIO: 31
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8575D,118 PCA8575.pdf
PCA8575D,118
Hersteller: NXP USA Inc.
Description: REMOTE 16-BIT I/O EXPANDER FOR I
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BAMTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
190+2.4 EUR
Mindestbestellmenge: 190
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SPC5746CSK1MMJ6,557
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Produkt ist nicht verfügbar
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SPC5744PFK1AMLQ8 MPC5744P.pdf
SPC5744PFK1AMLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZB84-C3V9215 BZB84_SER.pdf
BZB84-C3V9215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 3.9V,
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Operating Temperature: 150°C (TJ)
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: TO-236AB
Grade: Automotive
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
auf Bestellung 39472 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11632+0.048 EUR
Mindestbestellmenge: 11632
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BZX84-C30/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C30/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 30V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 30 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S908AZ60AH3CFUE
S908AZ60AH3CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
auf Bestellung 452 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18+30.75 EUR
Mindestbestellmenge: 18
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S908EY16AE0CFJER MC68HC908EY16A.pdf
S908EY16AE0CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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Anzahl Preis
47+9.89 EUR
Mindestbestellmenge: 47
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G1120B0MIPI IMXRT500RT600FS.pdf
G1120B0MIPI
Hersteller: NXP USA Inc.
Description: LCD 1.2" MIPI 390X390
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT595
Part Status: Active
auf Bestellung 6 Stücke:
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Anzahl Preis
1+150.52 EUR
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FRDM-K32W042
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR K32W042
Packaging: Bulk
Function: USB
Type: Interface
Contents: Board(s)
Utilized IC / Part: K32W042
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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MPC574XG324DSC2
Hersteller: NXP USA Inc.
Description: MPC574XB/C/G EVAL BRD
Produkt ist nicht verfügbar
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74HCT244BQ-Q100 PHGLS25316-1.pdf?t.download=true&u=5oefqw
74HCT244BQ-Q100
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Active
auf Bestellung 2971 Stücke:
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Anzahl Preis
1282+0.37 EUR
Mindestbestellmenge: 1282
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PCAL6408A-ARD getting-started-with-the-pcal6408a-ard-evaluation-board:GS-PCAL6408A-ARD
PCAL6408A-ARD
Hersteller: NXP USA Inc.
Description: 8-BIT GPIO EXPAND EVAL BOARD
Packaging: Box
Function: GPIO
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL6408A
Platform: Arduino
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+186.37 EUR
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