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74ALVC245PW118 NXP USA Inc. 74ALVC245.pdf Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8548J/N1,112 TDF8548J/N1,112 NXP USA Inc. TDF854x_Feb2011.pdf Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2 SPC5745BK1AVMH2 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2R SPC5745BK1AVMH2R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604SF2CLQ6 SPC5604SF2CLQ6 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
Produkt ist nicht verfügbar
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GPS1503MC NXP USA Inc. Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU8103UK/SZ NXP USA Inc. AN11678.pdf Description: MMIC LNA GPS 6XSON
Produkt ist nicht verfügbar
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GPS1503MCZ NXP USA Inc. Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU6005/N2X BGU6005/N2X NXP USA Inc. BGU6005_N2.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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100+0.32 EUR
250+0.29 EUR
500+0.27 EUR
1000+0.25 EUR
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BGU8019X115 BGU8019X115 NXP USA Inc. PHGL-S-A0008130814-1.pdf?t.download=true&u=5oefqw Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
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MVR5510AMBAHES MVR5510AMBAHES NXP USA Inc. Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMBAHESR2 MVR5510AMBAHESR2 NXP USA Inc. Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC1125JBD48/303EL LPC1125JBD48/303EL NXP USA Inc. LPC112X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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KITPF8201FRDMEVM KITPF8201FRDMEVM NXP USA Inc. KITPF8201FRDMEVM.pdf Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
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TDF19971BHN/C1,551 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,518 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,557 NXP USA Inc. Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34PF8100A0EP MC34PF8100A0EP NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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AFM907NT1 AFM907NT1 NXP USA Inc. AFM907N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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AFM907NT1 AFM907NT1 NXP USA Inc. AFM907N.pdf Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
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MC9S08QD2CSCR MC9S08QD2CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C652BIB48,157 SC16C652BIB48,157 NXP USA Inc. SC16C652B.pdf Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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SC16C652BIB48,151 SC16C652BIB48,151 NXP USA Inc. SC16C652B.pdf Description: UART INTERFACE IC 2CH. UART 32B
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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140+6.58 EUR
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74ABT573AD,118 74ABT573AD,118 NXP USA Inc. 74ABT573A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT573AD,118 74ABT573AD,118 NXP USA Inc. 74ABT573A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
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74ABT573AD,112 74ABT573AD,112 NXP USA Inc. 74ABT573A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
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N74F153D,623 N74F153D,623 NXP USA Inc. DS_568_74F153.pdf Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
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PTN3311DP,118 PTN3311DP,118 NXP USA Inc. PTN3310_PTN3311.pdf Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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DSP56311VL150R2 DSP56311VL150R2 NXP USA Inc. DSP56311.pdf Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Produkt ist nicht verfügbar
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74LVC377D,118 74LVC377D,118 NXP USA Inc. PHGLS25767-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 330 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
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928+0.53 EUR
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PTN3944EVM-KIT NXP USA Inc. UM11596.pdf Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 5 Stücke:
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OM13501UL NXP USA Inc. PCA8538.pdf Description: PCA8538 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8538
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
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NCX2222GUX NCX2222GUX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1PH2101DA6/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DUD/01V NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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MF1PH2101DA4/01J NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
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MF1PH2101DUF/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DA6/01J NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
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MF1PH2101DA4/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DUF/01V NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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MF1PH2101DUD/02V NXP USA Inc. MF1P_H_X1Y1_SDS.pdf Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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S9S08DN32F2CLH S9S08DN32F2CLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S9S08DN32F2CLHR S9S08DN32F2CLHR NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJF1441AT/0Z TJF1441AT/0Z NXP USA Inc. TJF1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJF1441AT/0Z TJF1441AT/0Z NXP USA Inc. TJF1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
auf Bestellung 2003 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.73 EUR
10+2.44 EUR
25+2.30 EUR
100+1.96 EUR
250+1.84 EUR
500+1.61 EUR
1000+1.33 EUR
Mindestbestellmenge: 7
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TJR1443ATK/0Z TJR1443ATK/0Z NXP USA Inc. TJR1443.pdf Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441BT/0Z TJR1441BT/0Z NXP USA Inc. TJR1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1442BT/0Z TJR1442BT/0Z NXP USA Inc. TJR1442.pdf Description: IC CAN STANDBY TXRX SO8
Produkt ist nicht verfügbar
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TJR1442AT/0Z TJR1442AT/0Z NXP USA Inc. TJR1442.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441AT/0Z TJR1441AT/0Z NXP USA Inc. TJR1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441DT/0Z TJR1441DT/0Z NXP USA Inc. TJR1441.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C9V1/LF1R BZX84-C9V1/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
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S912XEG128W1MAAR S912XEG128W1MAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.23 EUR
10+23.22 EUR
25+21.72 EUR
100+20.07 EUR
250+19.28 EUR
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MCIMX6U5EVM10ACR MCIMX6U5EVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
1+81.12 EUR
10+62.60 EUR
25+57.87 EUR
100+52.87 EUR
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PBLS4005Y115 NXP USA Inc. PBLS4005Y_PBLS4005V.pdf Description: NOW NEXPERIA PBLS4005Y - SMALL S
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
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PEMI6QFN/CM,132 PEMI6QFN/CM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.26 EUR
Mindestbestellmenge: 1902
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TJA1049TK/1Z TJA1049TK/1Z NXP USA Inc. TJA1049.pdf Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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TJA1049TK/3/1Z TJA1049TK/3/1Z NXP USA Inc. TJA1049.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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74AUP1G07GX/S500125 74AUP1G07GX/S500125 NXP USA Inc. PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Produkt ist nicht verfügbar
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74AUP1G07GF/S500132 74AUP1G07GF/S500132 NXP USA Inc. PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
Produkt ist nicht verfügbar
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74ALVC245PW118 74ALVC245.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDF8548J/N1,112 TDF854x_Feb2011.pdf
TDF8548J/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2
SPC5745BK1AVMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BK1AVMH2R
SPC5745BK1AVMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5604SF2CLQ6
SPC5604SF2CLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
Produkt ist nicht verfügbar
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GPS1503MC
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU8103UK/SZ AN11678.pdf
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS 6XSON
Produkt ist nicht verfügbar
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GPS1503MCZ
Hersteller: NXP USA Inc.
Description: MMIC LNA GPS SMD
Produkt ist nicht verfügbar
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BGU6005/N2X BGU6005_N2.pdf
BGU6005/N2X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 12518 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
32+0.56 EUR
42+0.42 EUR
47+0.38 EUR
100+0.32 EUR
250+0.29 EUR
500+0.27 EUR
1000+0.25 EUR
Mindestbestellmenge: 32
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BGU8019X115 PHGL-S-A0008130814-1.pdf?t.download=true&u=5oefqw
BGU8019X115
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3181 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2144+0.25 EUR
Mindestbestellmenge: 2144
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MVR5510AMBAHES
MVR5510AMBAHES
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMBAHESR2
MVR5510AMBAHESR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC1125JBD48/303EL LPC112X.pdf
LPC1125JBD48/303EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.71 EUR
10+5.86 EUR
25+5.39 EUR
80+4.95 EUR
250+4.64 EUR
500+4.50 EUR
Mindestbestellmenge: 3
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KITPF8201FRDMEVM KITPF8201FRDMEVM.pdf
KITPF8201FRDMEVM
Hersteller: NXP USA Inc.
Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+701.41 EUR
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TDF19971BHN/C1,551
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,518
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDF19971BHN/C1,557
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34PF8100A0EP PF8100_PF8200.pdf
MC34PF8100A0EP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.98 EUR
10+12.44 EUR
25+11.55 EUR
100+10.58 EUR
260+10.10 EUR
Mindestbestellmenge: 2
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AFM907NT1 AFM907N.pdf
AFM907NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+2.60 EUR
2000+2.54 EUR
3000+2.51 EUR
Mindestbestellmenge: 1000
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AFM907NT1 AFM907N.pdf
AFM907NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 4274 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.75 EUR
10+3.56 EUR
25+3.26 EUR
100+2.93 EUR
250+2.81 EUR
Mindestbestellmenge: 4
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MC9S08QD2CSCR MC9S08QD4.pdf
MC9S08QD2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC16C652BIB48,157 SC16C652B.pdf
SC16C652BIB48,157
Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
134+6.58 EUR
Mindestbestellmenge: 134
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SC16C652BIB48,151 SC16C652B.pdf
SC16C652BIB48,151
Hersteller: NXP USA Inc.
Description: UART INTERFACE IC 2CH. UART 32B
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
140+6.58 EUR
Mindestbestellmenge: 140
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74ABT573AD,118 74ABT573A.pdf
74ABT573AD,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74ABT573AD,118 74ABT573A.pdf
74ABT573AD,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 1665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1665+0.34 EUR
Mindestbestellmenge: 1665
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74ABT573AD,112 74ABT573A.pdf
74ABT573AD,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 2061 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1402+0.34 EUR
Mindestbestellmenge: 1402
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N74F153D,623 DS_568_74F153.pdf
N74F153D,623
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2672 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1665+0.30 EUR
Mindestbestellmenge: 1665
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PTN3311DP,118 PTN3310_PTN3311.pdf
PTN3311DP,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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DSP56311VL150R2 DSP56311.pdf
DSP56311VL150R2
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Produkt ist nicht verfügbar
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74LVC377D,118 PHGLS25767-1.pdf?t.download=true&u=5oefqw
74LVC377D,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 330 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 5500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
928+0.53 EUR
Mindestbestellmenge: 928
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PTN3944EVM-KIT UM11596.pdf
Hersteller: NXP USA Inc.
Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+974.90 EUR
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OM13501UL PCA8538.pdf
Hersteller: NXP USA Inc.
Description: PCA8538 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8538
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
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NCX2222GUX NCX2222.pdf
NCX2222GUX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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MF1PH2101DA6/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DUD/01V MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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MF1PH2101DA4/01J MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
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MF1PH2101DUF/02V
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DA6/01J MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
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MF1PH2101DA4/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Produkt ist nicht verfügbar
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MF1PH2101DUF/01V MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
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MF1PH2101DUD/02V MF1P_H_X1Y1_SDS.pdf
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Produkt ist nicht verfügbar
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S9S08DN32F2CLH
S9S08DN32F2CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S9S08DN32F2CLHR
S9S08DN32F2CLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJF1441AT/0Z TJF1441.pdf
TJF1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJF1441AT/0Z TJF1441.pdf
TJF1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
auf Bestellung 2003 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
10+2.44 EUR
25+2.30 EUR
100+1.96 EUR
250+1.84 EUR
500+1.61 EUR
1000+1.33 EUR
Mindestbestellmenge: 7
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TJR1443ATK/0Z TJR1443.pdf
TJR1443ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441BT/0Z TJR1441.pdf
TJR1441BT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1442BT/0Z TJR1442.pdf
TJR1442BT/0Z
Hersteller: NXP USA Inc.
Description: IC CAN STANDBY TXRX SO8
Produkt ist nicht verfügbar
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TJR1442AT/0Z TJR1442.pdf
TJR1442AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441AT/0Z TJR1441.pdf
TJR1441AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJR1441DT/0Z TJR1441.pdf
TJR1441DT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C9V1/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C9V1/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
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S912XEG128W1MAAR MC9S12XEP100RMV1.pdf
S912XEG128W1MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.23 EUR
10+23.22 EUR
25+21.72 EUR
100+20.07 EUR
250+19.28 EUR
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MCIMX6U5EVM10ACR IMX6SDLCEC.pdf
MCIMX6U5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+81.12 EUR
10+62.60 EUR
25+57.87 EUR
100+52.87 EUR
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PBLS4005Y115 PBLS4005Y_PBLS4005V.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBLS4005Y - SMALL S
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
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PEMI6QFN/CM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.26 EUR
Mindestbestellmenge: 1902
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TJA1049TK/1Z TJA1049.pdf
TJA1049TK/1Z
Hersteller: NXP USA Inc.
Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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TJA1049TK/3/1Z TJA1049.pdf
TJA1049TK/3/1Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
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74AUP1G07GX/S500125 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GX/S500125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
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74AUP1G07GF/S500132 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GF/S500132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
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