MPF5024AVNA0ESR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: PF5024
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Description: PF5024
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
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Technische Details MPF5024AVNA0ESR2 NXP USA Inc.
Description: PF5024, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: High Performance i.MX 8 Processor Based, Supplier Device Package: 40-HVQFN (6x6).
Weitere Produktangebote MPF5024AVNA0ESR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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MPF5024AVNA0ESR2 | Hersteller : NXP Semiconductors |
 Power Management Specialised - PMIC Power Management IC, pre-prog, 4 step-down DC/DC, QM Safety |
Produkt ist nicht verfügbar |