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PCF85176T/1Y PCF85176T/1Y NXP USA Inc. PCF85176.pdf Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
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4000+2.74 EUR
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PCF85176T/1Y PCF85176T/1Y NXP USA Inc. PCF85176.pdf Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
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5+5.18 EUR
10+3.87 EUR
25+3.53 EUR
100+3.17 EUR
250+3 EUR
500+2.94 EUR
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BZX84-B5V1215 BZX84-B5V1215 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.1V 250MW TO236AB
Produkt ist nicht verfügbar
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S9S08RNA60W1VLHR S9S08RNA60W1VLHR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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100+7.7 EUR
250+7.34 EUR
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LPC3240FET296015 LPC3240FET296015 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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MCZ33903CS5EK MCZ33903CS5EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
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CGD944C,112 CGD944C,112 NXP USA Inc. CGD944C.pdf Description: IC AMP CATV SOT115J
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A3T23H300W23SR6 NXP USA Inc. A3T23H300W23S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCX2131TF NXP USA Inc. Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BK0MLL4 SPC5603BK0MLL4 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5603BK0MLL4R SPC5603BK0MLL4R NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEMB15,115 PEMB15,115 NXP USA Inc. PHGLS24211-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PEMB15 - SMALL SIGN
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7340+0.081 EUR
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MC33772BTP1AE MC33772BTP1AE NXP USA Inc. MC33772B_SDS.pdf Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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PCF8578HT/1,518 PCF8578HT/1,518 NXP USA Inc. PCF8578.pdf Description: IC DRVR DOT MATRIX 64TQFP
Supplier Device Package: 64-TQFP (10x10)
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C
Configuration: Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S9KEAZN64ACLH S9KEAZN64ACLH NXP USA Inc. QP1010FS.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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MCU-LINK-PRO MCU-LINK-PRO NXP USA Inc. UM11673.pdf Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
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74HC11PW-Q100118 74HC11PW-Q100118 NXP USA Inc. 74HC_HCT11_Q100.pdf Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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MC9S08SE4MWL MC9S08SE4MWL NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 4KB FLASH 28SOIC
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE VARACTOR 20V SNGL SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
Produkt ist nicht verfügbar
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BB199,115 BB199,115 NXP USA Inc. BB199_Rev1.pdf Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
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S9S12GN16AMLFR S9S12GN16AMLFR NXP USA Inc. S12G Family Fact Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2082RC82029B NXP USA Inc. Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
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BAP70AM135 BAP70AM135 NXP USA Inc. BAP70-03.pdf Description: DIODE PIN 50V 100MA 6TSSOP
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BAP70AM/A115 BAP70AM/A115 NXP USA Inc. PHGLS29507-1.pdf?t.download=true&u=5oefqw Description: BAP70AM - PIN DIODE
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LX2160XC72029B LX2160XC72029B NXP USA Inc. Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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74AHC126PW-Q100118 74AHC126PW-Q100118 NXP USA Inc. 74AHC_AHCT126_Q100.pdf Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31,115 NXP USA Inc. BFG31.pdf Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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BFG310/XR,215 BFG310/XR,215 NXP USA Inc. BFG310_XR.pdf Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
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MC9S12DT256MPVE MC9S12DT256MPVE NXP USA Inc. 9S12DT256DGV3.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
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MC33797BPEWR2518 NXP USA Inc. FSCLS11648-1.pdf?t.download=true&u=5oefqw Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BA591/A115 NXP USA Inc. _BA591.pdf?t.download=true&u=ovmfp3 Description: MIXER DIODE, VERY HIGH FREQUENCY
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 35V
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: Standard - Single
Package / Case: SC-76, SOD-323
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74AVCH4T245PW118 74AVCH4T245PW118 NXP USA Inc. 74AVCH4T245.pdf Description: IC TRANSLATION TXRX 3.6V 16TSSOP
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MIMXRT117FCVM8A NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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MIMXRT117FDVMAA NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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100+29.14 EUR
250+28.05 EUR
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PXLS83722AESR2 NXP USA Inc. Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW-Q100118 74AVC8T245PW-Q100118 NXP USA Inc. 74AVC8T245_Q100.pdf Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74AVC8T245PW112 74AVC8T245PW112 NXP USA Inc. NEXP-S-A0002881984-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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UJA1167ATK/X/0Z UJA1167ATK/X/0Z NXP USA Inc. UJA1167A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1VL BZX84-C5V6/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1R BZX84-C5V6/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
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LPC1776FBD208K LPC1776FBD208K NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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NHS3100/A1Z NHS3100/A1Z NXP USA Inc. NHS3100.pdf Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 1788 Stücke:
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MC33772CTC0AE MC33772CTC0AE NXP USA Inc. MC33772C-DS.pdf Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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2+17.14 EUR
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SPC5643LF2MLQ1R,528 NXP USA Inc. Description: 32 BIT MCU, DUAL- POWER ARCHITEC
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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WLAN3002CZ NXP USA Inc. WLAN3002C.pdf Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04GW125 NXP USA Inc. 74AUP2GU04.pdf Description: IC INVERTER 2CH 2-INP 6TSSOP
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74LV32PW 74LV32PW NXP USA Inc. PHGLS15081-1.pdf?t.download=true&u=5oefqw Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
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MF1P4101DUD/01V NXP USA Inc. MF1P(H)x1x1.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL BZX84-C27/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZX84-C27/LF1R BZX84-C27/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 27V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY NXP USA Inc. TFF1044HN.pdf Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 SPC5747CK1CMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3L4684TK,115 NX3L4684TK,115 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
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PHB110NQ06LT,118 PHB110NQ06LT,118 NXP USA Inc. PHB110NQ06LT.pdf Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92A1A,518 NXP USA Inc. SC28L92.pdf Description: IC UART DUAL W/FIFO 44-PLCC
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S32G274AABK0VUCT S32G274AABK0VUCT NXP USA Inc. S32G2.pdf Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3816EWY PTN3816EWY NXP USA Inc. Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Cut Tape (CT)
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2+13.39 EUR
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100+6.76 EUR
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1000+5.49 EUR
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TEA1723DT/N1,118 TEA1723DT/N1,118 NXP USA Inc. TEA1723DT.pdf Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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PCF85176T/1Y PCF85176.pdf
PCF85176T/1Y
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
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PCF85176T/1Y PCF85176.pdf
PCF85176T/1Y
Hersteller: NXP USA Inc.
Description: 40 X 4 UNIVERSAL LCD DRIVER FOR
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
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5+5.18 EUR
10+3.87 EUR
25+3.53 EUR
100+3.17 EUR
250+3 EUR
500+2.94 EUR
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BZX84-B5V1215 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-B5V1215
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 250MW TO236AB
Produkt ist nicht verfügbar
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S9S08RNA60W1VLHR S9S08RN60DS.pdf
S9S08RNA60W1VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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2+11.91 EUR
10+9.15 EUR
25+8.46 EUR
100+7.7 EUR
250+7.34 EUR
500+7.31 EUR
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LPC3240FET296015 LPC3220_30_40_50.pdf
LPC3240FET296015
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Number of I/O: 51
Part Status: Active
Supplier Device Package: 296-TFBGA (15x15)
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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MCZ33903CS5EK MC33903,4,5.pdf
MCZ33903CS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
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61+11.66 EUR
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CGD944C,112 CGD944C.pdf
CGD944C,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
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A3T23H300W23SR6 A3T23H300W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCX2131TF
Hersteller: NXP USA Inc.
Description: USB TYPE-C REV 3.0 PD PHY
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5603BK0MLL4 MPC5604BC.pdf
SPC5603BK0MLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5603BK0MLL4R MPC5602D.pdf
SPC5603BK0MLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEMB15,115 PHGLS24211-1.pdf?t.download=true&u=5oefqw
PEMB15,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMB15 - SMALL SIGN
auf Bestellung 62428 Stücke:
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AnzahlPrivatkunde
7340+0.081 EUR
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MC33772BTP1AE MC33772B_SDS.pdf
MC33772BTP1AE
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
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PCF8578HT/1,518 PCF8578.pdf
PCF8578HT/1,518
Hersteller: NXP USA Inc.
Description: IC DRVR DOT MATRIX 64TQFP
Supplier Device Package: 64-TQFP (10x10)
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C
Configuration: Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S9KEAZN64ACLH QP1010FS.pdf
S9KEAZN64ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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10+3.46 EUR
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MCU-LINK-PRO UM11673.pdf
MCU-LINK-PRO
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M DEBUG PROBE
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s), Accessories
Part Status: Active
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74HC11PW-Q100118 74HC_HCT11_Q100.pdf
74HC11PW-Q100118
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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MC9S08SE4MWL MC9S08SE8.pdf
MC9S08SE4MWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE VARACTOR 20V SNGL SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
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BB199,115 BB199_Rev1.pdf
BB199,115
Hersteller: NXP USA Inc.
Description: DIODE RF VCO/FM RAD TUNE SOD-523
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 13.8pF @ 2V, 1MHz
Capacitance Ratio Condition: C0.5/C2
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 2.8
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2219+0.27 EUR
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S9S12GN16AMLFR S12G Family Fact Sheet.pdf
S9S12GN16AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LX2082RC82029B
Hersteller: NXP USA Inc.
Description: 8XA72 64-BIT ARM 2GHZ CAN-FD
Produkt ist nicht verfügbar
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BAP70AM135 BAP70-03.pdf
BAP70AM135
Hersteller: NXP USA Inc.
Description: DIODE PIN 50V 100MA 6TSSOP
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BAP70AM/A115 PHGLS29507-1.pdf?t.download=true&u=5oefqw
BAP70AM/A115
Hersteller: NXP USA Inc.
Description: BAP70AM - PIN DIODE
Produkt ist nicht verfügbar
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LX2160XC72029B
LX2160XC72029B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 16 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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74AHC126PW-Q100118 74AHC_AHCT126_Q100.pdf
74AHC126PW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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NBP8FD4T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Produkt ist nicht verfügbar
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BFG31,115 BFG31.pdf
BFG31,115
Hersteller: NXP USA Inc.
Description: RF TRANS PNP 15V 5GHZ SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 175°C (TJ)
Power - Max: 1W
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 70mA, 10V
Frequency - Transition: 5GHz
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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BFG310/XR,215 BFG310_XR.pdf
BFG310/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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MC9S12DT256MPVE 9S12DT256DGV3.pdf
MC9S12DT256MPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
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MC33797BPEWR2518 FSCLS11648-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: FOUR CHANNEL SQUIB DRIVER IC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BA591/A115 _BA591.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: MIXER DIODE, VERY HIGH FREQUENCY
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Grade: Automotive
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 35V
Resistance @ If, F: 500mOhm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.9pF @ 3V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: Standard - Single
Package / Case: SC-76, SOD-323
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3806+0.15 EUR
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74AVCH4T245PW118 74AVCH4T245.pdf
74AVCH4T245PW118
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Produkt ist nicht verfügbar
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MIMXRT117FCVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
DigiKey Programmable: Not Verified
Number of I/O: 13
Part Status: Active
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 2M x 8
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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1+45.49 EUR
10+36.5 EUR
25+34.25 EUR
100+31.77 EUR
250+30.61 EUR
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MIMXRT117FDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+41.84 EUR
10+33.51 EUR
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250+28.05 EUR
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PXLS83722AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC8T245PW-Q100118 74AVC8T245_Q100.pdf
74AVC8T245PW-Q100118
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74AVC8T245PW112 NEXP-S-A0002881984-1.pdf?t.download=true&u=5oefqw
74AVC8T245PW112
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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UJA1167ATK/X/0Z UJA1167A.pdf
UJA1167ATK/X/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 800 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX84-C5V6/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C5V6/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
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BZX84-C5V6/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C5V6/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
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LPC1776FBD208K LPC178X_7X.pdf
LPC1776FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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NHS3100/A1Z NHS3100.pdf
NHS3100/A1Z
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 3.6V
Standards: ISO 14443
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
auf Bestellung 1788 Stücke:
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4+6.58 EUR
10+5.69 EUR
25+5.38 EUR
100+4.95 EUR
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500+4.51 EUR
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MC33772CTC0AE MC33772C-DS.pdf
MC33772CTC0AE
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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2+17.14 EUR
10+13.34 EUR
25+12.39 EUR
100+11.34 EUR
250+10.84 EUR
500+10.54 EUR
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SPC5643LF2MLQ1R,528
Hersteller: NXP USA Inc.
Description: 32 BIT MCU, DUAL- POWER ARCHITEC
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 32x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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WLAN3002CZ WLAN3002C.pdf
Hersteller: NXP USA Inc.
Description: IC AMP GPS 4.9-5.925GHZ 8HX2SON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 4.9GHz ~ 5.925GHz
RF Type: General Purpose
Voltage - Supply: 2.7V ~ 5.25V
Gain: 16dB
Current - Supply: 10mA
Noise Figure: 2.4dB
P1dB: 32dBm
Test Frequency: 5.4GHz
Supplier Device Package: 8-HX2SON (1.5x1.5)
Part Status: Active
Produkt ist nicht verfügbar
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74AUP2GU04GW125 74AUP2GU04.pdf
74AUP2GU04GW125
Hersteller: NXP USA Inc.
Description: IC INVERTER 2CH 2-INP 6TSSOP
Produkt ist nicht verfügbar
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74LV32PW PHGLS15081-1.pdf?t.download=true&u=5oefqw
74LV32PW
Hersteller: NXP USA Inc.
Description: 74LV32PW - OR GATE, LV/LV-A/LVX/
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MF1P4101DUD/01V MF1P(H)x1x1.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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BZX84-C27/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZX84-C27/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C27/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 27 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TFF1044HN/N1/AY TFF1044HN.pdf
Hersteller: NXP USA Inc.
Description: IC MIXER OSC PLL LNB 36HVLGA
Produkt ist nicht verfügbar
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SPC5747CK1CMJ6 MPC5748G.pdf
SPC5747CK1CMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3L4684TK,115 NX3L4684.pdf
NX3L4684TK,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Part Status: Active
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
12+1.82 EUR
16+1.32 EUR
25+1.19 EUR
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PHB110NQ06LT,118 PHB110NQ06LT.pdf
PHB110NQ06LT,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 3960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 45 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±15V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SC28L92A1A,518 SC28L92.pdf
SC28L92A1A,518
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 44-PLCC
Produkt ist nicht verfügbar
Mindestbestellmenge: 29 Stücke
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S32G274AABK0VUCT S32G2.pdf
S32G274AABK0VUCT
Hersteller: NXP USA Inc.
Description: IC MPU 400MHZ/1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Part Status: Last Time Buy
Additional Interfaces: CAN, FlexRay, I2C, SPI, UART
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PTN3816EWY
PTN3816EWY
Hersteller: NXP USA Inc.
Description: 4-LANE DISPLAY PORT LIN REDRIVER
Capacitance - Input: 10 pF
Part Status: Last Time Buy
Signal Conditioning: Input Equalization
Supplier Device Package: 36-HWFLGA (2.1x6)
Data Rate (Max): 20Gbps
Current - Supply: 250mA
Applications: DisplayPort
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -20°C ~ 85°C (TA)
Input: Differential
Type: ReDriver
Output: Differential
Mounting Type: Surface Mount
Number of Channels: 4
Delay Time: 70ps
Package / Case: 36-WFLGA Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 6081 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.39 EUR
10+9.1 EUR
25+8 EUR
100+6.76 EUR
250+6.15 EUR
500+5.8 EUR
1000+5.49 EUR
2500+5.18 EUR
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TEA1723DT/N1,118 TEA1723DT.pdf
TEA1723DT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Output Isolation: Non-Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8.5V ~ 20V
Supplier Device Package: 7-SOIC
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 17 V
Part Status: Active
Power (Watts): 11 W
Produkt ist nicht verfügbar
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