Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 439 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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| PESD3V3S2UQ/S911115 | NXP USA Inc. |
Description: NOW NEXPERIA, TRANS VOLTAGE SUPPPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| UBA2036TS/N1118 | NXP USA Inc. |
Description: IC DVR FULL BRIDGE 28-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PEMI8QFN/CM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHMS ESD SMDNumber of Channels: 8 Part Status: Obsolete ESD Protection: Yes Resistance - Channel (Ohms): 20 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 12dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 20Ohms, C = 16pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Package / Case: 16-XFDFN Exposed Pad Packaging: Bulk |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC373APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
auf Bestellung 9700 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC373ABQ-Q100115 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
auf Bestellung 1990 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC373APW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PLVA2653A215 | NXP USA Inc. |
Description: ZENER DIODE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3606 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BYV10-600PQ127 | NXP USA Inc. |
Description: ULTRAFAST RECTIFIER DIODE TO 22Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PMDXB1200UPE147 | NXP USA Inc. |
Description: NOW NEXPERIA PMDXB1200UPE SMALL |
auf Bestellung 1785000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9620H/Q900/1,51 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 80LQFPCurrent - Supply: 250 µA Part Status: Active Supplier Device Package: 80-LQFP (12x12) Digits or Characters: 30 Characters, 60 Characters, 480 Elements Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C Mounting Type: Surface Mount Display Type: LCD Package / Case: 80-LQFP Packaging: Cut Tape (CT) |
auf Bestellung 3643 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC3GU04DC,125 | NXP USA Inc. |
Description: IC INVERTER 3CH 3-INP 8VSSOP |
auf Bestellung 198000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F84763VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 56800EX Data Converters: A/D 16x12b, 8x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F84763VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 54 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x12b, 8x16b; D/A 1x12b Core Processor: 56800EX EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 24K x 8 Program Memory Size: 128KB (128K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC56F8245MLD | NXP USA Inc. | Description: 16-BIT DSC, 56800E CORE, 48KB FL |
auf Bestellung 4480 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806F/28H,115 | NXP USA Inc. |
Description: IC REG LINEAR 2.8V 200MA 6XSONCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 2.8V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 6-XFDFN Packaging: Bulk |
auf Bestellung 9751 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K148HFT0MLUT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K146HNT0VLLT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K142MRT0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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FS32K142MRT0CLHR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC1226FBD48/301151 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFPPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC54607J256BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5744BBK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MVR5510AMMA4ESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S08SG32E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 20TSSOPDigiKey Programmable: Not Verified Number of I/O: 16 Part Status: Active Supplier Device Package: 20-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 12x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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NZX4V7A,133 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW ALF2 |
auf Bestellung 38470 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13030598 | NXP USA Inc. |
Description: HITEX LPC1850 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1850 Platform: Hitex |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| OM40003,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC54018 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Utilized IC / Part: LPC54018 Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| OM13024598 | NXP USA Inc. |
Description: LPC12D27 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC12D27 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| OM16000598 | NXP USA Inc. |
Description: DEMO BOARD Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR Supplied Contents: Board(s) Utilized IC / Part: 74AXP1G57 Type: Logic Function: Configurable Multiple Function Gate Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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OM7606/BGA2712598 | NXP USA Inc. |
Description: EVAL BOARD FOR BGA2712 Part Status: Active Supplied Contents: Board(s) Type: Amplifier Frequency: 1GHz ~ 3.2GHz For Use With/Related Products: BGA2712 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PCA9450AAHNY | NXP USA Inc. |
Description: PMIC FOR I.MX8M MINI 845S 56HVQFPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9S08SU8VFK | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 24QFNPackaging: Tray Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V Connectivity: I2C, SCI Peripherals: PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 17 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PEMI8QFN/WT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/23PF SMDPackaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Number of Channels: 8 |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC04AD | NXP USA Inc. |
Description: IC INVERTER 6CH 1-INP 14SOPackaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 1.08V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF Part Status: Active Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LPC54607J256BD208 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 171 DigiKey Programmable: Not Verified |
auf Bestellung 392 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC2G08GS115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G08GS AND GATPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 74LVC2G08GF115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G08GF - AND G |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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LD6806F/16P,115 | NXP USA Inc. |
Description: IC REG LINEAR 1.6V 200MA 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Output (Min/Fixed): 1.6V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF8100CHEP | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE-Packaging: Bulk |
auf Bestellung 780 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34PF8100CHEPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE-Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSONPackaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 14-HVSON (3x4.5) Duplex: Full |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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TJA1128ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 14HVSONPackaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 1/1 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 14-HVSON (3x4.5) Duplex: Full |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PCF8579HT/1,518 | NXP USA Inc. |
Description: INTERFACE CIRCUIT, CMOS, PQFP64Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MF1P4101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 Operating Temperature: -25°C ~ 70°C (TA) Type: RFID Transponder Frequency: 13.56MHz Package / Case: Die Packaging: Tray Supplier Device Package: Wafer Standards: ISO 14443, MIFARE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9887UK/N2AZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSPMax Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 29-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 29-WLCSP (3.19x2.07) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9895UK/N2BZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Active Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1 Jack, Filtered Package / Case: 29-UFBGA, WLCSP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9895UK/N2AZ | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Active Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1 Jack, Filtered Package / Case: 29-UFBGA, WLCSP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9895BUK/N1Z | NXP USA Inc. |
Description: IC AMP D 1 JACK 2.5W 29WLCSP Type: Class D Output Type: 1 Jack, Filtered Features: Depop, Short-Circuit and Thermal Protection Packaging: Bulk Part Status: Obsolete Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9887UK/N2BZ | NXP USA Inc. |
Description: IC AMP CLSS D MONO 2.65W 29WLCSPPart Status: Obsolete Supplier Device Package: 29-WLCSP (3.19x2.07) Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 29-UFBGA, WLCSP Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| BZX84-A16215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-A13 - ZENER D |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MC34931SEKR2 | NXP USA Inc. |
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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BZV90-C39115 | NXP USA Inc. |
Description: DIODE ZENER 36V 1.5W 5% UNICurrent - Reverse Leakage @ Vr: 50 nA @ 27.3 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Power - Max: 1.5 W Part Status: Active Supplier Device Package: SOT-223 Impedance (Max) (Zzt): 130 Ohms Voltage - Zener (Nom) (Vz): 39 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Tolerance: ±5% Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| LX2082RE82029B | NXP USA Inc. |
Description: IC MPU QORIQ LX 2GHZ 1150FBGA Additional Interfaces: CANbus, I2C, PCIe, SPI, UART SATA: SATA 6Gbps (4) Graphics Acceleration: No RAM Controllers: DDR4, SDRAM Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 (1) Supplier Device Package: 1150-FBGA (23x23) Core Processor: ARM® Cortex®-A72 Operating Temperature: 5°C ~ 105°C (TA) Speed: 2GHz Mounting Type: Surface Mount Package / Case: 1150-FBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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TJA1086HNJ | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 1/1 44HVQFNNumber of Drivers/Receivers: 1/1 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 44-VQFN Exposed Pad Packaging: Bulk Duplex: Full Supplier Device Package: 44-HVQFN (9x9) Protocol: FlexRay |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08RN32W1MLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 55 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5675KF0MMS2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 473MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 473-MAPBGA (19x19) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 34x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 2MB (2M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 473-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MCIMX6QP4AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGASATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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P1010NSN5HHB | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGASATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 425-TEPBGA I (19x19) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 425-FBGA Packaging: Tray Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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NVT2002TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR HXSON8UNumber of Circuits: 1 Voltage - VCCB: 1.8 V ~ 5.5 V Voltage - VCCA: 1 V ~ 3.6 V Channels per Circuit: 2 Translator Type: Voltage Level Channel Type: Bidirectional Supplier Device Package: HXSON8U Data Rate: 33MHz Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 8-XFDFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AXP1G10GMH | NXP USA Inc. |
Description: IC GATE NAND 1CH 3-INP 6XSONCurrent - Quiescent (Max): 600 nA Number of Circuits: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Supplier Device Package: 6-XSON (1.45x1) Number of Inputs: 3 Current - Output High, Low: 8mA, 8mA Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Bulk |
auf Bestellung 4653 Stücke: Lieferzeit 10-14 Tag (e) |
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| UBA2036TS/N1118 |
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Hersteller: NXP USA Inc.
Description: IC DVR FULL BRIDGE 28-SSOP
Description: IC DVR FULL BRIDGE 28-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PEMI8QFN/CM,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Number of Channels: 8
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
Description: FILTER RC(PI) 20 OHMS ESD SMD
Number of Channels: 8
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1567+ | 0.38 EUR |
| 74LVC373APW/AU118 |
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auf Bestellung 9700 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2049+ | 0.31 EUR |
| 74LVC373ABQ-Q100115 |
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auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1990+ | 0.36 EUR |
| PLVA2653A215 |
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Hersteller: NXP USA Inc.
Description: ZENER DIODE
Description: ZENER DIODE
Produkt ist nicht verfügbar
Mindestbestellmenge: 3606 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BYV10-600PQ127 |
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Hersteller: NXP USA Inc.
Description: ULTRAFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
Description: ULTRAFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMDXB1200UPE147 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMDXB1200UPE SMALL
Description: NOW NEXPERIA PMDXB1200UPE SMALL
auf Bestellung 1785000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4418+ | 0.14 EUR |
| PCA9620H/Q900/1,51 |
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Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 80LQFP
Current - Supply: 250 µA
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Digits or Characters: 30 Characters, 60 Characters, 480 Elements
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
Description: IC DRVR 7 SEGMENT 80LQFP
Current - Supply: 250 µA
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Digits or Characters: 30 Characters, 60 Characters, 480 Elements
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 80-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 3643 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.32 EUR |
| 10+ | 6.32 EUR |
| 25+ | 5.82 EUR |
| 100+ | 5.27 EUR |
| 250+ | 5.01 EUR |
| 500+ | 4.86 EUR |
| 74AHC3GU04DC,125 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8VSSOP
Description: IC INVERTER 3CH 3-INP 8VSSOP
auf Bestellung 198000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1694+ | 0.38 EUR |
| MC56F84763VLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 8x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 8x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 15.53 EUR |
| MC56F84763VLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b, 8x16b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b, 8x16b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.06 EUR |
| 10+ | 21.4 EUR |
| 25+ | 19.98 EUR |
| 100+ | 18.42 EUR |
| 250+ | 17.68 EUR |
| 500+ | 17.23 EUR |
| MC56F8245MLD |
Hersteller: NXP USA Inc.
Description: 16-BIT DSC, 56800E CORE, 48KB FL
Description: 16-BIT DSC, 56800E CORE, 48KB FL
auf Bestellung 4480 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 25.83 EUR |
| LD6806F/28H,115 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC REG LINEAR 2.8V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 9751 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2219+ | 0.27 EUR |
| FS32K148HFT0MLUT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
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| FS32K146HNT0VLLT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
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| FS32K142MRT0CLHT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
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| FS32K142MRT0CLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC1226FBD48/301151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC54607J256BD208E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5744BBK1AVKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
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| MVR5510AMMA4ESR2 |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PMIC VR5510
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S08SG32E1CTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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| NZX4V7A,133 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 500MW ALF2
Description: DIODE ZENER 4.7V 500MW ALF2
auf Bestellung 38470 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15000+ | 0.04 EUR |
| OM13030598 |
Hersteller: NXP USA Inc.
Description: HITEX LPC1850 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1850
Platform: Hitex
Description: HITEX LPC1850 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1850
Platform: Hitex
Produkt ist nicht verfügbar
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| OM40003,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54018
Platform: LPCXpresso™
Description: LPCXPRESSO LPC54018 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54018
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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| OM13024598 |
Hersteller: NXP USA Inc.
Description: LPC12D27 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC12D27
Description: LPC12D27 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC12D27
Produkt ist nicht verfügbar
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| OM16000598 |
Hersteller: NXP USA Inc.
Description: DEMO BOARD
Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR
Supplied Contents: Board(s)
Utilized IC / Part: 74AXP1G57
Type: Logic
Function: Configurable Multiple Function Gate
Packaging: Bulk
Description: DEMO BOARD
Primary Attributes: AND, Buffer, Inverter, NAND, NOR, OR, XNOR
Supplied Contents: Board(s)
Utilized IC / Part: 74AXP1G57
Type: Logic
Function: Configurable Multiple Function Gate
Packaging: Bulk
Produkt ist nicht verfügbar
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| OM7606/BGA2712598 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR BGA2712
Part Status: Active
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1GHz ~ 3.2GHz
For Use With/Related Products: BGA2712
Packaging: Bulk
Description: EVAL BOARD FOR BGA2712
Part Status: Active
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1GHz ~ 3.2GHz
For Use With/Related Products: BGA2712
Packaging: Bulk
Produkt ist nicht verfügbar
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| PCA9450AAHNY |
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Hersteller: NXP USA Inc.
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
Description: PMIC FOR I.MX8M MINI 845S 56HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 6.15 EUR |
| MC9S08SU8VFK |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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| PEMI8QFN/WT,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1567+ | 0.37 EUR |
| 74LVC04AD |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LPC54607J256BD208 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 171
DigiKey Programmable: Not Verified
auf Bestellung 392 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 31+ | 34.06 EUR |
| 74LVC2G08GS115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G08GS AND GAT
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC2G08GS AND GAT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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| 74LVC2G08GF115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC2G08GF - AND G
Description: NOW NEXPERIA 74LVC2G08GF - AND G
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LD6806F/16P,115 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.6V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.6V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2219+ | 0.26 EUR |
| MC34PF8100CHEP |
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auf Bestellung 780 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 50+ | 12.11 EUR |
| MC34PF8100CHEPR2 |
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auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 50+ | 12.11 EUR |
| TJA1128ATK/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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| TJA1128ATK/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Produkt ist nicht verfügbar
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| PCF8579HT/1,518 |
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Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Part Status: Active
Packaging: Bulk
Description: INTERFACE CIRCUIT, CMOS, PQFP64
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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| MF1P4101DUD/02V |
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
Description: MIFARE PLUS EV1
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Transponder
Frequency: 13.56MHz
Package / Case: Die
Packaging: Tray
Supplier Device Package: Wafer
Standards: ISO 14443, MIFARE
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TFA9887UK/N2AZ |
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Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9895UK/N2BZ |
Hersteller: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9895UK/N2AZ |
Hersteller: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Active
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1 Jack, Filtered
Package / Case: 29-UFBGA, WLCSP
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| TFA9895BUK/N1Z |
Hersteller: NXP USA Inc.
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Type: Class D
Output Type: 1 Jack, Filtered
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Obsolete
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC AMP D 1 JACK 2.5W 29WLCSP
Type: Class D
Output Type: 1 Jack, Filtered
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Bulk
Part Status: Obsolete
Max Output Power x Channels @ Load: 2.5W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9887UK/N2BZ |
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Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Description: IC AMP CLSS D MONO 2.65W 29WLCSP
Part Status: Obsolete
Supplier Device Package: 29-WLCSP (3.19x2.07)
Max Output Power x Channels @ Load: 2.65W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 29-UFBGA, WLCSP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BZX84-A16215 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-A13 - ZENER D
Description: NOW NEXPERIA BZX84-A13 - ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34931SEKR2 |
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Hersteller: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BZV90-C39115 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W 5% UNI
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 39 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
Description: DIODE ZENER 36V 1.5W 5% UNI
Current - Reverse Leakage @ Vr: 50 nA @ 27.3 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1.5 W
Part Status: Active
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 130 Ohms
Voltage - Zener (Nom) (Vz): 39 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LX2082RE82029B |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
SATA: SATA 6Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (1)
Supplier Device Package: 1150-FBGA (23x23)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 5°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1150-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| TJA1086HNJ |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Bulk
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
Description: IC TRANSCEIVER FULL 1/1 44HVQFN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 44-VQFN Exposed Pad
Packaging: Bulk
Duplex: Full
Supplier Device Package: 44-HVQFN (9x9)
Protocol: FlexRay
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 34+ | 16.27 EUR |
| S9S08RN32W1MLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SPC5675KF0MMS2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 473-MAPBGA (19x19)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 34x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 473-MAPBGA (19x19)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 34x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MCIMX6QP4AVT8AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| P1010NSN5HHB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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| NVT2002TLH |
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Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR HXSON8U
Number of Circuits: 1
Voltage - VCCB: 1.8 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: HXSON8U
Data Rate: 33MHz
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC XLTR VL BIDIR HXSON8U
Number of Circuits: 1
Voltage - VCCB: 1.8 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: HXSON8U
Data Rate: 33MHz
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 0.6 EUR |
| 8000+ | 0.58 EUR |
| 74AXP1G10GMH |
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Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 3-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 3
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC GATE NAND 1CH 3-INP 6XSON
Current - Quiescent (Max): 600 nA
Number of Circuits: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Supplier Device Package: 6-XSON (1.45x1)
Number of Inputs: 3
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 4653 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4653+ | 0.15 EUR |




























