Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 443 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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| 74LVT16244BBX,518 | NXP USA Inc. |
 Description: IC BUFF NON-INVERT 3.6V 60HXQFNPart Status: Active Supplier Device Package: 60-HXQFN (4x6) Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 4 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 60-XFQFN Dual Rows, Exposed Pad Packaging: Bulk |
auf Bestellung 4900 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8544VJAQGA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZX84-B4V3/LF1R | NXP USA Inc. |
Description: DIODE ZENER 4.3V 250MW SOT23 Current - Reverse Leakage @ Vr: 3 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Qualification: AEC-Q101 Grade: Automotive Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 90 Ohms Voltage - Zener (Nom) (Vz): 4.3 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±2% Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9S08QD2VSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOIC Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128 x 8 Program Memory Size: 2KB (2K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC68LC302AF16CT | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 100LQFP Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 100-LQFP (14x14) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: 0°C ~ 70°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1G57GS132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| IP3254CZ16-8TTL | NXP USA Inc. |
Description: 8-CH PASSIVE EMI-FILTER NETWORK Packaging: Bulk |
auf Bestellung 1430 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5645BK0VLT1R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP DigiKey Programmable: Not Verified Number of I/O: 177 Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 33x10b, 10x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 160K x 8 Program Memory Size: 2MB (2M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9KEAZN8AVFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9KEAZN8AVFK | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFN Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S08RN60W1MLF | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMX8MN1CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7618-55/C,118 | NXP USA Inc. |
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL Part Status: Active Packaging: Bulk |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCT2202UK012 | NXP USA Inc. |
Description: DIGITAL TEMPERATURE SENSOR Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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KIT-TPLSNIFEVB | NXP USA Inc. |
Description: TRANSFORMER PHYSICAL LAYER SNIFF Packaging: Box For Use With/Related Products: Logic Analyzer Accessory Type: Interface Board Part Status: Active Utilized IC / Part: Logic Analyzer |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2290FBD144015 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LPC2292FBD144/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MRF300AN-27MHZ | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V 3SIL Packaging: Bulk Package / Case: 3-SIP Current Rating (Amps): 10µA Mounting Type: Through Hole Frequency: 1.8MHz ~ 250MHz Power - Output: 300W Gain: 28.2dB Technology: LDMOS Supplier Device Package: 3-SIL Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5748CTK1VMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA DigiKey Programmable: Not Verified Number of I/O: 178 Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 768K x 8 Program Memory Size: 6MB (6M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12ZVL8F0CLCR | NXP USA Inc. | Description: IC MCU 16BIT 8KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12ZVL8F0CLC | NXP USA Inc. |
Description: IC MCU 16BIT 8KB FLASH 32LQFP Number of I/O: 19 Part Status: Active Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: S12Z EEPROM Size: 128 x 8 Program Memory Type: FLASH DigiKey Programmable: Not Verified Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 8KB (8K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| S9S08LG32J0VLK557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| S9S08LG32J0CLH557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74LVC11DB,118 | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14-SSOP Packaging: Bulk |
auf Bestellung 4963 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC11PW/AU118 | NXP USA Inc. |
Description: AND GATE, LVC/LCX/Z SERIES |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC11PW/S400118 | NXP USA Inc. |
Description: AND GATE, LVC/LCX/Z SERIES Packaging: Bulk |
auf Bestellung 3937 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1014SFVLLN | NXP USA Inc. |
Description: WCT1014SF 100 LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| WCT-15WTXMULTI | NXP USA Inc. |
Description: WCT-15WTXMULTI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MWCT1014SFVLLR | NXP USA Inc. |
Description: WCT1014SF 100 LQFP Grade: Automotive Supplier Device Package: 100-LQFP (14x14) Applications: Wireless Power Transmitter Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MWCT1014SFVLL | NXP USA Inc. |
Description: WCT1014SF 100 LQFP Supplier Device Package: 100-LQFP (14x14) Applications: General Purpose Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| TEA19031AMT/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH SMART CHRG |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TEA19031AOT/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH SMART CHRG |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| BUK768R1-40E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK768R1-100E - POW |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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LD6806F/28P,115 | NXP USA Inc. |
Description: IC REG LINEAR 2.8V 200MA 6-XSON Current - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.13V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 2.8V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 6-XFDFN Packaging: Bulk |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K142MAT0MLLT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 89 Supplier Device Package: 100-LQFP (14x14) Peripherals: POR, PWM, WDT Package / Case: 100-LQFP Packaging: Tray Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 64MHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCF5212CAE66R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 55 Part Status: Not For New Designs Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: Coldfire V2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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K32W041Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Part Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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K32W041Z | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Part Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C DigiKey Programmable: Not Verified Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 642 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN1DVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU7062N2Y | NXP USA Inc. |
Description: IC AMP 1.71GHZ-1.785GHZ 16HLQFN Test Frequency: 1.75GHz Noise Figure: 0.77dB Current - Supply: 215mA Gain: 37.2dB Voltage - Supply: 3.3V Frequency: 1.71GHz ~ 1.785GHz Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Packaging: Tape & Reel (TR) Supplier Device Package: 16-HLQFN (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BGU8011X,115 | NXP USA Inc. |
Description: SIGE:C LOW NOISE AMPLIFIER MMIC Part Status: Active Packaging: Bulk Supplier Device Package: 6-XSON (1.1x0.9) Test Frequency: 1.575GHz P1dB: -5dBm Noise Figure: 1.2dB Current - Supply: 9mA Gain: 17.6dB Voltage - Supply: 1.5V ~ 3.1V RF Type: Galileo, GLONASS, GNSS, GPS Frequency: 1.559GHz ~ 1.61GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN |
auf Bestellung 3478 Stücke: Lieferzeit 10-14 Tag (e) |
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MC10XS6225BEK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32SOIC Part Status: Obsolete Fault Protection: Open Load Detect, Over Temperature Supplier Device Package: 32-SOIC-EP Current - Output (Max): 4.5A, 9A Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Voltage - Load: 7V ~ 18V Rds On (Typ): 10mOhm, 25mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 2 Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Features: Status Flag Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SLN-VIZN-IOT | NXP USA Inc. |
Description: I.MXRT106F DEV FACE RECOGNITION |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PTN36002HQX | NXP USA Inc. | Description: DUALPORT 5GBPS USB3.1 GEN1 REDRI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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S912ZVH128F2VLL,557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16 BIT, HCS12 C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S912ZVH128F2CLQ557 | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, HCS12 C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 38 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S912ZVH128F2VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S912ZVL96F0VLFR | NXP USA Inc. |
Description: IC MCU 16BIT 96KB FLASH 48LQFP Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 96KB (96K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PNX9531E/V140557 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 37800 Stücke: Lieferzeit 10-14 Tag (e) |
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PNX9530E/V140557 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 1585 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12GA64F0WLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP DigiKey Programmable: Not Verified Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x12b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray Number of I/O: 40 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BUK652R0-30C,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 120A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V |
auf Bestellung 2193 Stücke: Lieferzeit 10-14 Tag (e) |
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TL431SDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 2% TO236AB Tolerance: ±2% Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Grade: Automotive Part Status: Obsolete Current - Cathode: 1 mA Current - Output: 100 mA Voltage - Output (Max): 36 V Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC08XS6421DEK | NXP USA Inc. |
Description: IC HIGH SIDE SWITCH 12V 32SOIC Features: Internal PWM Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC08XS6421BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC08XS6421DEKR2 | NXP USA Inc. |
Description: IC HIGH SIDE SWITCH 12V 32SOIC Packaging: Tape & Reel (TR) Features: Internal PWM Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 2:3 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC08XS6421BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Part Status: Obsolete Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Supplier Device Package: 32-HSOP Ratio - Input:Output: 1:1 Current - Output (Max): 5.5A, 11A Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Voltage - Load: 7V ~ 18V Rds On (Typ): 8mOhm, 21mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 4 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC08XS6421CEK | NXP USA Inc. |
Description: HIGH-SIDE SWITCH 12V DUAL 8MOHMS Part Status: Obsolete Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Supplier Device Package: 54-HSOP Ratio - Input:Output: 1:1 Current - Output (Max): 5.5A, 11A Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Voltage - Load: 7V ~ 18V Input Type: CMOS Rds On (Typ): 8mOhm, 21mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 4 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| KIT08XS6421EKEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC08XS6421 Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Contents: Board(s) Utilized IC / Part: MC08XS6421 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| FRDM-17XSF4-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD MC17XSF Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC08XS6421, MC08XSF421 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74LVT16244BBX,518 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HXQFN
Part Status: Active
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
Description: IC BUFF NON-INVERT 3.6V 60HXQFN
Part Status: Active
Supplier Device Package: 60-HXQFN (4x6)
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 4
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Bulk
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 833+ | 0.7 EUR |
| MPC8544VJAQGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B4V3/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Qualification: AEC-Q101
Grade: Automotive
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Description: DIODE ZENER 4.3V 250MW SOT23
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Qualification: AEC-Q101
Grade: Automotive
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 4.3 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08QD2VSCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC68LC302AF16CT |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: IC MPU M683XX 16MHZ 100LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 68.79 EUR |
| 74LVC1G57GS132 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C
Description: NOW NEXPERIA 74LVC1G57GS LOGIC C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP3254CZ16-8TTL |
|
auf Bestellung 1430 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1430+ | 0.4 EUR |
| SPC5645BK0VLT1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 160K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 160K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9KEAZN8AVFKR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9KEAZN8AVFK |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 32BIT 8KB FLASH 24QFN
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S08RN60W1MLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MN1CVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.84 EUR |
| 10+ | 38.41 EUR |
| 25+ | 36.07 EUR |
| BUK7618-55/C,118 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Part Status: Active
Packaging: Bulk
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Part Status: Active
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 468+ | 1.29 EUR |
| KIT-TPLSNIFEVB |
|
Hersteller: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER SNIFF
Packaging: Box
For Use With/Related Products: Logic Analyzer
Accessory Type: Interface Board
Part Status: Active
Utilized IC / Part: Logic Analyzer
Description: TRANSFORMER PHYSICAL LAYER SNIFF
Packaging: Box
For Use With/Related Products: Logic Analyzer
Accessory Type: Interface Board
Part Status: Active
Utilized IC / Part: Logic Analyzer
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 429.57 EUR |
| LPC2290FBD144015 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2292FBD144/01551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF300AN-27MHZ |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V 3SIL
Packaging: Bulk
Package / Case: 3-SIP
Current Rating (Amps): 10µA
Mounting Type: Through Hole
Frequency: 1.8MHz ~ 250MHz
Power - Output: 300W
Gain: 28.2dB
Technology: LDMOS
Supplier Device Package: 3-SIL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V 3SIL
Packaging: Bulk
Package / Case: 3-SIP
Current Rating (Amps): 10µA
Mounting Type: Through Hole
Frequency: 1.8MHz ~ 250MHz
Power - Output: 300W
Gain: 28.2dB
Technology: LDMOS
Supplier Device Package: 3-SIL
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5748CTK1VMJ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12ZVL8F0CLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 8KB FLASH 32LQFP
Description: IC MCU 16BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12ZVL8F0CLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 8KB FLASH 32LQFP
Number of I/O: 19
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 8KB FLASH 32LQFP
Number of I/O: 19
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
DigiKey Programmable: Not Verified
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08LG32J0VLK557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S08LG32J0CLH557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC11DB,118 |
|
auf Bestellung 4963 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2111+ | 0.27 EUR |
| 74LVC11PW/AU118 |
|
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC11PW/S400118 |
|
auf Bestellung 3937 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3937+ | 0.18 EUR |
| MWCT1014SFVLLN |
|
Hersteller: NXP USA Inc.
Description: WCT1014SF 100 LQFP
Description: WCT1014SF 100 LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| WCT-15WTXMULTI |
|
Hersteller: NXP USA Inc.
Description: WCT-15WTXMULTI
Description: WCT-15WTXMULTI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MWCT1014SFVLLR |
|
Hersteller: NXP USA Inc.
Description: WCT1014SF 100 LQFP
Grade: Automotive
Supplier Device Package: 100-LQFP (14x14)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: WCT1014SF 100 LQFP
Grade: Automotive
Supplier Device Package: 100-LQFP (14x14)
Applications: Wireless Power Transmitter
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MWCT1014SFVLL |
|
Hersteller: NXP USA Inc.
Description: WCT1014SF 100 LQFP
Supplier Device Package: 100-LQFP (14x14)
Applications: General Purpose
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: WCT1014SF 100 LQFP
Supplier Device Package: 100-LQFP (14x14)
Applications: General Purpose
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TEA19031AMT/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH SMART CHRG
Description: IC OFFLINE SWITCH SMART CHRG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA19031AOT/1J |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH SMART CHRG
Description: IC OFFLINE SWITCH SMART CHRG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BUK768R1-40E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK768R1-100E - POW
Description: NOW NEXPERIA BUK768R1-100E - POW
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LD6806F/28P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 6-XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC REG LINEAR 2.8V 200MA 6-XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2219+ | 0.29 EUR |
| FS32K142MAT0MLLT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Package / Case: 100-LQFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 89
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Package / Case: 100-LQFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF5212CAE66R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| K32W041Z |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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Stück im Wert von UAH
| K32W041Z |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
DigiKey Programmable: Not Verified
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
DigiKey Programmable: Not Verified
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 642 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.51 EUR |
| 10+ | 14.32 EUR |
| 25+ | 13.55 EUR |
| 100+ | 12.52 EUR |
| 250+ | 11.89 EUR |
| 500+ | 11.45 EUR |
| MIMX8MN1DVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.34 EUR |
| 10+ | 33.02 EUR |
| 25+ | 30.94 EUR |
| BGU7062N2Y |
|
Hersteller: NXP USA Inc.
Description: IC AMP 1.71GHZ-1.785GHZ 16HLQFN
Test Frequency: 1.75GHz
Noise Figure: 0.77dB
Current - Supply: 215mA
Gain: 37.2dB
Voltage - Supply: 3.3V
Frequency: 1.71GHz ~ 1.785GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HLQFN (8x8)
Description: IC AMP 1.71GHZ-1.785GHZ 16HLQFN
Test Frequency: 1.75GHz
Noise Figure: 0.77dB
Current - Supply: 215mA
Gain: 37.2dB
Voltage - Supply: 3.3V
Frequency: 1.71GHz ~ 1.785GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HLQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGU8011X,115 |
|
Hersteller: NXP USA Inc.
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Part Status: Active
Packaging: Bulk
Supplier Device Package: 6-XSON (1.1x0.9)
Test Frequency: 1.575GHz
P1dB: -5dBm
Noise Figure: 1.2dB
Current - Supply: 9mA
Gain: 17.6dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GNSS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Part Status: Active
Packaging: Bulk
Supplier Device Package: 6-XSON (1.1x0.9)
Test Frequency: 1.575GHz
P1dB: -5dBm
Noise Figure: 1.2dB
Current - Supply: 9mA
Gain: 17.6dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GNSS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
auf Bestellung 3478 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 739+ | 0.79 EUR |
| MC10XS6225BEK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Current - Output (Max): 4.5A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Current - Output (Max): 4.5A, 9A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 10mOhm, 25mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Status Flag
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SLN-VIZN-IOT |
|
Hersteller: NXP USA Inc.
Description: I.MXRT106F DEV FACE RECOGNITION
Description: I.MXRT106F DEV FACE RECOGNITION
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PTN36002HQX |
Hersteller: NXP USA Inc.
Description: DUALPORT 5GBPS USB3.1 GEN1 REDRI
Description: DUALPORT 5GBPS USB3.1 GEN1 REDRI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVH128F2VLL,557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVH128F2CLQ557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
Mindestbestellmenge: 38 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVH128F2VLQ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVL96F0VLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PNX9531E/V140557 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 37800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 50.58 EUR |
| PNX9530E/V140557 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 1585 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 60.68 EUR |
| S9S12GA64F0WLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x12b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x12b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Produkt ist nicht verfügbar
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| BUK652R0-30C,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
auf Bestellung 2193 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 224+ | 2.61 EUR |
| TL431SDT,215 |
|
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 2% TO236AB
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Description: IC VREF SHUNT ADJ 2% TO236AB
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MC08XS6421DEK |
Hersteller: NXP USA Inc.
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
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| MC08XS6421BEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MC08XS6421DEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MC08XS6421BEK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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| MC08XS6421CEK |
|
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 12V DUAL 8MOHMS
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: CMOS
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: HIGH-SIDE SWITCH 12V DUAL 8MOHMS
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 54-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A, 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: CMOS
Rds On (Typ): 8mOhm, 21mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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| KIT08XS6421EKEVB |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC08XS6421
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC08XS6421
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR MC08XS6421
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC08XS6421
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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| FRDM-17XSF4-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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