Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 446 nach 592
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BUK7E11-55B,127 | NXP USA Inc. |
 Description: MOSFET N-CH 55V 75A I2PAKPackaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V Power Dissipation (Max): 157W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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BCP56135 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MCF52100CVM80 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA Packaging: Tray Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Part Status: Not For New Designs Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 212 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX884-B5V6315 | NXP USA Inc. |
Description: NOW NEXPERIA BZX884-B5V6 ZENER D |
Produkt ist nicht verfügbar |
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FS32K144MST0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Obsolete Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5605BK0MLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5605BK0MLQ4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC5536JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 606 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC5534JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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PN7161B1EV/C100K | NXP USA Inc. |
Description: IC NFC CONTROLLER SPI VFBGA64 Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: SPI Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC Supplier Device Package: 64-VFBGA (4x4) Part Status: Active |
auf Bestellung 1609 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE18F256VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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MVR5510AMDAHESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MVR5510AMDAHES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-D Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS116L315 | NXP USA Inc. |
Description: BAS116L - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCZ33904C5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MC10XS6200EK574 | NXP USA Inc. |
Description: BUFFER/INVERTER PERIPHL DRIVER |
Produkt ist nicht verfügbar |
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MCZ33905CS3EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MCZ33903CP3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
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MCZ33905CD3EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP |
Produkt ist nicht verfügbar |
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MCZ33905CD5EK574 | NXP USA Inc. |
Description: IC SUPERVISOR PWR SUP MGMT CIRC |
Produkt ist nicht verfügbar |
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MC34903CP5EK574 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP WITH CAN HIGH |
Produkt ist nicht verfügbar |
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| SAF7770EL/101S13AK | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S500K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray |
Produkt ist nicht verfügbar |
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| MHT2001NR1 | NXP USA Inc. |
Description: IC AMP GPS 902MHZ-928MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 902MHz ~ 928MHz RF Type: General Purpose Voltage - Supply: 50V Gain: 33.8dB P1dB: 55.2dBm Test Frequency: 902MHz ~ 928MHz Supplier Device Package: TO-270 WB-14 |
Produkt ist nicht verfügbar |
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QN9080CHN518 | NXP USA Inc. |
Description: BTLE SOC |
Produkt ist nicht verfügbar |
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MC33772BTA1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BTA1AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772CTA2AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BSP2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BSA2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772CTP1AE | NXP USA Inc. |
Description: IC 6-CH LI-ION BATT CTRL 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
auf Bestellung 311 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33772BSA1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BTP2AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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MC33772BTP1AER2 | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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| 74LVC1G53GS115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G53GS SINGLE- |
Produkt ist nicht verfügbar |
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74HCT2G14GW-Q100125 | NXP USA Inc. |
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP Packaging: Bulk Features: Schmitt Trigger Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: SOT-363 Input Logic Level - High: 1.9V ~ 2.1V Input Logic Level - Low: 0.5V ~ 0.6V Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 1 µA |
Produkt ist nicht verfügbar |
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PCA9525DP,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 1CH 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C Current - Supply: 170µA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9621PW,118 | NXP USA Inc. |
Description: IC BUS PORT 8BIT 65MA 16TSSOP |
Produkt ist nicht verfügbar |
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LPC4320FET100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 |
Produkt ist nicht verfügbar |
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74LVCH322244AEC557 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 4275 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH322245AEC557 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 41225 Stücke: Lieferzeit 10-14 Tag (e) |
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| P2010NSN2MFC557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 32-BI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08AW16AE0CLC557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 22 |
Produkt ist nicht verfügbar |
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NCJ3320EHN/0Y | NXP USA Inc. | Description: NCJ3320 - NFC READER |
auf Bestellung 3520 Stücke: Lieferzeit 10-14 Tag (e) |
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NCF3310AHN/0J | NXP USA Inc. |
Description: IC NFC TAG I2C HVQFN16 Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: GPIO, I2C Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Supplier Device Package: 16-HVQFN (3x3) Part Status: Active |
Produkt ist nicht verfügbar |
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NCF3310AHN/0J | NXP USA Inc. |
Description: IC NFC TAG I2C HVQFN16 Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: GPIO, I2C Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Supplier Device Package: 16-HVQFN (3x3) Part Status: Active |
Produkt ist nicht verfügbar |
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| KIT33730EKEVBE | NXP USA Inc. |
Description: KIT SWITCH MODE POWER SUPPLY Packaging: Box Voltage - Input: 4.5V ~ 26.5V Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MC33730, MCZ33730 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down with LDO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FS32K148UAT0VLQR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEP100AVAGR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 |
Produkt ist nicht verfügbar |
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S9S12P64J0VLHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G48F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MKV46F256VLH16R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 29x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 48 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S912XET512J3VAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
74AUP1G08GM,132 | NXP USA Inc. |
Description: IC GATE AND 1CH 2-INP 6XSON |
auf Bestellung 249300 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU3.6B2A115 | NXP USA Inc. |
Description: DIODE ZENER 3.6V 320MW SOD323 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
PZU8.2B2A115 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 320MW SOD323 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PZU5.6B2A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU5.6B2A ZENER DIO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PZU9.1B2A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU9.1B2A ZENER DIO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PZU7.5B2A115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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|
PZU15B2A115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BUK7E11-55B,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 342+ | 1.48 EUR |
| MCF52100CVM80 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 21+ | 42.43 EUR |
| BZX884-B5V6315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K144MST0CLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BK0MLQ4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5605BK0MLQ4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5536JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.13 EUR |
| 10+ | 10.02 EUR |
| 25+ | 9.48 EUR |
| 160+ | 8.5 EUR |
| 320+ | 8.17 EUR |
| LPC5534JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.11 EUR |
| 10+ | 13.44 EUR |
| PN7161B1EV/C100K |
|
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 1609 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.29 EUR |
| 10+ | 12.4 EUR |
| 25+ | 11.74 EUR |
| 100+ | 10.84 EUR |
| 250+ | 10.3 EUR |
| 500+ | 9.92 EUR |
| MKE18F256VLL16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AMDAHESR2 |
|
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AMDAHES |
|
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 19.8 EUR |
| 10+ | 15.58 EUR |
| 25+ | 14.52 EUR |
| 100+ | 13.36 EUR |
| 260+ | 12.79 EUR |
| MCZ33904C5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC10XS6200EK574 |
|
Hersteller: NXP USA Inc.
Description: BUFFER/INVERTER PERIPHL DRIVER
Description: BUFFER/INVERTER PERIPHL DRIVER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CS3EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903CP3EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CD3EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905CD5EK574 |
|
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34903CP5EK574 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF7770EL/101S13AK |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MHT2001NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 902MHZ-928MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
RF Type: General Purpose
Voltage - Supply: 50V
Gain: 33.8dB
P1dB: 55.2dBm
Test Frequency: 902MHz ~ 928MHz
Supplier Device Package: TO-270 WB-14
Description: IC AMP GPS 902MHZ-928MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
RF Type: General Purpose
Voltage - Supply: 50V
Gain: 33.8dB
P1dB: 55.2dBm
Test Frequency: 902MHz ~ 928MHz
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| QN9080CHN518 |
|
Hersteller: NXP USA Inc.
Description: BTLE SOC
Description: BTLE SOC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTA1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTA1AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772CTA2AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSP2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BSA2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772CTP1AE |
|
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 311 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.05 EUR |
| 10+ | 13.37 EUR |
| 25+ | 12.45 EUR |
| 100+ | 11.43 EUR |
| 250+ | 10.95 EUR |
| MC33772BSA1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTP2AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33772BTP1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC1G53GS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G53GS SINGLE-
Description: NOW NEXPERIA 74LVC1G53GS SINGLE-
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT2G14GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: SOT-363
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Description: IC INVERT SCHMITT 2CH 2IN 6TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: SOT-363
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9525DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 170µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C
Current - Supply: 170µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9621PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4320FET100 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH322244AEC557 |
|
auf Bestellung 4275 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 47+ | 10.35 EUR |
| 74LVCH322245AEC557 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 41225 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 47+ | 10.35 EUR |
| P2010NSN2MFC557 |
|
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 242.36 EUR |
| S9S08AW16AE0CLC557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCJ3320EHN/0Y |
Hersteller: NXP USA Inc.
Description: NCJ3320 - NFC READER
Description: NCJ3320 - NFC READER
auf Bestellung 3520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 26+ | 18.72 EUR |
| NCF3310AHN/0J |
|
Hersteller: NXP USA Inc.
Description: IC NFC TAG I2C HVQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Description: IC NFC TAG I2C HVQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF3310AHN/0J |
|
Hersteller: NXP USA Inc.
Description: IC NFC TAG I2C HVQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Description: IC NFC TAG I2C HVQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Interface: GPIO, I2C
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KIT33730EKEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT SWITCH MODE POWER SUPPLY
Packaging: Box
Voltage - Input: 4.5V ~ 26.5V
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC33730, MCZ33730
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down with LDO
Part Status: Obsolete
Description: KIT SWITCH MODE POWER SUPPLY
Packaging: Box
Voltage - Input: 4.5V ~ 26.5V
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC33730, MCZ33730
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down with LDO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148UAT0VLQR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEP100AVAGR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12P64J0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48F0MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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| MKV46F256VLH16R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 29x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 29x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XET512J3VAGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
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| 74AUP1G08GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 6XSON
Description: IC GATE AND 1CH 2-INP 6XSON
auf Bestellung 249300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3620+ | 0.14 EUR |
| PZU3.6B2A115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.6V 320MW SOD323
Description: DIODE ZENER 3.6V 320MW SOD323
Produkt ist nicht verfügbar
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| PZU8.2B2A115 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 320MW SOD323
Description: DIODE ZENER 8.2V 320MW SOD323
Produkt ist nicht verfügbar
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| PZU5.6B2A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU5.6B2A ZENER DIO
Description: NOW NEXPERIA PZU5.6B2A ZENER DIO
Produkt ist nicht verfügbar
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| PZU9.1B2A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU9.1B2A ZENER DIO
Description: NOW NEXPERIA PZU9.1B2A ZENER DIO
Produkt ist nicht verfügbar
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| PZU7.5B2A115 |
|
Hersteller: NXP USA Inc.
Description: SINGLE ZENER DIODE
Description: SINGLE ZENER DIODE
Produkt ist nicht verfügbar
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| PZU15B2A115 |
|
Hersteller: NXP USA Inc.
Description: SINGLE ZENER DIODE
Description: SINGLE ZENER DIODE
Produkt ist nicht verfügbar
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