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OM67200JP OM67200JP NXP USA Inc. A1006.pdf Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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PHN203,518-NX PHN203,518-NX NXP USA Inc. Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
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LD6805K/22P,115 LD6805K/22P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
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LD6805K/25H,115 LD6805K/25H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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LD6806F/18H,115 LD6806F/18H,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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PZU602DB2115 PZU602DB2115 NXP USA Inc. PZUXDB2_SER.pdf Description: DIODE ZENER
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CBT16212DGG,112 CBT16212DGG,112 NXP USA Inc. PHGLS15875-1.pdf?t.download=true&u=5oefqw Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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8MPLUSLPD4-PEVK 8MPLUSLPD4-PEVK NXP USA Inc. IMX8MPLUSEVKFS.pdf Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
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74LVC16374ADL,112-NXP 74LVC16374ADL,112-NXP NXP USA Inc. Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC16374ADGG-Q100118 74LVC16374ADGG-Q100118 NXP USA Inc. 74LVC_LVCH16374A_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC163D112 NXP USA Inc. 74LVC163.pdf Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
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S32K148EVB-Q144 NXP USA Inc. S32K1xx.pdf Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
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MCIMX286CVM4CR2 NXP USA Inc. FSCLS07330-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286DVM4CR NXP USA Inc. FSCLS07330-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX286CVM4C MCIMX286CVM4C NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX285AVM4C NXP USA Inc. IMX28AEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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CBT3306PW-Q100118 NXP USA Inc. CBT3306_Q100.pdf Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
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2729+0.23 EUR
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CBT3306D-Q100118 CBT3306D-Q100118 NXP USA Inc. CBT3306_Q100.pdf Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1VL BZX84-C3V3/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC908KX2CDWE-NXP NXP USA Inc. FSCLS06738-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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N74F280BN,602 N74F280BN,602 NXP USA Inc. N74F280B.pdf Description: IC PARITY GEN/CHKER 9-BIT 14DIP
Produkt ist nicht verfügbar
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PSMN9RO-25YLC115 NXP USA Inc. Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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74ABT821DB,112 74ABT821DB,112 NXP USA Inc. 74ABT821.pdf Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
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489+1.00 EUR
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N74F5074D,602 N74F5074D,602 NXP USA Inc. 74F5074.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
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286+1.69 EUR
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N74F273AN,602 N74F273AN,602 NXP USA Inc. 74F273A.pdf Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
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642+0.77 EUR
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PCA9516AD,118 PCA9516AD,118 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1R BZX84-C3V3/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC14AWP112 NXP USA Inc. Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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K32W041AK K32W041AK NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.50 EUR
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SPC5744PK1AMLQ8 SPC5744PK1AMLQ8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0VLQT FS32K148HFT0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR MCIMX6Q5EYM10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 792 Stücke:
Lieferzeit 10-14 Tag (e)
1+140.57 EUR
10+117.11 EUR
25+111.25 EUR
100+104.82 EUR
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MCF54452CVP200 MCF54452CVP200 NXP USA Inc. MCF54455.pdf Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
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1+58.47 EUR
10+46.88 EUR
80+40.04 EUR
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MC56F82733MFM MC56F82733MFM NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U68JBD48K LPC11U68JBD48K NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1304 Stücke:
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2+9.10 EUR
10+7.01 EUR
25+6.49 EUR
80+6.02 EUR
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BUK7E11-55B,127 BUK7E11-55B,127 NXP USA Inc. BUK7E11-55B.pdf Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
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BCP56135 BCP56135 NXP USA Inc. BCP56_BCX56_BC56PA.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF52100CVM80 NXP USA Inc. Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
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BZX884-B5V6315 BZX884-B5V6315 NXP USA Inc. BZX884_BC_SER.pdf Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
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FS32K144MST0CLHT FS32K144MST0CLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLQ4R SPC5605BK0MLQ4R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLQ4 SPC5605BK0MLQ4 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5536JBD64E LPC5536JBD64E NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 606 Stücke:
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2+14.13 EUR
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160+8.50 EUR
320+8.17 EUR
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LPC5534JBD64E LPC5534JBD64E NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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2+17.11 EUR
10+13.44 EUR
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PN7161B1EV/C100K PN7161B1EV/C100K NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
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Lieferzeit 10-14 Tag (e)
2+14.29 EUR
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100+10.84 EUR
250+10.30 EUR
500+9.92 EUR
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MKE18F256VLL16 MKE18F256VLL16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MVR5510AMDAHESR2 MVR5510AMDAHESR2 NXP USA Inc. VR5510.pdf Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMDAHES MVR5510AMDAHES NXP USA Inc. VR5510.pdf Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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1+20.79 EUR
10+16.35 EUR
25+15.24 EUR
100+14.02 EUR
260+13.42 EUR
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BAS116L315 BAS116L315 NXP USA Inc. BAS116H.pdf Description: BAS116L - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33904C5EK574 MCZ33904C5EK574 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
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MC10XS6200EK574 MC10XS6200EK574 NXP USA Inc. MC12XS6D2.pdf Description: BUFFER/INVERTER PERIPHL DRIVER
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MCZ33905CS3EK574 MCZ33905CS3EK574 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC SUPERVISOR PWR SUP MGMT CIRC
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MCZ33903CP3EK574 MCZ33903CP3EK574 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: SYSTEM BASIS CHIP
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MCZ33905CD3EK574 MCZ33905CD3EK574 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: SYSTEM BASIS CHIP
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MCZ33905CD5EK574 MCZ33905CD5EK574 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: IC SUPERVISOR PWR SUP MGMT CIRC
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MC34903CP5EK574 MC34903CP5EK574 NXP USA Inc. MC34903_4_5.pdf Description: SYSTEM BASIS CHIP WITH CAN HIGH
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SAF7770EL/101S13AK NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
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SAF4000EL/101S500K NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Produkt ist nicht verfügbar
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MHT2001NR1 NXP USA Inc. Description: IC AMP GPS 902MHZ-928MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
RF Type: General Purpose
Voltage - Supply: 50V
Gain: 33.8dB
P1dB: 55.2dBm
Test Frequency: 902MHz ~ 928MHz
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
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QN9080CHN518 QN9080CHN518 NXP USA Inc. QN908x.pdf Description: BTLE SOC
Produkt ist nicht verfügbar
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OM67200JP A1006.pdf
OM67200JP
Hersteller: NXP USA Inc.
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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PHN203,518-NX
PHN203,518-NX
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
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LD6805K/22P,115 LD6805.pdf
LD6805K/22P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
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Anzahl Preis
3206+0.16 EUR
Mindestbestellmenge: 3206
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LD6805K/25H,115 LD6805.pdf
LD6805K/25H,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.5V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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Anzahl Preis
3206+0.16 EUR
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LD6806F/18H,115 LD6806_Series.pdf
LD6806F/18H,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2219+0.23 EUR
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PZU602DB2115 PZUXDB2_SER.pdf
PZU602DB2115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 5987 Stücke:
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CBT16212DGG,112 PHGLS15875-1.pdf?t.download=true&u=5oefqw
CBT16212DGG,112
Hersteller: NXP USA Inc.
Description: IC BUS FET EXC SW 12X2:2 56TSSOP
Packaging: Tube
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 2:2
Type: Bus FET Exchange Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
494+0.98 EUR
Mindestbestellmenge: 494
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8MPLUSLPD4-PEVK IMX8MPLUSEVKFS.pdf
8MPLUSLPD4-PEVK
Hersteller: NXP USA Inc.
Description: I.MX 8M PLUS EVAL KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Operating System: Android, FreeRTOS, Linux
Part Status: Active
auf Bestellung 14 Stücke:
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Anzahl Preis
1+1075.89 EUR
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74LVC16374ADL,112-NXP
74LVC16374ADL,112-NXP
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 2-
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 48-SSOP
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC16374ADGG-Q100118 74LVC_LVCH16374A_Q100.pdf
74LVC16374ADGG-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVC163D112 74LVC163.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC163D - BINARY
Produkt ist nicht verfügbar
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S32K148EVB-Q144 S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K148 EVAL BRD
Produkt ist nicht verfügbar
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MCIMX286CVM4CR2 FSCLS07330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX286DVM4CR FSCLS07330-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX286CVM4C IMX28CEC.pdf
MCIMX286CVM4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX285AVM4C IMX28AEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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CBT3306PW-Q100118 CBT3306_Q100.pdf
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
auf Bestellung 2729 Stücke:
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2729+0.23 EUR
Mindestbestellmenge: 2729
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CBT3306D-Q100118 CBT3306_Q100.pdf
CBT3306D-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, CBT SERIES
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V3/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC908KX2CDWE-NXP FSCLS06738-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 4263 Stücke:
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Anzahl Preis
52+10.26 EUR
Mindestbestellmenge: 52
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N74F280BN,602 N74F280B.pdf
N74F280BN,602
Hersteller: NXP USA Inc.
Description: IC PARITY GEN/CHKER 9-BIT 14DIP
Produkt ist nicht verfügbar
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PSMN9RO-25YLC115
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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74ABT821DB,112 74ABT821.pdf
74ABT821DB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24SSOP
auf Bestellung 708 Stücke:
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Anzahl Preis
489+1.00 EUR
Mindestbestellmenge: 489
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N74F5074D,602 74F5074.pdf
N74F5074D,602
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
auf Bestellung 495 Stücke:
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Anzahl Preis
286+1.69 EUR
Mindestbestellmenge: 286
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N74F273AN,602 74F273A.pdf
N74F273AN,602
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 38 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 170 MHz
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 9.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 1852 Stücke:
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642+0.77 EUR
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PCA9516AD,118 PCA9516A.pdf
PCA9516AD,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 400KHZ 16SO
Produkt ist nicht verfügbar
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BZX84-C3V3/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C3V3/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74LVC14AWP112
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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K32W041AK K32W041AM.pdf
K32W041AK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.50 EUR
Mindestbestellmenge: 3
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SPC5744PK1AMLQ8 MPC5744P.pdf
SPC5744PK1AMLQ8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0VLQT S32K1xx.pdf
FS32K148HFT0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR IMX6DQIEC.pdf
MCIMX6Q5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 792 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+140.57 EUR
10+117.11 EUR
25+111.25 EUR
100+104.82 EUR
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MCF54452CVP200 MCF54455.pdf
MCF54452CVP200
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.47 EUR
10+46.88 EUR
80+40.04 EUR
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MC56F82733MFM MC56F827XXDS.pdf
MC56F82733MFM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U68JBD48K LPC11U6X.pdf
LPC11U68JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.10 EUR
10+7.01 EUR
25+6.49 EUR
80+6.02 EUR
Mindestbestellmenge: 2
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BUK7E11-55B,127 BUK7E11-55B.pdf
BUK7E11-55B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2604 pF @ 25 V
auf Bestellung 990 Stücke:
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Anzahl Preis
342+1.48 EUR
Mindestbestellmenge: 342
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BCP56135 BCP56_BCX56_BC56PA.pdf
BCP56135
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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MCF52100CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 212 Stücke:
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Anzahl Preis
21+42.43 EUR
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BZX884-B5V6315 BZX884_BC_SER.pdf
BZX884-B5V6315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-B5V6 ZENER D
Produkt ist nicht verfügbar
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FS32K144MST0CLHT S32K1xx.pdf
FS32K144MST0CLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLQ4R MPC560XBFAMFS.pdf
SPC5605BK0MLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLQ4 MPC560XBFAMFS.pdf
SPC5605BK0MLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5536JBD64E LPC553x.pdf
LPC5536JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 606 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.13 EUR
10+10.02 EUR
25+9.48 EUR
160+8.50 EUR
320+8.17 EUR
Mindestbestellmenge: 2
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LPC5534JBD64E LPC553x.pdf
LPC5534JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
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Anzahl Preis
2+17.11 EUR
10+13.44 EUR
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PN7161B1EV/C100K PN7160_PN7161.pdf
PN7161B1EV/C100K
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER SPI VFBGA64
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Part Status: Active
auf Bestellung 1609 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.29 EUR
10+12.40 EUR
25+11.74 EUR
100+10.84 EUR
250+10.30 EUR
500+9.92 EUR
Mindestbestellmenge: 2
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MKE18F256VLL16 KE1xFP100M168SF0.pdf
MKE18F256VLL16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MVR5510AMDAHESR2 VR5510.pdf
MVR5510AMDAHESR2
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MVR5510AMDAHES VR5510.pdf
MVR5510AMDAHES
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-D
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.79 EUR
10+16.35 EUR
25+15.24 EUR
100+14.02 EUR
260+13.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
BAS116L315 BAS116H.pdf
BAS116L315
Hersteller: NXP USA Inc.
Description: BAS116L - RECTIFIER DIODE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MCZ33904C5EK574 MC33903-MC33904-MC33905.pdf
MCZ33904C5EK574
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
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MC10XS6200EK574 MC12XS6D2.pdf
MC10XS6200EK574
Hersteller: NXP USA Inc.
Description: BUFFER/INVERTER PERIPHL DRIVER
Produkt ist nicht verfügbar
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MCZ33905CS3EK574 MC33903-MC33904-MC33905.pdf
MCZ33905CS3EK574
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
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MCZ33903CP3EK574 MC33903-MC33904-MC33905.pdf
MCZ33903CP3EK574
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
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MCZ33905CD3EK574 MC33903-MC33904-MC33905.pdf
MCZ33905CD3EK574
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP
Produkt ist nicht verfügbar
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MCZ33905CD5EK574 MC33903-MC33904-MC33905.pdf
MCZ33905CD5EK574
Hersteller: NXP USA Inc.
Description: IC SUPERVISOR PWR SUP MGMT CIRC
Produkt ist nicht verfügbar
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MC34903CP5EK574 MC34903_4_5.pdf
MC34903CP5EK574
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP WITH CAN HIGH
Produkt ist nicht verfügbar
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SAF7770EL/101S13AK
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
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SAF4000EL/101S500K
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tray
Produkt ist nicht verfügbar
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MHT2001NR1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 902MHZ-928MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
RF Type: General Purpose
Voltage - Supply: 50V
Gain: 33.8dB
P1dB: 55.2dBm
Test Frequency: 902MHz ~ 928MHz
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
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QN9080CHN518 QN908x.pdf
QN9080CHN518
Hersteller: NXP USA Inc.
Description: BTLE SOC
Produkt ist nicht verfügbar
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