Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35717) > Seite 447 nach 596
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| RAPIDRF-35TL039 | NXP USA Inc. |
Description: 28V LDMOS RF FRONT END 5G 56W Packaging: Bulk Frequency: 3.4GHz ~ 3.6GHz Type: Front End Contents: Board(s) Supplied Contents: Board(s) Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
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74LVC1GU04GW-Q100125 | NXP USA Inc. |
 Description: INVERTER, LVC/LCX/Z SERIESPackaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 1 Supplier Device Package: 5-TSSOP Input Logic Level - High: 1.32V ~ 4.4V Input Logic Level - Low: 0.33V ~ 1.1V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
Produkt ist nicht verfügbar |
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MC34PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF1550A4EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC34PF1550A1EP | NXP USA Inc. | Description: POWER MANAGEMENT IC: 3 BUCK REGS |
Produkt ist nicht verfügbar |
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MC32PF1550A7EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC34PF1550A2EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC34PF1550A5EP | NXP USA Inc. |
Description: PF1550 |
Produkt ist nicht verfügbar |
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MC32PF1550A5EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC32PF1550A0EPR2 | NXP USA Inc. | Description: POWER MANAGEMENT IC: 3 BUCK REGS |
Produkt ist nicht verfügbar |
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PBSS5220PAPS115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS5220PAPS SMALL Packaging: Bulk Part Status: Active Package / Case: 6-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: 2 PNP Operating Temperature: 150°C (TJ) Power - Max: 370mW Current - Collector (Ic) (Max): 2A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V Frequency - Transition: 95MHz Supplier Device Package: DFN2020D-6 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 7440 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH16CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC8248CZQMIBA-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8245TVV300D-NXP | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32 BIT, PO Packaging: Bulk Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC™ MPC603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN3DVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 169 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8537BH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP |
Produkt ist nicht verfügbar |
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
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MIMXRT1062XVN5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 237 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1062DVN6B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC4851PW118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC4851PW SINGLE-E Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MAC57D5-208DC | NXP USA Inc. |
Description: MAC57D5XX EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4 Utilized IC / Part: MAC57D5xx |
Produkt ist nicht verfügbar |
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Bulk Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 292 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S67JET256551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 154K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S50FET180551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 |
Produkt ist nicht verfügbar |
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| LPC4330FET180/CP3342 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S50FET180E551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 |
Produkt ist nicht verfügbar |
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SPC5604BF2MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| OM13480UL | NXP USA Inc. |
Description: NVT4555UK SIM CARD LT/LDO WL CSP |
Produkt ist nicht verfügbar |
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CBT3257ADS,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 4 X 2:1 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3257ADB112 | NXP USA Inc. |
Description: NOW NEXPERIA CBT3257ADB - MULTIP |
auf Bestellung 2886 Stücke: Lieferzeit 10-14 Tag (e) |
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MC17XSG500EKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
Produkt ist nicht verfügbar |
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74AHCT377PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 8mA, 8mA Trigger Type: Positive Edge Clock Frequency: 130 MHz Input Capacitance: 3 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 8 |
auf Bestellung 17045 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT125PW/C1118 | NXP USA Inc. |
Description: BUS DRIVER, AHCT/VHCT/VT SERIES |
Produkt ist nicht verfügbar |
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MPC8313CVRAGDC | NXP USA Inc. |
Description: IC MPU POWERQUICC II PRO 516PBGA |
Produkt ist nicht verfügbar |
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MC68711E20MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
Produkt ist nicht verfügbar |
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MIMX8MM2CVTKZAA | NXP USA Inc. |
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5602BF2VLL6R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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PNX9530E/V140518 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 1758 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/28P,115 | NXP USA Inc. |
Description: IC REG LIN 2.8V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.8V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 8753 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8053X | NXP USA Inc. |
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON Packaging: Cut Tape (CT) Package / Case: 8-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 2GHz ~ 4GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75V ~ 5.25V Gain: 18.5dB Current - Supply: 48mA Noise Figure: 0.56dB P1dB: 18dBm Test Frequency: 2.5GHz Supplier Device Package: 8-HWSON (2x2) Part Status: Active |
auf Bestellung 2913 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF2131-ARD | NXP USA Inc. |
Description: PCF2131 RTC EVAL BOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF2131 Platform: Arduino |
Produkt ist nicht verfügbar |
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SPC5602BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K144UAT0VLHT,557 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74ALVCH16821DGG118 | NXP USA Inc. |
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP Packaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 350 MHz Input Capacitance: 5 pF Supplier Device Package: 56-TSSOP Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF Number of Bits per Element: 10 |
auf Bestellung 31014 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16500DGG118 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Packaging: Bulk Part Status: Active Package / Case: 56-TFSOP (0.240", 6.10mm Width) Number of Circuits: 18 Mounting Type: Surface Mount Logic Type: Universal Bus Transceiver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-TSSOP |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH162244ADGG118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVCH162244ADGG - Packaging: Bulk Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9901DP,118 | NXP USA Inc. |
Description: IC LED DRIVER LINEAR 20MA 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 20mA Internal Switch(s): Yes Supplier Device Package: 8-TSSOP Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| CBTL05024BS128 | NXP USA Inc. |
Description: HIGH PERFORMANCE MULTIPLEXER/DEM Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UEL/S500,147 | NXP USA Inc. |
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UEL147 | NXP USA Inc. |
Description: P-CHANNEL MOSFET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| PMCXB900UE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S912B32E4VFUE8R | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PIMD3115 | NXP USA Inc. |
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BZX84-B56,215 | NXP USA Inc. |
Description: DIODE ZENER 56V 250MW SOT23 Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 56 V Impedance (Max) (Zzt): 200 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V Qualification: AEC-Q101 |
auf Bestellung 35000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B51/DG/B2215 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX84-B51215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-B51 - ZENER D |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| RAPIDRF-35TL039 |
Hersteller: NXP USA Inc.
Description: 28V LDMOS RF FRONT END 5G 56W
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Front End
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
Description: 28V LDMOS RF FRONT END 5G 56W
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Front End
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC1GU04GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A1EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 93+ | 5.44 EUR |
| MC32PF1550A4EP |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A1EP |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1550A7EP |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A2EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A5EP |
|
Hersteller: NXP USA Inc.
Description: PF1550
Description: PF1550
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1550A5EP |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC32PF1550A0EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PBSS5220PAPS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1734+ | 0.27 EUR |
| MC9S08SH16CTGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8248CZQMIBA-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 80.46 EUR |
| MPC8245TVV300D-NXP |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 207.05 EUR |
| MIMX8MN3DVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 169 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.3 EUR |
| 10+ | 22.54 EUR |
| 25+ | 21.1 EUR |
| 168+ | 19.06 EUR |
| PCA8537BH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Description: IC DRVR 7 SEGMENT 64TQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1062XVN5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 24.18 EUR |
| 10+ | 19.17 EUR |
| 25+ | 17.91 EUR |
| 160+ | 16.17 EUR |
| MIMXRT1062DVN6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.17 EUR |
| 10+ | 15.99 EUR |
| 25+ | 14.94 EUR |
| 100+ | 14.59 EUR |
| MAC57D5-208DC |
Hersteller: NXP USA Inc.
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 58.84 EUR |
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S67JET256551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4330FET180/CP3342 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180E551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BF2MLL6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13480UL |
|
Hersteller: NXP USA Inc.
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBT3257ADS,112 |
|
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 4 X 2:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC MUX/DEMUX 4 X 2:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1169+ | 0.43 EUR |
| CBT3257ADB112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA CBT3257ADB - MULTIP
Description: NOW NEXPERIA CBT3257ADB - MULTIP
auf Bestellung 2886 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1367+ | 0.36 EUR |
| MC17XSG500EKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT377PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 17045 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1258+ | 0.42 EUR |
| 74AHCT125PW/C1118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313CVRAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Description: IC MPU POWERQUICC II PRO 516PBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68711E20MFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MM2CVTKZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 59.28 EUR |
| 10+ | 48.29 EUR |
| 25+ | 45.55 EUR |
| SPC5602BF2VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PNX9530E/V140518 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 63.72 EUR |
| LD6805K/28P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 8753 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3206+ | 0.16 EUR |
| BGU8053X |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2GHz ~ 4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.56dB
P1dB: 18dBm
Test Frequency: 2.5GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2GHz ~ 4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.56dB
P1dB: 18dBm
Test Frequency: 2.5GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
auf Bestellung 2913 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 3.27 EUR |
| 10+ | 2.82 EUR |
| 25+ | 2.66 EUR |
| 100+ | 2.45 EUR |
| 250+ | 2.32 EUR |
| 500+ | 2.22 EUR |
| 1000+ | 2.14 EUR |
| PCF2131-ARD |
|
Hersteller: NXP USA Inc.
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5602BK0CLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K144UAT0VLHT,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74ALVCH16821DGG118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Number of Bits per Element: 10
Description: IC FF D-TYPE DBL 10-BIT 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Number of Bits per Element: 10
auf Bestellung 31014 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 301+ | 1.5 EUR |
| 74ALVCH16500DGG118 |
|
Hersteller: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 350+ | 1.38 EUR |
| 74LVCH162244ADGG118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 709+ | 0.7 EUR |
| PCA9901DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 20mA
Internal Switch(s): Yes
Supplier Device Package: 8-TSSOP
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 20mA
Internal Switch(s): Yes
Supplier Device Package: 8-TSSOP
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL05024BS128 |
|
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL/S500,147 |
|
Hersteller: NXP USA Inc.
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL147 |
|
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Description: P-CHANNEL MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UE147 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912B32E4VFUE8R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIMD3115 |
|
Hersteller: NXP USA Inc.
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| BZX84-B56,215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 56V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q101
Description: DIODE ZENER 56V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q101
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13172+ | 0.034 EUR |
| BZX84-B51/DG/B2215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.071 EUR |
| BZX84-B51215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Produkt ist nicht verfügbar
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