Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34455) > Seite 447 nach 575
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| NHS3100UCODEADKUL | NXP USA Inc. |
Description: NHS3100 UCODE-I2C SOL STARTER KI Packaging: Bulk For Use With/Related Products: NHS3100 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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NX3L4684GM,132 | NXP USA Inc. |
 Description: IC SWITCH SPDTX2 750MOHM 10XQFNPackaging: Bulk Package / Case: 10-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 20MHz Supplier Device Package: 10-XQFN (1.55x2) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 50pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 40mOhm Switch Time (Ton, Toff) (Max): 45ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 2 |
auf Bestellung 3625 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4020PW-Q100118 | NXP USA Inc. |
Description: BINARY COUNTER, HCT SERIES |
auf Bestellung 2280 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4520D,118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT4520D - BINARY Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 58 MHz Number of Bits per Element: 4 |
auf Bestellung 4795 Stücke: Lieferzeit 10-14 Tag (e) |
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SOT89.jpg "BGA3012,115") |
BGA3012,115 | NXP USA Inc. |
Description: IC RF AMP CATV 5MHZ-1GHZ SOT89-3 |
Produkt ist nicht verfügbar |
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PCA9542APW/DG118 | NXP USA Inc. |
Description: IC I2C MUX 2-CH 14-TSSOP Packaging: Bulk Part Status: Active Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I2C Multiplexer Supplier Device Package: 14-TSSOP |
auf Bestellung 1293 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9542APW,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: I²C, SMBus Voltage - Supply: 2.3V ~ 5.5V Applications: 2-Channel I²C Multiplexer Supplier Device Package: 14-TSSOP Part Status: Obsolete |
auf Bestellung 7236 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU7041,115 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 40MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 3.1V ~ 3.5V Gain: 10dB Current - Supply: 38mA Noise Figure: 3.8dB P1dB: 12dBm Test Frequency: 40MHz ~ 1GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 3654 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7754HV/N205ZY | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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| SAF7754HV/N205ZK | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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| SAF7754HV/N205K | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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| SAF7754HV/N205Y | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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MC9S08GW32CLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Packaging: Bulk Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
auf Bestellung 5261 Stücke: Lieferzeit 10-14 Tag (e) |
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P5020NSE7QMB | NXP USA Inc. |
Description: IC MPU Q OR IQ 2.0GHZ 1295FCBGA |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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1PS88SB48/DG/B2115 | NXP USA Inc. |
Description: RECTIFIER DIODE |
auf Bestellung 200942 Stücke: Lieferzeit 10-14 Tag (e) |
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1PS88SB48,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA 6TSSOP |
Produkt ist nicht verfügbar |
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74AUP2G80GD,125 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 309 MHz Input Capacitance: 0.6 pF Supplier Device Package: 8-XSON (2x3) Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF Number of Bits per Element: 1 |
auf Bestellung 176611 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G80DC125 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 8VSSOP Packaging: Bulk Package / Case: 8-VFSOP (0.091", 2.30mm Width) Output Type: Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 309 MHz Input Capacitance: 0.6 pF Supplier Device Package: 8-VSSOP Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 93000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16244AEV/G518 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES, 4 |
auf Bestellung 23366 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16244ADGG-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 48-TSSOP Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 28360 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16244ADGG | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 48TSSOP |
Produkt ist nicht verfügbar |
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74LVC16244ADL,112 | NXP USA Inc. |
Description: IC BUFF DVR TRI-ST 16BIT 48SSOP |
Produkt ist nicht verfügbar |
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74LVCH16374ADGG-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIES |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16601DGG118 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Packaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Number of Circuits: 18 Mounting Type: Surface Mount Logic Type: Universal Bus Transceiver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-TSSOP |
auf Bestellung 1994 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16601DGG512 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Packaging: Bulk Part Status: Active |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FX512AVLH12R | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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MK22FX512AVLH12R | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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74LVT573D,118 | NXP USA Inc. |
Description: 74LVT573 - 3.3 V OCTAL D-TYPE TR Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 2.7ns Supplier Device Package: 20-SO Part Status: Active |
auf Bestellung 1950 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV139D,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 2:4 16SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 12mA, 12mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
auf Bestellung 7819 Stücke: Lieferzeit 10-14 Tag (e) |
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| TEA19363DB1484UL | NXP USA Inc. |
Description: 60W USB PD2.0 DEMO BOARD Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA19363 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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SPC5746CK1AMKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MMG3003NT1-NXP | NXP USA Inc. |
Description: WIDE BAND MEDIUM POWER AMPLIFIER |
auf Bestellung 470 Stücke: Lieferzeit 10-14 Tag (e) |
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MMZ25332BT1 | NXP USA Inc. |
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN Packaging: Cut Tape (CT) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.8GHz RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 3V ~ 5V Gain: 26.5dB Current - Supply: 390mA Noise Figure: 5.8dB P1dB: 33dBm Test Frequency: 2.5GHz Supplier Device Package: 12-QFN (3x3) |
auf Bestellung 1955 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFSC5G37D37T2 | NXP USA Inc. |
Description: AIRFAST PWR AMP 5G 29DB HLQFN26 |
Produkt ist nicht verfügbar |
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| AFSC5G37D37T2 | NXP USA Inc. |
Description: AIRFAST PWR AMP 5G 29DB HLQFN26 |
auf Bestellung 1717 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLA6H0912-500112 | NXP USA Inc. |
Description: BLA6H0912-500 - LDMOS AVIONICS R Packaging: Tray Package / Case: SOT634A Current Rating (Amps): 54A Frequency: 960MHz ~ 1.22GHz Power - Output: 450W Gain: 17dB Technology: LDMOS Supplier Device Package: CDFM2 Part Status: Not For New Designs Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 74 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XDP512J1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PMPB23XNE,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 7A DFN2020MD-6 |
auf Bestellung 357656 Stücke: Lieferzeit 10-14 Tag (e) |
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BAP51-05W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 240MW SOT323-3 |
auf Bestellung 20095 Stücke: Lieferzeit 10-14 Tag (e) |
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| MRF6V3090NBR5578 | NXP USA Inc. | Description: RF POWER UHF BAND N-CHANNEL FET |
Produkt ist nicht verfügbar |
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SPC5602BF2VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SL2S5402FTBX | NXP USA Inc. |
Description: ICODE Packaging: Tape & Reel (TR) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: ISO 15693, ISO 18000-3 Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: 3-XSON (1x1.45) Part Status: Active |
Produkt ist nicht verfügbar |
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S912ZVL12F0CLF | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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MCIMX6D5EYM12AC | NXP USA Inc. |
Description: I.MX 6 SERIES 32-BIT MPU ARM CO |
Produkt ist nicht verfügbar |
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| LS1084ASE7MQA | NXP USA Inc. |
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART |
Produkt ist nicht verfügbar |
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MK22FN1M0AVLK12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 80FQFP Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33HB2001EKR2518 | NXP USA Inc. |
Description: BRUSH DC MOTOR CONTROLLER 16A |
Produkt ist nicht verfügbar |
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MC33HB2002ES | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tray Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
Produkt ist nicht verfügbar |
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| MC33HB2002ESR2 | NXP USA Inc. |
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR Packaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: DC Motors Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Grade: Automotive Part Status: Active |
Produkt ist nicht verfügbar |
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S9S12GN48AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPF5024AVNA0ESR2 | NXP USA Inc. | Description: PF5024 |
Produkt ist nicht verfügbar |
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NX3L1G3157GMZ | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 900MOHM 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 900mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 1MHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 100mOhm Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 1 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| S32G274AABK0CUCT | NXP USA Inc. |
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: MII, RGMII, RMII, SGMII USB: USB OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Security Features: HSE-H |
Produkt ist nicht verfügbar |
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IP4284CZ10-TBR,115 | NXP USA Inc. |
Description: TVS DIODE 8VC DFN2510A-10 |
Produkt ist nicht verfügbar |
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SPC5746CK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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2PA1774QMB315 | NXP USA Inc. |
Description: NOW NEXPERIA 2PA1774QMB - SMALL Packaging: Bulk Package / Case: 3-XFDFN Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: DFN1006B-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW Qualification: AEC-Q101 |
auf Bestellung 57940 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC144VMB315 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 10 kOhms Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11E13FBD48301 | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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SPC5747CHK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5747CHK0AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| NHS3100UCODEADKUL |
Hersteller: NXP USA Inc.
Description: NHS3100 UCODE-I2C SOL STARTER KI
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Description: NHS3100 UCODE-I2C SOL STARTER KI
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| NX3L4684GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Bulk
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Bulk
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
auf Bestellung 3625 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1211+ | 0.41 EUR |
| 74HCT4020PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BINARY COUNTER, HCT SERIES
Description: BINARY COUNTER, HCT SERIES
auf Bestellung 2280 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1310+ | 0.42 EUR |
| 74HCT4520D,118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4520D - BINARY
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 58 MHz
Number of Bits per Element: 4
Description: NOW NEXPERIA 74HCT4520D - BINARY
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 58 MHz
Number of Bits per Element: 4
auf Bestellung 4795 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1242+ | 0.39 EUR |
| BGA3012,115 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP CATV 5MHZ-1GHZ SOT89-3
Description: IC RF AMP CATV 5MHZ-1GHZ SOT89-3
Produkt ist nicht verfügbar
| PCA9542APW/DG118 |
|
Hersteller: NXP USA Inc.
Description: IC I2C MUX 2-CH 14-TSSOP
Packaging: Bulk
Part Status: Active
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 14-TSSOP
Description: IC I2C MUX 2-CH 14-TSSOP
Packaging: Bulk
Part Status: Active
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I2C Multiplexer
Supplier Device Package: 14-TSSOP
auf Bestellung 1293 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 351+ | 1.38 EUR |
| PCA9542APW,112 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I²C, SMBus
Voltage - Supply: 2.3V ~ 5.5V
Applications: 2-Channel I²C Multiplexer
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
auf Bestellung 7236 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 351+ | 1.38 EUR |
| BGU7041,115 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 3654 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 0.74 EUR |
| 27+ | 0.66 EUR |
| 30+ | 0.6 EUR |
| 100+ | 0.52 EUR |
| 250+ | 0.46 EUR |
| 500+ | 0.41 EUR |
| 1000+ | 0.32 EUR |
| SAF7754HV/N205ZY |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| SAF7754HV/N205ZK |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| SAF7754HV/N205K |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| SAF7754HV/N205Y |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| MC9S08GW32CLK |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Bulk
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
auf Bestellung 5261 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 60+ | 8.34 EUR |
| P5020NSE7QMB |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 2.0GHZ 1295FCBGA
Description: IC MPU Q OR IQ 2.0GHZ 1295FCBGA
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 802.49 EUR |
| 1PS88SB48/DG/B2115 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Description: RECTIFIER DIODE
auf Bestellung 200942 Stücke:
Lieferzeit 10-14 Tag (e)| 1PS88SB48,115 |
|
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA 6TSSOP
Description: DIODE SCHOTTKY 40V 120MA 6TSSOP
Produkt ist nicht verfügbar
| 74AUP2G80GD,125 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (2x3)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (2x3)
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Number of Bits per Element: 1
auf Bestellung 176611 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.24 EUR |
| 74AUP2G80DC125 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-VSSOP
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-VSSOP
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 93000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1998+ | 0.24 EUR |
| 74LVC16244AEV/G518 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES, 4
Description: BUS DRIVER, LVC/LCX/Z SERIES, 4
auf Bestellung 23366 Stücke:
Lieferzeit 10-14 Tag (e)| 74LVC16244ADGG-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-TSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-TSSOP
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 28360 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 830+ | 0.58 EUR |
| 74LVC16244ADGG |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Produkt ist nicht verfügbar
| 74LVC16244ADL,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST 16BIT 48SSOP
Description: IC BUFF DVR TRI-ST 16BIT 48SSOP
Produkt ist nicht verfügbar
| 74LVCH16374ADGG-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Description: BUS DRIVER, LVC/LCX/Z SERIES
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| 74ALVCH16601DGG118 |
|
Hersteller: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
auf Bestellung 1994 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 367+ | 1.32 EUR |
| 74ALVCH16601DGG512 |
|
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 402+ | 1.32 EUR |
| MK22FX512AVLH12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
| MK22FX512AVLH12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
| 74LVT573D,118 |
|
Hersteller: NXP USA Inc.
Description: 74LVT573 - 3.3 V OCTAL D-TYPE TR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.7ns
Supplier Device Package: 20-SO
Part Status: Active
Description: 74LVT573 - 3.3 V OCTAL D-TYPE TR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.7ns
Supplier Device Package: 20-SO
Part Status: Active
auf Bestellung 1950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1186+ | 0.44 EUR |
| 74LV139D,112 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 2:4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC DECODER/DEMUX 1 X 2:4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 7819 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.24 EUR |
| TEA19363DB1484UL |
|
Hersteller: NXP USA Inc.
Description: 60W USB PD2.0 DEMO BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Description: 60W USB PD2.0 DEMO BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA19363
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| SPC5746CK1AMKU2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MMG3003NT1-NXP |
|
Hersteller: NXP USA Inc.
Description: WIDE BAND MEDIUM POWER AMPLIFIER
Description: WIDE BAND MEDIUM POWER AMPLIFIER
auf Bestellung 470 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 134+ | 3.69 EUR |
| MMZ25332BT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 3V ~ 5V
Gain: 26.5dB
Current - Supply: 390mA
Noise Figure: 5.8dB
P1dB: 33dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
Description: IC AMP LTE 1.8GHZ-2.8GHZ 12QFN
Packaging: Cut Tape (CT)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.8GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 3V ~ 5V
Gain: 26.5dB
Current - Supply: 390mA
Noise Figure: 5.8dB
P1dB: 33dBm
Test Frequency: 2.5GHz
Supplier Device Package: 12-QFN (3x3)
auf Bestellung 1955 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.45 EUR |
| 10+ | 12.33 EUR |
| 25+ | 11.21 EUR |
| 100+ | 10.08 EUR |
| 250+ | 9.24 EUR |
| 500+ | 8.4 EUR |
| AFSC5G37D37T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
Produkt ist nicht verfügbar
| AFSC5G37D37T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
Description: AIRFAST PWR AMP 5G 29DB HLQFN26
auf Bestellung 1717 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 64.57 EUR |
| 10+ | 60.24 EUR |
| 25+ | 59.89 EUR |
| BLA6H0912-500112 |
|
Hersteller: NXP USA Inc.
Description: BLA6H0912-500 - LDMOS AVIONICS R
Packaging: Tray
Package / Case: SOT634A
Current Rating (Amps): 54A
Frequency: 960MHz ~ 1.22GHz
Power - Output: 450W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM2
Part Status: Not For New Designs
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: BLA6H0912-500 - LDMOS AVIONICS R
Packaging: Tray
Package / Case: SOT634A
Current Rating (Amps): 54A
Frequency: 960MHz ~ 1.22GHz
Power - Output: 450W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM2
Part Status: Not For New Designs
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1084.55 EUR |
| S912XDP512J1VAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PMPB23XNE,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 7A DFN2020MD-6
Description: MOSFET N-CH 20V 7A DFN2020MD-6
auf Bestellung 357656 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3501+ | 0.15 EUR |
| BAP51-05W,115 |
|
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SOT323-3
Description: RF DIODE PIN 50V 240MW SOT323-3
auf Bestellung 20095 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2935+ | 0.17 EUR |
| MRF6V3090NBR5578 |
Hersteller: NXP USA Inc.
Description: RF POWER UHF BAND N-CHANNEL FET
Description: RF POWER UHF BAND N-CHANNEL FET
Produkt ist nicht verfügbar
| SPC5602BF2VLH4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SL2S5402FTBX |
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693, ISO 18000-3
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693, ISO 18000-3
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Produkt ist nicht verfügbar
| S912ZVL12F0CLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Produkt ist nicht verfügbar
| MCIMX6D5EYM12AC |
|
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Description: I.MX 6 SERIES 32-BIT MPU ARM CO
Produkt ist nicht verfügbar
| LS1084ASE7MQA |
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Description: IC MPU QORLQ LS1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
| MK22FN1M0AVLK12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC33HB2001EKR2518 |
|
Hersteller: NXP USA Inc.
Description: BRUSH DC MOTOR CONTROLLER 16A
Description: BRUSH DC MOTOR CONTROLLER 16A
Produkt ist nicht verfügbar
| MC33HB2002ES |
|
Hersteller: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
| MC33HB2002ESR2 |
Hersteller: NXP USA Inc.
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Description: H-BRIDGE, SPI, BRUSHED DC MOTOR
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: DC Motors
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
| S9S12GN48AMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| NX3L1G3157GMZ |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| S32G274AABK0CUCT |
|
Hersteller: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: MII, RGMII, RMII, SGMII
USB: USB OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Security Features: HSE-H
Produkt ist nicht verfügbar
| IP4284CZ10-TBR,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 8VC DFN2510A-10
Description: TVS DIODE 8VC DFN2510A-10
Produkt ist nicht verfügbar
| SPC5746CK1MMJ6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 2PA1774QMB315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: NOW NEXPERIA 2PA1774QMB - SMALL
Packaging: Bulk
Package / Case: 3-XFDFN
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: DFN1006B-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 57940 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6935+ | 0.064 EUR |
| PDTC144VMB315 |
|
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11225+ | 0.048 EUR |
| LPC11E13FBD48301 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Produkt ist nicht verfügbar
| SPC5747CHK0AVKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SP5747CHK0AVKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar