Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35330) > Seite 450 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
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IP4310CX8/P | NXP USA Inc. | Description: DATA LINE FILTER |
auf Bestellung 3938 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4310CX8/P135 | NXP USA Inc. | Description: DATA LINE FILTER |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34704BEP557 | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34704BEPR2528 | NXP USA Inc. |
![]() Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
FRDMP-KEAZ64Q64 | NXP USA Inc. | Description: FREEDOM KEA EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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SPC5748CSK0AVKU2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S08DZ128F2CLF | NXP USA Inc. | Description: IC MCU 8BIT 128KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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LS2088ASN7TTB | NXP USA Inc. | Description: LS2088A ST 1800 R1.1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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74HCT240DB,112-NXP | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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MPC8313CZQAFFC | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
TEF6644HW/V101/S30 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TEF6644HW/V101/S30 | NXP USA Inc. |
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auf Bestellung 23200 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV42F256VLL16Q | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
LPC54016JET180 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 1047 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54S016JET180 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 117 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF8534BHH/N3K | NXP USA Inc. | Description: IC OP AMP CLASS D 100LQFP |
Produkt ist nicht verfügbar |
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BAL99/DG/B2215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4 ns Technology: Standard Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Current - Average Rectified (Io): 250mA Supplier Device Package: SOT-23-3 Operating Temperature - Junction: 150°C (Max) Grade: Automotive Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 1 µA @ 70 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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74AUP2G34GX147 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-X2SON (1.0x0.8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TJA1152BT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 150°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 2Mbps Protocol: CANbus Supplier Device Package: 8-SO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TJA1152BT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: 150°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 2Mbps Protocol: CANbus Supplier Device Package: 8-SO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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BLF7G27L-150P,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: SOT-539A Current Rating (Amps): 37A Mounting Type: Chassis Mount Frequency: 2.5GHz ~ 2.7GHz Configuration: Dual, Common Source Power - Output: 30W Gain: 16.5dB Technology: LDMOS Supplier Device Package: SOT539A Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.2 A |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF7G27L-100,112 | NXP USA Inc. |
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auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF878,112 | NXP USA Inc. |
Description: TRANSISTOR RF LDMOS SOT979A Packaging: Bulk |
auf Bestellung 1155 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G13L-250P,112 | NXP USA Inc. |
Description: FET RF 100V 1.3GHZ SOT1121A Packaging: Tube |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81766VLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: I2C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 2.7V, 3.6V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F81746VLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: I²C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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74HC3G14GD,125-NXP | NXP USA Inc. | Description: IC INVERT SCHMITT 3CH 3-IN 8XSON |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TFF11145HN/N1115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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BTA206X-800ET127 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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NX3V1G384GW,125 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 450mOhm -3db Bandwidth: 25MHz Supplier Device Package: 5-TSSOP Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 12pC Switch Circuit: SPST - NC Multiplexer/Demultiplexer Circuit: 1:1 Switch Time (Ton, Toff) (Max): 26ns, 10ns Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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S9S12ZVL32F0MLC | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S08RNA60W1MLF | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FS32K146HFT0VLQT | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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P5010NSE7QMB557-NXP | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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P5010NSN7TNB557-NXP | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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T1022NSN7MQB557 | NXP USA Inc. |
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auf Bestellung 995 Stücke: Lieferzeit 10-14 Tag (e) |
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P5010NSN7MMB557-NXP | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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T4240NSE7TTB557 | NXP USA Inc. |
Description: QORIQ, 64B POWER ARCH, 24X 1.8GH Packaging: Bulk Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (16), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 24 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
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P5010NSN7QMB557 | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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P5020NSN1VNB557 | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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P5010NSE7TNB557 | NXP USA Inc. |
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auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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RAPIDRF-35TL039 | NXP USA Inc. |
Description: 28V LDMOS RF FRONT END 5G 56W Packaging: Bulk Frequency: 3.4GHz ~ 3.6GHz Type: Front End Supplied Contents: Board(s) Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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74LVC1GU04GW-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 1 Supplier Device Package: 5-TSSOP Input Logic Level - High: 1.32V ~ 4.4V Input Logic Level - Low: 0.33V ~ 1.1V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34PF1550A1EPR2 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF1550A4EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34PF1550A1EP | NXP USA Inc. | Description: POWER MANAGEMENT IC: 3 BUCK REGS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC32PF1550A7EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC34PF1550A2EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34PF1550A5EP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC32PF1550A5EP | NXP USA Inc. |
Description: PF1550 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC32PF1550A0EPR2 | NXP USA Inc. | Description: POWER MANAGEMENT IC: 3 BUCK REGS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PBSS5220PAPS115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: 6-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: 2 PNP Operating Temperature: 150°C (TJ) Power - Max: 370mW Current - Collector (Ic) (Max): 2A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V Frequency - Transition: 95MHz Supplier Device Package: DFN2020D-6 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 7440 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH16CTGR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MPC8248CZQMIBA-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8245TVV300D-NXP | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC™ MPC603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN3DVPIZAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 169 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8537BH/Q900/1,5 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PESD3V3V4UF,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 15pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V (Max) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Unidirectional Channels: 4 Voltage - Breakdown (Min): 5.3V Voltage - Clamping (Max) @ Ipp: 11V Power - Peak Pulse: 16W Power Line Protection: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
IP4310CX8/P |
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 3938 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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1603+ | 0.31 EUR |
IP4310CX8/P135 |
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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2061+ | 0.25 EUR |
MC34704BEP557 |
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Hersteller: NXP USA Inc.
Description: MULTIPLE CHANNEL DC-DC POWER MAN
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MULTIPLE CHANNEL DC-DC POWER MAN
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC34704BEPR2528 |
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Hersteller: NXP USA Inc.
Description: MULTIPLE CHANNEL DC-DC POWER MAN
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MULTIPLE CHANNEL DC-DC POWER MAN
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
FRDMP-KEAZ64Q64 |
Hersteller: NXP USA Inc.
Description: FREEDOM KEA EVAL BRD
Description: FREEDOM KEA EVAL BRD
Produkt ist nicht verfügbar
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SPC5748CSK0AVKU2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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S9S08DZ128F2CLF |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 48LQFP
Description: IC MCU 8BIT 128KB FLASH 48LQFP
Produkt ist nicht verfügbar
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LS2088ASN7TTB |
Hersteller: NXP USA Inc.
Description: LS2088A ST 1800 R1.1
Description: LS2088A ST 1800 R1.1
Produkt ist nicht verfügbar
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74HCT240DB,112-NXP |
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
Part Status: Active
Description: IC BUFFER INVERT 5.5V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
Part Status: Active
Produkt ist nicht verfügbar
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MPC8313CZQAFFC |
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Hersteller: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Description: IC MPU POWERQUICC II PRO 516PBGA
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TEF6644HW/V101/S30 |
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Hersteller: NXP USA Inc.
Description: IC DGTL TIMER 1CHIP 64HTQFP
Description: IC DGTL TIMER 1CHIP 64HTQFP
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TEF6644HW/V101/S30 |
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Hersteller: NXP USA Inc.
Description: IC DGTL TIMER 1CHIP 64HTQFP
Description: IC DGTL TIMER 1CHIP 64HTQFP
auf Bestellung 23200 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
32+ | 15.4 EUR |
MKV42F256VLL16Q |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC54016JET180 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 1047 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
64+ | 13.8 EUR |
LPC54S016JET180 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
31+ | 29.15 EUR |
TDF8534BHH/N3K |
Hersteller: NXP USA Inc.
Description: IC OP AMP CLASS D 100LQFP
Description: IC OP AMP CLASS D 100LQFP
Produkt ist nicht verfügbar
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BAL99/DG/B2215 |
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Hersteller: NXP USA Inc.
Description: DIODE STANDARD 80V 250MA SOT233
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 1 µA @ 70 V
Qualification: AEC-Q101
Description: DIODE STANDARD 80V 250MA SOT233
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 1 µA @ 70 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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74AUP2G34GX147 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Produkt ist nicht verfügbar
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TJA1152BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 2Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 2Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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TJA1152BT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 2Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 2Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Part Status: Active
Produkt ist nicht verfügbar
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BLF7G27L-150P,112 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V SOT539A
Packaging: Tube
Package / Case: SOT-539A
Current Rating (Amps): 37A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual, Common Source
Power - Output: 30W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: SOT539A
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V SOT539A
Packaging: Tube
Package / Case: SOT-539A
Current Rating (Amps): 37A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual, Common Source
Power - Output: 30W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: SOT539A
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 190.68 EUR |
BLF7G27L-100,112 |
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Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
Description: RF TRANSISTOR
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 131.47 EUR |
BLF878,112 |
auf Bestellung 1155 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 357.77 EUR |
BLF6G13L-250P,112 |
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 361.4 EUR |
MC56F81766VLF |
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Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 2.7V, 3.6V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.62 EUR |
10+ | 8.84 EUR |
25+ | 8.02 EUR |
MC56F81746VLF |
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Hersteller: NXP USA Inc.
Description: IC DSC 64KB/12KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: IC DSC 64KB/12KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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74HC3G14GD,125-NXP |
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3-IN 8XSON
Description: IC INVERT SCHMITT 3CH 3-IN 8XSON
Produkt ist nicht verfügbar
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TFF11145HN/N1115 |
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Hersteller: NXP USA Inc.
Description: LOW PHASE NOISE LO GENERATOR FOR
Description: LOW PHASE NOISE LO GENERATOR FOR
Produkt ist nicht verfügbar
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BTA206X-800ET127 |
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Hersteller: NXP USA Inc.
Description: NOW WEEN - BTA206X-800ET - 3 QUA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW WEEN - BTA206X-800ET - 3 QUA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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NX3V1G384GW,125 |
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Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SW SPST-NCX1 450MOHM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12ZVL32F0MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S08RNA60W1MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Produkt ist nicht verfügbar
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FS32K146HFT0VLQT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
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P5010NSE7QMB557-NXP |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 738.14 EUR |
P5010NSN7TNB557-NXP |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 744.39 EUR |
T1022NSN7MQB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Description: QORIQ RISC MICROPROCESSOR 32-BI
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 176.8 EUR |
P5010NSN7MMB557-NXP |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 597.57 EUR |
T4240NSE7TTB557 |
Hersteller: NXP USA Inc.
Description: QORIQ, 64B POWER ARCH, 24X 1.8GH
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Description: QORIQ, 64B POWER ARCH, 24X 1.8GH
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 2689.61 EUR |
P5010NSN7QMB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 703.01 EUR |
P5020NSN1VNB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ RISC MPU 64 BIT 2000MHZ
Description: QORIQ RISC MPU 64 BIT 2000MHZ
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 792.37 EUR |
P5010NSE7TNB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
Description: QORIQ, 64 BIT POWER ARCH SOC, 1.
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 781.6 EUR |
RAPIDRF-35TL039 |
Hersteller: NXP USA Inc.
Description: 28V LDMOS RF FRONT END 5G 56W
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
Description: 28V LDMOS RF FRONT END 5G 56W
Packaging: Bulk
Frequency: 3.4GHz ~ 3.6GHz
Type: Front End
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
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74LVC1GU04GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: INVERTER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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MC34PF1550A1EPR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
93+ | 5.44 EUR |
MC32PF1550A4EP |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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MC34PF1550A1EP |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Description: POWER MANAGEMENT IC: 3 BUCK REGS
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MC32PF1550A7EP |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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MC34PF1550A2EPR2 |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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MC34PF1550A5EP |
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Hersteller: NXP USA Inc.
Description: PF1550
Description: PF1550
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MC32PF1550A5EP |
Hersteller: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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MC32PF1550A0EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Description: POWER MANAGEMENT IC: 3 BUCK REGS
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PBSS5220PAPS115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1734+ | 0.27 EUR |
MC9S08SH16CTGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MPC8248CZQMIBA-NXP |
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Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 80.46 EUR |
MPC8245TVV300D-NXP |
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Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 207.05 EUR |
MIMX8MN3DVPIZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 169 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.93 EUR |
10+ | 22.24 EUR |
25+ | 20.82 EUR |
168+ | 18.81 EUR |
PCA8537BH/Q900/1,5 |
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Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Description: IC DRVR 7 SEGMENT 64TQFP
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PCA8537AH/Q900/1,5 |
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Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
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PCA8537AH/Q900/1,5 |
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Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
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PESD3V3V4UF,115 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 6XSON SOT886
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Description: TVS DIODE 3.3VWM 6XSON SOT886
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
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