Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34455) > Seite 450 nach 575
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| SAF4000EL/101S53CY | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S230K | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S130K | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S530Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S23BY | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S201K | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S53CK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S47AK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S23AY | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S23BK | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S470Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S574K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray |
Produkt ist nicht verfügbar |
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| BZV55-B47115 | NXP USA Inc. |
 Description: NOW NEXPERIA BZV55-B43 - ZENER DPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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S9S12P32J0VFTR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFN Packaging: Cut Tape (CT) Package / Case: 48-TFQFN Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 10x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9832-55A,115 | NXP USA Inc. |
Description: MOSFET N-CH 55V 12A SOT223 Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 12A (Tc) Rds On (Max) @ Id, Vgs: 29mOhm @ 8A, 10V Power Dissipation (Max): 8W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SC-73 Grade: Automotive Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 1594 pF @ 25 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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| MMA2605KGCWR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL 50G X- AXIS 16QF Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±50g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-QFN (6x6) Part Status: Active |
Produkt ist nicht verfügbar |
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NHS3100TEMOADKUL | NXP USA Inc. |
Description: NHS3100 STARTEK KIT Packaging: Bulk For Use With/Related Products: NHS3100 Frequency: 13.56MHz Type: RFID Reader Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C8V2/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 8.2V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 8.2 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 700 nA @ 5 V |
Produkt ist nicht verfügbar |
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BZX84-C8V2/LF1R | NXP USA Inc. |
Description: DIODE ZENER 8.2V 250MW TO236AB |
Produkt ist nicht verfügbar |
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BGU8019115 | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 18.5dB Current - Supply: 4.6mA Noise Figure: 0.55dB P1dB: -7dBm Test Frequency: 1.575GHz Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGU7003W | NXP USA Inc. | Description: WIDE BAND LOW POWER AMPLIFIER, 4 |
auf Bestellung 4980 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGU7004 | NXP USA Inc. |
Description: BGU7004 - NARROW BAND LOW POWER |
Produkt ist nicht verfügbar |
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BGU7003W,115 | NXP USA Inc. |
Description: IC RF AMP GPS 40MHZ-6GHZ 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 40MHz ~ 6GHz RF Type: General Purpose Voltage - Supply: 2.2V ~ 2.85V Current - Supply: 3mA ~ 15mA Noise Figure: 1.2dB P1dB: -23dBm Test Frequency: 100MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Part Status: Obsolete |
auf Bestellung 9704 Stücke: Lieferzeit 10-14 Tag (e) |
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PHB20N06T | NXP USA Inc. |
Description: NOW NEXPERIA PHB20N06T - POWER F |
Produkt ist nicht verfügbar |
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| MC56F82746VLF557 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8027VLH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP |
auf Bestellung 360 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8569CVJANKGB | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGA Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100Mbps (8), 1Gbps (4) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3, SDRAM Graphics Acceleration: No Part Status: Obsolete |
auf Bestellung 414 Stücke: Lieferzeit 10-14 Tag (e) |
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K32L2B21VFT0A | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48QFN Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 48-QFN (7x7) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MC33FS8510C4ES | NXP USA Inc. | Description: FS8510 |
Produkt ist nicht verfügbar |
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A3G26D055N-2400 | NXP USA Inc. |
Description: RF MOSFET GAN 48V 6DFN Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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A3G26D055NT4 | NXP USA Inc. |
Description: RF GAN MOSFET AIRFAST 8W 48V |
Produkt ist nicht verfügbar |
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A3G26D055NT4 | NXP USA Inc. |
Description: RF GAN MOSFET AIRFAST 8W 48V |
auf Bestellung 2347 Stücke: Lieferzeit 10-14 Tag (e) |
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A3G26D055N-2515 | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 55W 2515MHZ |
Produkt ist nicht verfügbar |
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A3G26D055N-1805 | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 25W 1805-18 Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.69GHz Power - Output: 8W Gain: 13.9dB Technology: GaN Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 40 mA |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| BYV10X-600P127 | NXP USA Inc. |
Description: DIODE GEN PURP 600V 10A TO220F Packaging: Bulk Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: TO-220F Operating Temperature - Junction: 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A Current - Reverse Leakage @ Vr: 10 µA @ 600 V |
Produkt ist nicht verfügbar |
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74AHCT139D,112 | NXP USA Inc. |
Description: DECODER/DRIVER, AHCT/VHCT SERIES Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 8mA, 8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
auf Bestellung 11950 Stücke: Lieferzeit 10-14 Tag (e) |
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AFIC10275NR5 | NXP USA Inc. |
Description: IC RF AMP 978MHZ-1.09GHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 978MHz ~ 1.09GHz Voltage - Supply: 50V Gain: 32dB Supplier Device Package: TO-270 WB-14 |
Produkt ist nicht verfügbar |
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MC9328MXLCVM15,557 | NXP USA Inc. |
Description: DRAGONBALL CORSICA |
Produkt ist nicht verfügbar |
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MC9328MXLVP15 | NXP USA Inc. |
Description: RISC MICROPROCESSOR, DRAGONBALL, |
Produkt ist nicht verfügbar |
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CLF1G0060S-10 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, C BAND, GALL |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MC34VR500VAES | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
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MC34VR500VAESR2 | NXP USA Inc. |
Description: REGULATOR BUCK QUAD WITH UP TO 4 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: QorlQ LS1/T1 Communications Processors Current - Supply: 15mA Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
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74LV365DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 6 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-SSOP |
auf Bestellung 1092 Stücke: Lieferzeit 10-14 Tag (e) |
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| JN5178/001K | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40VFQFN |
Produkt ist nicht verfügbar |
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TL431MFDT | NXP USA Inc. |
Description: TL431 - ADJUSTABLE PRECISION SHU Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MPF5020AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 293 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5023AMMA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18275AHN/C1518 | NXP USA Inc. |
Description: TDA18275AHN - HYBRID SILICON TUN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 32-HVQFN (5x5) Control Interface: I²C |
auf Bestellung 833034 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18273HN/C1/S3518 | NXP USA Inc. |
Description: TDA18273 - IC SILICON TUNER HYBR Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Professional Video Supplier Device Package: 40-HVQFN (6x6) Control Interface: I²C |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18212HN/M/C1/S3518 | NXP USA Inc. | Description: SILICON TUNER FOR TERRESTRIAL AN |
auf Bestellung 5026 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA18211HD/C2/S2551 | NXP USA Inc. |
Description: SILICON TUNER FOR TERRESTRIAL AN |
auf Bestellung 46110 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS606-EVB | NXP USA Inc. |
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR Packaging: Bulk Function: I2C to SPI Type: Interface Utilized IC / Part: SC18IS606 Supplied Contents: Board(s) Primary Attributes: 1.71V ~ 3.6V Operating Range Embedded: No Part Status: Active |
Produkt ist nicht verfügbar |
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SC18IS604-EVB | NXP USA Inc. |
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR Packaging: Bulk Function: I2C to SPI Type: Interface Utilized IC / Part: SC18IS604 Supplied Contents: Board(s) Primary Attributes: 1.71V ~ 3.6V Operating Range Embedded: No Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI2QFN/WM,115 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/16PF SMD |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4317JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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LPC2210FBD144/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 76 |
Produkt ist nicht verfügbar |
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| MC56F82748VLH557 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH |
Produkt ist nicht verfügbar |
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OM67200JP | NXP USA Inc. |
Description: A1006 DEVELOPER KIT Packaging: Bulk Function: Anti Tamper and Security Type: Interface Utilized IC / Part: A1006 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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PHN203,518-NX | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
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LD6805K/22P,115 | NXP USA Inc. |
Description: IC REG LIN 2.2V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.2V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/101S53CY |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| SAF4000EL/101S230K |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
| SAF4000EL/101S130K |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
| SAF4000EL/101S530Y |
Produkt ist nicht verfügbar
| SAF4000EL/101S23BY |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| SAF4000EL/101S201K |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
| SAF4000EL/101S53CK |
Produkt ist nicht verfügbar
| SAF4000EL/101S47AK |
Produkt ist nicht verfügbar
| SAF4000EL/101S23AY |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| SAF4000EL/101S23BK |
Produkt ist nicht verfügbar
| SAF4000EL/101S470Y |
Produkt ist nicht verfügbar
| SAF4000EL/101S574K |
Produkt ist nicht verfügbar
| BZV55-B47115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV55-B43 - ZENER D
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BZV55-B43 - ZENER D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| S9S12P32J0VFTR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.41 EUR |
| 10+ | 9.74 EUR |
| 100+ | 8.06 EUR |
| 1000+ | 7.03 EUR |
| BUK9832-55A,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 12A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 8A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1594 pF @ 25 V
Qualification: AEC-Q101
Description: MOSFET N-CH 55V 12A SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 8A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 1594 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
| MMA2605KGCWR2 |
|
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL 50G X- AXIS 16QF
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±50g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Part Status: Active
Description: IC SENSOR ACCEL 50G X- AXIS 16QF
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±50g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
| NHS3100TEMOADKUL |
|
Hersteller: NXP USA Inc.
Description: NHS3100 STARTEK KIT
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Part Status: Active
Description: NHS3100 STARTEK KIT
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 250.01 EUR |
| BZX84-C8V2/LF1VL |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Description: DIODE ZENER 8.2V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
Produkt ist nicht verfügbar
| BZX84-C8V2/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 250MW TO236AB
Description: DIODE ZENER 8.2V 250MW TO236AB
Produkt ist nicht verfügbar
| BGU8019115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2144+ | 0.25 EUR |
| BGU7003W |
Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER, 4
Description: WIDE BAND LOW POWER AMPLIFIER, 4
auf Bestellung 4980 Stücke:
Lieferzeit 10-14 Tag (e)| BGU7004 |
|
Hersteller: NXP USA Inc.
Description: BGU7004 - NARROW BAND LOW POWER
Description: BGU7004 - NARROW BAND LOW POWER
Produkt ist nicht verfügbar
| BGU7003W,115 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-6GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 40MHz ~ 6GHz
RF Type: General Purpose
Voltage - Supply: 2.2V ~ 2.85V
Current - Supply: 3mA ~ 15mA
Noise Figure: 1.2dB
P1dB: -23dBm
Test Frequency: 100MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Obsolete
Description: IC RF AMP GPS 40MHZ-6GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 40MHz ~ 6GHz
RF Type: General Purpose
Voltage - Supply: 2.2V ~ 2.85V
Current - Supply: 3mA ~ 15mA
Noise Figure: 1.2dB
P1dB: -23dBm
Test Frequency: 100MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Obsolete
auf Bestellung 9704 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1335+ | 0.36 EUR |
| PHB20N06T |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PHB20N06T - POWER F
Description: NOW NEXPERIA PHB20N06T - POWER F
Produkt ist nicht verfügbar
| MC56F82746VLF557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER 32-BIT FLASH
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC56F8027VLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Description: IC MCU 16BIT 32KB FLASH 64LQFP
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)| MPC8569CVJANKGB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100Mbps (8), 1Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 414 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 340 EUR |
| K32L2B21VFT0A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| A3G26D055N-2400 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET GAN 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 511.93 EUR |
| A3G26D055NT4 |
|
Hersteller: NXP USA Inc.
Description: RF GAN MOSFET AIRFAST 8W 48V
Description: RF GAN MOSFET AIRFAST 8W 48V
Produkt ist nicht verfügbar
| A3G26D055NT4 |
|
Hersteller: NXP USA Inc.
Description: RF GAN MOSFET AIRFAST 8W 48V
Description: RF GAN MOSFET AIRFAST 8W 48V
auf Bestellung 2347 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 48.56 EUR |
| 10+ | 44.79 EUR |
| 25+ | 42.78 EUR |
| 100+ | 41.77 EUR |
| A3G26D055N-2515 |
|
Hersteller: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 55W 2515MHZ
Description: RF REFERENCE CIRCUIT 55W 2515MHZ
Produkt ist nicht verfügbar
| A3G26D055N-1805 |
|
Hersteller: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 25W 1805-18
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF REFERENCE CIRCUIT 25W 1805-18
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.69GHz
Power - Output: 8W
Gain: 13.9dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 40 mA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1188 EUR |
| BYV10X-600P127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Description: DIODE GEN PURP 600V 10A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 600 V
Produkt ist nicht verfügbar
| 74AHCT139D,112 |
|
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: DECODER/DRIVER, AHCT/VHCT SERIES
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 8mA, 8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 11950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2664+ | 0.18 EUR |
| AFIC10275NR5 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
Description: IC RF AMP 978MHZ-1.09GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 978MHz ~ 1.09GHz
Voltage - Supply: 50V
Gain: 32dB
Supplier Device Package: TO-270 WB-14
Produkt ist nicht verfügbar
| MC9328MXLCVM15,557 |
|
Hersteller: NXP USA Inc.
Description: DRAGONBALL CORSICA
Description: DRAGONBALL CORSICA
Produkt ist nicht verfügbar
| MC9328MXLVP15 |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, DRAGONBALL,
Description: RISC MICROPROCESSOR, DRAGONBALL,
Produkt ist nicht verfügbar
| CLF1G0060S-10 |
|
Hersteller: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, C BAND, GALL
Description: RF PFET, 1-ELEMENT, C BAND, GALL
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 137.9 EUR |
| MC34VR500VAES |
|
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
| MC34VR500VAESR2 |
|
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR BUCK QUAD WITH UP TO 4
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 15mA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
| 74LV365DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
Description: IC BUF NON-INVERT 3.6V 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 6
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SSOP
auf Bestellung 1092 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 784+ | 0.61 EUR |
| JN5178/001K |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Produkt ist nicht verfügbar
| TL431MFDT |
|
Hersteller: NXP USA Inc.
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Description: TL431 - ADJUSTABLE PRECISION SHU
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MPF5020AMMA0ES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 293 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.68 EUR |
| 10+ | 9.58 EUR |
| 25+ | 9.06 EUR |
| 80+ | 7.85 EUR |
| 230+ | 7.45 EUR |
| MPF5023AMMA0ES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.7 EUR |
| 10+ | 8.76 EUR |
| 25+ | 8.35 EUR |
| 80+ | 7.25 EUR |
| 230+ | 6.92 EUR |
| 490+ | 6.31 EUR |
| TDA18275AHN/C1518 |
|
Hersteller: NXP USA Inc.
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
Description: TDA18275AHN - HYBRID SILICON TUN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I²C
auf Bestellung 833034 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 446+ | 1.08 EUR |
| TDA18273HN/C1/S3518 |
|
Hersteller: NXP USA Inc.
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
Description: TDA18273 - IC SILICON TUNER HYBR
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Professional Video
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I²C
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 96+ | 5.21 EUR |
| TDA18212HN/M/C1/S3518 |
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 5026 Stücke:
Lieferzeit 10-14 Tag (e)| TDA18211HD/C2/S2551 |
|
Hersteller: NXP USA Inc.
Description: SILICON TUNER FOR TERRESTRIAL AN
Description: SILICON TUNER FOR TERRESTRIAL AN
auf Bestellung 46110 Stücke:
Lieferzeit 10-14 Tag (e)| SC18IS606-EVB |
|
Hersteller: NXP USA Inc.
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Description: SC18IS606 I2C/SPI BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS606
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Produkt ist nicht verfügbar
| SC18IS604-EVB |
|
Hersteller: NXP USA Inc.
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
Description: SC18IS604 SPI/I2C BRIDGE EVAL BR
Packaging: Bulk
Function: I2C to SPI
Type: Interface
Utilized IC / Part: SC18IS604
Supplied Contents: Board(s)
Primary Attributes: 1.71V ~ 3.6V Operating Range
Embedded: No
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 109.31 EUR |
| PEMI2QFN/WM,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Description: FILTER RC(PI) 200 OHM/16PF SMD
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4121+ | 0.13 EUR |
| LPC4317JBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
| LPC2210FBD144/01551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 76
Produkt ist nicht verfügbar
| MC56F82748VLH557 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH
Description: MICROCONTROLLER 32-BIT FLASH
Produkt ist nicht verfügbar
| OM67200JP |
|
Hersteller: NXP USA Inc.
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Description: A1006 DEVELOPER KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| PHN203,518-NX |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
| LD6805K/22P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.16 EUR |