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MPC8349VVAGDB MPC8349VVAGDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 400MHZ 672TBGA
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MK22DN512VLH5 MK22DN512VLH5 NXP USA Inc. K22P64M50SF4.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
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FRDMGD3160DCMHB FRDMGD3160DCMHB NXP USA Inc. UM11637.pdf Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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FRDMGD3160HB8EVM FRDMGD3160HB8EVM NXP USA Inc. UM11777.pdf Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
Contents: Board(s), Cable(s)
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FRDMGD3160HBIEVM NXP USA Inc. Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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FRDMGD3160XM3EVM FRDMGD3160XM3EVM NXP USA Inc. getting-started-with-the-frdmgd3160xm3evm-evaluation-board:GS-FRDMGD3160XM3EVM Description: EVAL BOARD FOR KL25Z, MC33GD3160
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
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MGD3160AM315EK NXP USA Inc. PB_GD3160.pdf Description: SNGL CH GATE DRIVER 32SOIC
Voltage - Output Supply: 4.5V ~ 40V
Number of Channels: 1
Part Status: Active
Supplier Device Package: 32-SOIC
Current - Output High, Low: 15A, 15A
Current - Peak Output: 15A
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MGD3160AM335EK NXP USA Inc. PB_GD3160.pdf Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.5V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
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MGD3160AM535EK NXP USA Inc. PB_GD3160.pdf Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.75V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MGD3160AM515EK NXP USA Inc. Description: EV INVERTER CONTROL; IGBT & SIC
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MC33665ATS4AE MC33665ATS4AE NXP USA Inc. MC33665A_SDS.pdf Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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10+13.98 EUR
25+12.98 EUR
100+11.89 EUR
250+11.36 EUR
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MMG3001NT1 MMG3001NT1 NXP USA Inc. MMG3001NT1.pdf Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
P1dB: 18.5dBm
Noise Figure: 4.1dB
Current - Supply: 58mA
Gain: 20dB
Voltage - Supply: 5.6V
RF Type: General Purpose
Frequency: 40MHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
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2PD602AS 2PD602AS NXP USA Inc. 2PD602A.pdf Description: 2PD602A - NPN GENERAL PURPOSE TR
Part Status: Active
Packaging: Bulk
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BUK7613-60E118 BUK7613-60E118 NXP USA Inc. BUK7613-60E.pdf Description: NOW NEXPERIA BUK7613-60E - POWER
Produkt ist nicht verfügbar
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MC33FS6600M0ESR2 MC33FS6600M0ESR2 NXP USA Inc. FS6600.pdf Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC35FS6501NAE MC35FS6501NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6501NAER2 MC35FS6501NAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MC33592FTAR2 MC33592FTAR2 NXP USA Inc. MC33592.pdf Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
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MC33592FTAR2 MC33592FTAR2 NXP USA Inc. MC33592.pdf Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
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DSP56F801FA60E DSP56F801FA60E NXP USA Inc. DSP56F801.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
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S908AB32AH3CFUER S908AB32AH3CFUER NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64QFP
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
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SPC5746GK1MKU6R SPC5746GK1MKU6R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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S912XEP100W1MAGR S912XEP100W1MAGR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
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FS32K146HAT0MLHR FS32K146HAT0MLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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MC32PF3000A4EPR2 MC32PF3000A4EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
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MRF6S18060NR1 MRF6S18060NR1 NXP USA Inc. MRF6S18060NR1%2CNBR1.pdf Description: RF MOSFET LDMOS 26V TO270-4
Current - Test: 600 mA
Voltage - Test: 26 V
Voltage - Rated: 68 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15dB
Power - Output: 60W
Frequency: 1.99GHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Bulk
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MIMX8UX6CVLDZAC MIMX8UX6CVLDZAC NXP USA Inc. Description: I.MX8 QXP 21X21
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MC33MR2001T2VK NXP USA Inc. Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
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MCF51MM128CLK MCF51MM128CLK NXP USA Inc. MCF51MM256.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 80-FQFP (12x12)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x16b; D/A 1x12b
Core Processor: Coldfire V1
Package / Case: 80-LQFP
Packaging: Box
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MC33931EKR2 MC33931EKR2 NXP USA Inc. MC33931.pdf Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
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2+12.46 EUR
10+9.59 EUR
25+8.88 EUR
100+8.08 EUR
250+7.82 EUR
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KIT33937AEKEVBE NXP USA Inc. MC33937.pdf Description: KIT EVAL 3PHASE FET PRE-DRIVER
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33937A
Type: Power Management
Function: Motor Controller/Driver
Packaging: Box
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74LVT534D,112 74LVT534D,112 NXP USA Inc. 74LVT534.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
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PEMI1QFN/WT,315 PEMI1QFN/WT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
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PEMI1QFN/WT,315 PEMI1QFN/WT,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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FRDMGD31ECNEVM NXP USA Inc. Description: EVAL BOARD FOR GD3100, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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TJA1102SHN/0Z TJA1102SHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER 1/1 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Protocol: Ethernet
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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2+11.69 EUR
10+8.98 EUR
25+8.31 EUR
100+7.57 EUR
250+7.21 EUR
500+7 EUR
1000+6.82 EUR
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NX3L1T384GM,115 NX3L1T384GM,115 NXP USA Inc. NX3L1T384.pdf Description: IC SW SPST-NCX1 750MOHM 6XSON
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 6pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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BFG410W,115 BFG410W,115 NXP USA Inc. BFG410W.pdf Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Supplier Device Package: CMPAK-4
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Frequency - Transition: 22GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 4.5V
Current - Collector (Ic) (Max): 12mA
Power - Max: 54mW
Gain: 21dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA6017AT/1Y TEA6017AT/1Y NXP USA Inc. TEA6017AT.pdf Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TEA6017AT/1Y TEA6017AT/1Y NXP USA Inc. TEA6017AT.pdf Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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TEA6017DK1005 TEA6017DK1005 NXP USA Inc. TEA6017AT.pdf Description: TEA6017AT DEV PROGRAM BOARD
Secondary Attributes: I2C Interface(s)
Contents: Board(s)
Embedded: No
Primary Attributes: ESD Protection
Supplied Contents: Board(s)
Utilized IC / Part: TEA6017AT
Type: Power Management
Function: Power Factor Correction
Packaging: Box
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PMN25UN,115 PMN25UN,115 NXP USA Inc. PMN25UN.pdf Description: MOSFET N-CH 20V 6A 6TSOP
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Produkt ist nicht verfügbar
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FRDM-KE17Z FRDM-KE17Z NXP USA Inc. FRDM-KE17ZUM.pdf Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Platform: Freedom
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SPC5746BHK1AMMH6 SPC5746BHK1AMMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 65
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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SPC5746BSK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BHK1AMKU6 SPC5746BHK1AMKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BBK1AMKU6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BK1AVKU2 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
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SPC5746BBK1AMMH6 SPC5746BBK1AMMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SPC5746BTK1AVMH6 SPC5746BTK1AVMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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MC9S08SH8MSC MC9S08SH8MSC NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
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NHS3100UCODEDBUL NXP USA Inc. NHS3100.pdf Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Utilized IC / Part: NHS3100
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NHS3100
Packaging: Bulk
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74LVC821ABQ,118 74LVC821ABQ,118 NXP USA Inc. 74LVC821A.pdf Description: IC FF D-TYPE SNGL 10BIT 24DHVQFN
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Number of Bits per Element: 10
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Input Capacitance: 5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
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S912XEG128J2CALR S912XEG128J2CALR NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
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S912XEG256J2CALR S912XEG256J2CALR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XEG256BCALR S912XEG256BCALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XET256BCALR S912XET256BCALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
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S912XEG384BCALR S912XEG384BCALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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S912XEG384F0CALR S912XEG384F0CALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
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S912XEQ384F0CALR S912XEQ384F0CALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 384KB FLASH 112LQFP
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MPC8349VVAGDB MPC8349EAEC.pdf
MPC8349VVAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672TBGA
Produkt ist nicht verfügbar
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MK22DN512VLH5 K22P64M50SF4.pdf
MK22DN512VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Produkt ist nicht verfügbar
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FRDMGD3160DCMHB UM11637.pdf
FRDMGD3160DCMHB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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FRDMGD3160HB8EVM UM11777.pdf
FRDMGD3160HB8EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
Contents: Board(s), Cable(s)
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FRDMGD3160HBIEVM
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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FRDMGD3160XM3EVM getting-started-with-the-frdmgd3160xm3evm-evaluation-board:GS-FRDMGD3160XM3EVM
FRDMGD3160XM3EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
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MGD3160AM315EK PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: SNGL CH GATE DRIVER 32SOIC
Voltage - Output Supply: 4.5V ~ 40V
Number of Channels: 1
Part Status: Active
Supplier Device Package: 32-SOIC
Current - Output High, Low: 15A, 15A
Current - Peak Output: 15A
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MGD3160AM335EK PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.5V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
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MGD3160AM535EK PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.75V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MGD3160AM515EK
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
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MC33665ATS4AE MC33665A_SDS.pdf
MC33665ATS4AE
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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2+17.97 EUR
10+13.98 EUR
25+12.98 EUR
100+11.89 EUR
250+11.36 EUR
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MMG3001NT1 MMG3001NT1.pdf
MMG3001NT1
Hersteller: NXP USA Inc.
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
P1dB: 18.5dBm
Noise Figure: 4.1dB
Current - Supply: 58mA
Gain: 20dB
Voltage - Supply: 5.6V
RF Type: General Purpose
Frequency: 40MHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
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2PD602AS 2PD602A.pdf
2PD602AS
Hersteller: NXP USA Inc.
Description: 2PD602A - NPN GENERAL PURPOSE TR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BUK7613-60E118 BUK7613-60E.pdf
BUK7613-60E118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7613-60E - POWER
Produkt ist nicht verfügbar
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MC33FS6600M0ESR2 FS6600.pdf
MC33FS6600M0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6501NAE FS6500-FS4500-ASILD.pdf
MC35FS6501NAE
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6501NAER2 FS6500-FS4500-ASILD.pdf
MC35FS6501NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33592FTAR2 MC33592.pdf
MC33592FTAR2
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
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MC33592FTAR2 MC33592.pdf
MC33592FTAR2
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Produkt ist nicht verfügbar
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DSP56F801FA60E DSP56F801.pdf
DSP56F801FA60E
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
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S908AB32AH3CFUER
S908AB32AH3CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Produkt ist nicht verfügbar
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SPC5746GK1MKU6R
SPC5746GK1MKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Produkt ist nicht verfügbar
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S912XEP100W1MAGR
S912XEP100W1MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
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FS32K146HAT0MLHR S32K1xx.pdf
FS32K146HAT0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC32PF3000A4EPR2 PF3000.pdf
MC32PF3000A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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MRF6S18060NR1 MRF6S18060NR1%2CNBR1.pdf
MRF6S18060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Current - Test: 600 mA
Voltage - Test: 26 V
Voltage - Rated: 68 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15dB
Power - Output: 60W
Frequency: 1.99GHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Bulk
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MIMX8UX6CVLDZAC
MIMX8UX6CVLDZAC
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Produkt ist nicht verfügbar
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MC33MR2001T2VK
Hersteller: NXP USA Inc.
Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
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MCF51MM128CLK MCF51MM256.pdf
MCF51MM128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 80-FQFP (12x12)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x16b; D/A 1x12b
Core Processor: Coldfire V1
Package / Case: 80-LQFP
Packaging: Box
Produkt ist nicht verfügbar
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MC33931EKR2 MC33931.pdf
MC33931EKR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
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KIT33937AEKEVBE MC33937.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL 3PHASE FET PRE-DRIVER
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC33937A
Type: Power Management
Function: Motor Controller/Driver
Packaging: Box
Produkt ist nicht verfügbar
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74LVT534D,112 74LVT534.pdf
74LVT534D,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Produkt ist nicht verfügbar
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PEMI1QFN/WT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/WT,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WT,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Bulk
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FRDMGD31ECNEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3100, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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TJA1102SHN/0Z TJA1102_SDS.pdf
TJA1102SHN/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Protocol: Ethernet
Data Rate: 100Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 1.8V, 3.3V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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2+11.69 EUR
10+8.98 EUR
25+8.31 EUR
100+7.57 EUR
250+7.21 EUR
500+7 EUR
1000+6.82 EUR
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NX3L1T384GM,115 NX3L1T384.pdf
NX3L1T384GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Number of Circuits: 1
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 6pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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BFG410W,115 BFG410W.pdf
BFG410W,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 4.5V 22GHZ CMPAK-4
Supplier Device Package: CMPAK-4
Noise Figure (dB Typ @ f): 0.9dB ~ 1.2dB @ 900MHz ~ 2GHz
Frequency - Transition: 22GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 4.5V
Current - Collector (Ic) (Max): 12mA
Power - Max: 54mW
Gain: 21dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-82A, SOT-343
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA6017AT/1Y TEA6017AT.pdf
TEA6017AT/1Y
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEA6017AT/1Y TEA6017AT.pdf
TEA6017AT/1Y
Hersteller: NXP USA Inc.
Description: IC PFC LLC CONFIG CONTROLER SO16
Current - Startup: 890 µA
Part Status: Active
Supplier Device Package: 16-SO
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Frequency - Switching: 50kHz ~ 200kHz
Voltage - Supply: 19V ~ 36V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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TEA6017DK1005 TEA6017AT.pdf
TEA6017DK1005
Hersteller: NXP USA Inc.
Description: TEA6017AT DEV PROGRAM BOARD
Secondary Attributes: I2C Interface(s)
Contents: Board(s)
Embedded: No
Primary Attributes: ESD Protection
Supplied Contents: Board(s)
Utilized IC / Part: TEA6017AT
Type: Power Management
Function: Power Factor Correction
Packaging: Box
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PMN25UN,115 PMN25UN.pdf
PMN25UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6A 6TSOP
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 530mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 6A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 470 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Produkt ist nicht verfügbar
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FRDM-KE17Z FRDM-KE17ZUM.pdf
FRDM-KE17Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE12Z/KE13Z/KE17Z BRD
Platform: Freedom
Utilized IC / Part: KE12Z, KE13Z, KE17Z
Core Processor: ARM® Cortex®-M0+
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SPC5746BHK1AMMH6
SPC5746BHK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 65
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 384K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5746BSK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BHK1AMKU6 MPC5746C.pdf
SPC5746BHK1AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BBK1AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BK1AVKU2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Produkt ist nicht verfügbar
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SPC5746BBK1AMMH6
SPC5746BBK1AMMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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SPC5746BTK1AVMH6
SPC5746BTK1AVMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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MC9S08SH8MSC MC9S08SH32.pdf
MC9S08SH8MSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
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99+5.46 EUR
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NHS3100UCODEDBUL NHS3100.pdf
Hersteller: NXP USA Inc.
Description: NHS3100 UCODE-I2C SOL EVAL BOARD
Utilized IC / Part: NHS3100
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Frequency: 13.56MHz
For Use With/Related Products: NHS3100
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC821ABQ,118 74LVC821A.pdf
74LVC821ABQ,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 10BIT 24DHVQFN
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Number of Bits per Element: 10
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 7.3ns @ 3.3V, 50pF
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Input Capacitance: 5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 10 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
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567+1.02 EUR
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S912XEG128J2CALR
S912XEG128J2CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEG256J2CALR MC9S12XEP100RMV1.pdf
S912XEG256J2CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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S912XEG256BCALR
S912XEG256BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256BCALR
S912XET256BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
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S912XEG384BCALR
S912XEG384BCALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 24K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEG384F0CALR
S912XEG384F0CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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S912XEQ384F0CALR MC9S12XEPB.pdf
S912XEQ384F0CALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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