Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (37099) > Seite 455 nach 619

Hersteller: NXP USA Inc.
Description: PF7100 PMIC OTP

Hersteller: NXP USA Inc.
Description: LS2088A XT WE 2000 R1.1

Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Part Status: Active

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS8500
Packaging: Bulk
Function: Special Purpose: Mobiles
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS8500, PF5020, PF5024
Supplied Contents: Board(s), Cable(s)
Part Status: Active

Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR

Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH

Hersteller: NXP USA Inc.
Description: IC INVERTER OD 3CH 3-INP 8XSON

Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 25.2dB
Current - Supply: 7mA
Noise Figure: 3dB
P1dB: -5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP

Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.2dB
Current - Supply: 55mA
Noise Figure: 3.7dB
P1dB: 1dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0
Packaging: Bulk
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: WIDE BAND LOW POWER AMPLIFIER 0

Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 22.9dB
Current - Supply: 36mA
Noise Figure: 4dB
P1dB: -2dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
DigiKey Programmable: Not Verified
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-TSSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC

Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1292FCPBGA

Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 64MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 64MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)

Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER TRANSISTOR, 18

Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1200W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 174MHz ~ 230MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Supplied Contents: Board(s)

Hersteller: NXP USA Inc.
Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
For Use With/Related Products: MRFX1K80N
Frequency: 230MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRFX1K80N
Supplied Contents: Board(s)
Part Status: Active

Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
Power - Output: 13.5W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA

Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V 16PFP

Hersteller: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V

Hersteller: NXP USA Inc.
Description: RECEIVER 014
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1

Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP

Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA

Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP

Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D

Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D

Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: FS6500

Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active

Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I

Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Grade: Automotive
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART

Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified