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TEA19031AOT/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH SMART CHRG
Produkt ist nicht verfügbar
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BUK768R1-40E118 NXP USA Inc. BUK768R1-40E.pdf Description: NOW NEXPERIA BUK768R1-100E - POW
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LD6806F/28P,115 LD6806F/28P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.8V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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FS32K142MAT0MLLT FS32K142MAT0MLLT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
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MCF5212CAE66R MCF5212CAE66R NXP USA Inc. MCF5213EC.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
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K32W041Z K32W041Z NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
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K32W041Z K32W041Z NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
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10+11.51 EUR
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100+10.06 EUR
250+9.56 EUR
500+9.20 EUR
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MIMX8MN1DVPIZAA MIMX8MN1DVPIZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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BGU7062N2Y BGU7062N2Y NXP USA Inc. BGU7062N2.pdf Description: IC AMP 1.71GHZ-1.785GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.71GHz ~ 1.785GHz
Voltage - Supply: 3.3V
Gain: 37.2dB
Current - Supply: 215mA
Noise Figure: 0.77dB
Test Frequency: 1.75GHz
Supplier Device Package: 16-HLQFN (8x8)
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BGU8011X,115 BGU8011X,115 NXP USA Inc. BGU8011.pdf Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GNSS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.6dB
Current - Supply: 9mA
Noise Figure: 1.2dB
P1dB: -5dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.9)
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MC10XS6225BEK MC10XS6225BEK NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH HIGH SIDE 32SOIC
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
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SLN-VIZN-IOT SLN-VIZN-IOT NXP USA Inc. SLN-VIZN-IOT-UG.pdf Description: I.MXRT106F DEV FACE RECOGNITION
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PTN36002HQX NXP USA Inc. Description: DUALPORT 5GBPS USB3.1 GEN1 REDRI
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BUJ302A,127 BUJ302A,127 NXP USA Inc. PHGLS22628-1.pdf?t.download=true&u=5oefqw Description: TRANS NPN 400V 4A TO-220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 1A, 3.5A
Current - Collector Cutoff (Max): 250mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 800mA, 3V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 400 V
Power - Max: 80 W
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S912ZVH128F2VLL,557 S912ZVH128F2VLL,557 NXP USA Inc. MC9S12ZVFPRMV1.pdf Description: MICROCONTROLLER, 16 BIT, HCS12 C
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S912ZVH128F2CLQ557 S912ZVH128F2CLQ557 NXP USA Inc. MC9S12ZVFPRMV1.pdf Description: MICROCONTROLLER, 16-BIT, HCS12 C
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S912ZVH128F2VLQ S912ZVH128F2VLQ NXP USA Inc. S12ZVHFS.pdf Description: IC MCU 16BIT 128KB FLASH 144LQFP
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S912ZVL96F0VLFR S912ZVL96F0VLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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PNX9531E/V140557 PNX9531E/V140557 NXP USA Inc. _PNX9530E.pdf?t.download=true&u=ovmfp3 Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 37800 Stücke:
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PNX9530E/V140557 PNX9530E/V140557 NXP USA Inc. _PNX9530E.pdf?t.download=true&u=ovmfp3 Description: SOFTWARE ENABLED VIDEO AND MULTI
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S9S12GA64F0WLF S9S12GA64F0WLF NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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BUK652R0-30C,127 BUK652R0-30C,127 NXP USA Inc. Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
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TL431SDT,215 TL431SDT,215 NXP USA Inc. TL431_Family.pdf Description: IC VREF SHUNT ADJ 2% TO236AB
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
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MC08XS6421DEK MC08XS6421DEK NXP USA Inc. Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tube
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
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MC08XS6421BEKR2 MC08XS6421BEKR2 NXP USA Inc. MC12XS6D4.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC08XS6421DEKR2 MC08XS6421DEKR2 NXP USA Inc. Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
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MC08XS6421BEK MC08XS6421BEK NXP USA Inc. MC12XS6D4.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC08XS6421CEK MC08XS6421CEK NXP USA Inc. MC12XS6D4.pdf Description: HIGH-SIDE SWITCH 12V DUAL 8MOHMS
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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KIT08XS6421EKEVB NXP USA Inc. Description: EVAL BOARD FOR MC08XS6421
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17XSF4-EVB NXP USA Inc. Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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BZX585-B11135 BZX585-B11135 NXP USA Inc. BZX585_SERIES.pdf Description: NEXPERIA BZX585-B11 - ZENER DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A3G18D510-04SR3 A3G18D510-04SR3 NXP USA Inc. A3G18D510-04S.pdf Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 56W
Gain: 16dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 250 mA
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S9S08DN32F2VLC557 NXP USA Inc. MC9S08DN60.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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ASL4500SHNY ASL4500SHNY NXP USA Inc. ASL4500SHN.pdf Description: IC LED DRIVER RGLTR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 10V ~ 80V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 130MHz ~ 250MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Internal Switch(s): No
Topology: Step-Up (Boost)
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11970 Stücke:
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10+6.85 EUR
25+6.32 EUR
100+5.74 EUR
250+5.46 EUR
500+5.29 EUR
1000+5.15 EUR
2500+5.01 EUR
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BZB84-C56215 BZB84-C56215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA ZENER DIODE, 56V, 5
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PCU9655PW,518 PCU9655PW,518 NXP USA Inc. PCU9655.pdf Description: IC LED DRV LIN PWM 100MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCU9655PW,518 PCU9655PW,518 NXP USA Inc. PCU9655.pdf Description: IC LED DRV LIN PWM 100MA 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
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SPC5644CF0MLU1 SPC5644CF0MLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5602BAVLH4 SPC5602BAVLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5602BF2VLL4R SPC5602BF2VLL4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SPC5602BF2VLL4 SPC5602BF2VLL4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM17068/GPS1502LUL NXP USA Inc. Description: EVAL BOARD RF GPS1502
Packaging: Bulk
For Use With/Related Products: GPS1502
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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LPC1115JET48/303 NXP USA Inc. Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 4410 Stücke:
Lieferzeit 10-14 Tag (e)
50+17.60 EUR
Mindestbestellmenge: 50
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LPC1113FBD48/301 NXP USA Inc. Description: ARM CORTEX-M0 SERIES MICROCONTRO
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
20+21.88 EUR
Mindestbestellmenge: 20
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LPC1112FHN33/103 LPC1112FHN33/103 NXP USA Inc. PHGLS29589-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
Produkt ist nicht verfügbar
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LPC1115JET48/303151 LPC1115JET48/303151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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UJA1162A-EVB NXP USA Inc. UM11379.pdf Description: UJA1162A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1162A
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+143.11 EUR
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SP5747GTK0AMKU6R SP5747GTK0AMKU6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747GK0AMMJ6R SP5747GK0AMMJ6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5747GK0AMMJ6 SPC5747GK0AMMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5747GTK0AMKU6 SPC5747GTK0AMKU6 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF2984AHN/T0BEY NCF2984AHN/T0BEY NXP USA Inc. Description: MANTRA F
Produkt ist nicht verfügbar
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PMEG3010ESB314 PMEG3010ESB314 NXP USA Inc. PHGLS18278-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 477000 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.08 EUR
Mindestbestellmenge: 6662
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LS1026AXN8P1A LS1026AXN8P1A NXP USA Inc. LS1046AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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MC17XSF500EK-NXP MC17XSF500EK-NXP NXP USA Inc. FSCLS11458-1.pdf?t.download=true&u=5oefqw Description: HIGH-SIDE SWITCH, 18V, PENTA 17M
Produkt ist nicht verfügbar
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MC40XS6500CEK MC40XS6500CEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH 12V PENTA 40MOH
Produkt ist nicht verfügbar
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PCAL6408AHK115 NXP USA Inc. PCAL6408A.pdf Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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LPC1113FBD48/301151 LPC1113FBD48/301151 NXP USA Inc. PHGLS29859-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Produkt ist nicht verfügbar
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NCF2951BTT/T0E080J NCF2951BTT/T0E080J NXP USA Inc. Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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FXPS7115DI4T1 FXPS7115DI4T1 NXP USA Inc. FXPS7115D4.pdf Description: 40-115 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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TEA19031AOT/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH SMART CHRG
Produkt ist nicht verfügbar
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BUK768R1-40E118 BUK768R1-40E.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK768R1-100E - POW
Produkt ist nicht verfügbar
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LD6806F/28P,115 LD6806_Series.pdf
LD6806F/28P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2219+0.24 EUR
Mindestbestellmenge: 2219
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FS32K142MAT0MLLT S32K-DS.pdf
FS32K142MAT0MLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MCF5212CAE66R MCF5213EC.pdf
MCF5212CAE66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32W041Z K32W061.pdf
K32W041Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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K32W041Z K32W061.pdf
K32W041Z
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 814 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.29 EUR
10+11.51 EUR
25+10.90 EUR
100+10.06 EUR
250+9.56 EUR
500+9.20 EUR
Mindestbestellmenge: 2
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MIMX8MN1DVPIZAA IMX8MNCEC.pdf
MIMX8MN1DVPIZAA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.32 EUR
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BGU7062N2Y BGU7062N2.pdf
BGU7062N2Y
Hersteller: NXP USA Inc.
Description: IC AMP 1.71GHZ-1.785GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.71GHz ~ 1.785GHz
Voltage - Supply: 3.3V
Gain: 37.2dB
Current - Supply: 215mA
Noise Figure: 0.77dB
Test Frequency: 1.75GHz
Supplier Device Package: 16-HLQFN (8x8)
Produkt ist nicht verfügbar
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BGU8011X,115 BGU8011.pdf
BGU8011X,115
Hersteller: NXP USA Inc.
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Packaging: Bulk
Part Status: Active
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GNSS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17.6dB
Current - Supply: 9mA
Noise Figure: 1.2dB
P1dB: -5dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.9)
auf Bestellung 3478 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
739+0.66 EUR
Mindestbestellmenge: 739
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MC10XS6225BEK MC12XS6D2.pdf
MC10XS6225BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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SLN-VIZN-IOT SLN-VIZN-IOT-UG.pdf
SLN-VIZN-IOT
Hersteller: NXP USA Inc.
Description: I.MXRT106F DEV FACE RECOGNITION
Produkt ist nicht verfügbar
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PTN36002HQX
Hersteller: NXP USA Inc.
Description: DUALPORT 5GBPS USB3.1 GEN1 REDRI
Produkt ist nicht verfügbar
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BUJ302A,127 PHGLS22628-1.pdf?t.download=true&u=5oefqw
BUJ302A,127
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 4A TO-220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 1A, 3.5A
Current - Collector Cutoff (Max): 250mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 800mA, 3V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 400 V
Power - Max: 80 W
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
944+0.54 EUR
Mindestbestellmenge: 944
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S912ZVH128F2VLL,557 MC9S12ZVFPRMV1.pdf
S912ZVH128F2VLL,557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Produkt ist nicht verfügbar
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S912ZVH128F2CLQ557 MC9S12ZVFPRMV1.pdf
S912ZVH128F2CLQ557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
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S912ZVH128F2VLQ S12ZVHFS.pdf
S912ZVH128F2VLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
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S912ZVL96F0VLFR
S912ZVL96F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PNX9531E/V140557 _PNX9530E.pdf?t.download=true&u=ovmfp3
PNX9531E/V140557
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 37800 Stücke:
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Anzahl Preis
13+42.50 EUR
Mindestbestellmenge: 13
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PNX9530E/V140557 _PNX9530E.pdf?t.download=true&u=ovmfp3
PNX9530E/V140557
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 1585 Stücke:
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Anzahl Preis
11+50.99 EUR
Mindestbestellmenge: 11
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S9S12GA64F0WLF
S9S12GA64F0WLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK652R0-30C,127
BUK652R0-30C,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 229 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14964 pF @ 25 V
auf Bestellung 2193 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
224+2.19 EUR
Mindestbestellmenge: 224
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TL431SDT,215 TL431_Family.pdf
TL431SDT,215
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 2% TO236AB
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Grade: Automotive
Part Status: Obsolete
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC08XS6421DEK
MC08XS6421DEK
Hersteller: NXP USA Inc.
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tube
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Produkt ist nicht verfügbar
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MC08XS6421BEKR2 MC12XS6D4.pdf
MC08XS6421BEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC08XS6421DEKR2
MC08XS6421DEKR2
Hersteller: NXP USA Inc.
Description: IC HIGH SIDE SWITCH 12V 32SOIC
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Active
Produkt ist nicht verfügbar
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MC08XS6421BEK MC12XS6D4.pdf
MC08XS6421BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC08XS6421CEK MC12XS6D4.pdf
MC08XS6421CEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 12V DUAL 8MOHMS
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Input Type: CMOS
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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KIT08XS6421EKEVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC08XS6421
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17XSF4-EVB
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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BZX585-B11135 BZX585_SERIES.pdf
BZX585-B11135
Hersteller: NXP USA Inc.
Description: NEXPERIA BZX585-B11 - ZENER DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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A3G18D510-04SR3 A3G18D510-04S.pdf
A3G18D510-04SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 56W
Gain: 16dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 250 mA
Produkt ist nicht verfügbar
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S9S08DN32F2VLC557 MC9S08DN60.pdf
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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ASL4500SHNY ASL4500SHN.pdf
ASL4500SHNY
Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 10V ~ 80V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 130MHz ~ 250MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Internal Switch(s): No
Topology: Step-Up (Boost)
Supplier Device Package: 32-HVQFN (5x5)
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 11970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.96 EUR
10+6.85 EUR
25+6.32 EUR
100+5.74 EUR
250+5.46 EUR
500+5.29 EUR
1000+5.15 EUR
2500+5.01 EUR
Mindestbestellmenge: 2
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BZB84-C56215 BZB84_SER.pdf
BZB84-C56215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA ZENER DIODE, 56V, 5
Produkt ist nicht verfügbar
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PCU9655PW,518 PCU9655.pdf
PCU9655PW,518
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCU9655PW,518 PCU9655.pdf
PCU9655PW,518
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 100MA 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 100mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
auf Bestellung 2334 Stücke:
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Anzahl Preis
180+2.73 EUR
Mindestbestellmenge: 180
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SPC5644CF0MLU1
SPC5644CF0MLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BAVLH4
SPC5602BAVLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2VLL4R
SPC5602BF2VLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2VLL4
SPC5602BF2VLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM17068/GPS1502LUL
Hersteller: NXP USA Inc.
Description: EVAL BOARD RF GPS1502
Packaging: Bulk
For Use With/Related Products: GPS1502
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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LPC1115JET48/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 4410 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
50+17.60 EUR
Mindestbestellmenge: 50
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LPC1113FBD48/301
Hersteller: NXP USA Inc.
Description: ARM CORTEX-M0 SERIES MICROCONTRO
auf Bestellung 30 Stücke:
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Anzahl Preis
20+21.88 EUR
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LPC1112FHN33/103 PHGLS29589-1.pdf?t.download=true&u=5oefqw
LPC1112FHN33/103
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
Produkt ist nicht verfügbar
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LPC1115JET48/303151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1115JET48/303151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
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UJA1162A-EVB UM11379.pdf
Hersteller: NXP USA Inc.
Description: UJA1162A EVAL BOARD
Packaging: Bulk
Function: CAN Transceiver
Type: Interface
Utilized IC / Part: UJA1162A
Supplied Contents: Board(s)
Embedded: Yes, MCU
Part Status: Active
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Anzahl Preis
1+143.11 EUR
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SP5747GTK0AMKU6R
SP5747GTK0AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SP5747GK0AMMJ6R
SP5747GK0AMMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5747GK0AMMJ6 MPC5748G.pdf
SPC5747GK0AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5747GTK0AMKU6
SPC5747GTK0AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF2984AHN/T0BEY
NCF2984AHN/T0BEY
Hersteller: NXP USA Inc.
Description: MANTRA F
Produkt ist nicht verfügbar
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PMEG3010ESB314 PHGLS18278-1.pdf?t.download=true&u=5oefqw
PMEG3010ESB314
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Packaging: Bulk
Part Status: Active
auf Bestellung 477000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6662+0.08 EUR
Mindestbestellmenge: 6662
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LS1026AXN8P1A LS1046AFS.pdf
LS1026AXN8P1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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MC17XSF500EK-NXP FSCLS11458-1.pdf?t.download=true&u=5oefqw
MC17XSF500EK-NXP
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 18V, PENTA 17M
Produkt ist nicht verfügbar
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MC40XS6500CEK MC12XS6D3.pdf
MC40XS6500CEK
Hersteller: NXP USA Inc.
Description: HIGH-SIDE SWITCH 12V PENTA 40MOH
Produkt ist nicht verfügbar
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PCAL6408AHK115 PCAL6408A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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LPC1113FBD48/301151 PHGLS29859-1.pdf?t.download=true&u=5oefqw
LPC1113FBD48/301151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Produkt ist nicht verfügbar
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NCF2951BTT/T0E080J
NCF2951BTT/T0E080J
Hersteller: NXP USA Inc.
Description: IC ACTIC 4G 3D 38TSSOP
Produkt ist nicht verfügbar
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FXPS7115DI4T1 FXPS7115D4.pdf
FXPS7115DI4T1
Hersteller: NXP USA Inc.
Description: 40-115 KPA BAP DIG I2C
Produkt ist nicht verfügbar
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