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PN7161A1EV/C100Y PN7161A1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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PN7160A1EV/C100Y PN7160A1EV/C100Y NXP USA Inc. PN7160_PN7161.pdf Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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MWCT1213VLH NXP USA Inc. Description: NEVIS2 64LQFP
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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PMV45EN2215 PMV45EN2215 NXP USA Inc. PMV45EN2.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13589JP OM13589JP NXP USA Inc. A1006.pdf Description: A1006 DEMONSTRATION KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVL16F0WLF S9S12ZVL16F0WLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI6QFN/CK,132 PEMI6QFN/CK,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Produkt ist nicht verfügbar
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PEMI6QFN/CK,132 PEMI6QFN/CK,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
auf Bestellung 20000 Stücke:
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2061+0.27 EUR
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MHT1803B NXP USA Inc. Description: RF MOSFET TO247
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12P64J0CFT S9S12P64J0CFT NXP USA Inc. MC9S12P128RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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10+6.67 EUR
25+6.17 EUR
100+5.72 EUR
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LD6806F/12P,115 LD6806F/12P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.2V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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74ABT20N,112 74ABT20N,112 NXP USA Inc. 74ABT20.pdf Description: IC GATE NAND 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Current - Quiescent (Max): 50 µA
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PEMI1QFN/LG,315 PEMI1QFN/LG,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
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PEMI1QFN/LE,315 PEMI1QFN/LE,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
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S9S08DV96F2CLF S9S08DV96F2CLF NXP USA Inc. Description: IC MCU 8BIT 96KB FLASH 48LQFP
Produkt ist nicht verfügbar
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N74F827D,602 N74F827D,602 NXP USA Inc. 74F827_Rev2004.pdf Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 24mA, 64mA
Supplier Device Package: 24-SO
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BZV49-C7V5115 NXP USA Inc. Description: DIODE ZENER 75V 1W SOT89
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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BLF988S,112 NXP USA Inc. PHGLS25650-1.pdf?t.download=true&u=5oefqw Description: RF PFET, 2-ELEMENT, ULTRA HIGH F
auf Bestellung 20 Stücke:
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MRF6V2150NR1 NXP USA Inc. FSCLS05116-1.pdf?t.download=true&u=5oefqw Description: RF ULTRA HIGH FREQUENCY BAND, N-
auf Bestellung 1680 Stücke:
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74LVT162245BDGG112 NXP USA Inc. 74LVT162245B.pdf Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT162245BDGG118 NXP USA Inc. Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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B4420NSN7QQMD NXP USA Inc. B4420.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NSN7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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B4420NXN7QQMD NXP USA Inc. B4420.pdf Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NXN7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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G4860NSE7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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G4860NXE7QUMD NXP USA Inc. Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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LPC845M301JHI33K LPC845M301JHI33K NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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5+4.38 EUR
10+2.76 EUR
25+2.49 EUR
100+2.39 EUR
250+2.33 EUR
500+2.19 EUR
Mindestbestellmenge: 5
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74ALVC125D,118 74ALVC125D,118 NXP USA Inc. 74ALVC125.pdf Description: IC BUFFER NON-INVERT 3.6V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SO
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2240+0.24 EUR
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PSMN5R0-100ES PSMN5R0-100ES NXP USA Inc. PHGLS23342-1.pdf?t.download=true&u=5oefqw Description: ELEMENT, NCHANNEL, SILICON, MOSF
Produkt ist nicht verfügbar
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PSMN5R5-60YS115 PSMN5R5-60YS115 NXP USA Inc. PSMN5R5-60YS.pdf Description: NOW NEXPERIA 100A, 60V, 0.055OHM
Produkt ist nicht verfügbar
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74LVC32245AEC/DG518 NXP USA Inc. 74LVC32245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 27271 Stücke:
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MMA6853BKW574 MMA6853BKW574 NXP USA Inc. MMA685x.pdf Description: SINGLE-AXIS SPI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 70 Stücke:
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50+9.76 EUR
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S912XDP512J1VAGR S912XDP512J1VAGR NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AVC16834ADGV,112 74AVC16834ADGV,112 NXP USA Inc. 74AVC16834A.pdf Description: IC UNIV BUS DVR 18BIT 56TVSOP
auf Bestellung 1050 Stücke:
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407+1.36 EUR
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BUK6213-30A,118 BUK6213-30A,118 NXP USA Inc. BUK6213-30A.pdf Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 13mOhm @ 10A, 10V
Power Dissipation (Max): 102W (Tc)
Vgs(th) (Max) @ Id: 3V @ 1mA
Supplier Device Package: DPAK
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 44 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1986 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 4990 Stücke:
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1268+0.39 EUR
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BSC9131NJE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NLE7HHHB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NSN7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NXE7KHKB NXP USA Inc. BSC913xNW.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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MK10DX128VMC7R,518 NXP USA Inc. K10P100M72SF1.pdf Description: KINETIS K10: MICROCONTROLLER, FL
Produkt ist nicht verfügbar
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MK10DX128VMC7R518 NXP USA Inc. FSCLS07691-1.pdf?t.download=true&u=5oefqw Description: KINETIS K10: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL81Z128VMC7R MKL81Z128VMC7R NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6DP6AVT8AAR NXP USA Inc. IMX6DQPAEC.pdf Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
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LPC5534JBD64K LPC5534JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5536JBD64K LPC5536JBD64K NXP USA Inc. LPC553x.pdf Description: IC MCU M33 256KB/128KB HTQFP64
Produkt ist nicht verfügbar
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MCIMX6X1CVO08ACR MCIMX6X1CVO08ACR NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MKW35A512VFP4R MKW35A512VFP4R NXP USA Inc. MKW36A512.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8623BMDA0ES MFS8623BMDA0ES NXP USA Inc. FS8600_SDS.pdf Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IP4251CZ12-6,118 IP4251CZ12-6,118 NXP USA Inc. IP4251%2C52%2C53%2C54-TTL.pdf Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Produkt ist nicht verfügbar
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IP3047CX6,135 NXP USA Inc. Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 6-WFBGA, WLCSP
Size / Dimension: 0.063" L x 0.045" W (1.60mm x 1.15mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: Audio
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
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IP3048CX5,135 NXP USA Inc. Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
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IP4059CX5/LF,135 IP4059CX5/LF,135 NXP USA Inc. IP4059CX5.pdf Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Produkt ist nicht verfügbar
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IP4350CX24/LF,135 NXP USA Inc. IP4350CX24.pdf Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP4772CZ16,118 IP4772CZ16,118 NXP USA Inc. Description: IC VIDEO SGNL COND 16SSOP
Produkt ist nicht verfügbar
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IP4772CZ16,118 IP4772CZ16,118 NXP USA Inc. Description: IC VIDEO SGNL COND 16SSOP
auf Bestellung 395224 Stücke:
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IP4769CZ14,118 IP4769CZ14,118 NXP USA Inc. DiscreteSemiconductors.pdf Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
1902+0.26 EUR
Mindestbestellmenge: 1902
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SPC5746RK1MLU3 SPC5746RK1MLU3 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCIMX6U5DVM10ADR MCIMX6U5DVM10ADR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PN7161A1EV/C100Y PN7160_PN7161.pdf
PN7161A1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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PN7160A1EV/C100Y PN7160_PN7161.pdf
PN7160A1EV/C100Y
Hersteller: NXP USA Inc.
Description: IC NFC CONTROLLER I2C VFBGA64
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4x4)
Produkt ist nicht verfügbar
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MWCT1213VLH
Hersteller: NXP USA Inc.
Description: NEVIS2 64LQFP
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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PMV45EN2215 PMV45EN2.pdf
PMV45EN2215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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OM13589JP A1006.pdf
OM13589JP
Hersteller: NXP USA Inc.
Description: A1006 DEMONSTRATION KIT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVL16F0WLF
S9S12ZVL16F0WLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI6QFN/CK,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CK,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Produkt ist nicht verfügbar
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PEMI6QFN/CK,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CK,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
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2061+0.27 EUR
Mindestbestellmenge: 2061
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MHT1803B
Hersteller: NXP USA Inc.
Description: RF MOSFET TO247
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12P64J0CFT MC9S12P128RMV1.pdf
S9S12P64J0CFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.68 EUR
10+6.67 EUR
25+6.17 EUR
100+5.72 EUR
Mindestbestellmenge: 3
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LD6806F/12P,115 LD6806_Series.pdf
LD6806F/12P,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 200MA 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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2219+0.24 EUR
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74ABT20N,112 74ABT20.pdf
74ABT20N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 4-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 4
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.9ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 2
Current - Quiescent (Max): 50 µA
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Anzahl Preis
444+1.12 EUR
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PEMI1QFN/LG,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LG,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
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PEMI1QFN/LE,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/LE,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 11dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
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S9S08DV96F2CLF
S9S08DV96F2CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48LQFP
Produkt ist nicht verfügbar
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N74F827D,602 74F827_Rev2004.pdf
N74F827D,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 10
Current - Output High, Low: 24mA, 64mA
Supplier Device Package: 24-SO
auf Bestellung 2870 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
452+1.07 EUR
Mindestbestellmenge: 452
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BZV49-C7V5115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 75V 1W SOT89
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Produkt ist nicht verfügbar
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BLF988S,112 PHGLS25650-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF PFET, 2-ELEMENT, ULTRA HIGH F
auf Bestellung 20 Stücke:
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Anzahl Preis
1+899.94 EUR
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MRF6V2150NR1 FSCLS05116-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF ULTRA HIGH FREQUENCY BAND, N-
auf Bestellung 1680 Stücke:
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Anzahl Preis
6+109.29 EUR
Mindestbestellmenge: 6
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74LVT162245BDGG112 74LVT162245B.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74LVT162245BDGG118
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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B4420NSN7QQMD B4420.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NSN7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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B4420NXN7QQMD B4420.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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G4860NXN7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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G4860NSE7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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G4860NXE7QUMD
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Tray
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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LPC845M301JHI33K LPC84x.pdf
LPC845M301JHI33K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
auf Bestellung 1717 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.38 EUR
10+2.76 EUR
25+2.49 EUR
100+2.39 EUR
250+2.33 EUR
500+2.19 EUR
Mindestbestellmenge: 5
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74ALVC125D,118 74ALVC125.pdf
74ALVC125D,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SO
auf Bestellung 2240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2240+0.24 EUR
Mindestbestellmenge: 2240
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PSMN5R0-100ES PHGLS23342-1.pdf?t.download=true&u=5oefqw
PSMN5R0-100ES
Hersteller: NXP USA Inc.
Description: ELEMENT, NCHANNEL, SILICON, MOSF
Produkt ist nicht verfügbar
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PSMN5R5-60YS115 PSMN5R5-60YS.pdf
PSMN5R5-60YS115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 100A, 60V, 0.055OHM
Produkt ist nicht verfügbar
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74LVC32245AEC/DG518 74LVC32245A.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 27271 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
245+2.16 EUR
Mindestbestellmenge: 245
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MMA6853BKW574 MMA685x.pdf
MMA6853BKW574
Hersteller: NXP USA Inc.
Description: SINGLE-AXIS SPI INERTIAL SENSOR
Packaging: Bulk
Part Status: Active
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
50+9.76 EUR
Mindestbestellmenge: 50
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S912XDP512J1VAGR
S912XDP512J1VAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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74AVC16834ADGV,112 74AVC16834A.pdf
74AVC16834ADGV,112
Hersteller: NXP USA Inc.
Description: IC UNIV BUS DVR 18BIT 56TVSOP
auf Bestellung 1050 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
407+1.36 EUR
Mindestbestellmenge: 407
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BUK6213-30A,118 BUK6213-30A.pdf
BUK6213-30A,118
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 13mOhm @ 10A, 10V
Power Dissipation (Max): 102W (Tc)
Vgs(th) (Max) @ Id: 3V @ 1mA
Supplier Device Package: DPAK
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 44 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1986 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 4990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1268+0.39 EUR
Mindestbestellmenge: 1268
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BSC9131NJE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NLE7HHHB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NSN7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
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BSC9131NXE7KHKB BSC913xNW.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
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MK10DX128VMC7R,518 K10P100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER, FL
Produkt ist nicht verfügbar
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MK10DX128VMC7R518 FSCLS07691-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: KINETIS K10: 72MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL81Z128VMC7R KNTSKL8XFS.pdf
MKL81Z128VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 85
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX6DP6AVT8AAR IMX6DQPAEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
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LPC5534JBD64K LPC553x.pdf
LPC5534JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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LPC5536JBD64K LPC553x.pdf
LPC5536JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU M33 256KB/128KB HTQFP64
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MCIMX6X1CVO08ACR IMX6SXIEC.pdf
MCIMX6X1CVO08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
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MKW35A512VFP4R MKW36A512.pdf
MKW35A512VFP4R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MFS8623BMDA0ES FS8600_SDS.pdf
MFS8623BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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IP4251CZ12-6,118 IP4251%2C52%2C53%2C54-TTL.pdf
IP4251CZ12-6,118
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
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IP3047CX6,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 6-WFBGA, WLCSP
Size / Dimension: 0.063" L x 0.045" W (1.60mm x 1.15mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: Audio
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4438+0.11 EUR
Mindestbestellmenge: 4438
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IP3048CX5,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
auf Bestellung 100733 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.3 EUR
Mindestbestellmenge: 1567
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IP4059CX5/LF,135 IP4059CX5.pdf
IP4059CX5/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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IP4350CX24/LF,135 IP4350CX24.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
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IP4772CZ16,118
IP4772CZ16,118
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
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IP4772CZ16,118
IP4772CZ16,118
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
auf Bestellung 395224 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
656+0.84 EUR
Mindestbestellmenge: 656
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IP4769CZ14,118 DiscreteSemiconductors.pdf
IP4769CZ14,118
Hersteller: NXP USA Inc.
Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.26 EUR
Mindestbestellmenge: 1902
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SPC5746RK1MLU3
SPC5746RK1MLU3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MCIMX6U5DVM10ADR IMX6SDLCEC.pdf
MCIMX6U5DVM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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