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SPC5602BK0CLH4R SPC5602BK0CLH4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2VLH4 SPC5602BF2VLH4 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN32ACLH MC9S08DN32ACLH NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12GC128CFUE MC9S12GC128CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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74LV244DB653 NXP USA Inc. Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5745BK1VMH2 SPC5745BK1VMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5745BK1VMH2R SPC5745BK1VMH2R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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FS32K144UAT0VMHR FS32K144UAT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K146HFT0MMHT FS32K146HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MKE12Z256VLF7 MKE12Z256VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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3+7.06 EUR
10+5.38 EUR
25+4.97 EUR
80+4.57 EUR
230+4.54 EUR
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T1023RDB-PC T1023RDB-PC NXP USA Inc. T1023RDBFS.pdf Description: T1013/T1023 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: T1013, T1023
Board Type: Evaluation Platform
Core Processor: e5500
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4101DUF/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4101DA6/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4101DA4/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4101DUD/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34981ABHFK MC34981ABHFK NXP USA Inc. MC34981ABHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 40A
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: PWM
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1161ATK/0Z UJA1161ATK/0Z NXP USA Inc. UJA1161A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
4+5.16 EUR
10+3.88 EUR
25+3.56 EUR
100+3.21 EUR
250+3.04 EUR
500+3 EUR
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SVF331R3K2CKU2R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Produkt ist nicht verfügbar
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SVF331R3K2CKU2 SVF331R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MMRF5018HS-450 NXP USA Inc. MMRF5018HS.pdf Description: RF MOSFET NI400
Packaging: Tray
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Produkt ist nicht verfügbar
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PXLS84722AESR2 NXP USA Inc. Description: 2 AXIS MED/MED YZ
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7758HV/N207WY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPF7100BVBA3ES MPF7100BVBA3ES NXP USA Inc. Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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MPF7100BVMA4ES MPF7100BVMA4ES NXP USA Inc. Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08DN60AMLF MC9S08DN60AMLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R274KBK2MMM557 NXP USA Inc. PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw Description: POWER ARCHITECTURE E200Z4 32 BIT
Packaging: Bulk
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Part Status: Active
Produkt ist nicht verfügbar
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FS32R274KBK2MMM FS32R274KBK2MMM NXP USA Inc. S32R274.pdf Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
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SC28L194A1A,529 SC28L194A1A,529 NXP USA Inc. SC28L194.pdf Description: IC UART QUAD 68PLCC
Features: Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 3.3V, 5V
FIFO's: 16 Byte
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33PF8201A0ES MC33PF8201A0ES NXP USA Inc. PF8101_PF8201.pdf Description: IC POWER MANAGEMENT
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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2+15.22 EUR
10+11.87 EUR
25+11.04 EUR
100+10.12 EUR
260+9.66 EUR
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FS32K146HAT0VLLR FS32K146HAT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RD33771-48VEVM NXP USA Inc. UM11300.pdf Description: RD33771-48VEVM
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Type: Power Management
Function: CANbus
Packaging: Box
Produkt ist nicht verfügbar
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LD6836CX4/14P,315 LD6836CX4/14P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTC144ET/DG/B4215 PDTC144ET/DG/B4215 NXP USA Inc. PDTC144E_SER.pdf Description: TRANS PREBIAS
Qualification: AEC-Q101
Grade: Automotive
Part Status: Active
Packaging: Bulk
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT23-3 (TO-236)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
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15000+0.032 EUR
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BZB84-B4V7215 BZB84-B4V7215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA BZB84-B4V3 - ZENER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6Y0DVM05AA MCIMX6Y0DVM05AA NXP USA Inc. Description: IC MPU I.MX6 528MHZ 289MAPBGA
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Part Status: Active
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers: Electrophoretic, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
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74ABT126D,602 74ABT126D,602 NXP USA Inc. 74ABT126.pdf Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
auf Bestellung 13409 Stücke:
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74ABT126D,623 74ABT126D,623 NXP USA Inc. 74ABT126.pdf Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
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Lieferzeit 10-14 Tag (e)
1563+0.31 EUR
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MCIMX6G3CVM05AA MCIMX6G3CVM05AA NXP USA Inc. MCIMX6GxCzzzzzA.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Package / Case: 289-LFBGA
Packaging: Tray
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
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SPC5747CSK0AMKU6 SPC5747CSK0AMKU6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Produkt ist nicht verfügbar
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SP5747CSK0AMKU6R SP5747CSK0AMKU6R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Number of I/O: 129
DigiKey Programmable: Not Verified
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Produkt ist nicht verfügbar
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LS2088ARDB-PC LS2088ARDB-PC NXP USA Inc. LS2088ARDBFS.pdf Description: LS2088A EVAL BRD
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: LS2088A
Produkt ist nicht verfügbar
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S9S08EL32F1CTLR S9S08EL32F1CTLR NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51MM256VLK MCF51MM256VLK NXP USA Inc. MCF51MM256.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x16b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Number of I/O: 47
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PMT29EN,115 PMT29EN,115 NXP USA Inc. PMT29EN.pdf Description: MOSFET N-CH 30V 6A SOT223
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 820mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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PMT29EN,115 PMT29EN,115 NXP USA Inc. PMT29EN.pdf Description: MOSFET N-CH 30V 6A SOT223
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 820mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Produkt ist nicht verfügbar
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PCA9560PW,118 PCA9560PW,118 NXP USA Inc. PCA9560.pdf Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3.135V ~ 3.465V
Applications: Network, Telecom
Supplier Device Package: 20-TSSOP
Part Status: Active
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10+2.06 EUR
25+1.87 EUR
100+1.67 EUR
250+1.57 EUR
500+1.51 EUR
1000+1.46 EUR
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CBT3126DS,118 CBT3126DS,118 NXP USA Inc. CBT3126.pdf Description: IC BUS SWITCH 1 X 1:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
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CBT3126DB,118 CBT3126DB,118 NXP USA Inc. CBT3126.pdf Description: IC BUS SWITCH 1 X 1:1 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126D,118 NXP USA Inc. CBT3126.pdf Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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P87C54X2BA,512 P87C54X2BA,512 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
Produkt ist nicht verfügbar
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MC9S08PL32CQH MC9S08PL32CQH NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Number of I/O: 57
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10+3.65 EUR
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MCIMX251AJM4A MCIMX251AJM4A NXP USA Inc. IMX25AEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Part Status: Active
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
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10+29.57 EUR
25+27.76 EUR
100+25.77 EUR
450+24.33 EUR
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TDA8029HL/C207,118 TDA8029HL/C207,118 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SJA1110-EVM SJA1110-EVM NXP USA Inc. SJA1110AUTESFS.pdf Description: EVALUATION AUTO SWITCH
Packaging: Box
Function: Ethernet
Type: Interface
Utilized IC / Part: SJA1110, TJA1101, VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
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S9S12G96F0CLFR S9S12G96F0CLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Produkt ist nicht verfügbar
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PHT11N06LT,135 PHT11N06LT,135 NXP USA Inc. Description: MOSFET N-CH 55V 4.9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Rds On (Max) @ Id, Vgs: 40mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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CBTU4411EE,518 CBTU4411EE,518 NXP USA Inc. PHGLS24915-1.pdf?t.download=true&u=5oefqw Description: CBTU4411 - 11-BIT DDR2 SDRAM MUX
Part Status: Active
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Bulk
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CBTU4411EE518 NXP USA Inc. CBTU4411.pdf Description: BUS TRANSCEIVER CBT/FST/QS/5C/B
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NAFE11388B40BSK NAFE11388B40BSK NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Power (Watts): 125 mW
Number of Channels: 8
Part Status: Active
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 2.97V ~ 3.6V
Voltage - Supply, Analog: 2.97V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NAFE11388B40BSK NAFE11388B40BSK NXP USA Inc. Description: IC 8-IN LOW-POWER 25V AFE
Part Status: Active
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 2.97V ~ 3.6V
Voltage - Supply, Analog: 2.97V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Power (Watts): 125 mW
Number of Channels: 8
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100+23.04 EUR
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SPC5602BK0CLH4R
SPC5602BK0CLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2VLH4 MPC5604BC.pdf
SPC5602BF2VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN32ACLH MC9S08DN60AD.pdf
MC9S08DN32ACLH
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12GC128CFUE MC9S12C128V1.pdf
MC9S12GC128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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74LV244DB653
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5745BK1VMH2 MPC5746C.pdf
SPC5745BK1VMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BK1VMH2R MPC5746C.pdf
SPC5745BK1VMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144UAT0VMHR S32K1xx.pdf
FS32K144UAT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K146HFT0MMHT S32K1xx.pdf
FS32K146HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MKE12Z256VLF7 KE1xZP100M72SF1.pdf
MKE12Z256VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.06 EUR
10+5.38 EUR
25+4.97 EUR
80+4.57 EUR
230+4.54 EUR
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T1023RDB-PC T1023RDBFS.pdf
T1023RDB-PC
Hersteller: NXP USA Inc.
Description: T1013/T1023 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: T1013, T1023
Board Type: Evaluation Platform
Core Processor: e5500
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4101DUF/02V
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4101DA6/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4101DA4/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MF1PH4101DUD/02V
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34981ABHFK MC34981ABHFK.pdf
MC34981ABHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 40A
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: PWM
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1161ATK/0Z UJA1161A.pdf
UJA1161ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 29357 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.16 EUR
10+3.88 EUR
25+3.56 EUR
100+3.21 EUR
250+3.04 EUR
500+3 EUR
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SVF331R3K2CKU2R VYBRIDRSERIESEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Produkt ist nicht verfügbar
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SVF331R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF331R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MMRF5018HS-450 MMRF5018HS.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET NI400
Packaging: Tray
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
Produkt ist nicht verfügbar
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PXLS84722AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/MED YZ
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF7758HV/N207WY
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MPF7100BVBA3ES
MPF7100BVBA3ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MPF7100BVMA4ES
MPF7100BVMA4ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08DN60AMLF MC9S08DN60.pdf
MC9S08DN60AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R274KBK2MMM557 PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWER ARCHITECTURE E200Z4 32 BIT
Packaging: Bulk
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Part Status: Active
Produkt ist nicht verfügbar
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FS32R274KBK2MMM S32R274.pdf
FS32R274KBK2MMM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
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8+66 EUR
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SC28L194A1A,529 SC28L194.pdf
SC28L194A1A,529
Hersteller: NXP USA Inc.
Description: IC UART QUAD 68PLCC
Features: Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 3.3V, 5V
FIFO's: 16 Byte
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33PF8201A0ES PF8101_PF8201.pdf
MC33PF8201A0ES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.22 EUR
10+11.87 EUR
25+11.04 EUR
100+10.12 EUR
260+9.66 EUR
Mindestbestellmenge: 2 Stücke
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FS32K146HAT0VLLR S32K1xx.pdf
FS32K146HAT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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RD33771-48VEVM UM11300.pdf
Hersteller: NXP USA Inc.
Description: RD33771-48VEVM
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Type: Power Management
Function: CANbus
Packaging: Box
Produkt ist nicht verfügbar
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LD6836CX4/14P,315 LD6836.pdf
LD6836CX4/14P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTC144ET/DG/B4215 PDTC144E_SER.pdf
PDTC144ET/DG/B4215
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Qualification: AEC-Q101
Grade: Automotive
Part Status: Active
Packaging: Bulk
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SOT23-3 (TO-236)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
auf Bestellung 57000 Stücke:
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AnzahlPreis
15000+0.032 EUR
Mindestbestellmenge: 15000 Stücke
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BZB84-B4V7215 BZB84_SER.pdf
BZB84-B4V7215
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B4V3 - ZENER
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX6Y0DVM05AA
MCIMX6Y0DVM05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Part Status: Active
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers: Electrophoretic, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
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74ABT126D,602 74ABT126.pdf
74ABT126D,602
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
auf Bestellung 13409 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1379+0.35 EUR
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74ABT126D,623 74ABT126.pdf
74ABT126D,623
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1563+0.31 EUR
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MCIMX6G3CVM05AA MCIMX6GxCzzzzzA.pdf
MCIMX6G3CVM05AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Package / Case: 289-LFBGA
Packaging: Tray
Part Status: Obsolete
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: LCD, LVDS
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DDR3L
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 289-MAPBGA (14x14)
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A7
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 528MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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SPC5747CSK0AMKU6 MPC5746C.pdf
SPC5747CSK0AMKU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Produkt ist nicht verfügbar
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SP5747CSK0AMKU6R MPC5746C.pdf
SP5747CSK0AMKU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Number of I/O: 129
DigiKey Programmable: Not Verified
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Produkt ist nicht verfügbar
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LS2088ARDB-PC LS2088ARDBFS.pdf
LS2088ARDB-PC
Hersteller: NXP USA Inc.
Description: LS2088A EVAL BRD
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: LS2088A
Produkt ist nicht verfügbar
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S9S08EL32F1CTLR MC9S08EL32.pdf
S9S08EL32F1CTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF51MM256VLK MCF51MM256.pdf
MCF51MM256VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x16b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Number of I/O: 47
Produkt ist nicht verfügbar
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PMT29EN,115 PMT29EN.pdf
PMT29EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6A SOT223
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 820mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
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PMT29EN,115 PMT29EN.pdf
PMT29EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6A SOT223
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 820mW (Ta), 8.33W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6A (Ta)
Produkt ist nicht verfügbar
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PCA9560PW,118 PCA9560.pdf
PCA9560PW,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3.135V ~ 3.465V
Applications: Network, Telecom
Supplier Device Package: 20-TSSOP
Part Status: Active
auf Bestellung 3665 Stücke:
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AnzahlPreis
7+2.8 EUR
10+2.06 EUR
25+1.87 EUR
100+1.67 EUR
250+1.57 EUR
500+1.51 EUR
1000+1.46 EUR
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CBT3126DS,118 CBT3126.pdf
CBT3126DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Obsolete
auf Bestellung 17500 Stücke:
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AnzahlPreis
1776+0.28 EUR
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CBT3126DB,118 CBT3126.pdf
CBT3126DB,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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CBT3126D,118 CBT3126.pdf
CBT3126D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 14-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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P87C54X2BA,512 P80C3XX2_8XC5XX2.pdf
P87C54X2BA,512
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
Produkt ist nicht verfügbar
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MC9S08PL32CQH MC9S08PL60.pdf
MC9S08PL32CQH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Number of I/O: 57
auf Bestellung 10 Stücke:
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AnzahlPreis
4+4.88 EUR
10+3.65 EUR
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MCIMX251AJM4A IMX25AEC.pdf
MCIMX251AJM4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Part Status: Active
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 890 Stücke:
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AnzahlPreis
1+36.82 EUR
10+29.57 EUR
25+27.76 EUR
100+25.77 EUR
450+24.33 EUR
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TDA8029HL/C207,118 TDA8029.pdf
TDA8029HL/C207,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SJA1110-EVM SJA1110AUTESFS.pdf
SJA1110-EVM
Hersteller: NXP USA Inc.
Description: EVALUATION AUTO SWITCH
Packaging: Box
Function: Ethernet
Type: Interface
Utilized IC / Part: SJA1110, TJA1101, VR5510
Supplied Contents: Board(s)
Embedded: Yes
Part Status: Active
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AnzahlPreis
1+2110.03 EUR
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S9S12G96F0CLFR MC9S12GRMV1.pdf
S9S12G96F0CLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Produkt ist nicht verfügbar
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PHT11N06LT,135
PHT11N06LT,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 4.9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Rds On (Max) @ Id, Vgs: 40mOhm @ 5A, 5V
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): ±13V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1400 pF @ 25 V
Produkt ist nicht verfügbar
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CBTU4411EE,518 PHGLS24915-1.pdf?t.download=true&u=5oefqw
CBTU4411EE,518
Hersteller: NXP USA Inc.
Description: CBTU4411 - 11-BIT DDR2 SDRAM MUX
Part Status: Active
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Bulk
auf Bestellung 5990 Stücke:
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AnzahlPreis
268+1.76 EUR
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CBTU4411EE518 CBTU4411.pdf
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER CBT/FST/QS/5C/B
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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NAFE11388B40BSK
NAFE11388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Power (Watts): 125 mW
Number of Channels: 8
Part Status: Active
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 2.97V ~ 3.6V
Voltage - Supply, Analog: 2.97V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NAFE11388B40BSK
NAFE11388B40BSK
Hersteller: NXP USA Inc.
Description: IC 8-IN LOW-POWER 25V AFE
Part Status: Active
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 2.97V ~ 3.6V
Voltage - Supply, Analog: 2.97V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Power (Watts): 125 mW
Number of Channels: 8
auf Bestellung 1299 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+33.3 EUR
10+26.57 EUR
25+24.89 EUR
100+23.04 EUR
250+22.16 EUR
500+21.63 EUR
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