Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 467 nach 611
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MPC8541PXAPF | NXP USA Inc. |
 Description: IC MPU MPC85XX 833MHZ 783FCPBGAAdditional Interfaces: DUART, I2C, PCI Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR, SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 833MHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12GN32F0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: 12V1 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MRF6V3090NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO270-4 Current - Test: 350 mA Voltage - Test: 50 V Voltage - Rated: 110 V Part Status: Obsolete Supplier Device Package: TO-270 WB-4 Technology: LDMOS Gain: 22dB Power - Output: 18W Frequency: 860MHz Mounting Type: Surface Mount Package / Case: TO-270AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LD6836CX4/25P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2.5V 300MA 4WLCSP Current - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.16V @ 300mA PSRR: 55dB (1kHz) Part Status: Obsolete Control Features: Enable Voltage - Output (Min/Fixed): 2.5V Supplier Device Package: 4-WLCSP (0.76x0.76) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 300mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-XFBGA, WLCSP Packaging: Bulk |
auf Bestellung 17957 Stücke: Lieferzeit 10-14 Tag (e) |
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MK10DX64VLK7R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80FQFP EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tape & Reel (TR) Number of I/O: 56 Part Status: Active Supplier Device Package: 80-FQFP (12x12) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 31x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MCIMX6D7CZK08AD | NXP USA Inc. |
Description: IC MPU I.MX6D 800MHZ 569MAPBGA Packaging: Tray Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 189 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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N74F02D,623 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14-SO Part Status: Active Packaging: Bulk |
auf Bestellung 13800 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7751HN/N208W/SK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SAF7751HN/N208W/MP | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5742PFK1AMLQ9557 | NXP USA Inc. |
Description: MPC574XP MICROCONTROLLER POWER A Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BZX79-C36143 | NXP USA Inc. |
Description: NOW NEXPERIA BZX79-C36 - ZENER D Part Status: Active Packaging: Bulk Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 400 mW Supplier Device Package: ALF2 Impedance (Max) (Zzt): 90 Ohms Voltage - Zener (Nom) (Vz): 36 V Operating Temperature: -65°C ~ 200°C (TJ) Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Tolerance: ±5% |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 15000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G-VNP-RDB3 | NXP USA Inc. |
Description: VEHICLE NETWORKING REFERENCE DES Part Status: Active Utilized IC / Part: S32G3 Board Type: Single Board Computers (SBC) Core Processor: ARM® Cortex®-A53, Cortex®-M7 Contents: Board(s), Cable(s), Power Supply, Accessories Type: MPU Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BF1108,215 | NXP USA Inc. |
Description: BF1108 - SILICON RF SWITCHES Packaging: Bulk Part Status: Active |
auf Bestellung 11230 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVC64AMKHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: S12Z EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVC64AMKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: S12Z EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVCA19AMKH | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFP Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 16x12b SAR; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVC12F0MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 16x10b; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVC19F0MKH | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 16x10b; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVC19F0MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 16x10b; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVC12F0MKH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 42 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Core Size: 16-Bit Data Converters: A/D 16x10b; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F574D,623 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 65 mA Current - Output High, Low: 3mA, 24mA Trigger Type: Positive Edge Clock Frequency: 180 MHz Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F574D,623 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 65 mA Current - Output High, Low: 3mA, 24mA Trigger Type: Positive Edge Clock Frequency: 180 MHz Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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N74F574D,623 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 65 mA Current - Output High, Low: 3mA, 24mA Trigger Type: Positive Edge Clock Frequency: 180 MHz Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
auf Bestellung 8695 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F574D,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 65 mA Current - Output High, Low: 3mA, 24mA Trigger Type: Positive Edge Clock Frequency: 180 MHz Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
auf Bestellung 4750 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7751HV/N205/SCK | NXP USA Inc. |
Description: CAR DISP Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8309VMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGA Part Status: Obsolete Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 417MHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LM75B-PCT2202 | NXP USA Inc. |
Description: LM75B-PCT2202 Part Status: Last Time Buy Sensing Temperature - Local: -55°C ~ 125°C Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Resolution: 11 b Sensor Type: Digital, Local Voltage - Supply: 2.8V ~ 5.5V Operating Temperature: -55°C ~ 125°C (TA) Output Type: I2C Features: Programmable Limit, Shutdown Mode Packaging: Bulk |
Produkt ist nicht verfügbar |
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| KCHC908GR8MFAE | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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MIMXRT1021CAG4BR | NXP USA Inc. |
Description: IC MCU 32BIT 96KB ROM 144LQFP Packaging: Tape & Reel (TR) Part Status: Active Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 400MHz Program Memory Size: 96KB (96K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 19x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 96 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MIMXRT1021DAG5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 144LQFP RAM Size: 256K x 8 Speed: 500MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray Number of I/O: 96 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 19x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) DigiKey Programmable: Not Verified |
auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1021DAF5B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 100LQFP Number of I/O: 57 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) RAM Size: 256K x 8 Speed: 500MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 149 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1021CAG4B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 144LQFP Number of I/O: 96 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 19x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal DigiKey Programmable: Not Verified Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 256K x 8 Speed: 400MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1021CAF4B | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 100LQFP Number of I/O: 57 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: External Program Memory Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 256K x 8 Speed: 400MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1PS300/ZLX | NXP USA Inc. |
Description: DIODE SW 85V 170MA SC-70 Current - Reverse Leakage @ Vr: 500 nA @ 80 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA Voltage - DC Reverse (Vr) (Max): 85 V Part Status: Obsolete Operating Temperature - Junction: 150°C (Max) Supplier Device Package: SC-70 Current - Average Rectified (Io) (per Diode): 170mA (DC) Diode Configuration: 1 Pair Common Anode Technology: Standard Reverse Recovery Time (trr): 4 ns Speed: Small Signal =< 200mA (Io), Any Speed Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC33981ADHFK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 16QFN Features: Slew Rate Controlled, Status Flag, Watchdog Timer Packaging: Tray Package / Case: 16-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off, PWM Switch Type: Relay, Solenoid Driver Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 6mOhm (Max) Input Type: Non-Inverting Voltage - Load: 4.5V ~ 27V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 40A Ratio - Input:Output: 1:1 Supplier Device Package: 16-PQFN (12x12) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO Part Status: Active |
Produkt ist nicht verfügbar |
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MC33981ADHFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 16QFN Features: Slew Rate Controlled, Status Flag, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 16-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off, PWM Switch Type: Relay, Solenoid Driver Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 6mOhm (Max) Input Type: Non-Inverting Voltage - Load: 4.5V ~ 27V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 40A Ratio - Input:Output: 1:1 Supplier Device Package: 16-PQFN (12x12) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F8322MFAE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 32KB (16K x 16) RAM Size: 6K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: CANbus, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 21 DigiKey Programmable: Verified |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G175GN,132 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6XSON Number of Bits per Element: 1 Part Status: Active Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Supplier Device Package: 6-XSON (0.9x1) Input Capacitance: 2.5 pF Clock Frequency: 200 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 32mA Current - Quiescent (Iq): 40 µA Voltage - Supply: 1.65V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Type: D-Type Function: Reset Number of Elements: 1 Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 6-XFDFN Packaging: Bulk |
auf Bestellung 94945 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1023ASN8PQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| T2081NSN8P1B | NXP USA Inc. |
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFN Control Interface: I²C Part Status: Obsolete Supplier Device Package: 32-HVQFN (3x6) Applications: Video Display Voltage - Supply: 3.0V ~ 3.6V Function: Multiplexer Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 81045 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDF19971AHN/C1,551 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Part Status: Obsolete Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| FRDM-33664AEVM | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD - MC3366 Packaging: Bulk Part Status: Obsolete Embedded: Yes, MCU, 32-Bit Supplied Contents: Board(s) Utilized IC / Part: MC33664 Type: Power Management Function: Battery Cell Controller |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FS32K148HET0MMHT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Number of I/O: 89 Part Status: Active Supplier Device Package: 100-MAPBGA (11x11) Peripherals: I²S, POR, PWM, WDT Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| KIT908-5643EVM | NXP USA Inc. |
Description: EVAL BOARD FOR MC33908 MPC564XL Part Status: Active Embedded: Yes, MCU, 32-Bit Supplied Contents: Board(s) Utilized IC / Part: MC33908, MPC564xL Type: Interface Function: System Basis Chip (SBC) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFMAJ43LT3LT | NXP USA Inc. |
Description: QORIVVA MPC5643L 257 PIN 0.8MM P Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFMAJ43LT3A | NXP USA Inc. |
Description: QORIVVA MPC5643L 257 PIN 0.8MM P Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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NTS0102TL-Q100H | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NTS0102TL-Q100H | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3666 Stücke: Lieferzeit 10-14 Tag (e) |
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NTS0102TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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NTS0102TLH | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open Drain, Push-Pull, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON (2x3) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 8176 Stücke: Lieferzeit 10-14 Tag (e) |
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| RDW8897-SDSD-S1 | NXP USA Inc. |
Description: RDW8897-SDSD-S1 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MPC8260AVVMHBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Bulk Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F8155VFGE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 128LQFP DigiKey Programmable: Not Verified Number of I/O: 49 Part Status: Active Supplier Device Package: 128-LQFP (14x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 16 Program Memory Size: 256KB (128K x 16) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 128-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC34903CP3EK | NXP USA Inc. |
Description: IC SWITCH HIGH SIDE 32SOIC Part Status: Obsolete Supplier Device Package: 32-SOIC-EP Current - Supply: 2mA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12C64CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP DigiKey Programmable: Not Verified Number of I/O: 60 Part Status: Active Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FXTH87EH026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Output Type: RF Packaging: Tape & Reel (TR) Part Status: Obsolete Sensor Type: Tire Pressure Monitoring (TPMS) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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FXTH87EH026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Part Status: Obsolete Sensor Type: Tire Pressure Monitoring (TPMS) Output Type: RF Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC9S12DT256MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP DigiKey Programmable: Not Verified Number of I/O: 59 Part Status: Active Supplier Device Package: 80-QFP (14x14) Peripherals: PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SAF7751HV/N208WY | NXP USA Inc. |
Description: MULTI-TUNER CAR RADIO & AUDIO ON Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MPC8541PXAPF |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12GN32F0MLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF6V3090NR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 50V TO270-4
Current - Test: 350 mA
Voltage - Test: 50 V
Voltage - Rated: 110 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 22dB
Power - Output: 18W
Frequency: 860MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LD6836CX4/25P,315 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Description: IC REG LINEAR 2.5V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
auf Bestellung 17957 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2664+ | 0.21 EUR |
| MK10DX64VLK7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80FQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Description: IC MCU 32BIT 64KB FLASH 80FQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Active
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 31x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D7CZK08AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| N74F02D,623 |
|
auf Bestellung 13800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2420+ | 0.24 EUR |
| SPC5742PFK1AMLQ9557 |
|
Hersteller: NXP USA Inc.
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Description: MPC574XP MICROCONTROLLER POWER A
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX79-C36143 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Description: NOW NEXPERIA BZX79-C36 - ZENER D
Part Status: Active
Packaging: Bulk
Current - Reverse Leakage @ Vr: 50 nA @ 25.2 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 400 mW
Supplier Device Package: ALF2
Impedance (Max) (Zzt): 90 Ohms
Voltage - Zener (Nom) (Vz): 36 V
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Produkt ist nicht verfügbar
Mindestbestellmenge: 15000 Stücke
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| S32G-VNP-RDB3 |
|
Hersteller: NXP USA Inc.
Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
Description: VEHICLE NETWORKING REFERENCE DES
Part Status: Active
Utilized IC / Part: S32G3
Board Type: Single Board Computers (SBC)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BF1108,215 |
|
auf Bestellung 11230 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1082+ | 0.58 EUR |
| S912ZVC64AMKHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| S912ZVC64AMKH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| S912ZVCA19AMKH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVC12F0MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
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| S912ZVC19F0MKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVC19F0MKHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 192KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVC12F0MKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| N74F574D,623 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F574D,623 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| N74F574D,623 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 8695 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1924+ | 0.33 EUR |
| N74F574D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 65 mA
Current - Output High, Low: 3mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 180 MHz
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 4750 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1776+ | 0.32 EUR |
| MPC8309VMAHFCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 417MHz
Description: IC MPU MPC83XX 417MHZ 489BGA
Part Status: Obsolete
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 417MHz
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LM75B-PCT2202 |
Hersteller: NXP USA Inc.
Description: LM75B-PCT2202
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Output Type: I2C
Features: Programmable Limit, Shutdown Mode
Packaging: Bulk
Description: LM75B-PCT2202
Part Status: Last Time Buy
Sensing Temperature - Local: -55°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Resolution: 11 b
Sensor Type: Digital, Local
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Output Type: I2C
Features: Programmable Limit, Shutdown Mode
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1021CAG4BR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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Stück im Wert von UAH
| MIMXRT1021DAG5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 144LQFP
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 144LQFP
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
DigiKey Programmable: Not Verified
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.57 EUR |
| 10+ | 12.07 EUR |
| 25+ | 11.19 EUR |
| 100+ | 10.22 EUR |
| MIMXRT1021DAF5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 256K x 8
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.74 EUR |
| 10+ | 10.6 EUR |
| 25+ | 9.82 EUR |
| 100+ | 8.95 EUR |
| MIMXRT1021CAG4B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 144LQFP
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT EXT MEM 144LQFP
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 19x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
DigiKey Programmable: Not Verified
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.8 EUR |
| 10+ | 13.04 EUR |
| 25+ | 12.1 EUR |
| MIMXRT1021CAF4B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 100LQFP
Number of I/O: 57
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: External Program Memory
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 256K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1PS300/ZLX |
Hersteller: NXP USA Inc.
Description: DIODE SW 85V 170MA SC-70
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 85 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SC-70
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Description: DIODE SW 85V 170MA SC-70
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 85 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C (Max)
Supplier Device Package: SC-70
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Standard
Reverse Recovery Time (trr): 4 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33981ADHFK |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33981ADHFKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled, Status Flag, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off, PWM
Switch Type: Relay, Solenoid Driver
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 4.5V ~ 27V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F8322MFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 6K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 50.18 EUR |
| 10+ | 40.39 EUR |
| 50+ | 36.46 EUR |
| 100+ | 35.25 EUR |
| 74LVC1G175GN,132 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Supplier Device Package: 6-XSON (0.9x1)
Input Capacitance: 2.5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 32mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Number of Bits per Element: 1
Part Status: Active
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Supplier Device Package: 6-XSON (0.9x1)
Input Capacitance: 2.5 pF
Clock Frequency: 200 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 32mA
Current - Quiescent (Iq): 40 µA
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 94945 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2882+ | 0.2 EUR |
| LS1023ASN8PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| T2081NSN8P1B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04DP211BS,518 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 81045 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 311+ | 2.03 EUR |
| FRDM-33664AEVM |
|
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD - MC3366
Packaging: Bulk
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33664
Type: Power Management
Function: Battery Cell Controller
Description: FREEDOM EXPANSION BOARD - MC3366
Packaging: Bulk
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33664
Type: Power Management
Function: Battery Cell Controller
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148HET0MMHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: I²S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 880 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KIT908-5643EVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33908 MPC564XL
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33908, MPC564xL
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Description: EVAL BOARD FOR MC33908 MPC564XL
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC33908, MPC564xL
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFMAJ43LT3LT |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFMAJ43LT3A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
Description: QORIVVA MPC5643L 257 PIN 0.8MM P
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTS0102TL-Q100H |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| NTS0102TL-Q100H |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3666 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.8 EUR |
| 17+ | 1.3 EUR |
| 25+ | 1.18 EUR |
| 100+ | 1.04 EUR |
| 250+ | 0.96 EUR |
| 500+ | 0.93 EUR |
| 1000+ | 0.89 EUR |
| NTS0102TLH |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4000+ | 0.75 EUR |
| 8000+ | 0.74 EUR |
| NTS0102TLH |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 8176 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.63 EUR |
| 18+ | 1.18 EUR |
| 25+ | 1.06 EUR |
| 100+ | 0.93 EUR |
| 250+ | 0.87 EUR |
| 500+ | 0.83 EUR |
| 1000+ | 0.8 EUR |
| MPC8260AVVMHBB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Bulk
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 471.25 EUR |
| MC56F8155VFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 16
Program Memory Size: 256KB (128K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
Description: IC MCU 16BIT 256KB FLASH 128LQFP
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 128-LQFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 16
Program Memory Size: 256KB (128K x 16)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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| MC34903CP3EK |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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| MC9S12C64CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 60
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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| FXTH87EH026T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Output Type: RF
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Output Type: RF
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXTH87EH026T1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Output Type: RF
Packaging: Cut Tape (CT)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Part Status: Obsolete
Sensor Type: Tire Pressure Monitoring (TPMS)
Output Type: RF
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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| MC9S12DT256MFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Description: IC MCU 16BIT 256KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Part Status: Active
Supplier Device Package: 80-QFP (14x14)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SAF7751HV/N208WY |
Hersteller: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Bulk
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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