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SPC5607BAVLU6 SPC5607BAVLU6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5603BAVLQ4R SPC5603BAVLQ4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
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MPC8313VRAFF MPC8313VRAFF NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
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MCF5281CVM66J MCF5281CVM66J NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
Produkt ist nicht verfügbar
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MC68SEC000AA20R2 MC68SEC000AA20R2 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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MC68HC908GR4CFAE MC68HC908GR4CFAE NXP USA Inc. MC68HC908GR8,4.pdf Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MPC8308VMAGD MPC8308VMAGD NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Produkt ist nicht verfügbar
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SAF7751HN/N207WMP NXP USA Inc. Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BC847QASX BC847QASX NXP USA Inc. Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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T1024NXE7MQA557 NXP USA Inc. Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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NX6020NBKS115 NX6020NBKS115 NXP USA Inc. NX6020CAKS.pdf Description: MOSFET N-CH
Part Status: Active
Packaging: Bulk
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.16 EUR
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BUK98180-100A,115 BUK98180-100A,115 NXP USA Inc. BUK98180-100A.pdf Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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MPC5553MVZ132 MPC5553MVZ132 NXP USA Inc. MPC5553.pdf Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
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1+116.69 EUR
10+96.93 EUR
25+91.99 EUR
100+86.57 EUR
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PDZ5.1B/ZL115 PDZ5.1B/ZL115 NXP USA Inc. PDZ-B_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
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PDZ5.1B145 PDZ5.1B145 NXP USA Inc. PDZ-B_SER.pdf Description: PDZ5.1B - VOLTAGE REGULATOR DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MK22FN128VDC10 MK22FN128VDC10 NXP USA Inc. K22FPB_Rev.5_Mar3%2C2014_PB.pdf Description: IC MCU 32BIT 128KB FLASH 121BGA
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
Number of I/O: 67
Part Status: Active
Supplier Device Package: 121-BGA (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1595 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.56 EUR
10+7.37 EUR
25+6.82 EUR
80+6.35 EUR
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FS32K146HFT0VLLT FS32K146HFT0VLLT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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PDTA144EE,115 PDTA144EE,115 NXP USA Inc. NEXP-S-A0006011457-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTA144EE,115 PDTA144EE,115 NXP USA Inc. NEXP-S-A0006011457-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PDTA144TK,115 PDTA144TK,115 NXP USA Inc. PDTA144T_SERIES.pdf Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
Produkt ist nicht verfügbar
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BZX884-B15315 NXP USA Inc. Description: DIODE ZENER 12V 0.25W 2% UNIDIR
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
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MMRF1008GHR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GH-2L
Current Rating (Amps): 100µA
Mounting Type: Chassis Mount
Frequency: 900MHz ~ 1.215GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780GH-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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FS32K142UIT0VLHR FS32K142UIT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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FS32K142UIT0VLHT FS32K142UIT0VLHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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PMV25ENEA215 PMV25ENEA215 NXP USA Inc. PMV25ENEA.pdf Description: PMV25E SMALL SIGNAL FET, SOT23
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PSMN7R5-30YLD115 NXP USA Inc. Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5567MVR132 SPC5567MVR132 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
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MCF51JE256CMB MCF51JE256CMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
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FS32K144UIT0VLHR FS32K144UIT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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S9S08RN60W1MLH S9S08RN60W1MLH NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S08RN60W1MLHR S9S08RN60W1MLHR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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MPC8555VTALF MPC8555VTALF NXP USA Inc. MPC8555E.pdf Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Produkt ist nicht verfügbar
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MVF51NN151CMK50 MVF51NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 500MHZ 364LFBGA
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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P3S0200GMX P3S0200GMX NXP USA Inc. P3S0200.pdf Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
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P3S0200GMX P3S0200GMX NXP USA Inc. P3S0200.pdf Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
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74AVCH16245DGG112 74AVCH16245DGG112 NXP USA Inc. 74AVCH16245.pdf Description: NOW NEXPERIA 74AVCH16245DGG - BU
Part Status: Active
Packaging: Bulk
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N74F125N,602 N74F125N,602 NXP USA Inc. DS_568_74F125.pdf Description: IC BUFFER NON-INVERT 5.5V 14DIP
Number of Bits per Element: 1
Number of Elements: 4
Part Status: Obsolete
Supplier Device Package: 14-DIP
Current - Output High, Low: 15mA, 64mA
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
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MPC8349CZUAJDB MPC8349CZUAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FET100K LPC43S30FET100K NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
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MIMXRT1040-EVK MIMXRT1040-EVK NXP USA Inc. getting-started-with-the-mimxrt1040-evk:GS-MIMXRT1040-EVK Description: EVAL KIT I.MX RT1040
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: i.MX RT1040
Board Type: Evaluation Platform
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SLN-TLHMI-IOT SLN-TLHMI-IOT NXP USA Inc. MCU-SMHMI-SDUG.pdf Description: EVAL KIT I.MX RT117H
Part Status: Active
Platform: EdgeReady
Utilized IC / Part: RT117H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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FS32K144HAT0VMHR FS32K144HAT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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FS32K144HFT0MMHT FS32K144HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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MKW22D512VHA5 MKW22D512VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
Serial Interfaces: I2C, JTAG, SPI, UART, USB
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
DigiKey Programmable: Not Verified
Part Status: Active
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74AXP2G34GSH 74AXP2G34GSH NXP USA Inc. 74AXP2G34.pdf Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
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LX2120XE72029B LX2120XE72029B NXP USA Inc. Description: SSL MATRIX CONTROLLER
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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NCX2200GMAZ NCX2200GMAZ NXP USA Inc. NCX2200.pdf Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
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1PS300/ZL115 NXP USA Inc. PHGLS24307-1.pdf?t.download=true&u=5oefqw Description: SIGNAL DIODE
Part Status: Active
Packaging: Bulk
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BGE787B,112 BGE787B,112 NXP USA Inc. BGE787B_Rev4.pdf Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: SOT115J
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MKW21D512VHA5 MKW21D512VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Part Status: Active
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
DigiKey Programmable: Not Verified
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
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MKW21D512VHA5R MKW21D512VHA5R NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tape & Reel (TR)
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MCIMX6L8DVN10ABR MCIMX6L8DVN10ABR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
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LD6806CX4/28P,315 LD6806CX4/28P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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MC9S08DN60ACLH MC9S08DN60ACLH NXP USA Inc. FSCLS07395-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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MC9S08DN60ACLF557 MC9S08DN60ACLF557 NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08DN60ACLC MC9S08DN60ACLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
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MC68LK332GCAG16 MC68LK332GCAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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SSL5031BTS/1X SSL5031BTS/1X NXP USA Inc. Description: IC LED DRIVER OFFL SC74
Part Status: Discontinued at Digi-Key
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 9.5V
Topology: Step-Down (Buck)
Internal Switch(s): Yes
Applications: Lighting
Operating Temperature: -40°C ~ 160°C (TJ)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
Supplier Device Package: SC-74
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74LVC32245AEC,557 74LVC32245AEC,557 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
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SPC5602BK0CLH4 SPC5602BK0CLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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SPC5607BAVLU6 MPC560XBFAMFS.pdf
SPC5607BAVLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
Produkt ist nicht verfügbar
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SPC5603BAVLQ4R
SPC5603BAVLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8313VRAFF MPC8313E_Hrdw_Spec.pdf
MPC8313VRAFF
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCF5281CVM66J MCF5282UM.pdf
MCF5281CVM66J
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
Produkt ist nicht verfügbar
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MC68SEC000AA20R2 MC68SEC000.pdf
MC68SEC000AA20R2
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC68HC908GR4CFAE MC68HC908GR8,4.pdf
MC68HC908GR4CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8308VMAGD MPC8308EC.pdf
MPC8308VMAGD
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Produkt ist nicht verfügbar
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SAF7751HN/N207WMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BC847QASX
BC847QASX
Hersteller: NXP USA Inc.
Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
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T1024NXE7MQA557
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX6020NBKS115 NX6020CAKS.pdf
NX6020NBKS115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH
Part Status: Active
Packaging: Bulk
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2959+0.16 EUR
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BUK98180-100A,115 BUK98180-100A.pdf
BUK98180-100A,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MPC5553MVZ132 MPC5553.pdf
MPC5553MVZ132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
auf Bestellung 1130 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+116.69 EUR
10+96.93 EUR
25+91.99 EUR
100+86.57 EUR
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PDZ5.1B/ZL115 PDZ-B_SER.pdf
PDZ5.1B/ZL115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PDZ5.1B145 PDZ-B_SER.pdf
PDZ5.1B145
Hersteller: NXP USA Inc.
Description: PDZ5.1B - VOLTAGE REGULATOR DIOD
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MK22FN128VDC10 K22FPB_Rev.5_Mar3%2C2014_PB.pdf
MK22FN128VDC10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 121BGA
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
Number of I/O: 67
Part Status: Active
Supplier Device Package: 121-BGA (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1595 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.56 EUR
10+7.37 EUR
25+6.82 EUR
80+6.35 EUR
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FS32K146HFT0VLLT S32K1xx.pdf
FS32K146HFT0VLLT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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PDTA144EE,115 NEXP-S-A0006011457-1.pdf?t.download=true&u=5oefqw
PDTA144EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
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PDTA144EE,115 NEXP-S-A0006011457-1.pdf?t.download=true&u=5oefqw
PDTA144EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
Produkt ist nicht verfügbar
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PDTA144TK,115 PDTA144T_SERIES.pdf
PDTA144TK,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 47 kOhms
Resistors Included: R1 Only
Produkt ist nicht verfügbar
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BZX884-B15315
Hersteller: NXP USA Inc.
Description: DIODE ZENER 12V 0.25W 2% UNIDIR
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DFN1006-2
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 10.5 V
Produkt ist nicht verfügbar
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MMRF1008GHR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GH-2L
Current Rating (Amps): 100µA
Mounting Type: Chassis Mount
Frequency: 900MHz ~ 1.215GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780GH-2L
Part Status: Last Time Buy
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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FS32K142UIT0VLHR S32K1xx.pdf
FS32K142UIT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K142UIT0VLHT S32K-DS.pdf
FS32K142UIT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMV25ENEA215 PMV25ENEA.pdf
PMV25ENEA215
Hersteller: NXP USA Inc.
Description: PMV25E SMALL SIGNAL FET, SOT23
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PSMN7R5-30YLD115
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SPC5567MVR132
SPC5567MVR132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JE256CMB MCF51JE256.pdf
MCF51JE256CMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
Produkt ist nicht verfügbar
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FS32K144UIT0VLHR S32K1xx.pdf
FS32K144UIT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08RN60W1MLH S9S08RN60DS.pdf
S9S08RN60W1MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S08RN60W1MLHR S9S08RN60DS.pdf
S9S08RN60W1MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8555VTALF MPC8555E.pdf
MPC8555VTALF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Produkt ist nicht verfügbar
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MVF51NN151CMK50 VYBRIDFSERIESEC.pdf
MVF51NN151CMK50
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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1+63.34 EUR
10+51.66 EUR
90+45.73 EUR
180+44.51 EUR
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P3S0200GMX P3S0200.pdf
P3S0200GMX
Hersteller: NXP USA Inc.
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
Produkt ist nicht verfügbar
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P3S0200GMX P3S0200.pdf
P3S0200GMX
Hersteller: NXP USA Inc.
Description: IC BUS SW 2X1:2,2X2:1 10-XQFN
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
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14+1.28 EUR
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74AVCH16245DGG112 74AVCH16245.pdf
74AVCH16245DGG112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH16245DGG - BU
Part Status: Active
Packaging: Bulk
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N74F125N,602 DS_568_74F125.pdf
N74F125N,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Number of Bits per Element: 1
Number of Elements: 4
Part Status: Obsolete
Supplier Device Package: 14-DIP
Current - Output High, Low: 15mA, 64mA
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Logic Type: Buffer, Non-Inverting
Produkt ist nicht verfügbar
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MPC8349CZUAJDB MPC8349EAEC.pdf
MPC8349CZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LPC43S30FET100K LPC43S50_30_20.pdf
LPC43S30FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 49
Part Status: Active
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
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2+14.89 EUR
10+11.68 EUR
25+10.87 EUR
100+9.99 EUR
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MIMXRT1040-EVK getting-started-with-the-mimxrt1040-evk:GS-MIMXRT1040-EVK
MIMXRT1040-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT1040
Core Processor: ARM® Cortex®-M7
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Utilized IC / Part: i.MX RT1040
Board Type: Evaluation Platform
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SLN-TLHMI-IOT MCU-SMHMI-SDUG.pdf
SLN-TLHMI-IOT
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT117H
Part Status: Active
Platform: EdgeReady
Utilized IC / Part: RT117H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Contents: Board(s), Cable(s)
Type: MCU
Mounting Type: Fixed
Packaging: Bulk
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FS32K144HAT0VMHR S32K1xx.pdf
FS32K144HAT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144HFT0MMHT S32K1xx.pdf
FS32K144HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 89
Part Status: Active
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MKW22D512VHA5 MKW2xDxxx.pdf
MKW22D512VHA5
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
Serial Interfaces: I2C, JTAG, SPI, UART, USB
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
DigiKey Programmable: Not Verified
Part Status: Active
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2+17.28 EUR
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74AXP2G34GSH 74AXP2G34.pdf
74AXP2G34GSH
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Part Status: Active
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
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LX2120XE72029B
LX2120XE72029B
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Part Status: Active
SATA: SATA 3.0 (4)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: Yes
RAM Controllers: DDR4
Number of Cores/Bus Width: 12 Core, 64-Bit
USB: USB 3.0 (2) + PHY (2)
Ethernet: 100Gbps (2)
Supplier Device Package: 1517-FCPBGA (40x40)
Voltage - I/O: 1.2V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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NCX2200GMAZ NCX2200.pdf
NCX2200GMAZ
Hersteller: NXP USA Inc.
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
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31+0.58 EUR
44+0.4 EUR
50+0.36 EUR
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1PS300/ZL115 PHGLS24307-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SIGNAL DIODE
Part Status: Active
Packaging: Bulk
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8876+0.053 EUR
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BGE787B,112 BGE787B_Rev4.pdf
BGE787B,112
Hersteller: NXP USA Inc.
Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: SOT115J
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10+53.87 EUR
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MKW21D512VHA5 MKW2xDxxx.pdf
MKW21D512VHA5
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Part Status: Active
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
DigiKey Programmable: Not Verified
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tray
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2+16.53 EUR
10+14.35 EUR
25+13.6 EUR
100+12.56 EUR
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520+11.48 EUR
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MKW21D512VHA5R MKW2xDxxx.pdf
MKW21D512VHA5R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 2
Supplier Device Package: 63-MAPLGA (8x8)
Current - Transmitting: 19mA
Data Rate (Max): 250kbps
Current - Receiving: 15mA
Protocol: Zigbee®
Power - Output: 8dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 63-VFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6L8DVN10ABR IMX6SLCEC.pdf
MCIMX6L8DVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LD6806CX4/28P,315 LD6806_Series.pdf
LD6806CX4/28P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
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3328+0.15 EUR
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MC9S08DN60ACLH FSCLS07395-1.pdf?t.download=true&u=5oefqw
MC9S08DN60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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33+15.21 EUR
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MC9S08DN60ACLF557 MC9S08DN60AD.pdf
MC9S08DN60ACLF557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08DN60ACLC MC9S08DN60.pdf
MC9S08DN60ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC68LK332GCAG16 MC68332TS.pdf
MC68LK332GCAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 16.78MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SSL5031BTS/1X
SSL5031BTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SC74
Part Status: Discontinued at Digi-Key
Voltage - Supply (Max): 16V
Voltage - Supply (Min): 9.5V
Topology: Step-Down (Buck)
Internal Switch(s): Yes
Applications: Lighting
Operating Temperature: -40°C ~ 160°C (TJ)
Type: AC DC Offline Switcher
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
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74LVC32245AEC,557 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,557
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Part Status: Active
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
auf Bestellung 15535 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
89+5.44 EUR
Mindestbestellmenge: 89 Stücke
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SPC5602BK0CLH4
SPC5602BK0CLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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