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A5G37H110NT4 NXP USA Inc. A5G37H110N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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A5G35H110NT4 NXP USA Inc. A5G35H110N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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MC9S08SH16CTG,574 MC9S08SH16CTG,574 NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08SH16CTLR MC9S08SH16CTLR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF9002NR2 NXP USA Inc. MRF9002NR2.pdf Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2 NXP USA Inc. Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY NXP USA Inc. Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM NXP USA Inc. Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR S9S12HY64J0CLLR NXP USA Inc. MC9S12HY64RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP MC68LK332GCAG16-NXP NXP USA Inc. FSCLS03151-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMI1QFN/RP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 74AHCT2G126GD,125 NXP USA Inc. PHGLS27955-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 68069 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
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74AHCT2G241DP125 NXP USA Inc. 74AHC_AHCT2G241.pdf Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3087 Stücke:
Lieferzeit 10-14 Tag (e)
1567+0.33 EUR
Mindestbestellmenge: 1567
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74AHCT2G125GD,125-NX NXP USA Inc. Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836TD/36H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
2885+0.17 EUR
Mindestbestellmenge: 2885
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LD6836TD/22H,125 LD6836TD/22H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
2885+0.17 EUR
Mindestbestellmenge: 2885
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74HCT2G08DP 74HCT2G08DP NXP USA Inc. PHGLS18956-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
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BZX79-C51143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.034 EUR
Mindestbestellmenge: 15000
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BZX79-C56133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C56 - ZENER D
Produkt ist nicht verfügbar
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BAP51L,315 BAP51L,315 NXP USA Inc. BAP51L_1.pdf Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC35FS6511NAER2 MC35FS6511NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511NAE MC35FS6511NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39 NXP USA Inc. RAPIDRF-26E39.pdf Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+1532.27 EUR
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PCAL6408AHK NXP USA Inc. PCAL6408A.pdf Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE MC9S08AW16MFUE NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)
36+15.08 EUR
Mindestbestellmenge: 36
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BZV90-C56115 BZV90-C56115 NXP USA Inc. BZV90.pdf Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)
1990+0.27 EUR
Mindestbestellmenge: 1990
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74AHCT374D118 74AHCT374D118 NXP USA Inc. 74AHC_AHCT374.pdf Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
auf Bestellung 2000 Stücke:
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1348+0.37 EUR
Mindestbestellmenge: 1348
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MCIMX537CVP8C2 MCIMX537CVP8C2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
auf Bestellung 419 Stücke:
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1+102.45 EUR
10+84.85 EUR
84+76.13 EUR
168+74.25 EUR
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HOMEKIT-SDK NXP USA Inc. HMKITSDKFS.pdf Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR S912XEQ512BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVAA S912XEQ512BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816CX4/33P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMI2QFN/LP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
3806+0.13 EUR
Mindestbestellmenge: 3806
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UBA2211AT/N1,518 UBA2211AT/N1,518 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502BS,157 NXP USA Inc. PCA9502.pdf Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169AF-EVB UJA1169AF-EVB NXP USA Inc. UM11758.pdf Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+129.99 EUR
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PHPT60603PY115 PHPT60603PY115 NXP USA Inc. PHPT60603PY.pdf Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC13202FC MC13202FC NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA24S08AD PCA24S08AD NXP USA Inc. PHGLS20439-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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PCA24S08AD112 NXP USA Inc. Description: EEPROM 1MX8
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PCA24S08AD,112 PCA24S08AD,112 NXP USA Inc. PCA24S08A.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 636 Stücke:
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MC56F80746MLF MC56F80746MLF NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC56F80646VLF MC56F80646VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80626VLF MC56F80626VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80736VLF MC56F80736VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80746VLF MC56F80746VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F80726VLF MC56F80726VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
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MC56F8027VLHR MC56F8027VLHR NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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BLF7G24L-100,112 BLF7G24L-100,112 NXP USA Inc. PHGLS23273-1.pdf?t.download=true&u=5oefqw Description: RF TRANSISTOR
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MPC860ENCVR66D4 MPC860ENCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
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NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 2500 Stücke:
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MC68HC908QY4CDTE MC68HC908QY4CDTE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2880 Stücke:
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74CBTLVD3245DS,118 74CBTLVD3245DS,118 NXP USA Inc. 74CBTLVD3245_Rev_Mar2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
auf Bestellung 1482 Stücke:
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1110+0.45 EUR
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MC33FS8530A1ESR2 NXP USA Inc. FS84QFN48EP.pdf Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BK0VLQ6 SPC5606BK0VLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5G37H110NT4 A5G37H110N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
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A5G35H110NT4 A5G35H110N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
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MC9S08SH16CTG,574 MC9S08SH32.pdf
MC9S08SH16CTG,574
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08SH16CTLR MC9S08SH32.pdf
MC9S08SH16CTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF9002NR2 MRF9002NR2.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY
Hersteller: NXP USA Inc.
Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: PT2000
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR MC9S12HY64RMV1.pdf
S9S12HY64J0CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP FSCLS03151-1.pdf?t.download=true&u=5oefqw
MC68LK332GCAG16-NXP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RP,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 PHGLS27955-1.pdf?t.download=true&u=5oefqw
74AHCT2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
auf Bestellung 68069 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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74AHCT2G241DP125 74AHC_AHCT2G241.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-TSSOP
Part Status: Active
auf Bestellung 3087 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.33 EUR
Mindestbestellmenge: 1567
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74AHCT2G125GD,125-NX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836.pdf
LD6836TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2885+0.17 EUR
Mindestbestellmenge: 2885
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LD6836TD/22H,125 LD6836.pdf
LD6836TD/22H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2885+0.17 EUR
Mindestbestellmenge: 2885
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74HCT2G08DP PHGLS18956-1.pdf?t.download=true&u=5oefqw
74HCT2G08DP
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
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BZX79-C51143 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.034 EUR
Mindestbestellmenge: 15000
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BZX79-C56133 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
Produkt ist nicht verfügbar
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BAP51L,315 BAP51L_1.pdf
BAP51L,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006-2
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Produkt ist nicht verfügbar
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MC35FS6511NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6511NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC35FS6511NAE 35FS4500-35FS6500SDS.pdf
MC35FS6511NAE
Hersteller: NXP USA Inc.
Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39.pdf
RAPIDRF-26E39
Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Packaging: Bulk
Frequency: 2.496GHz ~ 2.69GHz
Type: Front End
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1532.27 EUR
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PCAL6408AHK PCAL6408A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
MC9S08AW16MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 163 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
36+15.08 EUR
Mindestbestellmenge: 36
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BZV90-C56115 BZV90.pdf
BZV90-C56115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1990+0.27 EUR
Mindestbestellmenge: 1990
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74AHCT374D118 74AHC_AHCT374.pdf
74AHCT374D118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Number of Bits per Element: 8
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1348+0.37 EUR
Mindestbestellmenge: 1348
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MCIMX537CVP8C2 IMX53IEC.pdf
MCIMX537CVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
auf Bestellung 419 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+102.45 EUR
10+84.85 EUR
84+76.13 EUR
168+74.25 EUR
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HOMEKIT-SDK HMKITSDKFS.pdf
Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR MC9S12XEPB.pdf
S912XEQ512BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVAA MC9S12XEPB.pdf
S912XEQ512BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816.pdf
LD6816CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3806+0.13 EUR
Mindestbestellmenge: 3806
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UBA2211AT/N1,518 UBA2211.pdf
UBA2211AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 900mA
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502.pdf
PCA9502BS,157
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SPI
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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UJA1169AF-EVB UM11758.pdf
UJA1169AF-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+129.99 EUR
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PHPT60603PY115 PHPT60603PY.pdf
PHPT60603PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC13202FC MC13202.pdf
MC13202FC
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA24S08AD PHGLS20439-1.pdf?t.download=true&u=5oefqw
PCA24S08AD
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4264 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
740+0.67 EUR
Mindestbestellmenge: 740
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PCA24S08AD112
Hersteller: NXP USA Inc.
Description: EEPROM 1MX8
Produkt ist nicht verfügbar
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PCA24S08AD,112 PCA24S08A.pdf
PCA24S08AD,112
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1839 Stücke:
Lieferzeit 10-14 Tag (e)
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 636 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.62 EUR
10+3.45 EUR
25+3.26 EUR
50+3.12 EUR
100+3 EUR
500+2.75 EUR
Mindestbestellmenge: 5
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MC56F80746MLF MC56F80XXX.pdf
MC56F80746MLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
100+7.39 EUR
250+7.05 EUR
500+6.85 EUR
1000+6.68 EUR
Mindestbestellmenge: 2
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MC56F80646VLF MC56F80XXX.pdf
MC56F80646VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80626VLF MC56F80XXX.pdf
MC56F80626VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80736VLF MC56F80XXX.pdf
MC56F80736VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80746VLF MC56F80XXX.pdf
MC56F80746VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F80726VLF MC56F80XXX.pdf
MC56F80726VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
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MC56F8027VLHR MC56F8037.pdf
MC56F8027VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 2892 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.2 EUR
10+18.3 EUR
25+17.07 EUR
100+15.72 EUR
250+15.08 EUR
500+14.69 EUR
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BLF7G24L-100,112 PHGLS23273-1.pdf?t.download=true&u=5oefqw
BLF7G24L-100,112
Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
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Anzahl Preis
6+96.04 EUR
Mindestbestellmenge: 6
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MPC860ENCVR66D4 MPC860EC.pdf
MPC860ENCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+320.54 EUR
Mindestbestellmenge: 2
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NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.75 EUR
10+2.46 EUR
25+2.34 EUR
100+1.92 EUR
250+1.79 EUR
500+1.59 EUR
1000+1.25 EUR
Mindestbestellmenge: 7
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MC68HC908QY4CDTE MC68HLC908QY4.pdf
MC68HC908QY4CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2880 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.67 EUR
10+9.02 EUR
96+7.65 EUR
192+7.38 EUR
288+7.24 EUR
576+7.04 EUR
1056+6.9 EUR
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74CBTLVD3245DS,118 74CBTLVD3245_Rev_Mar2017.pdf
74CBTLVD3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
auf Bestellung 1482 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1110+0.45 EUR
Mindestbestellmenge: 1110
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MC33FS8530A1ESR2 FS84QFN48EP.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5606BK0VLQ6 MPC5606B.pdf
SPC5606BK0VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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