Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 463 nach 607
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MC56F80646VLF | NXP USA Inc. |
Description: IC DIGITAL SIGNAL CTRL LQFP48 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F80626VLF | NXP USA Inc. |
Description: IC DIGITAL SIGNAL CTRL LQFP48 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F80736VLF | NXP USA Inc. |
Description: IC DIGITAL SIGNAL CTRL LQFP48 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F80746VLF | NXP USA Inc. |
Description: IC DIGITAL SIGNAL CTRL LQFP48 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F80726VLF | NXP USA Inc. |
Description: IC DIGITAL SIGNAL CTRL LQFP48 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC56F8027VLHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 53 Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 16x12b; D/A 2x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 16 Program Memory Size: 32KB (16K x 16) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
auf Bestellung 2892 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF7G24L-100,112 | NXP USA Inc. |
Description: RF TRANSISTOR |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860ENCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAAdditional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Speed: 66MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TA) |
auf Bestellung 123 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Channel Type: Bidirectional Supplier Device Package: 16-WLCSP (1.84x1.87) Data Rate: 104Mbps Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 16-UFBGA, WLCSP Packaging: Tape & Reel (TR) Number of Circuits: 1 Part Status: Active Voltage - VCCB: 1.65 V ~ 3.6 V Voltage - VCCA: 1.08 V ~ 1.95 V Channels per Circuit: 6 Translator Type: Voltage Level |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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NVT4858UKZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 16WLCSP Number of Circuits: 1 Part Status: Active Voltage - VCCB: 1.65 V ~ 3.6 V Voltage - VCCA: 1.08 V ~ 1.95 V Channels per Circuit: 6 Translator Type: Voltage Level Channel Type: Bidirectional Supplier Device Package: 16-WLCSP (1.84x1.87) Data Rate: 104Mbps Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 16-UFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68HC908QY4CDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Verified |
auf Bestellung 2580 Stücke: Lieferzeit 10-14 Tag (e) |
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74CBTLVD3245DS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPPart Status: Obsolete Supplier Device Package: 20-SSOP Voltage Supply Source: Single Supply Independent Circuits: 1 Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: Bus Switch Circuit: 8 x 1:1 Mounting Type: Surface Mount Package / Case: 20-SSOP (0.154", 3.90mm Width) Packaging: Bulk |
auf Bestellung 1482 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33FS8530A1ESR2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8500Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5606BK0VLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFPNumber of I/O: 121 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 15x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 80K x 8 Program Memory Size: 1MB (1M x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74ALVCH16373DL,118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2Part Status: Active Supplier Device Package: 48-SSOP Delay Time - Propagation: 2.1ns Current - Output High, Low: 24mA, 24mA Independent Circuits: 2 Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Logic Type: D-Type Transparent Latch Circuit: 8:8 Mounting Type: Surface Mount Output Type: Tri-State Package / Case: 48-BSSOP (0.295", 7.50mm Width) Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJD203A,127 | NXP USA Inc. |
Description: TRANS NPN 425V 4A TO-220ABPower - Max: 80 W Voltage - Collector Emitter Breakdown (Max): 425 V Current - Collector (Ic) (Max): 4 A Supplier Device Package: TO-220AB DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V Current - Collector Cutoff (Max): 100µA Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Through Hole Package / Case: TO-220-3 Packaging: Bulk |
auf Bestellung 1499 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJD103AD,118 | NXP USA Inc. |
Description: NOW WEEN - BUJD103AD - POWER BIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MPC860ENVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAAdditional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TA) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Bulk |
auf Bestellung 2997 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX79-B36,133 | NXP USA Inc. |
Description: DIODE ZENER 36V 400MW ALF2 |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041AY | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNMounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz DigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041AMK | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNDigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 2440 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041AMY | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFNDigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4, Bluetooth GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.4mA ~ 20.3mA Data Rate (Max): 2Mbps Current - Receiving: 4.3mA Protocol: Bluetooth v5.0, Thread, Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5634MF2MMG80 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 208MAPBGAPackaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 94K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 34x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Part Status: Active Number of I/O: 80 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| IMXEBOOKDC4 | NXP USA Inc. |
Description: KIT EVAL Packaging: Bulk For Use With/Related Products: i.MX 6SoloLite Accessory Type: Electronic Paper Display (EPD) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MCZ33905CS5EKR2,518 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCZ33905CD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOICSupplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCZ33905CS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICSupplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCZ33905CS5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Tape & Reel (TR) Supplier Device Package: 32-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC908GR16MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVCH32373AEC/G557 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Supplier Device Package: 96-LFBGA (13.5x5.5) Delay Time - Propagation: 3ns Current - Output High, Low: 24mA, 24mA Independent Circuits: 4 Voltage - Supply: 1.2V ~ 3.6V Operating Temperature: -40°C ~ 85°C Logic Type: D-Type Transparent Latch Circuit: 8:8 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 96-LFBGA |
auf Bestellung 8191 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVCH32373AEC/G551 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KIT10XS6225EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS6225 12 Part Status: Active Supplied Contents: Board(s) Utilized IC / Part: MC10XS6225 Type: Power Management Function: Power Distribution Switch (Load Switch) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KIT10XS6200EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS6200 12 Part Status: Active Supplied Contents: Board(s) Utilized IC / Part: MC10XS6200 Type: Power Management Function: Power Distribution Switch (Load Switch) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KIT25XS6300EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC25XS6300 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| LFVBBM34QA | NXP USA Inc. |
Description: MPC5534 EVAL BRD Packaging: Box Part Status: Obsolete Utilized IC / Part: MPC5534 Board Type: Evaluation Platform Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BYV415K-600PQ127 | NXP USA Inc. |
Description: DIODEPart Status: Active Packaging: Bulk |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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PDZ27B/ZL115 | NXP USA Inc. |
Description: DIODE ZENER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912B32E4CFUE8R | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 63 Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: CPU12 EEPROM Size: 768 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74AUP1G386GF,132 | NXP USA Inc. |
Description: IC GATE XOR 1CH 3-INP 6-XSONPackaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT891 (1x1) Input Logic Level - High: 1.6V ~ 2V Input Logic Level - Low: 0.7V ~ 0.9V Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF Number of Circuits: 1 Current - Quiescent (Max): 500 nA |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC08APW/S400118 | NXP USA Inc. |
Description: AND GATE, LVC/LCX/Z SERIES |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC08APW-Q100118 | NXP USA Inc. |
Description: 74LVC08APW-Q100 - AND GATE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S08DZ48F2MLFR | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 48LQFPNumber of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 3K x 8 Program Memory Size: 48KB (48K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NTM88J125T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Part Status: Obsolete Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| NTM88J125T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Part Status: Obsolete Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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JN5148/Z01,515 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 56HVQFNDigiKey Programmable: Not Verified Part Status: Obsolete Serial Interfaces: I2C, JTAG, SPI, UART RF Family/Standard: 802.15.4 Modulation: O-QPSK GPIO: 21 Supplier Device Package: 56-HVQFN (8x8) Current - Transmitting: 15mA Data Rate (Max): 667kbps Current - Receiving: 17.5mA Protocol: Zigbee® Power - Output: 2.75dBm Voltage - Supply: 2V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: TxRx + MCU Memory Size: 128kB ROM, 128kB RAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -96.5dBm Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NCF2961VHN3/0200EY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S9S12HY32J0CLH557 | NXP USA Inc. |
Description: 16-BIT MCU, S12 CORE, 32KB FLASH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12HY32J0VLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 100-LQFP (14x14) Peripherals: LCD, Motor control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| S912ZVHY32F1CLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 73 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LCD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 4x10b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S9S12HY32J0CLHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 50 Supplier Device Package: 64-LQFP (10x10) Peripherals: LCD, Motor control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S912ZVHY32F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFPDigiKey Programmable: Not Verified Number of I/O: 100 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LCD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| SL3S1205FUD2/HAA | NXP USA Inc. |
Description: UCODEPackaging: Tape & Reel (TR) Package / Case: Die Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 261576 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BGU7258X | NXP USA Inc. |
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSONSupplier Device Package: 6-HXSON (1.6x1.6) Test Frequency: 6GHz Noise Figure: 1.6dB Current - Supply: 13mA Gain: 14dB Voltage - Supply: 3V ~ 3.6V RF Type: ISM Frequency: 5GHz ~ 6GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 2825 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGU7051118 | NXP USA Inc. | Description: IC AMP LNA FOR WIRELESS 10HVSON |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BGU7045115 | NXP USA Inc. |
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BGU7063,518 | NXP USA Inc. |
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFNP1dB: -12.5dBm Noise Figure: 0.9dB Current - Supply: 230mA Gain: 37.5dB Voltage - Supply: 4.75V ~ 5.25V RF Type: Cellular Frequency: 1.92GHz ~ 1.98GHz Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Packaging: Tape & Reel (TR) Supplier Device Package: 16-HLQFN (8x8) Test Frequency: 1.95GHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| ASL9115FHNZ | NXP USA Inc. | Description: IC LED DRIVER 36HVQFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| ASL5115FHNZ | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 36HVQFNPackaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LPC1812JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFPNumber of I/O: 83 Part Status: Active Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 104K x 8 Program Memory Size: 512KB (512K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC1G27GF,132 | NXP USA Inc. |
Description: IC GATE NOR 1CH 3-INP 6XSONPackaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
auf Bestellung 169560 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC56F80646VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC56F80626VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F80736VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F80746VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F80726VLF |
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Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC56F8027VLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
auf Bestellung 2892 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 23.2 EUR |
| 10+ | 18.3 EUR |
| 25+ | 17.07 EUR |
| 100+ | 15.72 EUR |
| 250+ | 15.08 EUR |
| 500+ | 14.69 EUR |
| BLF7G24L-100,112 |
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Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 96.04 EUR |
| MPC860ENCVR66D4 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 320.54 EUR |
| NVT4858UKZ |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Description: IC TRANSLATOR BIDIR 16WLCSP
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NVT4858UKZ |
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC TRANSLATOR BIDIR 16WLCSP
Number of Circuits: 1
Part Status: Active
Voltage - VCCB: 1.65 V ~ 3.6 V
Voltage - VCCA: 1.08 V ~ 1.95 V
Channels per Circuit: 6
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 16-WLCSP (1.84x1.87)
Data Rate: 104Mbps
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 16-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.75 EUR |
| 10+ | 2.46 EUR |
| 25+ | 2.34 EUR |
| 100+ | 1.92 EUR |
| 250+ | 1.79 EUR |
| 500+ | 1.59 EUR |
| 1000+ | 1.25 EUR |
| MC68HC908QY4CDTE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2580 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.21 EUR |
| 10+ | 9.44 EUR |
| 96+ | 8.01 EUR |
| 192+ | 7.72 EUR |
| 288+ | 7.58 EUR |
| 576+ | 7.37 EUR |
| 1056+ | 7.21 EUR |
| 74CBTLVD3245DS,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Part Status: Obsolete
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 1482 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1110+ | 0.45 EUR |
| MC33FS8530A1ESR2 |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5606BK0VLQ6 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74ALVCH16373DL,118 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Part Status: Active
Supplier Device Package: 48-SSOP
Delay Time - Propagation: 2.1ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 2
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Bulk
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Part Status: Active
Supplier Device Package: 48-SSOP
Delay Time - Propagation: 2.1ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 2
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 430+ | 1.15 EUR |
| BUJD203A,127 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 425V 4A TO-220AB
Power - Max: 80 W
Voltage - Collector Emitter Breakdown (Max): 425 V
Current - Collector (Ic) (Max): 4 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
Description: TRANS NPN 425V 4A TO-220AB
Power - Max: 80 W
Voltage - Collector Emitter Breakdown (Max): 425 V
Current - Collector (Ic) (Max): 4 A
Supplier Device Package: TO-220AB
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Current - Collector Cutoff (Max): 100µA
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
auf Bestellung 1499 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 908+ | 0.55 EUR |
| BUJD103AD,118 |
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Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJD103AD - POWER BIP
Description: NOW WEEN - BUJD103AD - POWER BIP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC860ENVR50D4 |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Bulk
auf Bestellung 2997 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 312.25 EUR |
| BZX79-B36,133 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 400MW ALF2
Description: DIODE ZENER 36V 400MW ALF2
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 16000+ | 0.033 EUR |
| K32W041AY |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4000+ | 4.92 EUR |
| K32W041AMK |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.17 EUR |
| 10+ | 7.93 EUR |
| 25+ | 7.51 EUR |
| 100+ | 6.92 EUR |
| 250+ | 6.57 EUR |
| 500+ | 6.32 EUR |
| K32W041AMY |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4, Bluetooth
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.4mA ~ 20.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 4.3mA
Protocol: Bluetooth v5.0, Thread, Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| SPC5634MF2MMG80 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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| IMXEBOOKDC4 |
Hersteller: NXP USA Inc.
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
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| MCZ33905CS5EKR2,518 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Produkt ist nicht verfügbar
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| MCZ33905CD5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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| MCZ33905CS5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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| MCZ33905CS5EKR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Produkt ist nicht verfügbar
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| MC908GR16MFAE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Produkt ist nicht verfügbar
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| 74LVCH32373AEC/G557 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Supplier Device Package: 96-LFBGA (13.5x5.5)
Delay Time - Propagation: 3ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 96-LFBGA
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Supplier Device Package: 96-LFBGA (13.5x5.5)
Delay Time - Propagation: 3ns
Current - Output High, Low: 24mA, 24mA
Independent Circuits: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 96-LFBGA
auf Bestellung 8191 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 64+ | 7.56 EUR |
| KIT10XS6225EKEVB |
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6225 12
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC10XS6225
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
Description: EVALUATION KIT - MC10XS6225 12
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC10XS6225
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
Produkt ist nicht verfügbar
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| KIT10XS6200EKEVB |
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6200 12
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC10XS6200
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
Description: EVALUATION KIT - MC10XS6200 12
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: MC10XS6200
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
Produkt ist nicht verfügbar
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| KIT25XS6300EKEVB |
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Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC25XS6300 12
Description: EVALUATION KIT - MC25XS6300 12
Produkt ist nicht verfügbar
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| LFVBBM34QA |
Hersteller: NXP USA Inc.
Description: MPC5534 EVAL BRD
Packaging: Box
Part Status: Obsolete
Utilized IC / Part: MPC5534
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Description: MPC5534 EVAL BRD
Packaging: Box
Part Status: Obsolete
Utilized IC / Part: MPC5534
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BYV415K-600PQ127 |
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auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 252+ | 1.92 EUR |
| PDZ27B/ZL115 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
Produkt ist nicht verfügbar
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| S912B32E4CFUE8R |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 63
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12
EEPROM Size: 768 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 16BIT 32KB FLASH 80QFP
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 63
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: CPU12
EEPROM Size: 768 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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| 74AUP1G386GF,132 |
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Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1617+ | 0.31 EUR |
| 74LVC08APW/S400118 |
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Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
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| 74LVC08APW-Q100118 |
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Hersteller: NXP USA Inc.
Description: 74LVC08APW-Q100 - AND GATE
Description: 74LVC08APW-Q100 - AND GATE
Produkt ist nicht verfügbar
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| S9S08DZ48F2MLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 3K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 3K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| NTM88J125T1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Description: IC PRESSURE SENSOR 24HQFN
Part Status: Obsolete
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| NTM88J125T1 |
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Part Status: Obsolete
Packaging: Cut Tape (CT)
Description: IC PRESSURE SENSOR 24HQFN
Part Status: Obsolete
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| JN5148/Z01,515 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Supplier Device Package: 56-HVQFN (8x8)
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Supplier Device Package: 56-HVQFN (8x8)
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NCF2961VHN3/0200EY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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| S9S12HY32J0CLH557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S9S12HY32J0VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| S912ZVHY32F1CLL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 73
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 16BIT 32KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 73
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| S9S12HY32J0CLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 50
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 50
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| S912ZVHY32F1VLQ |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 16BIT 32KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SL3S1205FUD2/HAA |
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Hersteller: NXP USA Inc.
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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| BGU7258X |
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Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Supplier Device Package: 6-HXSON (1.6x1.6)
Test Frequency: 6GHz
Noise Figure: 1.6dB
Current - Supply: 13mA
Gain: 14dB
Voltage - Supply: 3V ~ 3.6V
RF Type: ISM
Frequency: 5GHz ~ 6GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Supplier Device Package: 6-HXSON (1.6x1.6)
Test Frequency: 6GHz
Noise Figure: 1.6dB
Current - Supply: 13mA
Gain: 14dB
Voltage - Supply: 3V ~ 3.6V
RF Type: ISM
Frequency: 5GHz ~ 6GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2825 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 23+ | 0.77 EUR |
| 27+ | 0.66 EUR |
| 29+ | 0.62 EUR |
| 100+ | 0.57 EUR |
| 250+ | 0.54 EUR |
| 500+ | 0.51 EUR |
| 1000+ | 0.49 EUR |
| BGU7051118 |
Hersteller: NXP USA Inc.
Description: IC AMP LNA FOR WIRELESS 10HVSON
Description: IC AMP LNA FOR WIRELESS 10HVSON
Produkt ist nicht verfügbar
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| BGU7045115 |
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Hersteller: NXP USA Inc.
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP
Produkt ist nicht verfügbar
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| BGU7063,518 |
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Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
P1dB: -12.5dBm
Noise Figure: 0.9dB
Current - Supply: 230mA
Gain: 37.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: Cellular
Frequency: 1.92GHz ~ 1.98GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HLQFN (8x8)
Test Frequency: 1.95GHz
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
P1dB: -12.5dBm
Noise Figure: 0.9dB
Current - Supply: 230mA
Gain: 37.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: Cellular
Frequency: 1.92GHz ~ 1.98GHz
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 16-HLQFN (8x8)
Test Frequency: 1.95GHz
Produkt ist nicht verfügbar
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| ASL9115FHNZ |
Hersteller: NXP USA Inc.
Description: IC LED DRIVER 36HVQFN
Description: IC LED DRIVER 36HVQFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| ASL5115FHNZ |
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Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| LPC1812JBD144551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 104K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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| 74LVC1G27GF,132 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 169560 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3909+ | 0.13 EUR |




























