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MCF5270VM100 MCF5270VM100 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 330 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.56 EUR
10+39.3 EUR
25+36.98 EUR
100+34.44 EUR
250+33.23 EUR
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S912ZVCA19F0WKH S912ZVCA19F0WKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 192KB FLASH 64LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023TT/C1,118 NXP USA Inc. TDA8023.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023TT/C1,118 NXP USA Inc. TDA8023.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV4020N,112 74LV4020N,112 NXP USA Inc. 74LV4020.pdf Description: IC 14BIT BINARY RIPPLE 16-DIP
auf Bestellung 547 Stücke:
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307+1.66 EUR
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MIMXRT117HDVMAA NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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1+40.09 EUR
10+32.24 EUR
25+30.27 EUR
100+28.12 EUR
250+27.09 EUR
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MPC8314ECVRAFDA MPC8314ECVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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MC9S12C32VFAE16 MC9S12C32VFAE16 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
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MC9S08QB4CWL MC9S08QB4CWL NXP USA Inc. www.nxp.com Description: IC MCU 8BIT 4KB FLASH 28SOIC
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LS2088ASE7QQB NXP USA Inc. Description: LS2088A ST WE 1600 R1.1
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MRFX1K80H-64MHZ MRFX1K80H-64MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 64MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 64MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5178 NXP USA Inc. PHGL-S-A0006350182-1.pdf?t.download=true&u=5oefqw Description: WIDEBAND RF POWER TRANSISTOR, 18
Produkt ist nicht verfügbar
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MRFX1K80H-VHFDHY MRFX1K80H-VHFDHY NXP USA Inc. MRFX1K80H.pdf?pspll=1 Description: MRFX1K80H REF BRD 230MHZ 1200W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Type: Transistor
Frequency: 174MHz ~ 230MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MRFX1K80N-230MHZ MRFX1K80N-230MHZ NXP USA Inc. MRFX1K80N.pdf Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transistor
Frequency: 230MHz
For Use With/Related Products: MRFX1K80N
Utilized IC / Part: MRFX1K80N
Contents: Board(s)
Produkt ist nicht verfügbar
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A5G26H110NT4 NXP USA Inc. A5G26H110N.pdf Description: RF MOSFET GAN 48V 6DFN
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 50 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 17.7dB
Power - Output: 15W
Frequency: 2.496GHz ~ 2.69GHz
Mounting Type: Surface Mount
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A5G37H110NT4 NXP USA Inc. A5G37H110N.pdf Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
Power - Output: 13.5W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
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A5G35H110NT4 NXP USA Inc. A5G35H110N.pdf Description: AIRFAST RF POWER GAN TRANSISTOR,
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MC9S08SH16CTG,574 MC9S08SH16CTG,574 NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
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MC9S08SH16CTLR MC9S08SH16CTLR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF9002NR2 NXP USA Inc. MRF9002NR2.pdf Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2 NXP USA Inc. Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
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PSMN7R5-25YLC,115 PSMN7R5-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 56A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY NXP USA Inc. Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM NXP USA Inc. Description: FREEDOM BOARD KIT - PT2000 PROG
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PT2000
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR S9S12HY64J0CLLR NXP USA Inc. MC9S12HY64RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP MC68LK332GCAG16-NXP NXP USA Inc. FSCLS03151-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMI1QFN/RP,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Tape & Reel (TR)
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 74AHCT2G126GD,125 NXP USA Inc. PHGLS27955-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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74AHCT2G241DP125 NXP USA Inc. 74AHC_AHCT2G241.pdf Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
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74AHCT2G125GD,125-NX NXP USA Inc. Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836TD/36H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
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2885+0.17 EUR
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LD6836TD/22H,125 LD6836TD/22H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
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74HCT2G08DP 74HCT2G08DP NXP USA Inc. PHGLS18956-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 2CH 2-INP 8TSSOP
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BZX79-C51143 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
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15000+0.034 EUR
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BZX79-C56133 NXP USA Inc. BZX79.pdf Description: NOW NEXPERIA BZX79-C56 - ZENER D
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BAP51L,315 BAP51L,315 NXP USA Inc. BAP51L_1.pdf Description: RF DIODE PIN 60V 500MW DFN1006-2
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC35FS6511NAER2 MC35FS6511NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6511NAE MC35FS6511NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
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RAPIDRF-26E39 RAPIDRF-26E39 NXP USA Inc. RAPIDRF-26E39.pdf Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
auf Bestellung 1 Stücke:
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1+1532.27 EUR
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PCAL6408AHK NXP USA Inc. PCAL6408A.pdf Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE MC9S08AW16MFUE NXP USA Inc. PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
auf Bestellung 163 Stücke:
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36+15.08 EUR
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BZV90-C56115 BZV90-C56115 NXP USA Inc. BZV90.pdf Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 1990 Stücke:
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74AHCT374D118 74AHCT374D118 NXP USA Inc. 74AHC_AHCT374.pdf Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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MCIMX537CVP8C2 MCIMX537CVP8C2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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HOMEKIT-SDK NXP USA Inc. HMKITSDKFS.pdf Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
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S912XEQ512BVAAR S912XEQ512BVAAR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
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S912XEQ512BVAA S912XEQ512BVAA NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816CX4/33P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
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PEMI2QFN/LP,115 PEMI2QFN/LP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
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UBA2211AT/N1,518 UBA2211AT/N1,518 NXP USA Inc. UBA2211.pdf Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Part Status: Obsolete
Current - Output Source/Sink: 900mA
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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PCA9502BS,157 PCA9502BS,157 NXP USA Inc. PCA9502.pdf Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 24-HVQFN (4x4)
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SPI
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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UJA1169AF-EVB UJA1169AF-EVB NXP USA Inc. UM11758.pdf Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
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PHPT60603PY115 PHPT60603PY115 NXP USA Inc. PHPT60603PY.pdf Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
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MC13202FC MC13202FC NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA24S08AD PCA24S08AD NXP USA Inc. PHGLS20439-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 8KBIT 400KHZ 8SO
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
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PCA24S08AD112 NXP USA Inc. Description: EEPROM 1MX8
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
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FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
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MC56F80746MLF MC56F80746MLF NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: 56800EF
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MCF5270VM100 MCF5275EC.pdf
MCF5270VM100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
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S912ZVCA19F0WKH S12ZVCFS.pdf
S912ZVCA19F0WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 64LQFP
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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TDA8023TT/C1,118 TDA8023.pdf
TDA8023TT/C1,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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TDA8023TT/C1,118 TDA8023.pdf
TDA8023TT/C1,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
Supplier Device Package: 28-TSSOP
Voltage - Supply: 2.7V ~ 6.5V
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV4020N,112 74LV4020.pdf
74LV4020N,112
Hersteller: NXP USA Inc.
Description: IC 14BIT BINARY RIPPLE 16-DIP
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MIMXRT117HDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
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MPC8314ECVRAFDA MPC8314EEC.pdf
MPC8314ECVRAFDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MC9S12C32VFAE16 MC9S12C128V1.pdf
MC9S12C32VFAE16
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S08QB4CWL www.nxp.com
MC9S08QB4CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Produkt ist nicht verfügbar
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LS2088ASE7QQB
Hersteller: NXP USA Inc.
Description: LS2088A ST WE 1600 R1.1
Produkt ist nicht verfügbar
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MRFX1K80H-64MHZ MRFX1K80H.pdf
MRFX1K80H-64MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 64MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 64MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5178 PHGL-S-A0006350182-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: WIDEBAND RF POWER TRANSISTOR, 18
Produkt ist nicht verfügbar
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MRFX1K80H-VHFDHY MRFX1K80H.pdf?pspll=1
MRFX1K80H-VHFDHY
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1200W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Type: Transistor
Frequency: 174MHz ~ 230MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Supplied Contents: Board(s)
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MRFX1K80N-230MHZ MRFX1K80N.pdf
MRFX1K80N-230MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80N REF BOARD - 230MHZ
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transistor
Frequency: 230MHz
For Use With/Related Products: MRFX1K80N
Utilized IC / Part: MRFX1K80N
Contents: Board(s)
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A5G26H110NT4 A5G26H110N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Package / Case: 6-LDFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Test: 50 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Part Status: Active
Supplier Device Package: 6-PDFN (7x6.5)
Technology: GaN
Gain: 17.7dB
Power - Output: 15W
Frequency: 2.496GHz ~ 2.69GHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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A5G37H110NT4 A5G37H110N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
Power - Output: 13.5W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
Produkt ist nicht verfügbar
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A5G35H110NT4 A5G35H110N.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Produkt ist nicht verfügbar
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MC9S08SH16CTG,574 MC9S08SH32.pdf
MC9S08SH16CTG,574
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08SH16CTLR MC9S08SH32.pdf
MC9S08SH16CTLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 23
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MRF9002NR2 MRF9002NR2.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V 16PFP
Produkt ist nicht verfügbar
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PXLS83333AESR2
Hersteller: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
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PSMN7R5-25YLC,115
PSMN7R5-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 56A LFPAK56
Input Capacitance (Ciss) (Max) @ Vds: 921 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 42W (Tc)
Rds On (Max) @ Id, Vgs: 7.4mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 56A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCF2922AHN3/0212CY
Hersteller: NXP USA Inc.
Description: RECEIVER 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDMPKPT2000EVM
Hersteller: NXP USA Inc.
Description: FREEDOM BOARD KIT - PT2000 PROG
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PT2000
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12HY64J0CLLR MC9S12HY64RMV1.pdf
S9S12HY64J0CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68LK332GCAG16-NXP FSCLS03151-1.pdf?t.download=true&u=5oefqw
MC68LK332GCAG16-NXP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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PEMI1QFN/RP,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/RP,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 23dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 100Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Tape & Reel (TR)
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 100
Produkt ist nicht verfügbar
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74AHCT2G126GD,125 PHGLS27955-1.pdf?t.download=true&u=5oefqw
74AHCT2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
auf Bestellung 68069 Stücke:
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2049+0.24 EUR
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74AHCT2G241DP125 74AHC_AHCT2G241.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8TSSOP
Part Status: Active
Supplier Device Package: 8-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Bulk
auf Bestellung 3087 Stücke:
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74AHCT2G125GD,125-NX
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Part Status: Active
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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LD6836TD/36H,125 LD6836.pdf
LD6836TD/36H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.6V 300MA 5TSOP
auf Bestellung 6000 Stücke:
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AnzahlPreis
2885+0.17 EUR
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LD6836TD/22H,125 LD6836.pdf
LD6836TD/22H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 300MA 5TSOP
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 2.2V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
Current - Supply (Max): 250 µA
Mounting Type: Surface Mount
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2885+0.17 EUR
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74HCT2G08DP PHGLS18956-1.pdf?t.download=true&u=5oefqw
74HCT2G08DP
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 2-INP 8TSSOP
Produkt ist nicht verfügbar
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BZX79-C51143 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C51 - ZENER D
auf Bestellung 35000 Stücke:
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AnzahlPreis
15000+0.034 EUR
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BZX79-C56133 BZX79.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX79-C56 - ZENER D
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BAP51L,315 BAP51L_1.pdf
BAP51L,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW DFN1006-2
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC35FS6511NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6511NAER2
Hersteller: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6511NAE 35FS4500-35FS6500SDS.pdf
MC35FS6511NAE
Hersteller: NXP USA Inc.
Description: FS6500
Produkt ist nicht verfügbar
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RAPIDRF-26E39 RAPIDRF-26E39.pdf
RAPIDRF-26E39
Hersteller: NXP USA Inc.
Description: 28 V LDMOS RF FRONT END 5G 50W
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Type: Front End
Frequency: 2.496GHz ~ 2.69GHz
Packaging: Bulk
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AnzahlPreis
1+1532.27 EUR
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PCAL6408AHK PCAL6408A.pdf
Hersteller: NXP USA Inc.
Description: LOW-VOLTAGE TRANSLATING, 8-BIT I
Produkt ist nicht verfügbar
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MC9S08AW16MFUE PHGL-S-A0002794566-1.pdf?t.download=true&u=5oefqw
MC9S08AW16MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
auf Bestellung 163 Stücke:
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AnzahlPreis
36+15.08 EUR
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BZV90-C56115 BZV90.pdf
BZV90-C56115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C56 ZENER DIO
Power - Max: 1.5 W
Supplier Device Package: SOT-223
Impedance (Max) (Zzt): 200 Ohms
Voltage - Zener (Nom) (Vz): 56 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Package / Case: TO-261-4, TO-261AA
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 1990 Stücke:
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AnzahlPreis
1990+0.27 EUR
Mindestbestellmenge: 1990 Stücke
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74AHCT374D118 74AHC_AHCT374.pdf
74AHCT374D118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT374D - BUS DR
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 10.4ns @ 5V, 50pF
Supplier Device Package: 20-SO
Input Capacitance: 3 pF
Clock Frequency: 130 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 8mA, 8mA
Current - Quiescent (Iq): 4 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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1348+0.37 EUR
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MCIMX537CVP8C2 IMX53IEC.pdf
MCIMX537CVP8C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
auf Bestellung 239 Stücke:
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1+106.71 EUR
10+88.37 EUR
84+79.29 EUR
168+77.33 EUR
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HOMEKIT-SDK HMKITSDKFS.pdf
Hersteller: NXP USA Inc.
Description: HOMEKIT SOFTWARE DEVELOPMENT KIT
Produkt ist nicht verfügbar
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S912XEQ512BVAAR MC9S12XEPB.pdf
S912XEQ512BVAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XEQ512BVAA MC9S12XEPB.pdf
S912XEQ512BVAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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LD6816CX4/33P,315 LD6816.pdf
LD6816CX4/33P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 150MA 4-WLCSP
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature, Transient Voltage
Voltage Dropout (Max): 0.075V @ 150mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Produkt ist nicht verfügbar
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PEMI2QFN/LP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/LP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3806+0.13 EUR
Mindestbestellmenge: 3806 Stücke
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UBA2211AT/N1,518 UBA2211.pdf
UBA2211AT/N1,518
Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Part Status: Obsolete
Current - Output Source/Sink: 900mA
Dimming: No
Supplier Device Package: 14-SO
Voltage - Supply: 10.7V ~ 13.8V
Operating Temperature: -40°C ~ 150°C
Type: CFL/TL Driver
Frequency: 40.05kHz ~ 42.68kHz
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9502BS,157 PCA9502.pdf
PCA9502BS,157
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SPI 24HVQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 24-HVQFN (4x4)
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SPI
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1169AF-EVB UM11758.pdf
UJA1169AF-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR UJA1169A
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: UJA1169A
Supplied Contents: Board(s)
Primary Attributes: 12V Supply
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI Interface(s)
Contents: Board(s)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+141.42 EUR
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PHPT60603PY115 PHPT60603PY.pdf
PHPT60603PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, LFPAK
Packaging: Bulk
Produkt ist nicht verfügbar
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MC13202FC MC13202.pdf
MC13202FC
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA24S08AD PHGLS20439-1.pdf?t.download=true&u=5oefqw
PCA24S08AD
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: EEPROM
Clock Frequency: 400 kHz
Technology: EEPROM
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Memory Organization: 1K x 8
auf Bestellung 4264 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
740+0.67 EUR
Mindestbestellmenge: 740 Stücke
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PCA24S08AD112
Hersteller: NXP USA Inc.
Description: EEPROM 1MX8
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Produkt ist nicht verfügbar
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FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Part Status: Active
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Supplier Device Package: 10-DFN (2x2)
Bandwidth: 1.6kHz
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2g, 4g, 8g, 16g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 10-VFDFN
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 636 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.62 EUR
10+3.45 EUR
25+3.26 EUR
50+3.12 EUR
100+3 EUR
500+2.75 EUR
Mindestbestellmenge: 5 Stücke
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MC56F80746MLF MC56F80XXX.pdf
MC56F80746MLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: 56800EF
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.32 EUR
10+8.74 EUR
25+8.1 EUR
100+7.39 EUR
250+7.05 EUR
500+6.85 EUR
1000+6.68 EUR
Mindestbestellmenge: 2 Stücke
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