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TDA18275HN/C1518 TDA18275HN/C1518 NXP USA Inc. TDA18275_SDS.pdf Description: HYBRID (ANALOG AND DIGITAL) SILI
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74HCT4066N,112 74HCT4066N,112 NXP USA Inc. 74HC_HCT4066.pdf Description: IC SWITCH SPST-NOX4 20OHM 14DIP
Number of Circuits: 4
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 1µA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 44ns, 30ns
Channel-to-Channel Matching (ΔRon): 3Ohm
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Crosstalk: -60dB @ 1MHz
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Supplier Device Package: 14-DIP
-3db Bandwidth: 200MHz
On-State Resistance (Max): 20Ohm (Typ)
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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KSCF5250AG120 NXP USA Inc. Description: IC MCU
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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S9KEAZN16AMLHR S9KEAZN16AMLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 16KB FLASH 64LQFP
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MMA6231QR2 MMA6231QR2 NXP USA Inc. MMA6231Q.pdf Description: ACCELEROMETER 10G ANALOG 16QFN
Produkt ist nicht verfügbar
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MPC850DEVR50BU MPC850DEVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850SRVR50BU MPC850SRVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
RAM Controllers: DRAM
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MK60DX256ZVMD10 MK60DX256ZVMD10 NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
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TEA2096T/1J TEA2096T/1J NXP USA Inc. TEA2096T.pdf Description: IC SYNC RECT CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 800 µA
DigiKey Programmable: Not Verified
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TEA2096T/1J TEA2096T/1J NXP USA Inc. TEA2096T.pdf Description: IC SYNC RECT CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 800 µA
DigiKey Programmable: Not Verified
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10+2.82 EUR
25+2.57 EUR
100+2.3 EUR
250+2.17 EUR
500+2.09 EUR
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TEA2096DB2201 TEA2096DB2201 NXP USA Inc. UM11815.pdf Description: EVAL BOARD FOR TEA2096T
Packaging: Box
Function: Rectifier Controller
Type: Power Management
Utilized IC / Part: TEA2096T
Supplied Contents: Board(s)
Primary Attributes: 4.75V to 38V Supply
Embedded: No
Part Status: Active
Contents: Board(s)
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BUK662R5-30C,118-NXP NXP USA Inc. Description: PFET, 100A I(D), 30V, 0.0048OHM,
Input Capacitance (Ciss) (Max) @ Vds: 6960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 114 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 204W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
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BUK662R7-55C NXP USA Inc. Description: NOW NEXPERIA BUK662R7-55C - POWE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12C32MPBE25 MC9S12C32MPBE25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 52TQFP
DigiKey Programmable: Verified
Number of I/O: 35
Part Status: Not For New Designs
Supplier Device Package: 52-TQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 52-LQFP
Packaging: Tray
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MMH3111NT1 MMH3111NT1 NXP USA Inc. MMH3111NT1.pdf Description: IC AMP CELL 250MHZ-4GHZ SOT89-4
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MMH3111NT1 MMH3111NT1 NXP USA Inc. MMH3111NT1.pdf Description: IC AMP CELL 250MHZ-4GHZ SOT89-4
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PCA85276ATT/AY PCA85276ATT/AY NXP USA Inc. PCA85276.pdf Description: AUTOMOTIVE 40 X 4 LCD DRIVER
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Configuration: 40 Segment
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Current - Supply: 3.5 µA
Supplier Device Package: 56-TSSOP
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Qualification: AEC-Q100
Grade: Automotive
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BB153,115 BB153,115 NXP USA Inc. BB153_Rev4.pdf Description: DIODE VHF VAR CAP 32V SOD324
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC56F84565VLKR MC56F84565VLKR NXP USA Inc. MC56F844XX.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 8x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
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NX3P1107UK012 NXP USA Inc. PHGLS25884-1.pdf?t.download=true&u=5oefqw Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 6759 Stücke:
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1567+0.39 EUR
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PDTA113EM,315 PDTA113EM,315 NXP USA Inc. PHGLS19170-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 250MW SOT883
Part Status: Active
Packaging: Bulk
auf Bestellung 140000 Stücke:
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MC68332GVAG16 MC68332GVAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MC9328MXLVM15 MC9328MXLVM15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 256BGA
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Produkt ist nicht verfügbar
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SAF775CHN/N208W/BK NXP USA Inc. Description: CAR DISP
Packaging: Tray
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SPC5602BK0MLQ6 SPC5602BK0MLQ6 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
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S9KEAZ64AMLHR S9KEAZ64AMLHR NXP USA Inc. S9KEA128P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
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SPC5744BSK1AMMH2 SPC5744BSK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
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VY22545-2557 NXP USA Inc. Description: VY22545-2557
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMH24115 PUMH24115 NXP USA Inc. PEMH24_PUMH24.pdf Description: R1=100 KILO OHM, R2=100 KILO OHM
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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KC9S08JM16CLC NXP USA Inc. Description: IC MCU
Produkt ist nicht verfügbar
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BUK754R0-55B,127 NXP USA Inc. PHGLS22709-1.pdf?t.download=true&u=5oefqw Description: PFET, 75A I(D), 55V, 0.004OHM, 1
Input Capacitance (Ciss) (Max) @ Vds: 6776 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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PDTC144EE,115 PDTC144EE,115 NXP USA Inc. PDTC144E_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Resistors Included: R1 and R2
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PDTC144EE,115 PDTC144EE,115 NXP USA Inc. PDTC144E_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Resistors Included: R1 and R2
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
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FRDM-HB2002ESEVM NXP USA Inc. UM11144.pdf Description: EVB FOR MC33772 SPI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: HB2002
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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MC33772CTC1AE MC33772CTC1AE NXP USA Inc. MC33772C-DS.pdf Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
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10+13.55 EUR
25+12.6 EUR
100+11.54 EUR
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MC9S12H128VPVE MC9S12H128VPVE NXP USA Inc. MC9S12H256%20Guide.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LCD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 85
Produkt ist nicht verfügbar
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SVF332R3K2CKU2R SVF332R3K2CKU2R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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SVF332R3K2CKU2 SVF332R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
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PHB66NQ03LT PHB66NQ03LT NXP USA Inc. PHGLS18369-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 66A, 25V, 0.0136OHM
Part Status: Active
Packaging: Bulk
auf Bestellung 800 Stücke:
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800+0.92 EUR
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PHB66NQ03LT118 PHB66NQ03LT118 NXP USA Inc. PHB66NQ03LT.pdf Description: NOW NEXPERIA PHB66NQ03LT 66A, 25
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7457VG1000NC MC7457VG1000NC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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SPC5602BAVLL4 SPC5602BAVLL4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BAVLQ6 SPC5607BAVLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
DigiKey Programmable: Not Verified
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SPC5603BAVLQ4 SPC5603BAVLQ4 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 144LQFP
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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SPC5602BAVLL4R SPC5602BAVLL4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
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SPC5607BAVLU6R SPC5607BAVLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5607BAVLU6 SPC5607BAVLU6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
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SPC5603BAVLQ4R SPC5603BAVLQ4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8313VRAFF MPC8313VRAFF NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCF5281CVM66J MCF5281CVM66J NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
Produkt ist nicht verfügbar
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MC68SEC000AA20R2 MC68SEC000AA20R2 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC68HC908GR4CFAE MC68HC908GR4CFAE NXP USA Inc. MC68HC908GR8,4.pdf Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8308VMAGD MPC8308VMAGD NXP USA Inc. MPC8308EC.pdf Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Produkt ist nicht verfügbar
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SAF7751HN/N207WMP NXP USA Inc. Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BC847QASX NXP USA Inc. Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
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T1024NXE7MQA557 NXP USA Inc. Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX6020NBKS115 NX6020NBKS115 NXP USA Inc. NX6020CAKS.pdf Description: MOSFET N-CH
Part Status: Active
Packaging: Bulk
auf Bestellung 162000 Stücke:
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BUK98180-100A,115 BUK98180-100A,115 NXP USA Inc. BUK98180-100A.pdf Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MPC5553MVZ132 MPC5553MVZ132 NXP USA Inc. MPC5553.pdf Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
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10+132.71 EUR
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PDZ5.1B/ZL115 PDZ5.1B/ZL115 NXP USA Inc. PDZ-B_SER.pdf Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TDA18275HN/C1518 TDA18275_SDS.pdf
TDA18275HN/C1518
Hersteller: NXP USA Inc.
Description: HYBRID (ANALOG AND DIGITAL) SILI
Produkt ist nicht verfügbar
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74HCT4066N,112 74HC_HCT4066.pdf
74HCT4066N,112
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NOX4 20OHM 14DIP
Number of Circuits: 4
Part Status: Obsolete
Current - Leakage (IS(off)) (Max): 1µA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 44ns, 30ns
Channel-to-Channel Matching (ΔRon): 3Ohm
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Crosstalk: -60dB @ 1MHz
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Supplier Device Package: 14-DIP
-3db Bandwidth: 200MHz
On-State Resistance (Max): 20Ohm (Typ)
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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KSCF5250AG120
Hersteller: NXP USA Inc.
Description: IC MCU
Part Status: Last Time Buy
Packaging: Bulk
Produkt ist nicht verfügbar
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S9KEAZN16AMLHR S9KEA128P80M48SF0.pdf
S9KEAZN16AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MMA6231QR2 MMA6231Q.pdf
MMA6231QR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 10G ANALOG 16QFN
Produkt ist nicht verfügbar
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MPC850DEVR50BU MPC850%20PowerQUICC.pdf
MPC850DEVR50BU
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC850SRVR50BU MPC850%20PowerQUICC.pdf
MPC850SRVR50BU
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
RAM Controllers: DRAM
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK60DX256ZVMD10 KINK6XFS.pdf
MK60DX256ZVMD10
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA2096T/1J TEA2096T.pdf
TEA2096T/1J
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CTRL SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 800 µA
DigiKey Programmable: Not Verified
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2500+1.99 EUR
5000+1.95 EUR
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TEA2096T/1J TEA2096T.pdf
TEA2096T/1J
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 4.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: 8-SO
Part Status: Active
Current - Supply: 800 µA
DigiKey Programmable: Not Verified
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6+3.83 EUR
10+2.82 EUR
25+2.57 EUR
100+2.3 EUR
250+2.17 EUR
500+2.09 EUR
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TEA2096DB2201 UM11815.pdf
TEA2096DB2201
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA2096T
Packaging: Box
Function: Rectifier Controller
Type: Power Management
Utilized IC / Part: TEA2096T
Supplied Contents: Board(s)
Primary Attributes: 4.75V to 38V Supply
Embedded: No
Part Status: Active
Contents: Board(s)
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BUK662R5-30C,118-NXP
Hersteller: NXP USA Inc.
Description: PFET, 100A I(D), 30V, 0.0048OHM,
Input Capacitance (Ciss) (Max) @ Vds: 6960 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 114 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Power Dissipation (Max): 204W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Bulk
Produkt ist nicht verfügbar
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BUK662R7-55C
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK662R7-55C - POWE
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MC9S12C32MPBE25 MC9S12C128V1.pdf
MC9S12C32MPBE25
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 52TQFP
DigiKey Programmable: Verified
Number of I/O: 35
Part Status: Not For New Designs
Supplier Device Package: 52-TQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 52-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MMH3111NT1 MMH3111NT1.pdf
MMH3111NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELL 250MHZ-4GHZ SOT89-4
Produkt ist nicht verfügbar
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MMH3111NT1 MMH3111NT1.pdf
MMH3111NT1
Hersteller: NXP USA Inc.
Description: IC AMP CELL 250MHZ-4GHZ SOT89-4
Produkt ist nicht verfügbar
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PCA85276ATT/AY PCA85276.pdf
PCA85276ATT/AY
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE 40 X 4 LCD DRIVER
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Configuration: 40 Segment
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Current - Supply: 3.5 µA
Supplier Device Package: 56-TSSOP
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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BB153,115 BB153_Rev4.pdf
BB153,115
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD324
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD-323
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-76, SOD-323
Packaging: Cut Tape (CT)
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MC56F84565VLKR MC56F844XX.pdf
MC56F84565VLKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 8x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX3P1107UK012 PHGLS25884-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LOGIC CONTROLLED HIGH-SIDE POWER
Packaging: Bulk
auf Bestellung 6759 Stücke:
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AnzahlPrivatkunde
1567+0.39 EUR
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PDTA113EM,315 PHGLS19170-1.pdf?t.download=true&u=5oefqw
PDTA113EM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Part Status: Active
Packaging: Bulk
auf Bestellung 140000 Stücke:
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10490+0.06 EUR
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MC68332GVAG16 MC68332TS.pdf
MC68332GVAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 15
Part Status: Not For New Designs
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 32-Bit Single-Core
Core Processor: CPU32
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9328MXLVM15 MC9328MXL.pdf
MC9328MXLVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256BGA
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Packaging: Tray
Part Status: Obsolete
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 256-PBGA (14x14)
Voltage - I/O: 1.8V, 3.0V
Produkt ist nicht verfügbar
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SAF775CHN/N208W/BK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5602BK0MLQ6 MPC5602D.pdf
SPC5602BK0MLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
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S9KEAZ64AMLHR S9KEA128P80M48SF0.pdf
S9KEAZ64AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
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SPC5744BSK1AMMH2 MPC5746C.pdf
SPC5744BSK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
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VY22545-2557
Hersteller: NXP USA Inc.
Description: VY22545-2557
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PUMH24115 PEMH24_PUMH24.pdf
PUMH24115
Hersteller: NXP USA Inc.
Description: R1=100 KILO OHM, R2=100 KILO OHM
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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KC9S08JM16CLC
Hersteller: NXP USA Inc.
Description: IC MCU
Produkt ist nicht verfügbar
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BUK754R0-55B,127 PHGLS22709-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: PFET, 75A I(D), 55V, 0.004OHM, 1
Input Capacitance (Ciss) (Max) @ Vds: 6776 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
auf Bestellung 959 Stücke:
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AnzahlPrivatkunde
392+1.62 EUR
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PDTC144EE,115 PDTC144E_SER.pdf
PDTC144EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Tape & Reel (TR)
Resistors Included: R1 and R2
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PDTC144EE,115 PDTC144E_SER.pdf
PDTC144EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 47 kOhms
Power - Max: 150 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: SC-75
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Resistors Included: R1 and R2
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
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FRDM-HB2002ESEVM UM11144.pdf
Hersteller: NXP USA Inc.
Description: EVB FOR MC33772 SPI
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: HB2002
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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MC33772CTC1AE MC33772C-DS.pdf
MC33772CTC1AE
Hersteller: NXP USA Inc.
Description: IC 6-CH LI-ION BATT CTRL 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
auf Bestellung 276 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.41 EUR
10+13.55 EUR
25+12.6 EUR
100+11.54 EUR
250+11.04 EUR
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MC9S12H128VPVE MC9S12H256%20Guide.pdf
MC9S12H128VPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LCD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 85
Produkt ist nicht verfügbar
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SVF332R3K2CKU2R VYBRIDRSERIESEC.pdf
SVF332R3K2CKU2R
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SVF332R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF332R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PHB66NQ03LT PHGLS18369-1.pdf?t.download=true&u=5oefqw
PHB66NQ03LT
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 66A, 25V, 0.0136OHM
Part Status: Active
Packaging: Bulk
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
800+0.92 EUR
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PHB66NQ03LT118 PHB66NQ03LT.pdf
PHB66NQ03LT118
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PHB66NQ03LT 66A, 25
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC7457VG1000NC MPC7457.pdf
MC7457VG1000NC
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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SPC5602BAVLL4
SPC5602BAVLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BAVLQ6 MPC560XBFAMFS.pdf
SPC5607BAVLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Number of I/O: 121
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10b, 5x12b
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BAVLQ4
SPC5603BAVLQ4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Number of I/O: 123
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BAVLL4R
SPC5602BAVLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
Produkt ist nicht verfügbar
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SPC5607BAVLU6R MPC560XBFAMFS.pdf
SPC5607BAVLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5607BAVLU6 MPC560XBFAMFS.pdf
SPC5607BAVLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
Produkt ist nicht verfügbar
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SPC5603BAVLQ4R
SPC5603BAVLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8313VRAFF MPC8313E_Hrdw_Spec.pdf
MPC8313VRAFF
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
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MCF5281CVM66J MCF5282UM.pdf
MCF5281CVM66J
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 150
Produkt ist nicht verfügbar
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MC68SEC000AA20R2 MC68SEC000.pdf
MC68SEC000AA20R2
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 64-QFP (14x14)
Voltage - I/O: 3.3V, 5.0V
Core Processor: EC000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC68HC908GR4CFAE MC68HC908GR8,4.pdf
MC68HC908GR4CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 32LQFP
Number of I/O: 21
Part Status: Last Time Buy
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 384 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8308VMAGD MPC8308EC.pdf
MPC8308VMAGD
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 473MAPBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 473-MAPBGA (19x19)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 473-LFBGA
Produkt ist nicht verfügbar
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SAF7751HN/N207WMP
Hersteller: NXP USA Inc.
Description: CAR DISP
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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BC847QASX
Hersteller: NXP USA Inc.
Description: TRANS NPN/PNP 45V DFN1010B-6
Part Status: Active
Supplier Device Package: DFN1010B-6
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max): 45V
Current - Collector (Ic) (Max): 100mA
Power - Max: 230mW
Operating Temperature: 150°C (TJ)
Transistor Type: 1 NPN, 1 PNP Complementary
Mounting Type: Surface Mount
Package / Case: 6-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
Produkt ist nicht verfügbar
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T1024NXE7MQA557
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 64-BI
Part Status: Active
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NX6020NBKS115 NX6020CAKS.pdf
NX6020NBKS115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH
Part Status: Active
Packaging: Bulk
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2959+0.19 EUR
Mindestbestellmenge: 2959 Stücke
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BUK98180-100A,115 BUK98180-100A.pdf
BUK98180-100A,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 4.6A SOT-223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 173mOhm @ 5A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 619 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MPC5553MVZ132 MPC5553.pdf
MPC5553MVZ132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 220
DigiKey Programmable: Not Verified
auf Bestellung 1124 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+159.01 EUR
10+132.71 EUR
25+131.01 EUR
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PDZ5.1B/ZL115 PDZ-B_SER.pdf
PDZ5.1B/ZL115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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