Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36589) > Seite 457 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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LPC4310FBD144,551 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 144LQFPDigiKey Programmable: Not Verified Number of I/O: 83 Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 168K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AUP3G0434GD125 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIES Packaging: Bulk Package / Case: 8-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Logic Type: Buffer/Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 3.6V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Input (2, 1) Schmitt Trigger Input: No Supplier Device Package: 8-XSON (2x3) Part Status: Active Number of Circuits: 3 |
auf Bestellung 92750 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G0434DC125 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIES Number of Circuits: 3 Part Status: Active Supplier Device Package: 8-VSSOP Schmitt Trigger Input: No Number of Inputs: 3 Input (2, 1) Current - Output High, Low: 4mA, 4mA Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Logic Type: Buffer/Inverter Mounting Type: Surface Mount Output Type: Single-Ended Package / Case: 8-VFSOP (0.091", 2.30mm Width) Packaging: Bulk |
auf Bestellung 2600 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74AUP3G0434GT115 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIES Packaging: Bulk Supplier Device Package: 8-XSON (1.95x1) Mounting Type: Surface Mount Package / Case: 8-XFDFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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74AUP3G0434GS115 | NXP USA Inc. |
Description: INVERTER, AUP/ULP/V SERIES |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S12ZVL16F0VLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP DigiKey Programmable: Not Verified Number of I/O: 19 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: S12Z EEPROM Size: 128 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S08SG4E2VTGR518 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AXP1T34GS,125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE |
auf Bestellung 4967 Stücke: Lieferzeit 10-14 Tag (e) |
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74AXP1T34GN,125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE |
auf Bestellung 3199 Stücke: Lieferzeit 10-14 Tag (e) |
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74AXP1T34GN125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AXP1T34GM125 | NXP USA Inc. |
Description: 74AXP1T34GM - BUFFER, AXP SERIES Part Status: Active Supplier Device Package: 6-XSON, SOT886 (1.45x1) Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 1 Voltage - Supply: 0.7V ~ 2.75V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AXP1T34GS125 | NXP USA Inc. |
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74AXP1T34GW125 | NXP USA Inc. |
Description: 74AXP1T34GW - BUFFER, AXP SERIES |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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74LV365N,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16DIP Part Status: Obsolete Supplier Device Package: 16-DIP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 6 Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Through Hole Output Type: 3-State Package / Case: 16-DIP (0.300", 7.62mm) Packaging: Tube |
auf Bestellung 1768 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV132DB,118 | NXP USA Inc. |
Description: NAND GATE, LV/LV-A/LVX/H SERIES, Current - Quiescent (Max): 40 µA Number of Circuits: 4 Part Status: Active Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF Input Logic Level - Low: 0.3V ~ 1.2V Input Logic Level - High: 1.4V ~ 3.9V Supplier Device Package: 14-SSOP Number of Inputs: 2 Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Features: Schmitt Trigger Packaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV132DB,112 | NXP USA Inc. |
Description: NAND GATE, LV/LV-A/LVX/H SERIES, |
auf Bestellung 2492 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVT162241DL,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 48SSOP Supplier Device Package: 48-SSOP Current - Output High, Low: 12mA, 12mA Number of Bits per Element: 4 Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 4 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 48-BSSOP (0.295", 7.50mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1581 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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FS32K116LAT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX6X3EVK10AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Package / Case: 400-LFBGA Packaging: Tray Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD, LVDS Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 760 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX6X3EVK10ACR | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD, LVDS Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (14x14) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX6S4AVM08ABR | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC22XS4200BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| SL2S5302FTB115 | NXP USA Inc. | Description: ICODE SLIX-S SMART LABEL IC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 997 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| A3V09H521-24SR6 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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BZT52H-B5V1/DLT115 | NXP USA Inc. |
Description: NOW NEXPERIA BZT52H-B5V1 - ZENER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX6QP5EVT2AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART SATA: SATA 3Gbps (1) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3L, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MCIMX6DP5EVT2AA | NXP USA Inc. |
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| PCA9617ADP-ARD | NXP USA Inc. |
Description: ARD FM+ I2C-BUS REPEATER EVAL BO Part Status: Active Platform: Arduino Utilized IC / Part: PCA9617A Contents: Board(s) Type: Interface Function: Level Shifter Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SPX3078D | NXP USA Inc. | Description: SENSORS UNCOMP |
Produkt ist nicht verfügbar |
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| P2041NSE7PNC | NXP USA Inc. |
Description: QORIQ, 32-BIT POWER ARCH SOC, 4 Packaging: Bulk Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MCF54452VP266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360BGA Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Core Size: 32-Bit Core Processor: Coldfire V4 Program Memory Type: ROMless Oscillator Type: External, Internal Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 32K x 8 Speed: 266MHz Mounting Type: Surface Mount Package / Case: 360-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 132 Supplier Device Package: 360-BGA (23x23) Peripherals: DMA, WDT |
auf Bestellung 895 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X3EVO10AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (17x17) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 227MHz, 1GHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8349VVAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672TBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MK22DN512VLH5 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 18x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 160 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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FRDMGD3160DCMHB | NXP USA Inc. |
Description: EVAL BOARD FOR GD3160, KL25Z Contents: Board(s), Cable(s) Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU Primary Attributes: 1-Channel (Single) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Type: Power Management Function: Gate Driver Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMGD3160HB8EVM | NXP USA Inc. |
Description: EVAL BOARD FOR GD3160, KL25Z Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU Secondary Attributes: SPI Interface(s) Contents: Board(s), Cable(s) |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDMGD3160HBIEVM | NXP USA Inc. |
Description: GD3160 HALF-BRIDGE EVAL KIT Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Embedded: Yes, MCU, 32-Bit Primary Attributes: 1-Channel (Single) Supplied Contents: Board(s), Cable(s) Utilized IC / Part: GD3160, KL25Z Type: Power Management Function: Gate Driver Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMGD3160XM3EVM | NXP USA Inc. |
Description: EVAL BOARD FOR KL25Z, MC33GD3160 Contents: Board(s), Cable(s), Accessories Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI) Type: Power Management Function: Gate Driver Packaging: Bulk Part Status: Active Embedded: Yes, MCU, 32-Bit Primary Attributes: 1-Channel (Single) Supplied Contents: Board(s), Cable(s), Accessories Utilized IC / Part: KL25Z, MC33GD3160 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM315EK | NXP USA Inc. |
Description: SNGL CH GATE DRIVER 32SOIC Voltage - Output Supply: 4.5V ~ 40V Number of Channels: 1 Part Status: Active Supplier Device Package: 32-SOIC Current - Output High, Low: 15A, 15A Current - Peak Output: 15A Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tube |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM335EK | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 15A 32SOIC Current - Output / Channel: 15A Applications: General Purpose Rds On (Typ): 500mOhm Voltage - Supply: 4.5V ~ 40V Output Configuration: Half Bridge Operating Temperature: -40°C ~ 125°C (TA) Interface: PWM, SPI Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tube Part Status: Active Fault Protection: Over Temperature, Short Circuit Supplier Device Package: 32-SOIC Voltage - Load: 12V ~ 25V Technology: IGBT |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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| MGD3160AM535EK | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 15A 32SOIC Fault Protection: Over Temperature, Short Circuit Supplier Device Package: 32-SOIC Voltage - Load: 12V ~ 25V Technology: IGBT Current - Output / Channel: 15A Applications: General Purpose Rds On (Typ): 500mOhm Voltage - Supply: 4.75V ~ 40V Output Configuration: Half Bridge Operating Temperature: -40°C ~ 125°C (TA) Interface: PWM, SPI Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MGD3160AM515EK | NXP USA Inc. | Description: EV INVERTER CONTROL; IGBT & SIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MC33665ATS4AE | NXP USA Inc. |
Description: IC BMS TPL TXRX CAN GATEWAY Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Function: Power Management Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 487 Stücke: Lieferzeit 10-14 Tag (e) |
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MMG3001NT1 | NXP USA Inc. |
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4 P1dB: 18.5dBm Noise Figure: 4.1dB Current - Supply: 58mA Gain: 20dB Voltage - Supply: 5.6V RF Type: General Purpose Frequency: 40MHz ~ 3.6GHz Mounting Type: Surface Mount Package / Case: TO-243AA Packaging: Tape & Reel (TR) Supplier Device Package: SOT-89-4 Test Frequency: 900MHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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2PD602AS | NXP USA Inc. |
Description: 2PD602A - NPN GENERAL PURPOSE TR Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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BUK7613-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK7613-60E - POWER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS6600M0ESR2 | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCU Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Applications: Safety Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS6501NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS6501NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33592FTAR2 | NXP USA Inc. |
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP Frequency: 315MHz, 434MHz Mounting Type: Surface Mount Sensitivity: -105dBm Package / Case: 24-LQFP Packaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 24-LQFP (4x4) Antenna Connector: PCB, Surface Mount Data Rate (Max): 11kBaud Current - Receiving: 5.7mA Applications: General Data Transfer Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C Data Interface: PCB, Surface Mount Modulation or Protocol: OOK |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33592FTAR2 | NXP USA Inc. |
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP Data Interface: PCB, Surface Mount Modulation or Protocol: OOK Frequency: 315MHz, 434MHz Mounting Type: Surface Mount Sensitivity: -105dBm Package / Case: 24-LQFP Packaging: Cut Tape (CT) Part Status: Obsolete Supplier Device Package: 24-LQFP (4x4) Antenna Connector: PCB, Surface Mount Data Rate (Max): 11kBaud Current - Receiving: 5.7mA Applications: General Data Transfer Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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DSP56F801FA60E | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 16KB (8K x 16) RAM Size: 1K x 16 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800 Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 11 DigiKey Programmable: Verified |
auf Bestellung 980 Stücke: Lieferzeit 10-14 Tag (e) |
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S908AB32AH3CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Speed: 8MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 51 Supplier Device Package: 64-QFP (14x14) Peripherals: POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5746GK1MKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP RAM Size: 768K x 8 Program Memory Size: 3MB (3M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 129 Part Status: Active Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4, e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912XEP100W1MAGR | NXP USA Inc. | Description: IC MCU 16BIT 1MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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FS32K146HAT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-LQFP (10x10) Peripherals: POR, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 24x12b SAR; D/A1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC32PF3000A4EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tape & Reel (TR) Supplier Device Package: 48-HVQFN (7x7) Applications: i.MX Processors Voltage - Supply: 2.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MRF6S18060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 26V TO270-4 Current - Test: 600 mA Voltage - Test: 26 V Voltage - Rated: 68 V Part Status: Obsolete Supplier Device Package: TO-270 WB-4 Technology: LDMOS Gain: 15dB Power - Output: 60W Frequency: 1.99GHz Mounting Type: Surface Mount Package / Case: TO-270AB Packaging: Bulk |
auf Bestellung 642 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8UX6CVLDZAC | NXP USA Inc. | Description: I.MX8 QXP 21X21 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MC33MR2001T2VK | NXP USA Inc. | Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LPC4310FBD144,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP3G0434GD125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Buffer/Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Number of Circuits: 3
auf Bestellung 92750 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1031+ | 0.57 EUR |
| 74AUP3G0434DC125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Number of Circuits: 3
Part Status: Active
Supplier Device Package: 8-VSSOP
Schmitt Trigger Input: No
Number of Inputs: 3 Input (2, 1)
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Buffer/Inverter
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
Description: INVERTER, AUP/ULP/V SERIES
Number of Circuits: 3
Part Status: Active
Supplier Device Package: 8-VSSOP
Schmitt Trigger Input: No
Number of Inputs: 3 Input (2, 1)
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Buffer/Inverter
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 764+ | 0.76 EUR |
| 74AUP3G0434GT115 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Supplier Device Package: 8-XSON (1.95x1)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Description: INVERTER, AUP/ULP/V SERIES
Packaging: Bulk
Supplier Device Package: 8-XSON (1.95x1)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AUP3G0434GS115 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AUP/ULP/V SERIES
Description: INVERTER, AUP/ULP/V SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S9S12ZVL16F0VLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S08SG4E2VTGR518 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AXP1T34GS,125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
auf Bestellung 4967 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2402+ | 0.25 EUR |
| 74AXP1T34GN,125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
auf Bestellung 3199 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1718+ | 0.36 EUR |
| 74AXP1T34GN125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Description: NOW NEXPERIA 74AXP1T34GN - BUFFE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AXP1T34GM125 |
|
Hersteller: NXP USA Inc.
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: 74AXP1T34GM - BUFFER, AXP SERIES
Part Status: Active
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 1
Voltage - Supply: 0.7V ~ 2.75V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AXP1T34GS125 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Description: NOW NEXPERIA 74AXP1T34GS - BUFFE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AXP1T34GW125 |
|
Hersteller: NXP USA Inc.
Description: 74AXP1T34GW - BUFFER, AXP SERIES
Description: 74AXP1T34GW - BUFFER, AXP SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LV365N,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Part Status: Obsolete
Supplier Device Package: 16-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 6
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 1768 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 340+ | 1.84 EUR |
| 74LV132DB,118 |
|
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.4V ~ 3.9V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Features: Schmitt Trigger
Packaging: Bulk
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 9ns @ 5V, 50pF
Input Logic Level - Low: 0.3V ~ 1.2V
Input Logic Level - High: 1.4V ~ 3.9V
Supplier Device Package: 14-SSOP
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Features: Schmitt Trigger
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1569+ | 0.37 EUR |
| 74LV132DB,112 |
|
Hersteller: NXP USA Inc.
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
Description: NAND GATE, LV/LV-A/LVX/H SERIES,
auf Bestellung 2492 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1443+ | 0.44 EUR |
| 74ALVT162241DL,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Supplier Device Package: 48-SSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Supplier Device Package: 48-SSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 1581 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FS32K116LAT0VLFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6X3EVK10AC |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Package / Case: 400-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Package / Case: 400-LFBGA
Packaging: Tray
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
Produkt ist nicht verfügbar
Mindestbestellmenge: 760 Stücke
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| MCIMX6X3EVK10ACR |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD, LVDS
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (14x14)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MCIMX6S4AVM08ABR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| MC22XS4200BEK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
Description: IC PWR SWITCH N-CHAN 1:2 32HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SL2S5302FTB115 |
Hersteller: NXP USA Inc.
Description: ICODE SLIX-S SMART LABEL IC
Description: ICODE SLIX-S SMART LABEL IC
Produkt ist nicht verfügbar
Mindestbestellmenge: 997 Stücke
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| A3V09H521-24SR6 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZT52H-B5V1/DLT115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZT52H-B5V1 - ZENER
Description: NOW NEXPERIA BZT52H-B5V1 - ZENER
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCIMX6QP5EVT2AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6QP 1.2GHZ 624FCBGA
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3L, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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| MCIMX6DP5EVT2AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6DP 1.2GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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| PCA9617ADP-ARD |
|
Hersteller: NXP USA Inc.
Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCA9617A
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Box
Description: ARD FM+ I2C-BUS REPEATER EVAL BO
Part Status: Active
Platform: Arduino
Utilized IC / Part: PCA9617A
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPX3078D |
Hersteller: NXP USA Inc.
Description: SENSORS UNCOMP
Description: SENSORS UNCOMP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2041NSE7PNC |
|
Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Description: QORIQ, 32-BIT POWER ARCH SOC, 4
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54452VP266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 32K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
Description: IC MCU 32BIT ROMLESS 360BGA
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Core Size: 32-Bit
Core Processor: Coldfire V4
Program Memory Type: ROMless
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 32K x 8
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 132
Supplier Device Package: 360-BGA (23x23)
Peripherals: DMA, WDT
auf Bestellung 895 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 64.8 EUR |
| 10+ | 52.67 EUR |
| 25+ | 49.63 EUR |
| 100+ | 46.31 EUR |
| 300+ | 44.45 EUR |
| MCIMX6X3EVO10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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Stück im Wert von UAH
| MPC8349VVAGDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672TBGA
Description: IC MPU MPC83XX 400MHZ 672TBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MK22DN512VLH5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
Im Einkaufswagen
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| FRDMGD3160DCMHB |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Description: EVAL BOARD FOR GD3160, KL25Z
Contents: Board(s), Cable(s)
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1146.08 EUR |
| FRDMGD3160HB8EVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
Contents: Board(s), Cable(s)
Description: EVAL BOARD FOR GD3160, KL25Z
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Secondary Attributes: SPI Interface(s)
Contents: Board(s), Cable(s)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1130.1 EUR |
| FRDMGD3160HBIEVM |
Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Description: GD3160 HALF-BRIDGE EVAL KIT
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: GD3160, KL25Z
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 797.72 EUR |
| FRDMGD3160XM3EVM |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
Description: EVAL BOARD FOR KL25Z, MC33GD3160
Contents: Board(s), Cable(s), Accessories
Secondary Attributes: SPI Interface(s), Graphical User Interface (GUI)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Part Status: Active
Embedded: Yes, MCU, 32-Bit
Primary Attributes: 1-Channel (Single)
Supplied Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: KL25Z, MC33GD3160
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 665.02 EUR |
| MGD3160AM315EK |
|
Hersteller: NXP USA Inc.
Description: SNGL CH GATE DRIVER 32SOIC
Voltage - Output Supply: 4.5V ~ 40V
Number of Channels: 1
Part Status: Active
Supplier Device Package: 32-SOIC
Current - Output High, Low: 15A, 15A
Current - Peak Output: 15A
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Description: SNGL CH GATE DRIVER 32SOIC
Voltage - Output Supply: 4.5V ~ 40V
Number of Channels: 1
Part Status: Active
Supplier Device Package: 32-SOIC
Current - Output High, Low: 15A, 15A
Current - Peak Output: 15A
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.56 EUR |
| 10+ | 17.68 EUR |
| MGD3160AM335EK |
|
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.5V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.5V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.85 EUR |
| 10+ | 17.93 EUR |
| 42+ | 17.1 EUR |
| MGD3160AM535EK |
|
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.75V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Description: IC HALF BRIDGE DRIVER 15A 32SOIC
Fault Protection: Over Temperature, Short Circuit
Supplier Device Package: 32-SOIC
Voltage - Load: 12V ~ 25V
Technology: IGBT
Current - Output / Channel: 15A
Applications: General Purpose
Rds On (Typ): 500mOhm
Voltage - Supply: 4.75V ~ 40V
Output Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C (TA)
Interface: PWM, SPI
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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| MGD3160AM515EK |
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Description: EV INVERTER CONTROL; IGBT & SIC
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33665ATS4AE |
|
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 487 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 17.59 EUR |
| 10+ | 13.7 EUR |
| 25+ | 12.72 EUR |
| 100+ | 11.65 EUR |
| 250+ | 11.14 EUR |
| MMG3001NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
P1dB: 18.5dBm
Noise Figure: 4.1dB
Current - Supply: 58mA
Gain: 20dB
Voltage - Supply: 5.6V
RF Type: General Purpose
Frequency: 40MHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
Description: IC AMP GPS 40MHZ-3.6GHZ SOT89-4
P1dB: 18.5dBm
Noise Figure: 4.1dB
Current - Supply: 58mA
Gain: 20dB
Voltage - Supply: 5.6V
RF Type: General Purpose
Frequency: 40MHz ~ 3.6GHz
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Supplier Device Package: SOT-89-4
Test Frequency: 900MHz
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 2PD602AS |
|
Hersteller: NXP USA Inc.
Description: 2PD602A - NPN GENERAL PURPOSE TR
Part Status: Active
Packaging: Bulk
Description: 2PD602A - NPN GENERAL PURPOSE TR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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| BUK7613-60E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK7613-60E - POWER
Description: NOW NEXPERIA BUK7613-60E - POWER
Produkt ist nicht verfügbar
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| MC33FS6600M0ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: SAFETY SBC FOR S32S2 MCU
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Applications: Safety
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC35FS6501NAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MC35FS6501NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| MC33592FTAR2 |
|
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33592FTAR2 |
|
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Data Interface: PCB, Surface Mount
Modulation or Protocol: OOK
Frequency: 315MHz, 434MHz
Mounting Type: Surface Mount
Sensitivity: -105dBm
Package / Case: 24-LQFP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 24-LQFP (4x4)
Antenna Connector: PCB, Surface Mount
Data Rate (Max): 11kBaud
Current - Receiving: 5.7mA
Applications: General Data Transfer
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Produkt ist nicht verfügbar
Im Einkaufswagen
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| DSP56F801FA60E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Verified
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.93 EUR |
| 10+ | 20.6 EUR |
| 25+ | 19.25 EUR |
| 100+ | 17.79 EUR |
| 250+ | 17.74 EUR |
| S908AB32AH3CFUER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Description: IC MCU 8BIT 32KB FLASH 64QFP
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 51
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Produkt ist nicht verfügbar
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| SPC5746GK1MKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Description: IC MCU 32BIT 3MB FLASH 176LQFP
RAM Size: 768K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 129
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Produkt ist nicht verfügbar
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| S912XEP100W1MAGR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
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| FS32K146HAT0MLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1MB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MC32PF3000A4EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Supplier Device Package: 48-HVQFN (7x7)
Applications: i.MX Processors
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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| MRF6S18060NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Current - Test: 600 mA
Voltage - Test: 26 V
Voltage - Rated: 68 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15dB
Power - Output: 60W
Frequency: 1.99GHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Bulk
Description: RF MOSFET LDMOS 26V TO270-4
Current - Test: 600 mA
Voltage - Test: 26 V
Voltage - Rated: 68 V
Part Status: Obsolete
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15dB
Power - Output: 60W
Frequency: 1.99GHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Bulk
auf Bestellung 642 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 146.74 EUR |
| MIMX8UX6CVLDZAC |
Hersteller: NXP USA Inc.
Description: I.MX8 QXP 21X21
Description: I.MX8 QXP 21X21
Produkt ist nicht verfügbar
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| MC33MR2001T2VK |
Hersteller: NXP USA Inc.
Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
Description: IC TXRX 77GHZ RADAR AUTO 89VFBGA
Produkt ist nicht verfügbar
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