Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36002) > Seite 457 nach 601
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LPC5534JBD64K | NXP USA Inc. |
 Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 13x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC5536JBD64K | NXP USA Inc. |
Description: IC MCU M33 256KB/128KB HTQFP64 |
Produkt ist nicht verfügbar |
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MCIMX6X1CVO08ACR | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA Packaging: Tape & Reel (TR) Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MKW35A512VFP4R | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz Memory Size: 512kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 5dBm Protocol: Bluetooth v5.0 Current - Receiving: 6.3mA Data Rate (Max): 1Mbps Current - Transmitting: 5.7mA Supplier Device Package: 40-HVQFN (6x6) Modulation: FSK, GFSK, MSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS8623BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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IP4251CZ12-6,118 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: 12-XFDFN Exposed Pad Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 10pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 16dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 6 |
Produkt ist nicht verfügbar |
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| IP3048CX5,135 | NXP USA Inc. |
Description: FILTER LC(PI) 3NH/190PF ESD SMD Packaging: Bulk Package / Case: 5-WFBGA, WLCSP Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 3nH (Total), C = 190pF (Total) Height: 0.027" (0.69mm) Attenuation Value: 35dB @ 800MHz ~ 2GHz Filter Order: 3rd Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Resistance - Channel (Ohms): 0.25 ESD Protection: Yes Number of Channels: 2 Current: 625 mA |
auf Bestellung 100733 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4059CX5/LF,135 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 5CSP Packaging: Tape & Reel (TR) Package / Case: 5-UFBGA, WLCSP Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: Ethernet, USB OTG Capacitance @ Frequency: 3pF @ 1MHz Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 5-CSP (1.33x0.96) Unidirectional Channels: 3 Voltage - Breakdown (Min): 6V Power Line Protection: Yes |
Produkt ist nicht verfügbar |
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| IP4350CX24/LF,135 | NXP USA Inc. |
Description: TVS DIODE 24WLCSP Packaging: Tape & Reel (TR) Package / Case: 24-WFBGA, WLCSP Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -35°C ~ 85°C (TA) Applications: Multimedia Card Interface Supplier Device Package: 24-WLCSP (1.95x2.11) Unidirectional Channels: 9 Voltage - Breakdown (Min): 6V Power Line Protection: Yes Part Status: Obsolete |
Produkt ist nicht verfügbar |
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IP4772CZ16,118 | NXP USA Inc. | Description: IC VIDEO SGNL COND 16SSOP |
Produkt ist nicht verfügbar |
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IP4772CZ16,118 | NXP USA Inc. | Description: IC VIDEO SGNL COND 16SSOP |
auf Bestellung 395224 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4769CZ14,118 | NXP USA Inc. |
Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Part Status: Obsolete |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5746RK1MLU3 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 12b SAR, 16b Sigma-Delta Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 176-LQFP (24x24) Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MCIMX6U5DVM10ADR | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA Packaging: Cut Tape (CT) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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| MCIMX6QP4AVT8AA | NXP USA Inc. |
Description: IC MPU I.MX6QP 852MHZ 624FCBGA Packaging: Bulk Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6DP6AVT1ABR | NXP USA Inc. |
Description: IC MPU I.MX6DP 1GHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6DP6AVT1ABR | NXP USA Inc. |
Description: IC MPU I.MX6DP 1GHZ 624FCBGA Packaging: Cut Tape (CT) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SC4E0CTG | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 96 Stücke: Lieferzeit 10-14 Tag (e) |
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MK51DN512CLQ10 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 94 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MRF24300NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 2.45GHz Power - Output: 330W Gain: 13.1dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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MRF24300NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V OM780-2 Packaging: Cut Tape (CT) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 2.45GHz Power - Output: 330W Gain: 13.1dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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| BLL6H1214L-250,112 | NXP USA Inc. |
Description: TRANS L-BAND RADAR LDMOS SOT502A Packaging: Tube |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604BK0CLQ6R | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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SPC5604BK0CLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MC9S12D64CPVE,557 | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 |
Produkt ist nicht verfügbar |
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MC9S12D64VFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12D64MPVE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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RD-UAMP-SENSOR | NXP USA Inc. |
Description: SUB-A CURRENT SENSOR BOARD Packaging: Bulk Interface: I2C Voltage - Supply: 3.3V Sensor Type: Current Sensor Supplied Contents: Board(s) Embedded: Yes, MCU Sensing Range: 60nA ~ 5mA Part Status: Active Contents: Board(s) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V12500HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Cut Tape (CT) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 500W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Active Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 200 mA |
auf Bestellung 201 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C3V9/LF1R | NXP USA Inc. |
Description: DIODE ZENER 3.9V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.9 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 3 µA @ 1 V |
Produkt ist nicht verfügbar |
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PCA9539BSHP | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24HVQFN Features: POR Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 50mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC852TVR80A | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MPC860SRZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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TDA8542TS/N1,112 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 1.2W 20SSOP Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 20-LSSOP (0.173", 4.40mm Width) Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 18V Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm Supplier Device Package: 20-SSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA8547TS/N1/02,11 | NXP USA Inc. |
Description: IC AMP CLASS AB STER 1.2W 20SSOP Features: Mute, Short-Circuit and Thermal Protection, Standby Packaging: Tube Package / Case: 20-LSSOP (0.173", 4.40mm Width) Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class AB Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.2V ~ 18V Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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74HC670D,652 | NXP USA Inc. |
Description: IC 4X4 REGISTER FILE 3ST 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Register File Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 4 Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74HC670D,653 | NXP USA Inc. |
Description: IC 4X4 REGISTER FILE 3ST 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 1:1 Type: Register File Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 4 Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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IP3253CZ8-4-TTL,132 | NXP USA Inc. |
Description: NOW NEXPERIA CONSUMER CIRCUIT Packaging: Bulk |
Produkt ist nicht verfügbar |
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IP3253CZ8-4-TTL132 | NXP USA Inc. |
Description: Nexperia IP3253CZ8-4-TT - 4-chan Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC9S12B64CFUE-NXP | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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MC908AP32ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44QFP Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 44-QFP (10x10) Part Status: Not For New Designs Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP32CFAER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, IRSCI, SCI, SPI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCZ33903BS5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
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PCF8570T/F5,518 | NXP USA Inc. |
Description: IC SRAM 2KBIT I2C 100KHZ 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 6V Technology: SRAM Clock Frequency: 100 kHz Memory Format: SRAM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCF8570P/F5,112 | NXP USA Inc. |
Description: IC SRAM 2KBIT I2C 100KHZ 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Memory Size: 2Kbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 6V Technology: SRAM Clock Frequency: 100 kHz Memory Format: SRAM Supplier Device Package: 8-DIP Memory Interface: I2C Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCF8570T/F5,512 | NXP USA Inc. |
Description: IC SRAM 2KBIT I2C 100KHZ 8SO Packaging: Tube Package / Case: 8-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 2Kbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 6V Technology: SRAM Clock Frequency: 100 kHz Memory Format: SRAM Supplier Device Package: 8-SO Memory Interface: I2C Memory Organization: 256 x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1832TS/1X | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 36kHz ~ 130kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V |
auf Bestellung 2296 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33904C5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
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PEMI6QFN/BYP,132 | NXP USA Inc. |
Description: FILTER RC(PI) ESD SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Height: 0.020" (0.50mm) Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5606SF2VLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| 74HCT4851PW112 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT4851PW - SINGL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MCF51JM32VLD | NXP USA Inc. |
Description: MCF51JM 32-BIT MCU, COLDFIRE V1 |
Produkt ist nicht verfügbar |
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MCF51JM128EVLD | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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| CGD985HCI/01112 | NXP USA Inc. |
Description: IC AMP POWER SOT115 Packaging: Bulk Package / Case: SOT-115J Mounting Type: Chassis Mount Frequency: 40MHz ~ 1.003GHz RF Type: CATV Voltage - Supply: 24V Gain: 25.5dB Current - Supply: 440mA Noise Figure: 5dB Supplier Device Package: SOT-115J |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDZ6.8B/ZLX | NXP USA Inc. |
Description: DIODE ZENER SOD323 Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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LD6805K/14P,115 | NXP USA Inc. |
Description: IC REG LIN 1.4V 150MA DFN1010C-4 Packaging: Tape & Reel (TR) Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 1.4V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BZV49-C11115 | NXP USA Inc. |
Description: DIODE ZENER 10V 1W 5% UNIDIR Packaging: Bulk Tolerance: ±5% Package / Case: TO-243AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-89 Part Status: Active Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
Produkt ist nicht verfügbar |
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LFSTBEB7361 | NXP USA Inc. |
Description: EVAL BOARD FOR MMA7361L |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| NX3L1T3157GM | NXP USA Inc. |
Description: IC SWITCH SPDT 6XSON Packaging: Bulk |
Produkt ist nicht verfügbar |
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NX3L1T3157GM,115 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 500MOHM 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 500mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Number of Circuits: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LPC5534JBD64K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC5536JBD64K |
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Hersteller: NXP USA Inc.
Description: IC MCU M33 256KB/128KB HTQFP64
Description: IC MCU M33 256KB/128KB HTQFP64
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6X1CVO08ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKW35A512VFP4R |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 5dBm
Protocol: Bluetooth v5.0
Current - Receiving: 6.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 5.7mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS8623BMDA0ES |
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Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4251CZ12-6,118 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP3048CX5,135 |
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Bulk
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
auf Bestellung 100733 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1567+ | 0.3 EUR |
| IP4059CX5/LF,135 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 5CSP
Packaging: Tape & Reel (TR)
Package / Case: 5-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Ethernet, USB OTG
Capacitance @ Frequency: 3pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 5-CSP (1.33x0.96)
Unidirectional Channels: 3
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4350CX24/LF,135 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Description: TVS DIODE 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-WFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: Multimedia Card Interface
Supplier Device Package: 24-WLCSP (1.95x2.11)
Unidirectional Channels: 9
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4772CZ16,118 |
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
Description: IC VIDEO SGNL COND 16SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IP4772CZ16,118 |
Hersteller: NXP USA Inc.
Description: IC VIDEO SGNL COND 16SSOP
Description: IC VIDEO SGNL COND 16SSOP
auf Bestellung 395224 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 656+ | 0.84 EUR |
| IP4769CZ14,118 |
|
Hersteller: NXP USA Inc.
Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Description: IC VGA TXRX/DDC LEV SHIF 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1902+ | 0.26 EUR |
| SPC5746RK1MLU3 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6U5DVM10ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6QP4AVT8AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6QP 852MHZ 624FCBGA
Packaging: Bulk
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 125.55 EUR |
| MCIMX6DP6AVT1ABR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 500+ | 111.62 EUR |
| MCIMX6DP6AVT1ABR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6DP 1GHZ 624FCBGA
Packaging: Cut Tape (CT)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 164.45 EUR |
| 10+ | 138.01 EUR |
| 25+ | 131.41 EUR |
| 100+ | 124.16 EUR |
| S9S08SC4E0CTG |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 96 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.51 EUR |
| 10+ | 3.51 EUR |
| 96+ | 2.88 EUR |
| MK51DN512CLQ10 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF24300NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF24300NR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 330W
Gain: 13.1dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BLL6H1214L-250,112 |
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 605.09 EUR |
| SPC5604BK0CLQ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BK0CLQ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12D64CPVE,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12D64VFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12D64MPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| RD-UAMP-SENSOR |
|
Hersteller: NXP USA Inc.
Description: SUB-A CURRENT SENSOR BOARD
Packaging: Bulk
Interface: I2C
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 60nA ~ 5mA
Part Status: Active
Contents: Board(s)
Description: SUB-A CURRENT SENSOR BOARD
Packaging: Bulk
Interface: I2C
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Supplied Contents: Board(s)
Embedded: Yes, MCU
Sensing Range: 60nA ~ 5mA
Part Status: Active
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 275.18 EUR |
| MRF6V12500HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 500W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Active
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 1054.42 EUR |
| 10+ | 984.3 EUR |
| BZX84-C3V9/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.9V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Description: DIODE ZENER 3.9V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9539BSHP |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC852TVR80A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC860SRZQ50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA8542TS/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA8547TS/N1/02,11 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Description: IC AMP CLASS AB STER 1.2W 20SSOP
Features: Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 2 @ 8Ohm
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC670D,652 |
|
Hersteller: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC670D,653 |
|
Hersteller: NXP USA Inc.
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC 4X4 REGISTER FILE 3ST 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 1:1
Type: Register File
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 4
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S12B64CFUE-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC908AP32ACFBE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908AP32CFAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903BS5EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCF8570T/F5,518 |
|
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF8570P/F5,112 |
|
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-DIP
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-DIP
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCF8570T/F5,512 |
|
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 6V
Technology: SRAM
Clock Frequency: 100 kHz
Memory Format: SRAM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1832TS/1X |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Description: IC OFFLINE SWITCH FLYBACK SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 36kHz ~ 130kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
auf Bestellung 2296 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 22+ | 0.81 EUR |
| 31+ | 0.57 EUR |
| 35+ | 0.51 EUR |
| 100+ | 0.44 EUR |
| 250+ | 0.41 EUR |
| 500+ | 0.39 EUR |
| 1000+ | 0.38 EUR |
| MCZ33904C5EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PEMI6QFN/BYP,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) ESD SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Height: 0.020" (0.50mm)
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1902+ | 0.27 EUR |
| SPC5606SF2VLQ6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT4851PW112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4851PW - SINGL
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74HCT4851PW - SINGL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF51JM32VLD |
|
Hersteller: NXP USA Inc.
Description: MCF51JM 32-BIT MCU, COLDFIRE V1
Description: MCF51JM 32-BIT MCU, COLDFIRE V1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF51JM128EVLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.24 EUR |
| 10+ | 16.01 EUR |
| 25+ | 14.96 EUR |
| 160+ | 14.54 EUR |
| CGD985HCI/01112 |
|
Hersteller: NXP USA Inc.
Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 62.92 EUR |
| PDZ6.8B/ZLX |
Hersteller: NXP USA Inc.
Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LD6805K/14P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.4V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 1.4V 150MA DFN1010C-4
Packaging: Tape & Reel (TR)
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
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| BZV49-C11115 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 10V 1W 5% UNIDIR
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: DIODE ZENER 10V 1W 5% UNIDIR
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-243AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-89
Part Status: Active
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
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| LFSTBEB7361 |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MMA7361L
Description: EVAL BOARD FOR MMA7361L
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| NX3L1T3157GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 500mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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