Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 454 nach 592
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PBSS5220PAPS115 | NXP USA Inc. |
 Description: NOW NEXPERIA PBSS5220PAPS SMALLPackaging: Bulk Part Status: Active Package / Case: 6-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: 2 PNP Operating Temperature: 150°C (TJ) Power - Max: 370mW Current - Collector (Ic) (Max): 2A Voltage - Collector Emitter Breakdown (Max): 20V Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V Frequency - Transition: 95MHz Supplier Device Package: DFN2020D-6 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 7440 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH16CTGR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC8248CZQMIBA-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8245TVV300D-NXP | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32 BIT, PO Packaging: Bulk Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC™ MPC603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN3DVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
auf Bestellung 51 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA8537BH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP |
Produkt ist nicht verfügbar |
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
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PCA8537AH/Q900/1,5 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Display Type: LCD Mounting Type: Surface Mount Interface: I2S Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 22 Characters, 44 Characters, 352 Elements Supplier Device Package: 64-TQFP (10x10) Current - Supply: 200 µA |
Produkt ist nicht verfügbar |
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PESD3V3V4UF,115 | NXP USA Inc. |
Description: TVS DIODE 3.3VWM 6XSON SOT886 Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 15pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V (Max) Supplier Device Package: 6-XSON, SOT886 (1.45x1) Unidirectional Channels: 4 Voltage - Breakdown (Min): 5.3V Voltage - Clamping (Max) @ Ipp: 11V Power - Peak Pulse: 16W Power Line Protection: No |
Produkt ist nicht verfügbar |
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MIMXRT1062XVN5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 237 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1062DVN6B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Part Status: Active Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC4851PW118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HC4851PW SINGLE-E Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MAC57D5-208DC | NXP USA Inc. |
Description: MAC57D5XX EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4 Utilized IC / Part: MAC57D5xx |
Produkt ist nicht verfügbar |
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74ABT640D,602 | NXP USA Inc. |
Description: IC TXRX INVERT 5.5V 20SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-SO |
auf Bestellung 2422 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT640D,623 | NXP USA Inc. |
Description: IC TXRX INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 20-SO |
auf Bestellung 950 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Bulk Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 292 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32R274KSK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S67JET256551 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 256LBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 204MHz Program Memory Size: 1MB (1M x 8) RAM Size: 154K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 16x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Part Status: Active Number of I/O: 164 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S50FET180551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 |
Produkt ist nicht verfügbar |
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| LPC4330FET180/CP3342 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC43S50FET180E551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 264K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 118 |
Produkt ist nicht verfügbar |
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SPC5604BF2MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| OM13480UL | NXP USA Inc. |
Description: NVT4555UK SIM CARD LT/LDO WL CSP |
Produkt ist nicht verfügbar |
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CBT3257ADS,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 4 X 2:1 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3257ADB112 | NXP USA Inc. |
Description: NOW NEXPERIA CBT3257ADB - MULTIP |
auf Bestellung 2886 Stücke: Lieferzeit 10-14 Tag (e) |
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MC17XSG500EKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
Produkt ist nicht verfügbar |
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74AHCT377PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 8mA, 8mA Trigger Type: Positive Edge Clock Frequency: 130 MHz Input Capacitance: 3 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 8 |
auf Bestellung 17045 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT125PW/C1118 | NXP USA Inc. |
Description: BUS DRIVER, AHCT/VHCT/VT SERIES |
Produkt ist nicht verfügbar |
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MPC8313CVRAGDC | NXP USA Inc. |
Description: IC MPU POWERQUICC II PRO 516PBGA |
Produkt ist nicht verfügbar |
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MC68711E20MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
Produkt ist nicht verfügbar |
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MIMX8MM2CVTKZAA | NXP USA Inc. |
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5602BF2VLL6R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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PNX9530E/V140518 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 1758 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/28P,115 | NXP USA Inc. |
Description: IC REG LIN 2.8V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.8V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 8753 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8053X | NXP USA Inc. |
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON Packaging: Cut Tape (CT) Package / Case: 8-WFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 2GHz ~ 4GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 4.75V ~ 5.25V Gain: 18.5dB Current - Supply: 48mA Noise Figure: 0.56dB P1dB: 18dBm Test Frequency: 2.5GHz Supplier Device Package: 8-HWSON (2x2) Part Status: Active |
Produkt ist nicht verfügbar |
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PCF2131-ARD | NXP USA Inc. |
Description: PCF2131 RTC EVAL BOARD Packaging: Bulk Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF2131 Platform: Arduino |
Produkt ist nicht verfügbar |
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SPC5602BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K144UAT0VLHT,557 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Tape & Reel (TR) |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| NTM88H135T1 | NXP USA Inc. |
Description: IC PRESSURE SENSOR 24HQFN Packaging: Cut Tape (CT) |
auf Bestellung 3606 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16821DGG118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 2 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 350 MHz Input Capacitance: 5 pF Supplier Device Package: 56-TSSOP Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF Number of Bits per Element: 10 |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH16500DGG118 | NXP USA Inc. |
Description: REGISTERED BUS TRANSCEIVER Packaging: Bulk Part Status: Active Package / Case: 56-TFSOP (0.240", 6.10mm Width) Number of Circuits: 18 Mounting Type: Surface Mount Logic Type: Universal Bus Transceiver Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-TSSOP |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH162244ADGG118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVCH162244ADGG - Packaging: Bulk Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9901DP,118 | NXP USA Inc. |
Description: IC LED DRIVER LINEAR 20MA 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Outputs: 1 Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 20mA Internal Switch(s): Yes Supplier Device Package: 8-TSSOP Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| CBTL05024BS128 | NXP USA Inc. |
Description: HIGH PERFORMANCE MULTIPLEXER/DEM Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| PMCXB900UEL/S500,147 | NXP USA Inc. |
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| PMCXB900UEL147 | NXP USA Inc. |
Description: P-CHANNEL MOSFET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| PMCXB900UE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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S912B32E4VFUE8R | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PIMD3115 | NXP USA Inc. |
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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BZX84-B56,215 | NXP USA Inc. |
Description: DIODE ZENER 56V 250MW SOT23 Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 56 V Impedance (Max) (Zzt): 200 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V Qualification: AEC-Q101 |
auf Bestellung 35000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B51/DG/B2215 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZX84-B51215 | NXP USA Inc. |
Description: NOW NEXPERIA BZX84-B51 - ZENER D |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| P3041NSE7NNC557 | NXP USA Inc. |
Description: QORIQ, 32 BIT POWER ARCH SOC, 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MKV44F64VLH16557 | NXP USA Inc. |
Description: CORTEX M4F RISC MICROCONTROLLER |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV42F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV42F64VLH16557 | NXP USA Inc. |
Description: CORTEX M4F RISC MICROCONTROLLER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV44F256VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV44F256VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV44F128VLH16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PBSS5220PAPS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
Description: NOW NEXPERIA PBSS5220PAPS SMALL
Packaging: Bulk
Part Status: Active
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 2 PNP
Operating Temperature: 150°C (TJ)
Power - Max: 370mW
Current - Collector (Ic) (Max): 2A
Voltage - Collector Emitter Breakdown (Max): 20V
Vce Saturation (Max) @ Ib, Ic: 390mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 1A, 2V
Frequency - Transition: 95MHz
Supplier Device Package: DFN2020D-6
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 7440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1734+ | 0.27 EUR |
| MC9S08SH16CTGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8248CZQMIBA-NXP |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: HDLC/SDLC, I2C, SCC, SMC, SPI, TDM, UART/USART
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 6+ | 80.46 EUR |
| MPC8245TVV300D-NXP |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
Description: RISC MICROPROCESSOR, 32 BIT, PO
Packaging: Bulk
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC™ MPC603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: DMA, DUART, I2C, I²O, PCI, UART
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 207.05 EUR |
| MIMX8MN3DVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 3 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 37.51 EUR |
| 10+ | 30.07 EUR |
| 25+ | 28.21 EUR |
| PCA8537BH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Description: IC DRVR 7 SEGMENT 64TQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA8537AH/Q900/1,5 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Description: IC DRVR 7 SEGMENT 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2S
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 22 Characters, 44 Characters, 352 Elements
Supplier Device Package: 64-TQFP (10x10)
Current - Supply: 200 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PESD3V3V4UF,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 6XSON SOT886
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Description: TVS DIODE 3.3VWM 6XSON SOT886
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1062XVN5B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 24.06 EUR |
| 10+ | 19.07 EUR |
| 25+ | 17.82 EUR |
| 160+ | 16.09 EUR |
| MIMXRT1062DVN6B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.17 EUR |
| 10+ | 15.99 EUR |
| 25+ | 14.94 EUR |
| 100+ | 14.59 EUR |
| MAC57D5-208DC |
Hersteller: NXP USA Inc.
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
Description: MAC57D5XX EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A5, Cortex®-M0+, Cortex®-M4
Utilized IC / Part: MAC57D5xx
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74ABT640D,602 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Description: IC TXRX INVERT 5.5V 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
auf Bestellung 2422 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 650+ | 0.78 EUR |
| 74ABT640D,623 |
|
Hersteller: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Description: IC TXRX INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
auf Bestellung 950 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 650+ | 0.75 EUR |
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 58.84 EUR |
| FS32R274KSK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S67JET256551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 154K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC4330FET180/CP3342 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC43S50FET180E551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 118
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BF2MLL6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13480UL |
|
Hersteller: NXP USA Inc.
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Description: NVT4555UK SIM CARD LT/LDO WL CSP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBT3257ADS,112 |
|
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 4 X 2:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC MUX/DEMUX 4 X 2:1 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1169+ | 0.43 EUR |
| CBT3257ADB112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA CBT3257ADB - MULTIP
Description: NOW NEXPERIA CBT3257ADB - MULTIP
auf Bestellung 2886 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1367+ | 0.36 EUR |
| MC17XSG500EKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74AHCT377PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 130 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 10.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 17045 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1258+ | 0.42 EUR |
| 74AHCT125PW/C1118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8313CVRAGDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Description: IC MPU POWERQUICC II PRO 516PBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68711E20MFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MM2CVTKZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MM 1.6GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 58.96 EUR |
| 10+ | 48.05 EUR |
| 25+ | 45.32 EUR |
| SPC5602BF2VLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PNX9530E/V140518 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 63.72 EUR |
| LD6805K/28P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.8V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 8753 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3206+ | 0.16 EUR |
| BGU8053X |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2GHz ~ 4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.56dB
P1dB: 18dBm
Test Frequency: 2.5GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Description: IC RF AMP GSM 2GHZ-4GHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2GHz ~ 4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 18.5dB
Current - Supply: 48mA
Noise Figure: 0.56dB
P1dB: 18dBm
Test Frequency: 2.5GHz
Supplier Device Package: 8-HWSON (2x2)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF2131-ARD |
|
Hersteller: NXP USA Inc.
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
Description: PCF2131 RTC EVAL BOARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF2131
Platform: Arduino
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5602BK0CLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K144UAT0VLHT,557 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTM88H135T1 |
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 5.28 EUR |
| NTM88H135T1 |
auf Bestellung 3606 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.01 EUR |
| 5+ | 7.19 EUR |
| 10+ | 6.89 EUR |
| 25+ | 6.53 EUR |
| 50+ | 6.29 EUR |
| 100+ | 6.06 EUR |
| 500+ | 5.61 EUR |
| 1000+ | 5.44 EUR |
| 74ALVCH16821DGG118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Number of Bits per Element: 10
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 350 MHz
Input Capacitance: 5 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 4.5ns @ 3.3V, 50pF
Number of Bits per Element: 10
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 367+ | 1.38 EUR |
| 74ALVCH16500DGG118 |
|
Hersteller: NXP USA Inc.
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
Description: REGISTERED BUS TRANSCEIVER
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Number of Circuits: 18
Mounting Type: Surface Mount
Logic Type: Universal Bus Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 350+ | 1.38 EUR |
| 74LVCH162244ADGG118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVCH162244ADGG -
Packaging: Bulk
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 709+ | 0.7 EUR |
| PCA9901DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 20mA
Internal Switch(s): Yes
Supplier Device Package: 8-TSSOP
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER LINEAR 20MA 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 20mA
Internal Switch(s): Yes
Supplier Device Package: 8-TSSOP
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL05024BS128 |
|
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Description: HIGH PERFORMANCE MULTIPLEXER/DEM
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL/S500,147 |
|
Hersteller: NXP USA Inc.
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Description: 0.6A, 20V, 2-ELEMENT, N CHANNEL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UEL147 |
|
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Description: P-CHANNEL MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMCXB900UE147 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912B32E4VFUE8R |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PIMD3115 |
|
Hersteller: NXP USA Inc.
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
Description: PIMD3 - NPN/PNP RESISTOR-EQUIPPE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B56,215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 56V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q101
Description: DIODE ZENER 56V 250MW SOT23
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 56 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 39.2 V
Qualification: AEC-Q101
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13172+ | 0.034 EUR |
| BZX84-B51/DG/B2215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 7212+ | 0.071 EUR |
| BZX84-B51215 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Description: NOW NEXPERIA BZX84-B51 - ZENER D
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P3041NSE7NNC557 |
|
Hersteller: NXP USA Inc.
Description: QORIQ, 32 BIT POWER ARCH SOC, 4
Description: QORIQ, 32 BIT POWER ARCH SOC, 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKV44F64VLH16557 |
|
Hersteller: NXP USA Inc.
Description: CORTEX M4F RISC MICROCONTROLLER
Description: CORTEX M4F RISC MICROCONTROLLER
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 61+ | 8.18 EUR |
| MKV42F128VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKV42F64VLH16557 |
|
Hersteller: NXP USA Inc.
Description: CORTEX M4F RISC MICROCONTROLLER
Description: CORTEX M4F RISC MICROCONTROLLER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKV44F256VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKV44F256VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MKV44F128VLH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH