MC33FS6500NAER2 NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore, LQFP48EP
| Anzahl | Preis |
|---|---|
| 1+ | 10.74 EUR |
| 10+ | 8.24 EUR |
| 25+ | 7.6 EUR |
| 100+ | 6.92 EUR |
| 250+ | 6.58 EUR |
| 500+ | 6.39 EUR |
| 1000+ | 6.32 EUR |
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Technische Details MC33FS6500NAER2 NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO, Part Status: Active, Supplier Device Package: 48-HLQFP (7x7), Applications: System Basis Chip, Voltage - Supply: 1V ~ 5V, Operating Temperature: -40°C ~ 125°C, Mounting Type: Surface Mount, Package / Case: 48-LQFP Exposed Pad, Packaging: Tape & Reel (TR).
Weitere Produktangebote MC33FS6500NAER2
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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MC33FS6500NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO Part Status: Active Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MC33FS6500NAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Part Status: Active
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH