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MCZ33903BS5EKR2 MCZ33903BS5EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
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PCF8570T/F5,518 PCF8570T/F5,518 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-SO
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PCF8570P/F5,112 PCF8570P/F5,112 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-DIP
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
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PCF8570T/F5,512 PCF8570T/F5,512 NXP USA Inc. PCF8570.pdf Description: IC SRAM 2KBIT I2C 100KHZ 8SO
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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TEA1832TS/1X TEA1832TS/1X NXP USA Inc. TEA1832TS.pdf Description: IC OFFLINE SWITCH FLYBACK SC74
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 36kHz ~ 130kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
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MCZ33904C5EKR2 MCZ33904C5EKR2 NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
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PEMI6QFN/BYP,132 PEMI6QFN/BYP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) ESD SMD
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
Number of Channels: 6
ESD Protection: Yes
Technology: RC (Pi)
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SPC5606SF2VLQ6 SPC5606SF2VLQ6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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74HCT4851PW112 NXP USA Inc. 74HC_HCT4851.pdf Description: NOW NEXPERIA 74HCT4851PW - SINGL
Part Status: Active
Packaging: Bulk
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MCF51JM32VLD MCF51JM32VLD NXP USA Inc. FSCLS07441-1.pdf?t.download=true&u=5oefqw Description: MCF51JM 32-BIT MCU, COLDFIRE V1
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MCF51JM128EVLD MCF51JM128EVLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
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CGD985HCI/01112 NXP USA Inc. PHGLS22646-1.pdf?t.download=true&u=5oefqw Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
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PDZ6.8B/ZLX NXP USA Inc. Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
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LD6805K/14P,115 LD6805K/14P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.4V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
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BZV49-C11115 NXP USA Inc. Description: DIODE ZENER 10V 1W 5% UNIDIR
Package / Case: TO-243AA
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: SOT-89
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
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LFSTBEB7361 LFSTBEB7361 NXP USA Inc. LFSBEB7361ACCQSG.pdf Description: EVAL BOARD FOR MMA7361L
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NX3L1T3157GM NXP USA Inc. PHGLS20414-1.pdf?t.download=true&u=5oefqw Description: IC SWITCH SPDT 6XSON
Packaging: Bulk
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NX3L1T3157GM,115 NX3L1T3157GM,115 NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 500mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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NX3L1T3157GMZ NX3L1T3157GMZ NXP USA Inc. NX3L1T3157.pdf Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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MC9328MX1DVM20 MC9328MX1DVM20 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Obsolete
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -30°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
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PCA6416AHF,128 PCA6416AHF,128 NXP USA Inc. PCA6416A.pdf Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PSMN4R6-100XS,127 PSMN4R6-100XS,127 NXP USA Inc. PSMN4R6-100XS.pdf Description: MOSFET N-CH 100V 70.4A TO220F
Input Capacitance (Ciss) (Max) @ Vds: 9900 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 153 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 63.8W (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 70.4A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
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S912ZVMC64F1MKH S912ZVMC64F1MKH NXP USA Inc. FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
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MRFX1K80H-27MHZ MRFX1K80H-27MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 27MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 27MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
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MC17XS6400CEKR2 MC17XS6400CEKR2 NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 17mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Slew Rate Controlled
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A
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MC17XS6400CEK MC17XS6400CEK NXP USA Inc. MC12XS6D1.pdf Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
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S9S12XS128J1MALR S9S12XS128J1MALR NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
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BF1206,115 BF1206,115 NXP USA Inc. BF1206_Rev_Oct2010.pdf Description: RF MOSFET 5V 6TSSOP
Current - Test: 18 mA
Voltage - Test: 5 V
Voltage - Rated: 6 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Noise Figure: 1.3dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
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SC16C754BIBM,151 SC16C754BIBM,151 NXP USA Inc. SC16C754B.pdf Description: IC UART QUAD W/FIFO 64-LQFP
Part Status: Obsolete
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 64-LQFP (7x7)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 64-LQFP
Packaging: Tray
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74AUP2G86GD,125 74AUP2G86GD,125 NXP USA Inc. 74AUP2G86.pdf Description: IC GATE XOR 2CH 2-INP 8-XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
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PMCPB5530X PMCPB5530X NXP USA Inc. PHGLS24967-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA PMCPB5530X - SMALL
Packaging: Bulk
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MPC8306CVMACDCA557 NXP USA Inc. MPC8306EC.pdf Description: POWERQUICC POWER ARCH SOC, 200MH
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MPC8306CVMAFDCA557 NXP USA Inc. MPC8306EC.pdf Description: POWERQUICC RISC MICROPROCESSOR
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FS32K144HRT0MMHR FS32K144HRT0MMHR NXP USA Inc. S32K-DS.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K144HRT0MMHT FS32K144HRT0MMHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
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LD6806TD/22H,125 LD6806TD/22H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.2V 200MA 5TSOP
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LD6806TD/23H,125 LD6806TD/23H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6806TD/13H,125 LD6806TD/13H,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.3V 200MA 5TSOP
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LD6805K/15P,115 LD6805K/15P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.5V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Packaging: Bulk
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
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SPC5645CF0VLT1R SPC5645CF0VLT1R NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208TQFP
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SPC5644BK0MLU1R SPC5644BK0MLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
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FRDM-K22F-A8974 FRDM-K22F-A8974 NXP USA Inc. UM11736.pdf Description: DEV BOARD FXLS8974CF IOT ACC
Contents: Board(s), Cable(s)
Interface: I2C, Serial, SPI
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Packaging: Bulk
Part Status: Active
Sensing Range: ±2g, 4g, 8g, 16g
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FXLS8974CF, K22
Sensor Type: Accelerometer, 3 Axis
Voltage - Supply: 1.71V ~ 3.6V
Produkt ist nicht verfügbar
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LD6836CX4/12H,315 LD6836CX4/12H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.2V 300MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK10DN64VMP5 MK10DN64VMP5 NXP USA Inc. FSCL-S-A0000435448-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 64KB FLASH 64MAPBGA
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MK10DN128VMP5 MK10DN128VMP5 NXP USA Inc. FSCL-S-A0000435448-1.pdf?t.download=true&u=5oefqw Description: KINETIS K10: 50MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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MKL02Z16VFG4 MKL02Z16VFG4 NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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BZX84J-C2V4115 BZX84J-C2V4115 NXP USA Inc. BZX84J_SER.pdf Description: NOW NEXPERIA BZX84J-C2V4 ZENER D
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MK10DN32VFT5 MK10DN32VFT5 NXP USA Inc. K10P48M50SF0.pdf Description: IC MCU 32BIT 32KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x16b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MK10DN32VMP5 MK10DN32VMP5 NXP USA Inc. K10P64M50SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
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SPC5605BK0MLU6R SPC5605BK0MLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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SPC5605BK0MLU6 SPC5605BK0MLU6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
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PN5472A2EV/C20803518 NXP USA Inc. Description: NFC CONTROLLER PN547
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MK20DN512ZVMD10 MK20DN512ZVMD10 NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
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SVF511R3K1CMK4 SVF511R3K1CMK4 NXP USA Inc. Description: IC MPU VYBRID 400MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
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MKW31Z512VHT4 MKW31Z512VHT4 NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
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S912XEQ512AVAL S912XEQ512AVAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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S912XEQ512AVALR S912XEQ512AVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
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PEMI4QFN/WM,132 PEMI4QFN/WM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
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PEMI6QFN/WM,132 PEMI6QFN/WM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Number of Channels: 6
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
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PEMI6QFN/RT,132 PEMI6QFN/RT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 100 OHM/23PF SMD
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MCZ33903BS5EKR2 MC33903,4,5.pdf
MCZ33903BS5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
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PCF8570T/F5,518 PCF8570.pdf
PCF8570T/F5,518
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-SO
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PCF8570P/F5,112 PCF8570.pdf
PCF8570P/F5,112
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8DIP
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-DIP
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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PCF8570T/F5,512 PCF8570.pdf
PCF8570T/F5,512
Hersteller: NXP USA Inc.
Description: IC SRAM 2KBIT I2C 100KHZ 8SO
DigiKey Programmable: Not Verified
Memory Organization: 256 x 8
Memory Interface: I2C
Supplier Device Package: 8-SO
Memory Format: SRAM
Clock Frequency: 100 kHz
Technology: SRAM
Voltage - Supply: 2.5V ~ 6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 2Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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TEA1832TS/1X TEA1832TS.pdf
TEA1832TS/1X
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Voltage - Start Up: 22 V
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: SC-74
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Topology: Flyback
Output Isolation: Isolated
Internal Switch(s): No
Frequency - Switching: 36kHz ~ 130kHz
Duty Cycle: 90%
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Cut Tape (CT)
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MCZ33904C5EKR2 MC33903,4,5.pdf
MCZ33904C5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
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PEMI6QFN/BYP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/BYP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
Number of Channels: 6
ESD Protection: Yes
Technology: RC (Pi)
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1902+0.32 EUR
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SPC5606SF2VLQ6 MPC5606S.pdf
SPC5606SF2VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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74HCT4851PW112 74HC_HCT4851.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4851PW - SINGL
Part Status: Active
Packaging: Bulk
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MCF51JM32VLD FSCLS07441-1.pdf?t.download=true&u=5oefqw
MCF51JM32VLD
Hersteller: NXP USA Inc.
Description: MCF51JM 32-BIT MCU, COLDFIRE V1
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MCF51JM128EVLD MCF51JM128.pdf
MCF51JM128EVLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
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1+24.09 EUR
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CGD985HCI/01112 PHGLS22646-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC AMP POWER SOT115
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Frequency: 40MHz ~ 1.003GHz
RF Type: CATV
Voltage - Supply: 24V
Gain: 25.5dB
Current - Supply: 440mA
Noise Figure: 5dB
Supplier Device Package: SOT-115J
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8+74.87 EUR
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PDZ6.8B/ZLX
Hersteller: NXP USA Inc.
Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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LD6805K/14P,115 LD6805.pdf
LD6805K/14P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.4V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.4V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZV49-C11115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 10V 1W 5% UNIDIR
Package / Case: TO-243AA
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Power - Max: 1 W
Part Status: Active
Supplier Device Package: SOT-89
Impedance (Max) (Zzt): 20 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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LFSTBEB7361 LFSBEB7361ACCQSG.pdf
LFSTBEB7361
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MMA7361L
Produkt ist nicht verfügbar
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NX3L1T3157GM PHGLS20414-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT 6XSON
Packaging: Bulk
Produkt ist nicht verfügbar
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NX3L1T3157GM,115 NX3L1T3157.pdf
NX3L1T3157GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 500MOHM 6XSON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 20mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 500mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NX3L1T3157GMZ NX3L1T3157.pdf
NX3L1T3157GMZ
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 900MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 900mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 100mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9328MX1DVM20 MC9328MX1.pdf
MC9328MX1DVM20
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Part Status: Obsolete
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: -30°C ~ 70°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 256-MAPBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA6416AHF,128 PCA6416A.pdf
PCA6416AHF,128
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 12039 Stücke:
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8+2.92 EUR
10+2.12 EUR
25+1.93 EUR
100+1.71 EUR
250+1.61 EUR
500+1.55 EUR
1000+1.54 EUR
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PSMN4R6-100XS,127 PSMN4R6-100XS.pdf
PSMN4R6-100XS,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 70.4A TO220F
Input Capacitance (Ciss) (Max) @ Vds: 9900 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 153 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 63.8W (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 15A, 10V
Current - Continuous Drain (Id) @ 25°C: 70.4A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Produkt ist nicht verfügbar
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S912ZVMC64F1MKH FSCL-S-A0000953857-1.pdf?t.download=true&u=5oefqw
S912ZVMC64F1MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 64-HLQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFX1K80H-27MHZ MRFX1K80H.pdf
MRFX1K80H-27MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 27MHZ 1800W
Utilized IC / Part: MRFX1K80H
Contents: Board(s)
Supplied Contents: Board(s)
Type: Transistor
Frequency: 27MHz
For Use With/Related Products: MRFX1K80H
Packaging: Bulk
Produkt ist nicht verfügbar
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MC17XS6400CEKR2 MC12XS6D1.pdf
MC17XS6400CEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Packaging: Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Rds On (Typ): 17mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 5
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Slew Rate Controlled
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Supplier Device Package: 32-SOIC-EP
Ratio - Input:Output: 1:1
Current - Output (Max): 5.5A
Produkt ist nicht verfügbar
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MC17XS6400CEK MC12XS6D1.pdf
MC17XS6400CEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Produkt ist nicht verfügbar
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S9S12XS128J1MALR MC9S12XS256RMV1.pdf
S9S12XS128J1MALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Produkt ist nicht verfügbar
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BF1206,115 BF1206_Rev_Oct2010.pdf
BF1206,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Current - Test: 18 mA
Voltage - Test: 5 V
Voltage - Rated: 6 V
Part Status: Obsolete
Supplier Device Package: 6-TSSOP
Noise Figure: 1.3dB
Technology: MOSFET
Gain: 30dB
Configuration: N-Channel Dual Gate
Frequency: 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 30mA
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC16C754BIBM,151 SC16C754B.pdf
SC16C754BIBM,151
Hersteller: NXP USA Inc.
Description: IC UART QUAD W/FIFO 64-LQFP
Part Status: Obsolete
With Modem Control: Yes
With False Start Bit Detection: Yes
With Auto Flow Control: Yes
Supplier Device Package: 64-LQFP (7x7)
Data Rate (Max): 5Mbps
FIFO's: 64 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
Number of Channels: 4, QUART
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74AUP2G86GD,125 74AUP2G86.pdf
74AUP2G86GD,125
Hersteller: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8-XSON
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Input Logic Level - Low: 0.7V ~ 0.9V
Input Logic Level - High: 1.6V ~ 2V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
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2049+0.3 EUR
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PMCPB5530X PHGLS24967-1.pdf?t.download=true&u=5oefqw
PMCPB5530X
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMCPB5530X - SMALL
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC8306CVMACDCA557 MPC8306EC.pdf
Hersteller: NXP USA Inc.
Description: POWERQUICC POWER ARCH SOC, 200MH
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13+49.23 EUR
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MPC8306CVMAFDCA557 MPC8306EC.pdf
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSOR
Produkt ist nicht verfügbar
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FS32K144HRT0MMHR S32K-DS.pdf
FS32K144HRT0MMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K144HRT0MMHT S32K-DS.pdf
FS32K144HRT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6806TD/22H,125 LD6806_Series.pdf
LD6806TD/22H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
auf Bestellung 30000 Stücke:
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3206+0.2 EUR
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LD6806TD/23H,125 LD6806_Series.pdf
LD6806TD/23H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.3V 200MA 5TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.3V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LD6806TD/13H,125 LD6806_Series.pdf
LD6806TD/13H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 5TSOP
Produkt ist nicht verfügbar
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LD6805K/15P,115 LD6805.pdf
LD6805K/15P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.5V 150MA DFN1010C-4
Current - Supply (Max): 150 µA
Protection Features: Over Current, Transient Voltage
Voltage Dropout (Max): 0.25V @ 150mA
PSRR: 75dB (1kHz)
Packaging: Bulk
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V
Supplier Device Package: DFN1010C-4
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 35 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-UDFN Exposed Pad
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3206+0.19 EUR
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SPC5645CF0VLT1R
SPC5645CF0VLT1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Produkt ist nicht verfügbar
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SPC5644BK0MLU1R
SPC5644BK0MLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-K22F-A8974 UM11736.pdf
FRDM-K22F-A8974
Hersteller: NXP USA Inc.
Description: DEV BOARD FXLS8974CF IOT ACC
Contents: Board(s), Cable(s)
Interface: I2C, Serial, SPI
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Packaging: Bulk
Part Status: Active
Sensing Range: ±2g, 4g, 8g, 16g
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: FXLS8974CF, K22
Sensor Type: Accelerometer, 3 Axis
Voltage - Supply: 1.71V ~ 3.6V
Produkt ist nicht verfügbar
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LD6836CX4/12H,315 LD6836.pdf
LD6836CX4/12H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 300MA 4-WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Part Status: Obsolete
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK10DN64VMP5 FSCL-S-A0000435448-1.pdf?t.download=true&u=5oefqw
MK10DN64VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64MAPBGA
Produkt ist nicht verfügbar
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MK10DN128VMP5 FSCL-S-A0000435448-1.pdf?t.download=true&u=5oefqw
MK10DN128VMP5
Hersteller: NXP USA Inc.
Description: KINETIS K10: 50MHZ CORTEX-M4 PER
Produkt ist nicht verfügbar
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MKL02Z16VFG4 KL0xPB.pdf
MKL02Z16VFG4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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100+2.8 EUR
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BZX84J-C2V4115 BZX84J_SER.pdf
BZX84J-C2V4115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX84J-C2V4 ZENER D
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MK10DN32VFT5 K10P48M50SF0.pdf
MK10DN32VFT5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x16b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK10DN32VMP5 K10P64M50SF0.pdf
MK10DN32VMP5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLU6R MPC560XBFAMFS.pdf
SPC5605BK0MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5605BK0MLU6 MPC560XBFAMFS.pdf
SPC5605BK0MLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN5472A2EV/C20803518
Hersteller: NXP USA Inc.
Description: NFC CONTROLLER PN547
auf Bestellung 37971 Stücke:
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65+10.13 EUR
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MK20DN512ZVMD10 K20P121M100SF2.pdf
MK20DN512ZVMD10
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Produkt ist nicht verfügbar
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SVF511R3K1CMK4
SVF511R3K1CMK4
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MKW31Z512VHT4 MKW41Z512.pdf
MKW31Z512VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 128kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
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2+11.98 EUR
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25+9.03 EUR
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520+8.29 EUR
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S912XEQ512AVAL MC9S12XEPB.pdf
S912XEQ512AVAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912XEQ512AVALR MC9S12XEPB.pdf
S912XEQ512AVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEMI4QFN/WM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/WM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
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2959+0.2 EUR
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PEMI6QFN/WM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/WM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Number of Channels: 6
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
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1902+0.31 EUR
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PEMI6QFN/RT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/RT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
Produkt ist nicht verfügbar
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