Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35464) > Seite 449 nach 592
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TEA2206T/1J | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 8-SO Part Status: Active |
auf Bestellung 4622 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT162245ADL112 | NXP USA Inc. |
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auf Bestellung 816 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS606PWJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS606PWJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3419 Stücke: Lieferzeit 10-14 Tag (e) |
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SC18IS604PWJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SC18IS604PWJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.71V ~ 3.6V Current - Supply: 4mA Protocol: I2C Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 817 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q4AVT10ADR518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC32PW/S400118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XEQ512F1VAA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512F1VAAR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OMA1007TL-SKT | NXP USA Inc. |
Description: EVAL BOARD FOR A1007TL Packaging: Bulk Function: Anti Tamper and Security Type: Interface Contents: Board(s) Utilized IC / Part: A1007TL Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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MC32PF1550A3EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC33VR5500V3ES | NXP USA Inc. | Description: VR5500 |
Produkt ist nicht verfügbar |
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FRDMGD3160DSBHB | NXP USA Inc. |
![]() Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Secondary Attributes: Graphical User Interface (GUI) Embedded: Yes, MCU, 32-Bit |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA2771,115 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 20MHz ~ 2.5GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 21.4dB Current - Supply: 33.3mA Noise Figure: 4.5dB P1dB: 12.1dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74AUP2G07GX147 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-X2SON (1.0x0.8) Part Status: Active |
auf Bestellung 80000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT162245ADL653 | NXP USA Inc. |
![]() Packaging: Bulk Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Part Status: Active |
Produkt ist nicht verfügbar |
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LPC11E67JBD48K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 187 Stücke: Lieferzeit 10-14 Tag (e) |
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SCIMX6S6AVM083C | NXP USA Inc. |
Description: I.MX 6 SERIES 32-BIT MPU ARM COR Packaging: Tray |
Produkt ist nicht verfügbar |
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8CH-DMIC | NXP USA Inc. |
![]() Packaging: Box Function: Microphone Type: Audio Contents: Board(s) Utilized IC / Part: SPH0641LM4H-1 Supplied Contents: Board(s) Primary Attributes: 8-Channel (Octal) Secondary Attributes: On-Board LEDs Embedded: Yes Part Status: Active |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836TD/21P,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.1V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.2V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 21000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/22P,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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P1014NSE5HFB557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLS8962AFR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 10-VFDFN Mounting Type: Surface Mount Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Supplier Device Package: 10-DFN (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FXLS8962AFR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 10-VFDFN Mounting Type: Surface Mount Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Supplier Device Package: 10-DFN (2x2) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PEMI8QFN/LP,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 19dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1102,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Current Rating (Amps): 40mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: 6-TSSOP Voltage - Rated: 7 V Voltage - Test: 5 V Current - Test: 15 mA |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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A2I09VD015GNR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 575MHz ~ 960MHz RF Type: General Purpose Voltage - Supply: 48V ~ 55V Gain: 34dB Current - Supply: 84mA Test Frequency: 920MHz Supplier Device Package: TO-270WBG-15 |
Produkt ist nicht verfügbar |
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MC33FS6510NAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC07XSF517BEK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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P5040NSE72QC | NXP USA Inc. |
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auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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T2081NSE8PTB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.533GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G20LS-180RN112 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BLF6G10LS-160RN112 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF6G10LS-135RN112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT502 Packaging: Bulk Part Status: Active |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S5EVM10AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F27D,623 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 3 |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1463AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1463AT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 2502 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85063TP-ARD | NXP USA Inc. |
Description: RTC W/ CAL&ALARM EVAL BOARD Packaging: Box Function: Real Time Clock (RTC) Type: Clock Timing Contents: Board(s) Utilized IC / Part: PCF85063TP Platform: Arduino Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
![]() Features: Alarm, Leap Year, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATT1/AZ | NXP USA Inc. |
![]() Features: Alarm, Leap Year, Watchdog Timer Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 10-TSSOP Voltage - Supply, Battery: 0.9V ~ 5.5V Current - Timekeeping (Max): 0.885µA @ 3.3V Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 6648 Stücke: Lieferzeit 10-14 Tag (e) |
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PMCM6501VNE023 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PMCM6501VPE023 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74LVC138APW/AU118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 49760 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC138APW-Q100118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 22994 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT573AN,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Tri-State Mounting Type: Through Hole Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 3.3ns Supplier Device Package: 20-DIP Part Status: Obsolete |
auf Bestellung 1332 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1011CFM | NXP USA Inc. |
Description: 15W SINGLE-COIL CONSUMER STAND Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: General Purpose Supplier Device Package: 32-HVQFN (5x5) Part Status: Active |
auf Bestellung 83788 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VMC7R | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MCIMX7D5EVM10SC | NXP USA Inc. |
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA Packaging: Tray Package / Case: 541-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 541-MAPBGA (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
Produkt ist nicht verfügbar |
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74HCT423DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 22 ns Independent Circuits: 2 Current - Output High, Low: 4mA, 4mA Schmitt Trigger Input: No Supplier Device Package: 16-SSOP Voltage - Supply: 4.5 V ~ 5.5 V |
auf Bestellung 15359 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2244AD,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 20-SO Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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BUJ103AX,127 | NXP USA Inc. |
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auf Bestellung 10483 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U1AVM08ACR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Not For New Designs |
auf Bestellung 934 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVHY32F1VLQ | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W-001-T10 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: K32W061 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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K32W061Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 986 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W061Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C24/LF1R | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 70 Ohms Supplier Device Package: SOT-23 (TO-236AB) Grade: Automotive Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
TEA2206T/1J |
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Hersteller: NXP USA Inc.
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
Description: IC ACTIVE BRIDGE CTRL SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 8-SO
Part Status: Active
auf Bestellung 4622 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.29 EUR |
10+ | 6.31 EUR |
25+ | 5.82 EUR |
100+ | 5.27 EUR |
250+ | 5.02 EUR |
500+ | 4.86 EUR |
1000+ | 4.73 EUR |
74ABT162245ADL112 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ABT162245ADL - BU
Description: NOW NEXPERIA 74ABT162245ADL - BU
auf Bestellung 816 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
512+ | 1.02 EUR |
SC18IS606PWJ |
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Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I2C TO SPI BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 3.09 EUR |
SC18IS606PWJ |
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Hersteller: NXP USA Inc.
Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC I2C TO SPI BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3419 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.76 EUR |
10+ | 4.33 EUR |
25+ | 3.98 EUR |
100+ | 3.58 EUR |
250+ | 3.4 EUR |
500+ | 3.28 EUR |
1000+ | 3.19 EUR |
SC18IS604PWJ |
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Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC SPI TO I2C BRIDGE
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SC18IS604PWJ |
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Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC SPI TO I2C BRIDGE
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Current - Supply: 4mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 817 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 5.97 EUR |
10+ | 4.51 EUR |
25+ | 4.15 EUR |
100+ | 3.75 EUR |
250+ | 3.55 EUR |
500+ | 3.44 EUR |
MCIMX6Q4AVT10ADR518 |
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Hersteller: NXP USA Inc.
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Description: CORTEX A9 RISC MICROPROCESSOR 32
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74AHC32PW/S400118 |
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Hersteller: NXP USA Inc.
Description: OR GATE, AHC SERIES
Description: OR GATE, AHC SERIES
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XEQ512F1VAA |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S912XEQ512F1VAAR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
OMA1007TL-SKT |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR A1007TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1007TL
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC32PF1550A3EP |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33VR5500V3ES |
Hersteller: NXP USA Inc.
Description: VR5500
Description: VR5500
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
FRDMGD3160DSBHB |
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Hersteller: NXP USA Inc.
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Description: GD3160 HALF-BRIDGE EVAL KIT
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 1222.72 EUR |
BGA2771,115 |
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Hersteller: NXP USA Inc.
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 20MHz ~ 2.5GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.4dB
Current - Supply: 33.3mA
Noise Figure: 4.5dB
P1dB: 12.1dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74AUP2G07GX147 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-X2SON (1.0x0.8)
Part Status: Active
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
945+ | 0.5 EUR |
74ABT162245ADL653 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Description: IC TXRX NON-INVERT 5.5V
Packaging: Bulk
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
LPC11E67JBD48K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.98 EUR |
10+ | 7.64 EUR |
25+ | 7.06 EUR |
80+ | 6.51 EUR |
8CH-DMIC |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Contents: Board(s)
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Secondary Attributes: On-Board LEDs
Embedded: Yes
Part Status: Active
Description: EVAL BOARD FOR SPH0641LM4H-1
Packaging: Box
Function: Microphone
Type: Audio
Contents: Board(s)
Utilized IC / Part: SPH0641LM4H-1
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Secondary Attributes: On-Board LEDs
Embedded: Yes
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 157.91 EUR |
LD6836TD/21P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.1V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.1V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.1V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2664+ | 0.18 EUR |
LD6806TD/22P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2959+ | 0.16 EUR |
P1014NSE5HFB557 |
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Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 32-BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 75.42 EUR |
FXLS8962AFR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
FXLS8962AFR1 |
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Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN
Mounting Type: Surface Mount
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Supplier Device Package: 10-DFN (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PEMI8QFN/LP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1567+ | 0.32 EUR |
BF1102,115 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 15 mA
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 40mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 15 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1110+ | 0.45 EUR |
A2I09VD015GNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Description: IC AMP GPS 575-960MHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WBG-15
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC33FS6510NAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MC07XSF517BEK |
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Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
P5040NSE72QC |
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Hersteller: NXP USA Inc.
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
Description: QORIQ, 64-BIT POWER ARCH SOC, 4
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 835.91 EUR |
T2081NSE8PTB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Bulk
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 535.6 EUR |
BLF6G10LS-160RN112 |
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 147.97 EUR |
BLF6G10LS-135RN112 |
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 127.17 EUR |
MCIMX6S5EVM10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 64.59 EUR |
10+ | 52.73 EUR |
60+ | 47.58 EUR |
120+ | 46.18 EUR |
N74F27D,623 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
Description: IC GATE NOR 3CH 3-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 3
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2420+ | 0.19 EUR |
TJA1463AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 1.38 EUR |
TJA1463AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2502 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.75 EUR |
10+ | 2.02 EUR |
25+ | 1.84 EUR |
100+ | 1.63 EUR |
250+ | 1.54 EUR |
500+ | 1.48 EUR |
1000+ | 1.43 EUR |
PCF85063TP-ARD |
Hersteller: NXP USA Inc.
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
Description: RTC W/ CAL&ALARM EVAL BOARD
Packaging: Box
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063TP
Platform: Arduino
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 165.44 EUR |
PCF85263ATT1/AZ |
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Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2500+ | 0.97 EUR |
5000+ | 0.92 EUR |
PCF85263ATT1/AZ |
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Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC RTC CLK/CALENDAR I2C 10TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.9V ~ 1.8V, 0.9V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-TSSOP
Voltage - Supply, Battery: 0.9V ~ 5.5V
Current - Timekeeping (Max): 0.885µA @ 3.3V
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 6648 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8+ | 2.29 EUR |
10+ | 2.04 EUR |
25+ | 1.93 EUR |
100+ | 1.59 EUR |
250+ | 1.48 EUR |
500+ | 1.31 EUR |
1000+ | 1.04 EUR |
PMCM6501VNE023 |
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Hersteller: NXP USA Inc.
Description: PMCM6501 N-CHANNEL, MOSFET
Description: PMCM6501 N-CHANNEL, MOSFET
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
PMCM6501VPE023 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
74LVC138APW/AU118 |
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Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 49760 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2959+ | 0.18 EUR |
74LVC138APW-Q100118 |
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Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 22994 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2228+ | 0.23 EUR |
74ABT573AN,112 |
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Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-DIP
Part Status: Obsolete
auf Bestellung 1332 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
567+ | 0.86 EUR |
MWCT1011CFM |
Hersteller: NXP USA Inc.
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Description: 15W SINGLE-COIL CONSUMER STAND
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: General Purpose
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 83788 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
86+ | 5.92 EUR |
MK20DX256VMC7R |
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Hersteller: NXP USA Inc.
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Description: KINETIS K20 - 72MHZ CORTEX-M4 P
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MCIMX7D5EVM10SC |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA
Packaging: Tray
Package / Case: 541-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 541-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7D 1.0GHZ 541MAPBGA
Packaging: Tray
Package / Case: 541-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 541-MAPBGA (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Produkt ist nicht verfügbar
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74HCT423DB,112 |
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Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Description: IC MULTIVIBRATOR 22NS 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
auf Bestellung 15359 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1066+ | 0.46 EUR |
74LVC2244AD,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 20-SO
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1347+ | 0.36 EUR |
BUJ103AX,127 |
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Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJ103AX - POWER BIPO
Description: NOW WEEN - BUJ103AX - POWER BIPO
auf Bestellung 10483 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
760+ | 0.66 EUR |
MCIMX6U1AVM08ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
Description: IC MPU 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Not For New Designs
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 130.42 EUR |
S912ZVHY32F1VLQ |
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Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
42+ | 11.2 EUR |
K32W-001-T10 |
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Hersteller: NXP USA Inc.
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
Description: K32W061/41 UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W061
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 58.84 EUR |
K32W061Z |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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K32W061Z |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 986 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.7 EUR |
10+ | 13.47 EUR |
25+ | 12.25 EUR |
100+ | 11.02 EUR |
250+ | 10.1 EUR |
500+ | 9.19 EUR |
K32W061Y |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4000+ | 7.58 EUR |
BZX84-C24/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
Description: DIODE ZENER 24V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 70 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 16.8 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
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